ADA-4743-BLK

Agilent ADA-4743 Silicon Bipolar Darlington Amplifier Data Sheet Features • Small Signal gain amplifier • Operating frequency DC – 2.5 GHz • Unconditionally stable • 50 Ohms input & output • Flat, Broadband Frequency Response up to 1 GHz • Operating Current: 40 to 80 mA • Industry standard SOT-343 package • Lead-free option available Specifications 900 MHz, 3.8V, 60 mA (typ.) • 16.5 dB associated gain • 17.1 dBm P1dB • 32.6 dBm OIP3 • 4.2 dB noise figure • VSWR < 2 throughput operating frequency • Single supply, typical Id = 60 mA Applications • Cellular/PCS/WLL base stations • Wireless data/WLAN • Fiber-optic systems VCC = 5 V Rc C bypass Description Agilent Technologies’ ADA-4743 is an economical, easy-to-use, general purpose silicon bipolar RFIC gain block amplifiers housed in a 4-lead SC-70 (SOT-343) surface mount plastic package which requires only half the board space of a SOT-143 package. The Darlington feedback structure provides inherent broad bandwidth performance, resulting in useful operating frequency up to 2.5 GHz. This is an ideal device for small-signal gain cascades or IF amplification. ADA-4743 is fabricated using Agilent’s HP25 silicon bipolar process, which employs a doublediffused single polysilicon process with self-aligned submicron emitter geometry. The process is capable of simultaneous high fT and high NPN breakdown (25 GHz fT at 6V BVCEO). The process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. Surface Mount Package SOT-343 Pin Connections and Package Marking RFout & Vd GND GND 3Tx RFin Note: Top View. Package marking provides orientation and identification. “3T” = Device Code “x” = Date code character identifies month of manufacture. Typical Biasing Configuration V -V Rc = cc d Id • ISM Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1B) Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control. RFC C block RF input 3Tx C block Vd = 3.8 V RF output ADA-4743 Absolute Maximum Ratings [1] Symbol Id Pdiss Pin max. Tj TSTG θjc Parameter Device Current Total Power Dissipation [2] RF Input Power Channel Temperature Storage Temperature Thermal Resistance [3] Units mA mW dBm °C °C °C/W Absolute Maximum 90 370 20 150 -65 to 150 163 Notes: 1. Operation of this device above any one of these parameters may cause permanent damage. 2. Ground lead temperature is 25°C. Derate 6.1 mW/°C for TL >89°C . 3. Junction-to-case thermal resistance measured using 150°C Liquid Crystal Measurement method. ADA-4743 Electrical Specifications TA = 25°C, Zo=50Ω, Pin = -25 dBm, Id = 60 mA (unless specified otherwise) Symbol Vd Gp ∆Gp F3dB VSMRin VSMRout NF P1dB OIP3 DV/dT Parameter and Test Condition: Id = 60 mA, Zo = 50Ω Device Voltage Id = 60 mA Power Gain (|S21| Gain Flatness 3 dB Bandwidth Input Voltage Standing Wave Ratio Output Voltage Standing Wave Ratio 50Ω Noise Figure Output Power at 1dB Gain Compression Output 3rd Order Intercept Point Device Voltage Temperature Coefficient 2 Frequency Units V Min. 3.3 15 Typ. 3.8 16.6 16.5 0.5 1.5 4 1.7:1 1.5:1 Max. 4.3 18 Std. Dev. 100 MHz 900 MHz[1,2] 100 to 900 MHz 0.1 to 2 GHz dB dB GHz 0.1 to 6 GHz 0.1 to 6 GHz 100 MHz 900 MHz[1,2] 100 MHz 900 MHz[1,2] 100 MHz[3] 900 MHz[1,2,3] dB dBm dBm mV/°C 4.1 4.2 17.7 17.1 33.4 32.6 -4.9 0.11 0.16 Notes: 1. Typical value determined from a sample size of 500 parts from 3 wafers. 2. Measurement obtained using production test board described in the block diagram below. 3. I) 900 MHz OIP3 test condition: F1 = 900 MHz, F2 = 905 MHz and Pin = -25 dBm per tone. II) 100 MHz OIP3 test condition: F1 = 100 MHz, F2 = 105 MHz and Pin = -25 dBm per tone. Input 50 Ohm Transmission (0.5 dB loss) DUT 50 Ohm Transmission including Bias (0.5 dB loss) Output Block diagram of 900 MHz production test board used for Vd, Gain, P1dB, OIP3, and NF measurements. Circuit losses have been de-embedded from actual measurements. 2 Product Consistency Distribution Charts at 900 MHz, Id = 60 mA 300 250 200 150 100 50 0 15 240 200 160 120 80 40 0 3.3 15.5 16 16.5 GAIN (dB) 17 17.5 18 3.5 3.7 Vd (V) 3.9 4.1 4.3 Figure 1. Gain distribution @ 60 mA. LSL=15, Nominal=16.5, USL=18 Figure 2. Vd distribution @ 60 mA. LSL = 3.3, Nominal = 3.8, USL = 4.3 Notes: 1. Statistics distribution determined from a sample size of 500 parts taken from 3 different wafers. 2. Future wafers allocated to this product may have typical values anywhere between the minimum and maximum specification limits. ADA-4743 Typical Performance Curves (at 25°C, unless specified otherwise) 20 20 35 30 15 15 P1dB (dBm) OIP3 (dBm) GAIN (dB) 25 10 10 20 5 5 15 0 0 1 2 3 4 5 6 FREQUENCY (GHz) 0 0 1 2 3 4 5 6 FREQUENCY (GHz) 10 0 1 2 3 4 5 6 FREQUENCY (GHz) Figure 3. Gain vs. Frequency at Id = 60 mA. Figure 4. P1dB vs. Frequency at Id = 60 mA. Figure 5. OIP3 vs. Frequency at Id = 60 mA. 6 90 80 17 16.5 5 70 60 50 40 30 4 25°C 85°C GAIN (dB) NF (dB) -40°C 16 15.5 -40°C 15 14.5 25°C 85°C 3 Id (mA) 20 10 2 0 1 2 3 4 5 6 FREQUENCY (GHz) 0 14 0 1 2 Vd (V) 3 4 5 0 20 40 60 Id (mA) 80 100 Figure 6. NF vs. Frequency at Id = 60 mA. Figure 7. Id vs. Vd and Temperature. Figure 8. Gain vs. Id and Temperature at 900 MHz. 3 ADA-4743 Typical Performance Curves (at 25°C, unless specified otherwise), continued 20 40 35 15 30 6 5 4 P1dB (dBm) OIP3 (dBm) 10 -40°C 5 25°C 85°C 25 -40°C 20 15 10 25°C 85°C NF (dB) 3 -40°C 2 1 0 25°C 85°C 0 0 20 40 60 80 100 Id (mA) 0 20 40 60 80 100 0 20 40 Id (mA) 60 80 100 Id (mA) Figure 9. P1dB vs. Id and Temperature at 900 MHz. 18 17 16 15 0.1 0.5 0.9 1.5 2.0 2.5 3 4 5 Figure 10. OIP3 vs. Id and Temperature at 900 MHz. 25 0.1 0.5 0.9 1.5 2.0 2.5 3 4 Figure 11. NF vs. Id and Temperature at 900 MHz. 38 0.1 0.5 20 33 0.9 1.5 P1dB (dBm) OIP3 (dBm) GAIN (dB) 14 13 12 11 10 9 15 28 2.0 2.5 3 10 5 6 23 4 5 6 6 5 18 0 0 20 40 60 80 100 0 20 40 60 80 100 Id (mA) Id (mA) 13 0 20 40 60 80 100 Id (mA) Figure 12. Gain vs. Id and Frequency (GHz). Figure 13. P1dB vs. Id and Frequency (GHz). Figure 14. OIP3 vs. Id and Frequency (GHz). 5.5 6 0 0 5 5 -5 -5 ORL (dB) Id = 5 0 mA Id = 6 0 mA Id = 8 0 mA 0 2 4 6 8 10 12 4.5 2.5 2.0 1.5 0.9 0.5 0.1 IRL (dB) NF (dB) 4 3 -10 -10 -15 -15 Id = 5 0 mA Id = 6 0 mA Id = 8 0 mA 0 2 4 6 8 10 12 4 -20 -20 3.5 0 20 40 Id (mA) 60 80 100 -25 -25 FREQUENCY (GHz) FREQUENCY (GHz) Figure 15. NF vs. Id and Frequency (GHz). Figure 16. Input Return Loss vs. Id and Frequency. Figure 17. Output Return Loss vs. Id and Frequency. 4 ADA-4743 Typical Scattering Parameters, TA = 25°C, Id = 50 mA Freq. GHz 0.1 0.5 0.9 1.0 1.5 1.9 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 S11 Mag. 0.11 0.136 0.203 0.214 0.262 0.278 0.284 0.289 0.281 0.265 0.239 0.218 0.204 0.206 0.219 0.225 0.237 0.263 0.307 0.345 0.4 0.45 0.496 Ang. 0.7 12.2 14.9 11.8 -4.1 -13.9 -16.6 -28.7 -40.4 -53.8 -70.5 -90.6 -114.3 -140 -163.7 172.6 147.8 121.8 97.6 78.9 63.8 50.6 40 dB 16.59 16.45 16.13 16.04 15.57 15.22 15.14 14.75 14.38 14.01 13.63 13.24 12.74 12.24 11.67 11.13 10.52 9.82 8.99 7.97 7.08 6 5.05 S21 Mag. 6.751 6.644 6.406 6.336 6.002 5.767 5.718 5.467 5.239 5.017 4.804 4.594 4.334 4.093 3.833 3.603 3.359 3.096 2.814 2.504 2.259 1.995 1.79 S12 Ang. 176.1 160.8 145.9 142.5 125.7 112.9 109.8 94.4 79.4 64.2 49.3 34.4 19.5 5.1 -9.5 -23.8 -38.2 -52.6 -66.6 -79.1 -91 -102.8 -113.5 S22 Ang. -0.8 -3.9 -6.2 -6.4 -7 -6.8 -6.7 -5.7 -4.6 -3.6 -3.1 -3.4 -4.9 -7.3 -11 -15.8 -22.1 -29.4 -37.2 -44.4 -50.8 -57.9 -65.1 K Ang. -5.6 -17.2 -26.3 -29.65 -46.8 -60.6 -64 -81.8 -102.3 -125.6 -149.2 -170.4 172.3 158.4 145.1 130.2 113.5 96.2 79.1 65.4 54.3 44.3 35.7 1.1 1.1 1.1 1.1 1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.1 1.1 1.0 1.0 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 Mag. 0.1 0.098 0.094 0.093 0.09 0.088 0.088 0.087 0.089 0.092 0.098 0.105 0.114 0.125 0.137 0.152 0.167 0.179 0.188 0.194 0.202 0.21 0.215 Mag. 0.192 0.191 0.214 0.218 0.232 0.232 0.231 0.221 0.209 0.204 0.215 0.244 0.276 0.309 0.338 0.364 0.393 0.427 0.462 0.501 0.541 0.583 0.62 Notes: 1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The output reference plane is at the end of the output lead. 5 ADA-4743 Typical Scattering Parameters, TA = 25°C, Id = 60 mA Freq. GHz 0.1 0.5 0.9 1.0 1.5 1.9 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 S11 Mag. 0.102 0.131 0.199 0.204 0.257 0.275 0.28 0.287 0.279 0.261 0.238 0.217 0.201 0.205 0.216 0.223 0.238 0.264 0.309 0.347 0.405 0.449 0.499 Ang. 0.5 14.2 16.3 13.3 -3.2 -12.9 -15.8 -27.7 -39.9 -53.6 -70.2 -91.2 -115.4 -141 -164.8 171.4 146.1 120.4 96.1 78.1 63.3 49.6 39.5 dB 16.7 16.56 16.24 16.15 15.68 15.33 15.25 14.85 14.48 14.09 13.71 13.31 12.8 12.3 11.72 11.17 10.55 9.83 8.99 7.97 7.07 5.99 5.06 S21 Mag. 6.836 6.73 6.489 6.418 6.08 5.84 5.786 5.529 5.296 5.066 4.846 4.631 4.363 4.121 3.853 3.617 3.369 3.102 2.816 2.502 2.258 1.992 1.79 S12 Ang. 176.1 160.7 145.8 142.3 125.5 112.7 109.6 94.2 79 63.9 49 34.1 19.1 4.6 -9.9 -24.2 -38.6 -52.9 -66.9 -79.4 -91.1 -103.1 -113.6 S22 Ang. -0.8 -3.8 -6 -6.3 -6.8 -6.6 -6.5 -5.5 -4.3 -3.3 -2.8 -3 -4.6 -6.9 -10.7 -15.5 -21.9 -29.3 -37.1 -44.4 -50.7 -57.8 -65.1 K Ang. -5.6 -17 -25.9 -29 -46.4 -60.3 -63.7 -81.7 -102.4 -126 -149.7 -170.9 171.8 157.8 144.6 129.7 113 95.7 78.7 65 53.9 43.9 35.4 1.1 1.1 1.1 1.1 1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.1 1.1 1.0 1.0 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 Mag. 0.099 0.097 0.094 0.093 0.089 0.088 0.087 0.087 0.089 0.092 0.097 0.105 0.114 0.125 0.138 0.152 0.167 0.18 0.189 0.195 0.202 0.21 0.216 Mag. 0.183 0.182 0.207 0.212 0.225 0.226 0.225 0.216 0.205 0.2 0.212 0.243 0.275 0.308 0.338 0.365 0.394 0.429 0.464 0.503 0.543 0.585 0.622 Notes: 1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The output reference plane is at the end of the output lead. 6 ADA-4743 Typical Scattering Parameters, TA = 25°C, Id = 80 mA Freq. GHz 0.1 0.5 0.9 1.0 1.5 1.9 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 S11 Mag. 0.093 0.123 0.195 0.201 0.253 0.271 0.278 0.286 0.278 0.261 0.235 0.214 0.198 0.205 0.218 0.228 0.244 0.272 0.32 0.358 0.413 0.46 0.507 Ang. 1.2 16.5 18.4 15 -1.9 -12.3 -15.2 -27.3 -40 -54 -71.8 -93.2 -118 -144.6 -169 167.1 142 117.4 94 75.8 62 48.2 38 dB 16.81 16.68 16.36 16.27 15.8 15.44 15.36 14.96 14.57 14.17 13.77 13.36 12.81 12.29 11.67 11.09 10.45 9.69 8.84 7.81 6.9 5.78 4.83 S21 Mag. 6.929 6.824 6.58 6.51 6.164 5.916 5.863 5.595 5.353 5.113 4.882 4.654 4.371 4.116 3.835 3.584 3.329 3.053 2.767 2.457 2.213 1.946 1.744 S12 Ang. 176.1 160.6 145.6 142 125.1 112.2 109 93.4 78.2 62.9 47.9 32.8 17.8 3.2 -11.4 -25.7 -40 -54.3 -68.2 -80.5 -91.9 -103.9 -114.2 S22 Ang. -0.7 -3.7 -5.7 -6.1 -6.6 -6.3 -6.2 -5.1 -3.8 -2.8 -2.2 -2.5 -4.2 -6.6 -10.5 -15.5 -22 -29.5 -37.3 -44.5 -50.9 -58 -65.1 K Ang. -5.6 -16.7 -25.2 -28.4 -45.9 -59.8 -63.3 -81.5 -102.5 -126.5 -150.5 -171.9 170.7 156.7 143.4 128.5 111.7 94.4 77.5 64 53 43.2 34.8 1.1 1.1 1.1 1.1 1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.1 1.1 1.0 1.0 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 Mag. 0.098 0.096 0.093 0.092 0.089 0.087 0.087 0.087 0.088 0.092 0.098 0.106 0.115 0.126 0.139 0.154 0.169 0.181 0.19 0.196 0.202 0.21 0.216 Mag. 0.172 0.172 0.197 0.203 0.217 0.218 0.218 0.21 0.2 0.196 0.209 0.241 0.274 0.307 0.337 0.364 0.393 0.427 0.462 0.5 0.54 0.582 0.619 Notes: 1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The output reference plane is at the end of the output lead. 7 Ordering Information Part Number ADA-4743-TR1 ADA-4743-TR2 ADA-4743-BLK ADA-4743-TR1G ADA-4743-TR2G ADA-4743-BLKG No. of Devices 3000 10000 100 3000 10000 100 Container 7” Reel 13” Reel antistatic bag 7” Reel 13” Reel antistatic bag Note: For lead-free option, the part number will have the character “G” at the end. Package Dimensions Outline 43 SOT-343 (SC70 4-lead) 1.30 BSC Recommended PCB Pad Layout for Agilent’s SC70 4L/SOT-343 Products 1.30 0.051 1.00 0.039 HE E 0.60 0.024 2.00 0.079 b1 D .090 0.035 1.15 0.045 Dimensions in inches mm A A2 b A1 L DIMENSIONS (mm) C SYMBOL E D HE A A2 A1 b b1 c L MIN. 1.15 1.85 1.80 0.80 0.80 0.00 0.25 0.55 0.10 0.10 MAX. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.70 0.20 0.46 NOTES: 1. All dimensions are in mm. 2. Dimensions are inclusive of plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to EIAJ SC70. 5. Die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. Package surface to be mirror finish. 8 Device Orientation REEL TOP VIEW 4 mm END VIEW CARRIER TAPE USER FEED DIRECTION COVER TAPE 8 mm Tape Dimensions For Outline 4T P P0 D P2 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 10° MAX. K0 10° MAX. A0 B0 DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER DIAMETER PITCH POSITION WIDTH THICKNESS WIDTH TAPE THICKNESS CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) SYMBOL A0 B0 K0 P D1 D P0 E W t1 C Tt F P2 SIZE (mm) 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 1.50 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 8.00 + 0.30 - 0.10 0.254 ± 0.02 5.40 ± 0.10 0.062 ± 0.001 3.50 ± 0.05 2.00 ± 0.05 SIZE (INCHES) 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 0.061 + 0.002 0.157 ± 0.004 0.069 ± 0.004 0.315 + 0.012 0.0100 ± 0.0008 0.205 + 0.004 0.0025 ± 0.0004 0.138 ± 0.002 0.079 ± 0.002 PERFORATION CARRIER TAPE COVER TAPE DISTANCE For product information and a complete list of Agilent contacts and distributors, please go to our web site. www.agilent.com/semiconductors E-mail: SemiconductorSupport@agilent.com Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-9274EN December 4, 2004 5989-1976EN