Agilent ADNK-2052 Solid-State Optical Mouse Sensor
Sample Kit
Kit Components See table below. Sensor The sensor technical information is contained in the ADNS-2051 Data Sheet. Lens The lens information is contained in the HDNS-2100/HDNS2100#001 Data Sheet. LED Assembly Clip The assembly information is contained in the HDNS-2200/HDNS2200#001 Technical Data Sheet. Part Number ADNS-2051 Description Solid-State Optical Mouse Sensor HDNS-2100 Lens Plate (Round Lens) HDNS-2100#001 Lens Plate (Trimmed Lens) HDNS-2200 LED Assembly Clip (Black Clip) HDNS-2200#001 LED Assembly Clip (Clear Clip) HLMP-ED80-XXXXX 639 nm T-13/4 (5 mm) Diameter LED Documentation ADNS-2051 Data Sheet Documentation HDNS-2100/HDNS-2100#001 Data Sheet Documentation HDNS-2200/HDNS-2200#001 Data Sheet Documentation HLMP-ED80-XXXXX LED Data Sheet Floppy Diskette Base Plate Feature IGES File Name Sensor Lens Lens LED Clip LED Clip LED — — — — — Quantity 5 5 5 5 5 5 1 1 1 1 1 LED Information on the LED is contained in the HLMP-ED80-XXXXX Data Sheet. Base Plate Feature IGES File The IGES file provides recommended base plate molding features to ensure optical alignment.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-6066EN April 8, 2003 5988-9325EN
Agilent ADNS-2051 Optical Mouse Sensor
Data Sheet
Description The ADNS-2051 is a low cost optical sensor used to implement a non-mechanical tracking engine for computer mice. It is based on optical navigation technology, which measures changes in position by optically acquiring sequential surface images (frames) and mathematically determining the direction and magnitude of movement. The sensor is housed in a 16-pin staggered dual inline package (DIP) that is designed for use with the HDNS-2100 Lens and HDNS-2200 Clip and HLMP-ED80-XXXXX (639 nm LED illuminator source). There are no moving parts, and precision optical alignment is not required, facilitating high volume assembly. The output format is two channel quadrature (X and Y direction) which emulates encoder phototransistors. The current X and Y information are also available in registers accessed via a serial port.
Default resolution is specified as 400 counts per inch (cpi), with rates of motion up to 14 inches per second (ips). Resolution can also be programmed to 800 cpi. The part is programmed via a two wire serial port, through registers. Theory of Operation The ADNS-2051 is based on Optical Navigation Technology. It contains an Image Acquisition System (IAS), a Digital Signal Processor (DSP), a two-channel quadrature output, and a two wire serial port. The IAS acquires microscopic surface images via the lens and illumination system provided by the HDNS-2100, 2200, and HLMP-ED80-XXXXX LED. These images are processed by the DSP to determine the direction and distance of motion. The DSP generates the ∆x and ∆ y relative displacement values that are converted into two channel quadrature signals.
Features • Precise optical navigation technology • No mechanical moving parts • Complete 2D motion sensor • Serial interface and/or quadrature interface • Smooth surface navigation • Programmable frame speed up to 2300 frames per sec (fps) • Accurate motion up to 14 ips • 800 cpi resolution • High reliability • High speed motion detector • No precision optical alignment • Wave solderable • Single 5.0 volt power supply • Shutdown pin for USB suspend mode operation • Power conservation mode during times of no movement • On chip LED drive with regulated current • Serial port registers – Programming – Data transfer • 16-pin staggered dual inline package (DIP) Applications • Mice for desktop PCs, workstations, and portable PCs • Trackballs • Integrated input devices
Outline Drawing of ADNS-2051 Optical Mouse Sensor Pinout
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin SCLK XA XB YB YA XY_LED REFA REFB OSC_IN GND OSC_OUT GND VDD R_BIN PD SDIO Description Serial port clock (input) XA quadrature output XB quadrature output YB quadrature output YA quadrature output LED control Internal reference Internal reference Oscillator input System ground Oscillator output System ground 5.0 volt power supply LED current bin resistor Power down pin, active high Serial data (input and output)
Figure 1. Top view.
REFA REFB 7 9 8 OSC_IN YA XY_LED 5 11 6 10 GND OSC_OUT YB 4 12 GND XA XB 2 3 16 SCLK 1 15 PD R_BIN SDIO
A2051 YYWW
14
13
VDD
YYWW
A2051
PIN 1 22.30 (0.878)
0.99 (0.039) 3.18 (0.125)
9.10 (0.358)
5.15 (0.203) LEAD WIDTH 0.50 (0.020) 1.42 (0.056) KAPTON TAPE 0.25 (0.010) 5° TYP. 6.17 (0.243) 12.34 (0.486) 6.02 (0.237) 13.38 (0.527) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. DIMENSIONAL TOLERANCE: ± 0.1 mm. 3. COPLANARITY OF LEADS: 0.1 mm. 4. LEAD PITCH TOLERANCE: ± 0.15 mm. 5. CUMULATIVE PITCH TOLERANCE: ± 0.15 mm. 6. ANGULAR TOLERANCE: ± 3.0 DEGREES. 7. MAXIMUM FLASH + 0.2 mm. 8. CHAMFER (25 DEGREES x 2) ON THE TAPER SIDE OF THE LEAD.
LEAD OFFSET 1.27 (0.050) 2.54 LEAD PITCH (0.100)
4.55 (0.179)
∅ 5.60 (0.220)
∅ 0.80 (0.032)
Figure 2. Package outline drawing.
2
Overview of Optical Mouse Sensor Assembly 2D Assembly Drawing of ADNS-2051 Figures 3 and 4, shown with HDNS-2100, HDNS-2200, and HLMP-ED80-XXXXX. Agilent Technologies provides an IGES file drawing describing the base plate molding features for lens and PCB alignment. The components interlock as they are mounted onto defined features on the base plate. The ADNS-2051 sensor is designed for mounting on a through hole PCB, looking down. There is an aperture stop and features on the package that align to the lens (see Figure 3). The HDNS-2100 lens provides optics for the imaging of the surface as well as illumination of the surface at the optimum angle. Features on the lens align it to the sensor, base plate, and clip with the LED. The lens also has a large round flange to provide a long creepage path for any ESD events that occur at the opening of the base plate (see Figure 4). The HDNS-2200 clip holds the LED in relation to the lens. The LED must be inserted into the clip and the LED’s leads formed prior to loading on the PCB. The clip interlocks the sensor to the lens, and through the lens to the alignment features on the base plate. The HLMP-ED80-XXXXX LED is recommended for illumination. If used with the bin table, sufficient illumination can be guaranteed.
1.27 (0.050) 2.32 (0.091) 40.53 (1.596) 39.39 (1.551) 30.32 (1.194)
∅ 3.50 (1.38)
5.10 (0.201)
12.60 (0.498)
11.38 (0.448)
13.88 (0.546)
0 REF. 1.28 (0.050) CLEAR ZONE 0 REF. ∅ 0.80 RECOMMENDED (16 PLACES) (0.031) 7.50 (0.295) 1.22 (0.048)
DIMENSIONS IN MILLIMETERS (INCHES)
Figure 3. Recommended PCB mechanical cutouts and spacing (top view).
TOP VIEW
44.29 (1.744)
+x
19.10 (0.752)
+y BASE PLATE ESD LENS RING
SIDE VIEW
PLASTIC SPRING CLIP
14.58 (0.574)
13.82 (0.544)
10.58 (0.417)
7.45 (0.293) PCB
SENSOR
BASE PLATE ALIGNMENT POST
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 4. 2D assembly drawing of ADNS-2051 (top and side view).
3
HDNS-2200 (CLIP)
HLMP-ED80-XXXXX (LED) ADNS-2051 (SENSOR)
CUSTOMER SUPPLIED PCB
HDNS-2100 (LENS)
CUSTOMER SUPPLIED BASE PLATE WITH RECOMMENDED ALIGNMENT FEATURES PER IGES DRAWING
Figure 5. Exploded view drawing.
PCB Assembly Considerations 1. Insert the sensor and all other electrical components into PCB. 2. Bend the LED leads 90° and then insert the LED into the assembly clip until the snap feature locks the LED base. 3. Insert the LED/clip assembly into PCB. 4. Wave Solder the entire assembly in a no-wash solder process utilizing solder fixture. The solder fixture is needed to protect the sensor during the solder process. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. The solder fixture is also used to
set the reference height of the sensor to the PCB top during wave soldering (Note: DO NOT remove the kapton tape during wave soldering). 5. Place the lens onto the base plate. 6. Remove the protective kapton tape from optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. It is recommended not to place the PCB facing up during the entire mouse assembly process. The PCB should be held vertically during the kapton removal process.
7. Insert PCB assembly over the lens onto the base plate aligning post to retain PCB assembly. The sensor aperture ring should self-align to the lens. 8. The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment. 9. Install mouse top case. There MUST be a feature in the top case to press down onto the clip to ensure all components are interlocked to the correct vertical height.
4
SCLK SERIAL PORT SDIO XA
QUADRATURE OUTPUT
OSC_IN SERIAL PORT OSCILLATOR OSC_OUT REFA
VOLTAGE REGULATOR AND POWER CONTROL
RESONATOR
POWER ON RESET
XB QUADRATURE OUTPUTS YA YB R_BIN LED XY_LED
REFB PD VDD GND GND
VOLTAGE REFERENCE
IMAGE PROCESSOR
LED DRIVE
5 VOLT POWER
Figure 6. Block diagram of ADNS-2051 optical mouse sensor.
Design Considerations for Improving ESD Performance The flange on the lens has been designed to increase the creepage and clearance distance for electrostatic discharge. The table on the right shows typical values assuming base plate construction per the Agilent supplied IGES file and HDNS-2100 lens flange.
Typical Distance Creepage Clearance
Millimeters 16.0 2.1
and therefore, cyanoacrylatebased adhesives or other adhesives that may damage the lens should NOT be used. The trimmed lens, HDNS2100#001, is not recommended for corded applications due to the ESD spec requirement.
For improved ESD performance, the lens flange can be sealed (i.e. glued) to the base plate. Note that the lens material is polycarbonate
SENSOR CLIP LED
PCB
LENS/LIGHT PIPE
BASE PLATE
SURFACE
Figure 7. PCB assembly.
5
Recommended Typical Application using SDIO Pins
4.7 µF 0.1 µF 11 VDD VPP D+
0.1 µF
13 VDD 12 10 GND GND
VDD D+ D1.3 kΩ GND GND QA SHLD VDD VDD QB
7 13
INTERNAL IMAGE SENSOR
HDNS-2100 LENS
HLMP-ED80-XXXXX
SURFACE XY_LED 6 9 CERAMIC RESONATOR 18 MHz 11 7 0.1 µF REFB R_BIN XA 2 XB 3 YB 4 YA 5 8 14 R1 VALUE (kΩ) R1 15.0 15.0 15.0 15.0 15.0 15.0 ~ 18.0 15.0 ~ 22.0 15.0 ~ 27.0 15.0 ~ 33.0 15.0 ~ 37.0 LED BIN K L M N P Q R S T U 2.2 µF AVX MURATA KBR-18-00-MSA CSALS18M0X55-B0
CYPRESS CY7C63723A-PC
12 D8 VREG
P0.4 18 P0.5 P0.6 P0.7 P0.3 P0.2 17 16 15 4 L 3 M 2 R BUTTONS
15 16
PD SDIO
OSC_IN
ADNS 2051
OSC_OUT
5 P1.0 14 P1.1
1
REFA SCLK
RΩ
Z-WHEEL ENCODER
1 Z LED
P0.0
P0.1
VSS 6 XTALOUT XTALIN
Figure 8. Application using SDIO pins.
Notes on Bypass Capacitors: • Caps for pins 7, 8 and 12, 13 MUST have trace lengths LESS than 5 mm. • The 0.1 µF caps must be ceramic. • Caps should have less than 5 nH of self inductance • Caps should have less than 0.2 Ω ESR Surface mount parts are recommended.
Regulatory Requirements • Passes FCC B and worldwide analogous emission limits when assembled into a mouse with unshielded cable and following Agilent recommendations. • Passes EN61000-4-4/IEC801-4 EFT tests when assembled into a mouse with unshielded cable and following Agilent recommendations. • UL flammability level UL94 V-0. • Provides sufficient ESD creepage/clearance distance to avoid
discharge up to 15 kV when assembled into a mouse according to usage instructions above. • For eye safety consideration, please refer to the technical report available on the web site, http://www.agilent.com • The 15.0 kΩ resistor is determined by the absolute maximum rating of 50 mA for the HLMP-ED80-XXXXX. The other resistor values for brighter bins will guarantee good signals with reduced power.
6
Alternative Application using Quadrature Output Pins
4.7 µF 1.5 MΩ 9 12 VDD CEXT
0.1 µF
13 VDD 12 10 GND GND
INTERNAL IMAGE SENSOR
HDNS-2100 LENS
HLMP-ED80-XXXXX
SURFACE XY_LED 6 9 CERAMIC RESONATOR 18 MHz AVX KBR-18-00-MSA MURATA CSALS18M0X55-B0
0.33 µF VDD D+ D– GND SHLD 6 MHz 11 6 M 19 R L 20 14 D+
CYPRESS CY7C63001A-PC
P0.1 2 P0.0 P0.2 P0.3 P1.1 XTALOUT P1.2 P0.5 P0.4 VSS VPP 7 8 P1.3 P1.0 1 3 4 16 15 5 2 3 4 5 15 1
XA XB YB
OSC_IN
ADNS-2051
OSC_OUT REFA 11 7
13 D– 10 XTALIN
YA PD SCLK REFB R_BIN 8 14
0.1 µF
2.2 µF
16 SDIO
R1 VALUE (kΩ) R1 15.0 15.0 15.0 15.0 15.0 15.0 ~ 18.0 15.0 ~ 22.0 15.0 ~ 27.0 15.0 ~ 33.0 15.0 ~ 37.0
LED BIN K L M N P Q R S T U
P0.6 17 P0.7 18
BUTTONS
PANASONIC EVQ SERIES ENCODER Z-WHEEL 1.5 kΩ 7.5 kΩ
D- RESISTOR CONNECTION ALTERNATIVE D- RESISTOR CONNECTION
3.3 V REGULATOR LP2950AC Z-3.3
Figure 9. Application using quadrature output pins.
Notes on Bypass Capacitors: • Caps for pins 7, 8 and 12, 13 MUST have trace lengths LESS than 5 mm. • The 0.1 µF caps must be ceramic. • Caps should have less than 5 nH of self inductance • Caps should have less than 0.2 Ω ESR Surface mount parts are recommended. SDIO and SCLK pins should be grounded if not used. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Lead Solder Temperature Supply Voltage ESD Input Voltage Input Voltage 7 Symbol TS TA Min. –40 –15 Max. 85 55 260 5.5 2 VDD + 0.5 3.6 Units ˚C ˚C ˚C V kV V V Notes
For 10 seconds, 1.6 mm below seating plane. All pins, human body model MIL 883 Method 3015 PD, SDIO, SCLK, XA, XB, YA, YB, XY_LED, R_BIN OSC_IN, OSC_OUT, REF_A
VDD
–0.5
VIN VIN
–0.5 –0.5
Recommended Operating Conditions Parameter Operating Temperature Power Supply Voltage Symbol TA VDD Min. 0 4.25 Typ. 5.0 Max. 40 5.5 Units ˚C volts Notes Register values retained for voltage transients below 4.25 V but greater than 4 V. Peak to peak within 0-100 MHz. Set by ceramic resonator.
Power Supply Rise Time Supply Noise Clock Frequency Serial Port Clock Frequency Resonator Impendance Distance from Lens Reference Plane to Surface Speed Acceleration Light Level onto IC SDIO Read Hold Time SDIO Serial Write-Write Time SDIO Serial Write-Read Time SDIO Serial Read-Write Time SDIO Serial Read-Read Time Data Delay after PD ←
VRT VN fCLK SCLK XRES Z S A IRRINC tHOLD tSWW tSWR tSRW tSRR tCOMPUTE 17.4 18.0
100 100 18.7 fCLK/4 55 2.5 14 0.15 25,000 30,000
ms mV MHz MHz Ω mm
2.3 0 80 100 100 100 100 120 120 3.2
2.4
SDIO Write Setup Time PD Pulse Width (to power down the chip) PD Pulse Width (to reset the serial port)
tSETUP tPDW
60 700
tPDR
100
Frame Rate Bin Resistor 8
FR R1 15 K
1500 15 K 37 K
Results in ±0.2 mm DOF. (See Figure 10.) in/sec @ frame rate = 1500/second. g @ frame rate = 1500/second. mW/m2 λ = 639 nm λ = 875 nm µs Hold time for valid data. (Refer to Figure 28.) µs Time between two write commands. (Refer to Figure 31.) µs Time between write and read operation. (Refer to Figure 32.) ns Time between read and write operation. (Refer to Figure 33.) ns Time between two read commands. (Refer to Figure 33.) ms After tCOMPUTE, all registers contain data from first image after PD . Note that an additional 75 frames for AGC (shutter) stabilization may be required if mouse movement occurred while PD was high. (Refer to Figure 12.) ns Data valid time before the rising of SCLK. (Refer to Figure 26.) µs Pulse width to initiate the power down cycle @ 1500 fps. (Refer to Figure 12 and Figure 14.) µs Pulse width to reset the serial port @ 1500 fps (but may also initiate a power down cycle. Normal PD recovery sequence to be followed. (Refer to Figure 15.) frames/s See Frame_Period register section. Ω Refer to Figure 8. ←
ADNS-2051
HDNS-2100
Z
OBJECT SURFACE
Figure 10. Distance from lens reference plane to surface.
AC Electrical Specifications Electrical Characteristics over recommended operating conditions. Typical values at 25˚C, VDD = 5.0 V, 1500 fps, 18 MHz. Parameter Power Down Symbol tPD Min. Typ. 700 Max. Units µs Notes From PD Time uncertainty due to firmware delay. (Refer to Figure 12.) From PD to valid quad signals 705 µsec + 75 frames. (Refer to Figure 12.) From VDD to valid quad signals 705 µsec + 40 frames CL = 30 pF (the rise time is between 10% and 90%) CL = 30 pF (the fall time is between 10% and 90%) CL = 30 pF (the rise time is between 10% and 90%) CL = 30 pF (the fall time is between 10% and 90%) With HLMP-ED80-XXXXX LED (the rise time is between 10% and 90%) With HLMP-ED80-XXXXX LED (the fall time is between 10% and 90%) Serial port will reset if current transaction is not complete within tSPTT. (Refer to Figure 36.) Max. supply current during a VDD ramp from 0 to 5.0 V with > 500 µs rise time. Does not include charging current for bypass capacitors. ← ← ←
Power Up from VDD
←
Power Up from PD
tPUPD
50
ms
Rise and Fall Times:
XA, XB, YA, YB
Serial Port Transaction Timer
Transient Supply Current
← SDIO ILED
tPU
30
ms
tr tf tr tf tr
30 16 50 20 40
ns ns ns ns ns
tf
200
ns
tSPTT
0.7
0.9
1.0
s
IDDT
20
37
mA
9
DC Electrical Specifications Electrical Characteristics over recommended operating conditions. Typical values at 25˚C, VDD = 5.0 V, 18 MHz. Parameter DC Supply Current (mouse moving) Peak Supply Current (mouse moving) DC Supply Current (mouse not moving) DC Supply Current (power down) SCLK, SDIO, PD Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Output Low Voltage (XA, XB, YA, YB) Output High Voltage (XA, XB, YA, YB) Output Low Voltage (XY_LED) XY LED Current XY LED Current (fault mode) REF_A (normal mode) REF_A (power down mode) Symbol IDD AVG Min. Typ. 15 Max. 25 Units mA Notes No load on XA, XB, YA, YB, SCLK, SDIO. Excluding LED current. No load on XA, XB, YA, YB, SCLK, SDIO. Excluding LED current. No load on XA, XB, YA, YB, SCLK, SDIO. Excluding LED current. PD = high; SCLK, SDIO = GND or VDD; V DD = 4.25 V to 5.25 V.
IDD PEAK
20
mA
IDD
12
25
mA
IDDPD
170
240
µA
VIL VIH VOL VOH VOL VOH VOL ILED ILED VREFA VREFA
0.8 0.5 * VDD 0.7 0.6 * VDD 0.4 0.6 * VDD 1.1 Typ–15% 630/R1
V V V V V V V
@ IOL = 2 mA (SDIO only) @ IOH = 2 mA (SDIO only) @ IOL = 0.5 mA. @ IOH = 0.5 mA . Refer to Figure 11. Refer to Figure 11, see table below. R1 < 200 Ω. 1.5 KΩ to 3.0 V or GND, PD = low. 1.5 KΩ to 3.0 V or GND, PD = high.
Typ + 15% A 500 µA V V
3.3 3.3
100
Typical LED Current Table R1 Value LED current (typical) kΩ mA 15 42 18 35 22 29 27 23 33 19 37 17
NORMALIZED ILED – %
80 60
40
20 R = 15 k R = 30 k 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
VOL (V)
Figure 11. Typical I-V characteristic of ADNS-2051 XY_LED pin.
10
PD Pin Timing
PD
IDD 75 FRAMES tpd 705 µs tpupd tCOMPUTE (SEE FIGURE 15)
Figure 12. PD timing normal mode.
PD
I LED
PD
SCLK
tPDW 700 µs
REGISTER READ OPERATION tCOMPUTE
(POWER DOWN)
Figure 13. PD timing sleep mode.
Figure 14. PD minimum pulse width.
PD OSCILLATOR START 250 µs LED CURRENT RESET COUNT 455 µs INITIALIZATION 2410 µs NEW ACQUISITION
SCLK 705 µs OPTIONAL SPI TRANSACTIONS WITH OLD IMAGE DATA tCOMPUTE SPI TRANSACTIONS WITH NEW IMAGE DATA AT DEFAULT FRAME RATE
Figure 15. Detail of PD falling edge timing.
Quadrature Mode Timing The output waveforms emulate the output from encoders. With the resolution set to 400 cpi, from one to five quadrature states can exist within one frame time. The minimum state time is 133 µs. If the resolution is 11
800 cpi, then up to ten quadrature states can exist within a frame time. If the motion within a frame is greater than these values, the extra motion will be reported in the next frame. The following diagrams (see Figures 16, 17, and 18) show the timing
for positive X motion, to the right or positive Y motion, up. If a power down via the PD pin occurs during a transfer, the transfer will resume after PD is de-asserted. The timing for that quadrature state will be increased by the length of the PD time.
X MOTION TO THE RIGHT Y MOTION UP XA/YA FIVE OR MORE XB/YB 133 µs 133 µs 133 µs 133 µs 133 µs
XA/YA FOUR XB/YB 133 µs 133 µs 133 µs 267 µs
XA/YA THREE XB/YB 133 µs 133 µs 400 µs
XA/YA TWO XB/YB 133 µs 533 µs
XA/YA ONE XB/YB 667 µs
~ 667µs @ 1500 FRAMES/SECOND
ONE FRAME
Figure 16. Quadrature states per frame (400 cpi mode).
12
X MOTION TO THE RIGHT Y MOTION UP
XA/YA TEN OR MORE XB/YB 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs
XA/YA NINE XB/YB 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 133 µs
XA/YA EIGHT XB/YB 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 200 µs
XA/YA SEVEN XB/YB 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 266 µs
XA/YA SIX XB/YB 66.7 µs 66.7 µs 66.7 µs 66.7 µs 66.7 µs 333 µs
~ 667µs @ 1500 FRAMES/SECOND
ONE FRAME
Figure 17. Quadrature states per frame (800 cpi mode).
13
X MOTION TO THE RIGHT Y MOTION UP XA/YA FIVE XB/YB 66.7 µs 66.7 µs 66.7 µs 66.7 µs 400 µs
XA/YA FOUR XB/YB 66.7 µs 66.7 µs 66.7 µs 476 µs
XA/YA THREE XB/YB 66.7 µs 66.7 µs
XA/YA TWO XB/YB 66.7 µs
XA/YA ONE XB/YB
~ 667µs @ 1500 FRAMES/SECOND
ONE FRAME
Figure 18. Quadrature states per frame (800 cpi mode).
14
Quadrature State Machine The following state machine shows the states of the quadrature pins. The two things to note are that while the PD pin is asserted, the state machine is halted. Once PD is de-asserted, the state machine picks up from where it left off. State 0 is entered after a power up reset.
PD STATE 0
+1 STATE 2 -1
PD X AND Y OUTPUT A 0 0 1 1 B 0 1 0 1
STATE +1 -1 -1 +1 0 1 2 3 PD
-1 STATE 1 PD +1 STATE 3
Figure 19. Quadrature state machine.
Quadrature Output Waveform The two channel quadrature outputs are 5.0 volt CMOS outputs. The ∆ x count is used to generate the XA and XB signals, and ∆y count is used for the YA and YB signals.
XA LEFT MOTION (-DIRECTION) XB -1 -1 -1 -1 MOTION COUNT
YA DOWN MOTION (- DIRECTION) YB -1 -1 -1 -1 MOTION COUNT
XA RIGHT MOTION (+ DIRECTION) XB +1 +1 +1 +1 MOTION COUNT
YA UP MOTION (+ DIRECTION) YB +1 +1 +1 +1 MOTION COUNT
Figure 20. Quadrature output waveform.
15
Typical Performance Characteristics Performance characteristics over recommended operating conditions. Typical values at 25°C, VDD = 5.0 V, 18 MHz. Parameter Path Error (Deviation) Symbol PERROR Min. Typ. 0.5 Max. Units % Notes Path Error (Deviation) is the error from the ideal cursor path. It is expressed as a percentage of total travel and is measured over standard surfaces.
The following graphs (Figures 21, 22, 23, and 24) are the typical performance of the ADNS-2051 sensor, assembled as shown in the 2D assembly drawing with the HDNS-2100 Lens/Prism, the HDNS-2200 clip, and the HLMP-ED80-XXXXX LED (page 3, Figure 4).
TYPICAL RESOLUTION vs. HEIGHT 500 450 COUNTS PER INCH 350 300 250 200 150 100 50 0
RELATIVE RESPONSE
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 800 900 1000
Z
400
DOF DOF RECOMMENDED OPERATING REGION WHITE PAPER MANILA FOLDER BURL FORMICA DARK WALNUT BLACK COPY
-50 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 HEIGHT – mm (2.4 = NOMINAL FOCUS)
WAVELENGTH (nm)
Figure 21. Typical resolution vs. Z (comparative surfaces).[2,3]
Figure 22. Wavelength responsitivity.[1]
TYPICAL RESOLUTION vs. HEIGHT AT DIFFERENT LED CURRENT LEVELS [BRIGHTNESS] (MANILA FOLDER) 450 400
Z
TYPICAL RESOLUTION vs. HEIGHT AT DIFFERENT LED CURRENT LEVELS [BRIGHTNESS] (BLACK COPY) 450 400 350
COUNTS PER INCH
350
COUNTS PER INCH
DOF DOF
300 250 200 150 100 50
300 250 200 150 100 50 0
RECOMMENDED OPERATING REGION Z DOF DOF
RECOMMENDED OPERATING REGION
100% 75% 50%
100% 75% 50%
0 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 HEIGHT – mm (2.4 = NOMINAL FOCUS)
-50 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 HEIGHT – mm (2.4 = NOMINAL FOCUS)
Figure 23. Typical resolution vs. z (manila folder and LED variation).[2,3]
Figure 24. Typical resolution vs. z (black copy and LED variation).[2,3]
Note: 1. The ADNS-2051 is designed for optimal performance when used with the HLMP-ED80-XXXXX (red LED 639 nm). For use with other LED colors (i.e., blue, green), please consult factory. When using alternate LEDs, there may also be performance degradation and additional eye safety considerations. 2. Z = Distance from Lens Reference plane to Surface. 3. DOF = Depth of Field.
16
Synchronous Serial Port The synchronous serial port is used to set and read parameters in the ADNS-2051, and can be used to read out the motion information instead of the quadrature data pins. The port is a two wire, half duplex port. The host micro-controller always initiates communication; the ADNS-2051 never initiates data transfers.
SCLK: The serial port clock. It is always generated by the master (the microcontroller). SDIO: PD: The data line. A third line is sometimes involved. PD (Power Down) is usually used to place the ADNS-2051 in a low power mode to meet USB suspend specification. PD can also be used to force re-synchronization between the micro-controller and the ADNS-2051 in case of an error.
Write Operation Write operations, where data is going from the micro-controller to the ADNS-2051, is always initiated by the micro-controller and consists of two bytes. The first byte contains the address (seven bits) and has a “1” as its MSB to indicate data direction. The second byte contains the data. The transfer is synchronized by SCLK. The micro-controller changes SDIO on falling edges of SCLK. The ADNS-2051 reads SDIO on rising edges of SCLK.
SCLK CYCLE # SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
SDIO
1
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
DON'T CARE
SDIO DRIVEN BY MICRO-CONTROLLER
Figure 25. Write operation.
120 ns 120 ns
SCLK
SDIO 120 ns, MIN. tsetup = 60 ns, MIN.
Figure 26. SDIO setup and hold times SCLK pulse width.
17
Read Operation A read operation, which means that data is going from the ADNS-2051 to the microcontroller, is always initiated by the micro-controller and consists of two bytes. The first byte contains the address, is written by the micro-controller, and has a “0” as its MSB to indicate data
direction. The second byte contains the data and is driven by the ADNS-2051. The transfer is synchronized by SCLK. SDIO is changed on falling edges of SCLK and read on every rising edge of SCLK. The micro-controller must go to a high Z state after the last address data bit. The ADNS-2051 will go to the high Z state after
the last data bit (see detail “B” in Figure 28). One other thing to note during a read operation is that SCLK will need to be delayed after the last address data bit to ensure that the ADNS-2051 has at least 100 µs to prepare the requested data. This is shown in the timing diagrams below.
SCLK CYCLE # SCLK SDIO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
0
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SDIO DRIVEN BY MICRO-CONTROLLER DETAIL "A"
SDIO DRIVEN BY ADNS-2051 DETAIL "B"
Figure 27. Read operation.
120 ns, MAX. DETAIL "A" tHOLD 100 µs, MIN. SCLK MICROCONTROLLER TO ADNS-2051 SDIO HANDOFF SDIO A1 60 ns, MIN. A0 120 ns, MIN. 0 ns, MIN. Hi-Z D7 0 ns, MIN. 120 ns, MAX. D6
Figure 28. Microcontroller to ADNS-2051 SDIO handoff.
DETAIL "B"
120 ns, MIN. SCLK
ADNS-2051 TO MICROCONTROLLER SDIO HANDOFF SDIO D0
10 ns, MAX. R/W BIT OF NEXT ADDRESS
RELEASED BY 2051
DRIVEN BY MICRO
Figure 29. ADNS-2051 to microcontroller SDIO handoff.
Note: The 120 ns high state of SCLK is the minimum data hold time of the ADNS-2051. Since the falling edge of SCLK is actually the start of the next read or write command, the ADNS-2051 will hold the state of D0 on the SDIO line until the falling edge of SCLK. In both write and read operations, SCLK is driven by the micro-controller. Serial port communications is not allowed while PD (power down) is high. See “Error Detection and Recovery” regarding re-synchronizing via PD. 18
Forcing the SDIO Line to the Hi-Z State There are times when the SDIO line from the ADNS-2051 should be in the Hi-Z state. If the microprocessor has completed a write to the ADNS-2051, the SDIO line is Hi-Z, since the SDIO pin is still configured as an input. However, if the last operation from the microprocessor was a read, the ADNS-2051 will hold the D0 state on SDIO until a falling edge of SCLK.
To place the SDIO pin into the Hi-Z state, raise the PD pin for 100 µs (min). The PD pin can stay high, with the ADNS-2051 in the shutdown state, or the PD pin can be lowered, returning the ADNS-2051 to normal operation. The SDIO line will now be in the Hi-Z state.
100 µs
PD
SDIO
Hi-Z
Figure 30. SDIO Hi-Z state and timing.
Required timing between Read and Write Commands (tsxx) There are minimum timing requirements between read and write commands on the serial port.
tSWW >100 µs
If the rising edge of the SCLK for the last data bit of the second write command occurs before the 100 microsecond required delay, then the first write command may not complete correctly.
SCLK ADDRESS DATA ADDRESS DATA
WRITE OPERATION
WRITE OPERATION
Figure 31. Timing between two write commands.
tSWR >100 µs
If the rising edge of SCLK for the last address bit of the read command occurs before the 100 microsecond required delay, then the write command may not complete correctly.
•••
SCLK ADDRESS DATA ADDRESS
•••
WRITE OPERATION
NEXT READ OPERATION
Figure 32. Timing between write and read commands.
19
The falling edge of SCLK for the first address bit of either the read or write command must be at least 120 ns after the last SCLK rising edge of the last data bit of the previous read operation.
tHOLD >100 µs
tSRW, tSRR >120 ns
•••
SCLK ADDRESS READ OPERATION DATA ADDRESS
•••
NEXT READ OR WRITE OPERATION
Figure 33. Timing between read and either write or subsequent read commands.
SCLK DATA PD >1 µs
Figure 34. Timing between SCLK and PD rising edge.
20
Error Detection and Recovery 1. The ADNS-2051 and the micro-controller might get out of synchronization due to ESD events, power supply droops or micro-controller firmware flaws. In such a case, the micro-controller should raise PD for 100 µs. The ADNS-2051 will reset the serial port but will not reset the registers and be prepared for the beginning of a new transmission. 2. The ADNS-2051 has a transaction timer for the serial port. If the sixteenth SCLK rising edge is spaced more than approximately 0.9 seconds from the first SCLK edge of the current transaction, the serial port will reset. 3. Invalid addresses: – Writing to an invalid address will have no effect. Reading from an invalid address will return all zeros. 4. Collision detection on SDIO – The only time that the ADNS-2051 drives the SDIO line is during a READ operation. To avoid data collisions, the microcontroller should relinquish SDIO before the falling edge of SCLK after the last
address bit. The ADNS-2051 begins to drive SDIO after the next rising edge of SCLK. The ADNS-2051 relinquishes SDIO within 120 ns of the falling SCLK edge after the last data bit. The microcontroller can begin driving SDIO any time after that. In order to maintain low power consumption in normal operation or when the PD pin is pulled high, the micro-controller should not leave SDIO floating until the next transmission (although that will not cause any communication difficulties). 5. In case of synchronization failure, both the ADNS-2051 and the micro-controller may drive SDIO. The ADNS-2051 can withstand 30 mA of short circuit current and will withstand infinite duration short circuit conditions. 6. Termination of a transmission by the micro-controller may sometimes be required (for example, due to a USB suspend interrupt during a read operation). To accomplish this the micro-controller should raise PD. The ADNS-2051 will not write to any register and will reset the serial port (but
nothing else) and be prepared for the beginning of future transmissions after PD goes low. 7. The micro-controller can verify success of write operations by issuing a read command to the same address and comparing written data to read data. 8. The micro-controller can verify the synchronization of the serial port by periodically reading the product ID register.
Notes on Power up and the Serial Port The sequence in which VDD, PD, SCLK, and SDIO are set during powerup can affect the operation of the serial port. The diagram below shows what can happen shortly after powerup when the microprocessor tries to read data from the serial port. This diagram shows the VDD rising to valid levels, at some point the microcontroller starts its program, sets the SCLK and SDIO lines to be outputs, and sets them high. It then waits to ensure that the ADNS-2051 has powered up and is ready to communicate. The microprocessor then tries to read from location 0x00, Product_ID,
VDD
PD
SCLK ADDRESS = 0x00 SDIO DATA = 0x02
PROBLEM AREA
Figure 35. Power up serial port watchdog timer sequence.
21
and is expecting a value of 0x02. If it receives this value, it then knows that the communication to the ADNS-2051 is operational. The problem occurs if the ADNS-2051 powers up before the microprocessor sets the SCLK and SDIO lines to be outputs and high. The ADNS-2051 sees the raising of the SCLK as a valid rising edge, and clocks in the state of the SDIO as the first bit of the address (sets either a read or a write depending upon the state). In the case of SDIO low, then a read operation has started. When the microprocessor begins to actually send the address, the ADNS-2051 already has the first bit of an address. When the seventh bit is sent by the micro, the ADNS-2051 has a valid address, and drives the SDIO line high within 120 ns (see detail “A” in Figure 27 and Figure 28). This results in a bus fight for SDIO. Since the address is wrong, the data sent back will be incorrect. In the case of SDIO high, a write operation is started. The address and data are out of synchronization, and the wrong data will be written to the wrong address. Two Solutions There are two different ways to solve the problem, waiting for the serial port watchdog timer to time out, or using the PD line to reset the serial port.
1. Serial Port Watchdog Timer Timeout
VDD > tSPTT PD
SCLK ADDRESS = 0x00 SDIO DATA = 0x02
Figure 36. Power up serial port watchdog timer sequence.
If the microprocessor waits at least t SPTT from VDD valid, it will ensure that the ADNS-2051 has powered up and the watchdog timer has timed out. This assumes that the microprocessor and the ADNS-2051 share the same power supply. If not, then the microprocessor must wait tSPTT from ADNS-2051 VDD valid. Then when the SCLK toggles for the address, the ADNS-2051 will be in sync with the microprocessor. 2. PD Sync
4 ms
VDD
PD
SCLK ADDRESS = 0x00 SDIO DATA = 0x02
Figure 37. Power up serial port PD sync sequence.
The PD line can be used to resync the serial port. If the microprocessor waits for 4 ms from V DD valid, and then outputs a valid PD pulse (see Figure 15), then the serial port will be ready for data.
Resync Note If the microprocessor and the ADNS-2051 get out of sync, then the data either written or read from the registers will be incorrect. An easy way to solve this is to output a PD pulse to resync the parts after an incorrect read.
22
SPI communication code for the Cypress CY7C63000 or CY7C63001 (Please consult factory for the CY7C63722 or CY7C63723 codes.)
Note: This programming sequence is not covered in Agilent's product warranty. It is only a recommended example when using the mentioned Cypress microcontrollers. For the latest updates on Cypress microcontrollers, please contact Cypress at email: usbapps@cypress.com or call (858) 613-7929 (US).
The following code can be used to implement the SPI data communications. See the schematic in Figure 9.
; ; ; ; ; ; Notes:
CY7C63001 20pin package ADNS-2051 SDIO line connected to pin5 (P1.0) PD connected to pin 16 (P1.1) SCLK line connected to pin15 (P1.3) 01h 05h 09h ; GPIO data port 1 ; Interrupt enable for port 1 ; Pullup resistor control for port 1
; I/O port Port1_Data: equ Port1_Interrupt: equ Port1_Pullup: equ
; ; Port bit definitions SDIO: equ 01h PD: equ 02h SCLK: equ 08h Pt1_Current: equ 00h ; ; GPIO Isink registers Port1_Isink: equ 38h Port1_Isink0: equ 38h Port1_Isink1: equ 39h Port1_Isink3: equ 3Bh ; ; ; data memory variables spi_addr: equ 40h spi_data: equ 41h bit_counter: equ 44h port1_wrote: equ 45h ; ; ; ; initialize Port 1 mov A, Pt1_Current iowr Port1_Isink0 iowr Port1_Isink1 iowr Port1_Isink3 mov A, 0h iowr Port1_Pullup mov A, ~(PD|SDIO) mov [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data mov A, 0 iowr Port1_Interrupt ; ; ; ; There are possible instructionsbefore It is assumed that These instructions
; ; ; ;
bit 0 bit 1 bit 3 port1 current setting
; ; ; ;
address data of SPI bit what we
of spi writes spi writes counter wrote last
; ; ; ;
select DAC setting isink current Port 1 bit[0] isink current Port 1 bit[1] isink current Port 1 bit[3]
; enable Port 1 bit [7:0] pullups ; turn on the ADNS-2051 ; PD low, SCLK, SDIO ; disable port 1 interrupts
problems with the SPI port if the microcontroller starts executing the ADNS-2051 sensor has powered up. See page 18 for details. power to the microcontroller is OK if the next instructions can be executed. will reset the SPI port of the sensor.
Resync_sensor:
mov A,~(SCLK|SDIO|PD) ; set the SCLK, SDIO and PD lines low and [port1_wrote], A mov A, [port1_wrote]
23
iowr Port1_Data
; If the power to the sensor needs more time ; to stabilize, insert a delay here ; wait about 4 milliseconds for the sensor ; oscillator to stabilize
call call call call call call
delay700us delay700us delay700us delay700us delay700us delay700us
mov A, (SCLK|SDIO|PD or [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data call delay700us mov A, ~PD and [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data call call call call call call ; ; ; ; ; ; ; ; ; ; ; ; ReadSPI routine delay700us delay700us delay700us delay700us delay700us delay700us
; set the SCLK, SDIO and PD lines high ; this shuts down the oscillator and ; resets the SPI port ; wait for the PD to reset the part ; set the PD line low to put the sensor ; back into normal operation
; wait about 4 milliseconds for the sensor ; oscillator to stabilize
; sensor SPI port now in sync
Includes delays for long traces or cables between the uP and ADNS-2051 Has correct timing of SCLK and SDIO On entry: spi_addr = Address of SPI register in the ADNS-2051 spi_data = undefined On exit spi_addr = undefined spi_data = register contents from ADNS-2051 mov mov nop nop nop nop nop nop dec jnz A, 64 [bit_counter], A ; wait 200us (optional) ; (about 3us per loop)
ReadSPI: Waitrspi:
[bit_counter] Waitrspi ; read address ; lower MSB of address (read) ; wait 200us (about 3us per loop)(100us minimum required) ; wait for data to be ready
mov A,~80h and [spi_addr], A call writeaddr mov mov nop nop nop nop nop nop dec jnz A,64 [bit_counter], A
Waitrspi2:
[bit_counter] Waitrspi2
24
nextr:
rd1: rdx:
mov A, 0h mov [spi_data], A mov A, 08h mov [bit_counter], A mov A, SDIO or [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data mov A, ~SCLK and [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data nop nop nop nop nop nop nop mov A,[spi_data] asl mov [spi_data], A iord Port1_Data and A, SDIO jz rdx mov A, 01h or [spi_data], A mov A, SCLK or [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data nop nop nop nop nop nop nop dec [bit_counter] jnz nextr ret
; clear the data
; write a 1 to SDIO ; lower SCLK
; ; ; ; ;
wait for cable to settle if ADNS-2051 is connected to IC via short PCB traces, then the number of NOPs can reduced or eliminated
; shift next bit ; shift next bit ; read SDIO
; raise SCLK
; wait for cable to settle
; ; ; ; ; ; ; ; ; ; ; ;
WriteSPI routine Includes delays for long traces or cables between the uP and ADNS-2051. Has correct timing of SCLK and SDIO On entry: spi_addr = Address of SPI register in the ADNS-2051 spi_data = Data to be written to the SPI register On exit spi_addr = undefined spi_data = undefined mov mov nop nop nop nop nop nop dec jnz A, 64 [bit_counter], A ; wait 200us (optional) ; about 3us per loop
WriteSPI: Waitspi:
[bit_counter] Waitspi ; write address
mov A, 80h
25
or [spi_addr], A call writeaddr jmp wrdata writeaddr: nexta: mov A, 08h mov [bit_counter], A mov A, ~SCLK and [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data mov A, [spi_addr] asl mov [spi_addr], A jnc addr0 mov A, SDIO or [port1_wrote], A jmp addrx mov A, ~SDIO and [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data nop nop nop nop nop nop nop mov A, SCLK or [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data nop nop nop nop nop nop nop dec [bit_counter] jnz nexta ret mov A, 08h mov [bit_counter], A mov A, ~SCLK and [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data mov A, [spi_data] asl mov [spi_data], A jnc wr0 mov A, SDIO or [port1_wrote], A jmp wrx mov A, ~SDIO and [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data nop nop nop nop nop nop nop mov A, SCLK
; set MSB of address (write)
; 8 bits to shift out ; lower SCLK
; shift next bit
addr1: addr0: addrx:
; raise SDIO ; lower SDIO ; wait for cable to settle
; raise SCLK ; ADNS-2051 reads the address bit ; wait for cable to settle
wrdata: nextw:
; 8 bits of data ; lower SCLK
; shift next bit
wr1: wr0: wrx:
; raise SDIO ; lower SDIO ; wait for cable to settle
; raise SCLK
26
or [port1_wrote], A mov A, [port1_wrote] iowr Port1_Data nop nop nop nop nop nop nop dec [bit_counter] jnz nextw ret delay700us: waitd0: mov A, ffh mov [bit_counter], A nop nop nop nop nop nop dec [bit_counter] jnz waitd0 ret
; ADNS-2051 reads the data bit ; wait for cable to settle
; wait for 710us ; reuse bit_counter
; 2us
Example calling syntax
; ; ; ; WriteSPI Set register 0a to 40h, LED blink mode mov A, 0ah mov [spi_addr], A mov A, 40h mov [spi_data], A call WriteSPI ; ; ; ; ; ; ; ; ; ; move address into A move address into spi_addr move data into A move data into spi_data call WriteSPI routine, on return, spi_addr and spi_data will be undefined
ReadSPI Read register 02h, the motion register mov A, 02h mov [spi_addr], A call ReadSPI ; ; ; ; move address into A move address into spi_addr call ReadSPI, on return, data is in spi_data, spi_addr is undefined
27
Registers The ADNS-2051 can be programmed through registers, via the serial port, and configuration and motion data can be read from these registers. Address 0x00 0x01 0x02 0x03 0x04 0x05 Register Product_ID Revision_ID Motion Delta_X Delta_Y SQUAL Address 0x06 0x07 0x08 0x09 0x0a 0x0b Register Average_Pixel Maximum_Pixel Reserved Reserved Configuration_bits Reserved Address 0x0c 0x0d 0x0e 0x0f 0x10 0x11 Register Data_Out_Lower Data_Out_Upper Shutter_Lower Shutter_Upper Frame_Period_Lower Frame_Period_Upper
Product_ID Address: 0x00 Access: Read Reset Value: 0x02 Bit 7 6 5 4 3 2 Field PID7 PID6 PID5 PID4 PID3 PID2 Data Type: Eight bit number with the product identifier.
1 PID1
0 PID0
USAGE: The value in this register does not change, it can be used to verify that the serial communications link is OK.
Revision_ID Address: 0x01 Access: Read Reset Value: 0xNN Bit 7 6 5 4 3 2 Field RID7 RID6 RID5 RID4 RID3 RID2 Data Type: Eight bit number with current revision of the IC.
1 RID1
0 RID0
USAGE: NN is a value between 00 and FF which represent the current design revision of the device.
Motion Access: Read Bit 7 Field MOT Data Type: Bit field
6 Reserved
Address: 0x02 Reset Value: 0x00 5 4 FAULT OVFY
3 OVFX
2 Reserved
1 Reserved
0 RES
USAGE: Register 0x02 allows the user to determine if motion has occurred since the last time it was read. If so, then the user should read registers 0x03 and 0x04 to get the accumulated motion. It also tells if the motion buffers have overflowed and whether or not an LED fault occurred since the last reading. The current resolution is also shown.
28
Field Name MOT
Reserved FAULT
OVFY
OVFX
Reserved Reserved RES
Description Motion since last report or PD 0 = No motion 1 = Motion occurred, data ready for reading in Delta_X and Delta_Y registers Reserved for future LED Fault detected – set when R_BIN is too low or too high, shorts to VDD or Ground 0 = No fault 1 = Fault detected Motion overflow Y, ∆ Y buffer has overflowed since last report 0 = No overflow 1 = Overflow has occurred Motion overflow X, ∆X buffer has overflowed since last report 0 = No overflow 1 = Overflow has occurred Reserved for future Reserved for future Resolution in counts per inch 0 = 400 1 = 800
Notes for Motion: 1. Reading this register freezes the Delta_X and Delta_Y register values. Read this register before reading the Delta_X and Delta_Y registers. If Delta_X and Delta_Y are not read before the motion register is read a second time, the data in Delta_X and Delta_Y will be lost. 2. Agilent RECOMMENDS that registers 0x02, 0x03 and 0x04 be read sequentially. 3. Internal buffers can accumulate more than eight bits of motion for X or Y. If either one of the internal buffers overflows, then absolute path data is lost, and the OVFX or OVFY bit is set. These bits (OVFX and OVFY) are cleared once some motion has been read from the Delta_X and Delta_Y registers, and if the buffers are not at full scale. Since more data is present in the buffers, the cycle of reading the Motion, Delta_X and Delta_Y registers should be repeated until the motion bit (MOT) is cleared. Until MOT is cleared, either the Delta_X or Delta_Y registers will read either positive or negative full scale. If the motion register has not been read for a long time, at 400 cpi it may take up to 16 read cycles to clear the buffers, at 800 cpi, up to 32 cycles. 4. FAULT is a sticky bit that is cleared by reading the Motion register. It signifies that an LED fault has occurred since the last time the motion register was read. Once an LED fault has cleared, the hardware will drive the LED normally.
Delta_X Address: 0x03 Access: Read Reset Value: 0x00 Bit 7 6 5 4 3 2 Field X7 X6 X5 X4 X3 X2 Data Type: Eight bit 2‘s complement number.
1 X1
0 X0
USAGE: X movement is counts since last report. Absolute value is determined by resolution. Reading clears the register.
MOTION
-128
-127
-2
-1
0
+1
+2
+126
+127
DELTA_X
80
81
FE
FF
00
01
02
7E
7F
29
Delta_Y Address: 0x04 Access: Read Reset Value: 0x00 Bit 7 6 5 4 3 2 Field Y7 Y6 Y5 Y4 Y3 Y2 Data Type: Eight bit 2‘s complement number.
1 Y1
0 Y0
USAGE: Y movement is counts since last report. Absolute value is determined by resolution. Reading clears the register.
MOTION -128 -127 -2 -1 0 +1 +2 +126 +127
DELTA_Y
80
81
FE
FF
00
01
02
7E
7F
Surface_Quality Access: Read Bit 7 6 Field SQ7 SQ6 Data Type: Eight bit number.
5 SQ5
Address: 0x05 Reset Value: 0x00 4 3 2 SQ4 SQ3 SQ2
1 SQ1
0 SQ0
USAGE: SQUAL is a measure of the number of features visible by the sensor in the current frame. The maximum value is 255. Since small changes in the current frame can result in changes in SQUAL, variations in SQUAL when looking at a surface are expected. The graph below shows 250 sequentially acquired SQUAL values, while a sensor was moved slowly over white paper. SQUAL is nearly equal to zero, if there is no surface below the sensor.
SQUAL VALUES (WHITE PAPER) 256
SQUAL VALUE
192 128 64 0
0
25
50
75
100
125
150
175
200
225
250
NORMALIZED SQUAL COUNTS
The focus point is important and could affect the squal value, the graph below showing another setup with various z-height. The graph clearly shows that the squal count is dependent on focus distance. Note: This graph is obtained by getting multiple readings over different heights.
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0
-1.0 -0.8 -0.5 -0.3 0 0.25 0.5 0.75 1.0
X+ 3σ X X – 3σ
DELTA FROM NOMINAL FOCUS (mm)
Figure 38. Typical mean squal vs. Z (white paper).
30
Average_Pixel Access: Read Bit 7 6 Field 0 0 Data Type: Six bit number.
5 AP5
Address: 0x06 Reset Value: 0x00 4 3 2 AP4 AP3 AP2
1 AP1
0 AP0
USAGE: Average Pixel value in current frame. Minimum value = 0, maximum = 63. The average pixel value can be adjusted every frame. Shown below is a graph of 250 sequentially acquired average pixel values, while the sensor was moved slowly over white paper.
AVERAGE PIXEL (WHITE PAPER)
AVERAGE PIXEL VALUE
64 48 32 16 0
0
25
50
75
100
125
150
175
200
225
250
Maximum_Pixel Access: Read Bit 7 6 Field 0 0 Data Type: Six bit number.
5 MP5
Address: 0x07 Reset Value: 0x00 4 3 2 MP4 MP3 MP2
1 MP1
0 MP0
USAGE: Maximum Pixel value in current frame. Minimum value = 0, maximum value = 63. The maximum pixel value can be adjusted every frame. Shown below is a graph of 250 sequentially acquired maximum pixel values, while the sensor was moved slowly over white paper.
MAXIMUM PIXEL (WHITE PAPER)
MAXIMUM PIXEL VALUE
64 48 32 16 0
0
25
50
75
100
125
150
175
200
225
250
Reserved Reserved
Address: 0x08 Address: 0x09
31
Configuration_bits Access: Read/Write Bit 7 Field RESET Data Type: Bit field
6 LED_MODE
Address: 0x0a Reset Value: 0x00 5 4 Sys Test RES
3 PixDump
2 Reserved
1 Reserved
0 Sleep
USAGE: Register 0x0a allows the user to change the configuration of the sensor. Shown below are the bits, their default values, and optional values.
Field Name RESET
LED_MODE
Sys Test
Description Power up defaults (bit always reads 0) 0 = No effect 1 = Reset registers and bits to power up default settings (bold entries) LED Shutter Mode 0 = Shutter mode off (LED always on) (even if no motion up to 1 sec.) 1 = Shutter mode on (LED only on when the electronic shutter is open) System Tests (bit always reads 0) 0 = No tests 1 = perform all system tests, output 16 bit CRC via Data_Out_Upper and Data_Out_Lower registers.
RES
Pix Dump
Reserved Reserved Sleep
Note: Since part of the system test is a RAM test, the RAM will be overwritten with the default values when the test is done. If any configuration changes from the default are needed for operation, make the changes AFTER the system test is run. This operation requires substantially more time to complete than other register transactions. Resolution in counts per inch 0 = 400 1 = 800 Dump the pixel array through Data_Out_Upper and Data_Out_Lower, 256 bytes 0 = disabled 1 = dump pixel array Reserved Reserved Sleep Mode 0 = Normal, fall asleep after one second of no movement (1500 frames/s) 1 = Always awake
Address: 0x0b
Reserved
32
Data_Out_Lower Access: Read Bit 7 Field DO7
6 DO6
5 DO5
Address: 0x0c Reset Value: undefined 4 3 2 1 DO4 DO3 DO2 DO1
0 DO0
Data_Out_Upper Access: Read Bit 7 6 5 Field DO15 DO14 DO13 Data Type: Sixteen bit word.
Address: 0x0d Reset Value: undefined 4 3 2 1 DO12 DO11 DO10 DO9
0 DO8
USAGE: Data can be written to these registers from the system self test, or the pixel dump command. The data can be read out 0x0d, or 0x0d first, then 0x0c.
System test result 1: System test result 2: Pixel Dump command
Data_Out_Upper FE 4D Pixel Address
Data_Out_Lower D4 10 Pixel Data (Lower 6 bits)
Note One of two results returned. These values are subject to change with each device design revision.
Once the pixel dump command is given, the sensor writes the address and the value for the first pixel into the Data_Out_Upper and Data_Out_Lower registers. The MSB of Data_Out_Lower is the status bit for the data. If the bit is high, the data are NOT valid. Once the MSB is low, the data for that particular read are valid and should be saved. The pixel address and data will then be incremented on the next frame. Once the pixel dump is complete, the PixDump bit in register 0x0a should be set to zero. To obtain an accurate image, the LED needs to be turned on by changing the sleep mode of the configuration register 0x0a to always awake.
33
Pixel Address Map (Looking through the HDNS-2100 Lens)
LAST PIXEL FF EF DF CF BF AF 9F 8F 7F 6F 5F 4F 3F 2F 1F 0F FE EE DE CE BE AE 9E 8E 7E 6E 5E 4E 3E 2E 1E 0E FD ED DD CD BD AD 9D 8D 7D 6D 5D 4D 3D 2D 1D 0D FC EC DC CC BC AC 9C 8C 7C 6C 5C 4C 3C 2C 1C 0C FB EB DB CB BB AB 9B 8B 7B 6B 5B 4B 3B 2B 1B 0B FA EA DA CA BA AA 9A 8A 7A 6A 5A 4A 3A 2A 1A 0A F9 E9 D9 C9 B9 A9 99 89 79 69 59 49 39 29 19 09 F8 E8 D8 C8 B8 A8 98 88 78 68 58 48 38 28 18 08 F7 E7 D7 C7 B7 A7 97 87 77 67 57 47 37 27 17 07 F6 E6 D6 C6 B6 A6 96 86 76 66 56 46 36 26 16 06 F5 E5 D5 C5 B5 A5 95 85 75 65 55 45 35 25 15 05 F4 E4 D4 C4 B4 A4 94 84 74 64 54 44 34 24 14 04 F3 E3 D3 C3 B3 A3 93 83 73 63 53 43 33 23 13 03 F2 E2 D2 C2 B2 A2 92 82 72 62 52 42 32 22 12 02 F1 E1 D1 C1 B1 A1 91 81 71 61 51 41 31 21 11 01 F0 E0 D0 C0 B0 A0 90 80 70 60 50 40 30 20 10 00 FIRST PIXEL
TOP X-RAY VIEW OF MOUSE
LB
RB
POSITIVE Y
1
A2051 YYWW
16
8
9
POSITIVE X
Figure 39. Directions are for a complete mouse, with the HDNS-2100 lens.
34
Pixel Dump Pictures The following images (Figure 40) are the output of the pixel dump command. The data ranges from zero for complete black, to 63 for complete white. An internal AGC circuit adjusts the shutter value to keep the brightest feature (max. pixel) in the mid 50s.
(a) White Paper
(b) Manila Folder
(c) Neoprene Mouse Pad (Gray)
(d) USAF Test Chart Group 3, Element 1 8 line pairs per mm
Figure 40. Pixel dump pictures.
35
Shutter_Lower Access: Read Bit 7 Field S7
6 S6
5 S5
Address: 0x0e Reset Value: 0x64 4 3 2 S4 S3 S2
1 S1
0 S0
Shutter_Upper Access: Read Bit 7 6 Field S15 S14 Data Type: Sixteen bit word.
5 S13
Address: 0x0f Reset Value: 0x00 4 3 2 S12 S11 S10
1 S9
0 S8
USAGE: Units are clock cycles; default value is 64. Read Shutter_Upper first, then Shutter_Lower. They should be read consecutively. The shutter is adjusted to keep the average and maximum pixel values within normal operating ranges. The shutter value can be adjusted to a new value on every frame. When the shutter adjusts, it changes by ±1/16 of the current value. Shown below is a graph of 250 sequentially acquired shutter values, while the sensor was moved slowly over white paper.
SHUTTER VALUES (WHITE PAPER) 800
SHUTTER VALUE (CLOCK CYCLES)
600 400 200 0
0
25
50
75
100
125
150
175
200
225
250
The focus point is important and could affect the shutter value. The graph below shows another setup with various z-height. This graph clearly shows that the shutter value is dependent on focus distance.
TYPICAL SHUTTER vs. Z (WHITE PAPER) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0
-1.0 -0.8 -0.5 -0.3 0 0.25 0.5 0.75 1.0
NORMALIZED SHUTTER VALUE (COUNTS)
X+ 3σ X X – 3σ
DISTANCE FROM NOMINAL FOCUS (mm)
Figure 41. Typical shutter vs. Z (white paper).
Note: This graph shows average readings over different heights.
36
The maximum value of the shutter is dependent upon the frame rate and clock frequency. The formula for the maximum shutter value is: Max. Shutter Value = Clock Frequency –2816 Frame Rate
For a clock frequency of 18 MHz, the following table shows the maximum shutter value. 1 clock cycle is 55.56 nsec. Max Shutter Decimal 5010 6184 9184 15184 33184 Shutter Upper 13 18 23 3B 81
Frames/second 2300 2000 1500 1000 500
Hex 0x1392 0x1828 0x23E0 0x3B50 0x81A0
Lower 92 28 E0 50 A0
← Default Max. Shutter
Frame_Period_Lower Access: Read/Write Bit 7 6 Field FP 7 FP 6
5 FP 5
Address: 0x10 Reset Value: 0x20 4 3 2 FP 4 FP 3 FP 2
1 FP 1
0 FP 0
Frame_Period_Upper Address: 0x11 Access: Read/Write Reset Value: 0xd1 Bit 7 6 5 4 3 2 Field FP15 FP14 FP13 FP12 FP11 FP10 Data Type: Sixteen bit 2‘s complement word.
1 FP 9
0 FP 8
USAGE: The frame period counter counts up until it overflows. Units are clock cycles. The formula is: Counts (hex) ← ← Clock Rate = Counts (decimal) Frame Rate Counts (2‘s complement hex)
For an 18 MHz clock, here are the Frame_Period values for popular frame rates. Counts Decimal 7826 9000 12000 18000 36000 Frame_Period Upper Lower E1 6E DC D8 D1 20 B9 B0 73 60
Frames/second 2300* 2000* 1500 1000 500
Hex 0x1E92 0x2328 0x2EE0 0x4650 0x8CA0
2‘s Comp 0xE16E 0xDCD8 0xD120 0xB9B0 0x7360
← Default Frame Time ← Minimum Frame Time
*Note: To optimize tracking performance on dark surfaces, it is recommended that an adaptive frame rate based on shutter value be implemented, for frame rates greater than 1500. Changing the frame rate results in changes in the maximum speed, acceleration limits, and dark surface performance. To read from the registers, read Frame_Period_Upper first followed by Frame_Period_Lower. To write to the registers, write Frame_Period_Lower first followed by Frame_Period_Upper.
37
IC Register State after Reset (power up or setting bit 7, register 0x0a) Address Register Value Meaning 0x0 Product_ID 0x02 Product ID = 2 (Fixed value) 0x01 Revision_ID 0xNN Revision of IC (Fixed value). (For each device design revision.) 0x02 Motion 0x00 No Motion LED = No Fault No X data overflow No Y data overflow Resolution is 400 counts per inch 0x03 Delta_X 0x00 No X motion 0x04 Delta_Y 0x00 No Y motion 0x05 SQUAL 0x00 No image yet to measure 0x06 Average_Pixel 0x00 No image yet to measure 0x07 Maximum_Pixel 0x00 No image yet to measure 0x08 Reserved — 0x09 Reserved — 0x0a Configuration_bits 0x00 Part is not Reset LED Shutter Mode is off No System tests Resolution = 400 counts per inch Pixel Dump is disabled Sleep mode is enabled 0x0b Reserved — 0x0c Data_Out_Lower undefined No data to read 0x0d Data_Out_Upper undefined No data to read 0x0e Shutter_Lower 0x64 Initial shutter value 0x0f Shutter_Upper 0x00 Initial shutter value 0x10 Frame_Period_Lower 0x20 Initial frame period value (corresponds to 1500 fps) 0x11 Frame_Period_Upper 0xd1 Initial frame period value (corresponds to 1500 fps)
38
Optical Mouse Design References Application Note AN1179 Eye Safety calculation AN1228 Ordering Information Specify part number as follows: ADNS-2051 = Sensor IC in a 16-pin staggered DIP, 20 per tube. ADNB-2050 = Sensor IC and HDNS-2100 round lens bundle kit, 1000 pc incremental ADNB-2051 = Sensor IC and HDNS-2100#001 Round lens bundle kit, 1000 pc incremental HDNS-2100 = Round Optical Mouse Lens HDNS-2100#001 = Trimmed Optical Mouse Lens HDNS-2200 = LED Assembly Clip (Black) HDNS-2200#001 = LED Assembly Clip (Clear) HLMP-ED80-XXXXX = LED
39
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-4289EN May 6, 2003 5988-8477EN
Radiometrically Tested AlInGaP II LED Lamps for Sensor-Based Applications Technical Data
SunPower Series Precision Optical Performance HLMP-ED80-xxxxx
Features
• Characterized by Radiometric Intensity • High Optical Power Output • Extremely Long Useful Life • Low Power Consumption • Well Defined Spatial Radiation Patterns • 639 nm PEAK Red Color • 30° Viewing Angle • High Operating Temperature: TjLED = +130°C • Superior Resistance to Moisture • Suitable for Outdoor Use
Applications
• Photo Sensor Stimulus • Infrared Emitter Replacement • Solid State Optical Mouse Sensors • Surface Imaging Sensors • Optical Position and Motion Sensors • Human Interface Devices • Computer Printer Dot Quality Control • Battery Powered Systems
Description
Radiometrically Tested Precision Optical Performance AlInGaP II (aluminum indium gallium phosphide) LEDs offer increased sensor-based application design flexibility. High-resolution radiometric intensity bins (mW/sr) enable customers to precisely match LED lamp performance with sensor functionality. Visible LEDs offer new styling alternatives — light can be leveraged to develop more attractive products. In comparison to invisible infrared sources, safety concerns are significantly improved by the human autonomic pupil response and reflexive movement away from bright light. Visible LEDs further indidcate system on / off status.
The AlInGaP II technology provides extremely stable light output over very long periods of time, with low power consumption. These lamps are made with an advanced optical grade epoxy system offering superior high temperature and moisture resistance performance in outdoor systems. The epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. Please contact your Agilent Technologies Representative for more information and design for manufacture advice. Application Brief I-024 Pulsed Operating Ranges for AlInGaP LEDs vs. Projected Long Term Light Output Performance and other application information is available at www.agilent.com/go/led_lamps.
Benefits
• Radiometric LED Characterization Decreases System Variability • Improved System Reliability • Visual Styling • Visible Color for Improved Application Safety • On / Off Indication • Suitable for a Variety of Sensor-Based Applications
2
Device Selection Guide
Part Number HLMP-ED80-K0T00 HLMP-ED80-K0000 Minimum Radiometric Intensity (mW/Sr) at 20 mA 7.2 7.2 Maximum Forward Voltage (V) at 20 mA 2.6 2.4
Package Dimensions
5.00 ± 0.20 (0.197 ± 0.008)
8.71 ± 0.20 (0.343 ± 0.008
1.14 ± 0.20 (0.045 ± 0.008)
2.35 (0.093) MAX. 31.60 (1.244) MIN.
0.70 (0.028) MAX. CATHODE LEAD
1.00 MIN. (0.039)
0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004)
CATHODE FLAT
5.80 ± 0.20 (0.228 ± 0.008)
2.54 ± 0.38 (0.100 ± 0.015)
Note: All dimensions are in mm (inches).
3
Part Numbering System
HLMP - x x x x - x x x xx Mechanical Option 00: Bulk VF Bin Selections 0: Maximum VF 2.4 V T: Maximum VF 2.6 V Maximum Intensity Bin 0: No maximum Iv bin limit Minimum Intensity Bin Refer to device selection guide Color D: 630 nm red Package E: T-1 3/4 (5 mm) round lamp
Absolute Maximum Ratings at TA = 25°C
DC Forward Current[1,2,3] ............................................................ 50 mA Peak Pulsed Forward Current[2,3] .............................................. 100 mA Average Forward Current ............................................................ 30 mA Reverse Voltage (I R = 100 µA) ......................................................... 5 V LED Junction Temperature .......................................................... 130°C Operating Temperature .............................................. –40°C to +100°C Storage Temperature .................................................. –40°C to +120°C Dip/Drag Solder Temperature ................................ 260°C for 6 seconds Through-the-Wave Preheat Temperature ..................................... 145°C Through-the-Wave Solder Temperature ................. 245°C for 3 seconds [1.59 mm (0.060 in.) below seating plane]
Notes: 1. Derate linearly as shown in Figure 4. 2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to HP Application Brief I-024 (5966-3087E). 3. Please contact your Agilent sales representative about operating currents below 10 mA.
4
Electrical/Optical Characteristics at TA = 25°C
Parameter Forward Voltage ED80-xx0xx ED80-xxTxx Reverse Voltage Peak Wavelength Symbol VF VR λ PEAK λd ∆λ1/2 5 Min. Typ. 2.00 2.35 20 639 630 17 Max. 2.40 2.60 Units V V nm nm nm Test Conditions IF = 20 mA IR = 100 µA Peak of Wavelength of Spectral Distribution at IF = 20 mA Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA s Exponential Time Constant, e-t/τ VF = 0, f = 1 MHz LED Junction-to-Cathode Lead Emitted Luminous Power/Emitted Radiant Power at IF = 20 mA Emitted Radiant Power at IF = 20 mA
Dominant Wavelength[1] Spectral Halfwidth
Speed of Response Capacitance Thermal Resistance Luminous Efficacy[5]
τs C RΘJ-PIN ηv 2 θ1/2 Ie
20 40 240 155
ns pF °C/W lm/W
Viewing Angle[2] Radiometric Intensity
30 7.23 50.50
Deg. mW/sr
Notes: 1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram referenced to Illuminant E. 2. θ 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. The radiometric intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. The luminous intensity, Iv, in candelas, may be found from the equation I v = Ieηv, where Ie is the radiometric intensity in watts per steradian and ηv is the luminous efficacy in lumens/watt.
1.0
100 90
RELATIVE INTENSITY
RED
CURRENT – mA
80 70 60 50 40 30 20 10 0 1.0 RED
0.5
0 550
600 WAVELENGTH – nm
650
700
1.5
2.0
2.5
3.0
VF – FORWARD VOLTAGE – V
Figure 1. Relative Intensity vs. Peak Wavelength.
Figure 2a. Forward Current vs. Forward Voltage for Option -xx0xx.
5
RELATIVE RADIOMETRIC INTENSITY (NORMALIZED AT 20 mA)
50
2.5
IF – FORWARD CURRENT – mA
50 40 30 RθJA = 780° C/W 20 10 0
FORWARD CURRENT
40
2.0
RθJA = 585° C/W
30
1.5
20
1.0
10
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0
10
20
30
40
50
0
20
40
60
80
100
FORWARD VOLTAGE – V
IF – DC FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
Figure 2b. Forward Current vs. Forward Voltage for Option -xxTxx.
Figure 3. Relative Luminous Intensity vs. Forward Current.
Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJMAX = 130°C.
NORMALIZED RADIOMETRIC INTENSITY
1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -25 -20 -15 -10 -5 0 5 10 15 20 25
Radiometric Intensity Bin Limits (mW/sr at 20 mA)
Bin ID K L M N P
ANGULAR DISPLACEMENT – DEGREES
Min. 8.5 10.2 12.2 14.7 17.6 21.2 25.4 30.5 36.5
Max. 10.2 12.2 14.7 17.6 21.2 25.4 30.5 36.5 43.9
Q R S T
Figure 5. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.
Notes: 1. Tolerance for each bin will be ± 15%. 2. Bin categories are established for classification of products. Products may not be available in all bin categories.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-7360EN September 18, 2002 5988-7916EN
Agilent HDNS-2100 Solid-State Optical Mouse Lens
Data Sheet
Ordering Information Specify Part Number as follows: Flange Description The HDNS-2100 Solid-State Optical Mouse Lens is designed for use with Agilent Optical Mouse Sensors and the illumination subsystem provided by the HDNS-2200 or HDNS-2200 #001 LED Assembly Clip and the HLMP-ED80 LED. Together with the LED, the HDNS-2100 provides Round the directed illumination and optical imaging necessary for proper operation of the Optical Mouse Sensor. The HDNS-2100 is a precision molded optical component and should be handled with care to avoid scratching of the optical surfaces. Rectangular Part Number HDNS-2100 HDNS-2100 #001
Minimum order quantity of 1000.
Outline Drawings HDNS-2100
∅ 42.00 ± 0.1 mm (1.654 ± 0.0039) 2.00 (0.079) 7.87 (0.310) 8.00 (0.315) 6.00 (0.236) 16.00 (0.630) 39.50 ± 0.1 mm (1.555 ± 0.0039) 8.00 (0.315) R 0.50 (0.020) 4 PLACES 14.53 (0.572) 10.45 (0.411) 2.30 (0.091) 13.00 (0.512)
HDNS-2100 #001
30.50 (1.201) 7.87 (0.310) 8.00 (0.315) 6.00 (0.236)
5.05 (0.199)
14.53 (0.572) 10.45 (0.411) 1.00 (0.039) 9.85 (0.388) OPTICAL AXIS
5.05 (0.199)
1.30 (0.051) 1.15 (0.045)
OPTICAL AXIS
1.00 (0.037)
1.30 (0.051)
1.15 (0.045)
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.2 mm (± 0.0079 IN.) EXCEPT WHERE NOTED. 3. THERE IS ALSO A FLASH TOLERANCE OF –0, +0.2 mm ON THE FLANGE.
Mechanical Assembly Requirements All specifications reference Figure 2, Optical System Assembly Diagram. Symbol Min. Typical Max. Distance from Object Surface to Lens Reference Plane Distance from Mouse Sensor Lid Surface to Object Surface Lateral Distance from Center of Aperture Stop to Center of Lens Surface A B C 2.3 2.4 7.45 0 0.20 2.5
Units mm mm mm
Conditions
Sensor lid must be in contact with lens housing surface Aperture stop should selfcenter on lens
LENS
BOTTOM SIDE
PRISM BOTTOM SIDE
C MOUSE SENSOR HDNS-2100
TOP SIDE
B A OBJECT SURFACE
LENS PRISM
Figure 2. Optical system assembly diagram.
Figure 3. Logo locations.
Lens Design Optical Performance Specifications All specifications are based on the Mechanical Assembly Requirements. Symbol Numerical Aperture Magnification Design Wavelength Object to Image Distance Lens Material* Index of Refraction Depth of Field Field Coverage Radius N DOF λ 8.735 1.5800 NA Min. 0.1 0.85 Typical 0.13 1.00 639 8.823 1.5818 ± 0.5 1.00 8.911 1.5840 mm mm Max. 0.16 1.15 nm mm Units
NOTES: 1. TOPSIDE LOGO EXTENDS 0.2 mm ABOVE THE FLANGE SURFACE. 2. BOTTOMSIDE LOGO EXTENDS 0.1 mm BELOW THE SURFACE. 3. BOTTOMSIDE LOGO IS EITHER LEFT SIDE, AS SHOWN AS ABOVE, OR PRISM SIDE OF THE LENS.
Conditions Image at nominal location
λ = 639 nm
* Lens material is polycarbonate. Cyanoacrylate based adhesives should not be used as they will cause lens material deformation.
Mounting Instructions for the HDNS-2100 Lens to the Base Plate An IGES format drawing file with design specifications for mouse base plate features is available. These features are useful in maintaining proper positioning and alignment of the HDNS-2100 when used with the Agilent Optical Mouse Sensor. This file can be obtained by contacting your local sales representative.
LENS RECESS DIMENSIONS: HDNS-2100 HDNS-2100 #001 43.0 mm DIA. 31.5 x 17.0 mm
KEY PYRAMID FEATURE: 2.50 mm HEIGHT MAX.
Figure 4. Illustration of base plate mounting features.
www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. April 25, 2001 Obsoletes 5988-2271EN 5988-2835EN
Solid-State Optical Mouse LED Assembly Clip Technical Data
HDNS-2200 HDNS-2200 #001
Description
The HDNS-2200 LED Assembly Clip is designed to provide optical and mechanical coupling of a standard T13/4 (5 mm diameter) LED to the HDNS-2100 Solid State Optical Mouse Lens. This coupling is essential to achieve the proper illumination required for the HDNS-2000 Sensor to operate on a wide variety of surfaces. The clip also provides a mechanical compression feature which locates over the HDNS-2000 and is used to ensure that a light mechanical contact is always maintained between the HDNS-2000 Sensor and the HDNS-2100 Lens when assembled. The inner surface of the top case of the mouse housing should be designed to lightly compress this feature when the case is closed at final assembly.
Ordering Information
Specify Part Number as follows: Color Black Clear Part Number HDNS-2200 HDNS-2200 #001
Minimum order quantity of 100.
HDNS-2200 LED Assembly Clip Outline Drawing
33.01 (1.300) 9.42 (0.371) 1.24 (0.049)
19.10 (0.752)
12.08 (0.476)
7.22 (0.284)
6.46 (0.254)
2.50 (0.098) SQUARE POST
3.76 (0.148)
DIMENSIONS IN MILLIMETERS (INCHES)
www.semiconductor.agilent.com Data subject to change. Copyright © 2000 Agilent Technologies 5968-7178E (1/00)
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