0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
HI1538

HI1538

  • 厂商:

    HSMC

  • 封装:

  • 描述:

    HI1538 - PNP EPITAXIAL PLANAR TRANSISTOR - Hi-Sincerity Mocroelectronics

  • 数据手册
  • 价格&库存
HI1538 数据手册
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9020-B Issued Date : 1996.04.15 Revised Date : 2000.11.01 Page No. : 1/3 HI1538 PNP EPITAXIAL PLANAR TRANSISTOR Description High-definition CRT display video output, wide-band amp. Features • High fT: fT=400MHz • High breakdown voltage: VCEO=120Vmin • Small reverse transfer capacitance and excellent HF response Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ....................................................................................................... -55 ~ +150 °C Junction Temperature ................................................................................................................ +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)................................................................................................ 1.3 W Total Power Dissipation (Tc=25°C) ................................................................................................. 20 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage ............................................................................................... -120 V BVCEO Collector to Emitter Voltage ............................................................................................ -120 V BVEBO Emitter to Base Voltage ...................................................................................................... -3 V IC Collector Current .................................................................................................................. -200 mA IC Peak Collector Current ......................................................................................................... -400 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. -120 -120 -3 60 40 400 2.8 Typ. 160 Max. -100 -100 -1 -1 320 Unit V V V nA nA V V Test Conditions IC=-10uA, IE=0 IC=-1mA, IB=0 IE=-100uA, IC=0 VCB=-80V VEB=-2V, IC=-30mA, IB=-3mA IC=-30mA, IB=-3mA VCE=-10V, IC=-10mA VCE=-10V, IC=-100mA VCE=-10V, IC=-50mA VCB=-30V, f=1MHz MHz pF *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1 Rank Range D 60-120 E 100-200 F 160-320 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10000 Spec. No. : HE9020-B Issued Date : 1996.04.15 Revised Date : 2000.11.01 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 1000 hFE 100 VCE=10V VCE(sat) @ IC=10IB 100 10 1 10 100 1000 10 10 100 1000 Collector Current (mA) Collector Current (mA) Saturation Voltage & Collector Current 10000 100 Capacitance & Reverse-Biased Voltage Saturation Voltage (mV) 1000 VBE(sat) @ IC=10IB Capacitance (Pf) 10 Cob 100 1 10 100 1000 1 1 10 100 Collector Current (mA) Reverse Biased Voltage (V) Cutoff Frequency & I C 1000 1 Safe Operating Area Cutoff Frequency (MHz) Collector Current (A) fT 100 0.1 PT=1ms PT=100ms PT=1s 10 1 10 100 1000 0.01 1 10 100 1000 Collector Current (mA) Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking : HSMC Logo Spec. No. : HE9020-B Issued Date : 1996.04.15 Revised Date : 2000.11.01 Page No. : 3/3 A B C D Product Series Rank Part Number Date Code Ink Mark F 3 I E K 2 1 G Style : Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code : I *:Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification
HI1538 价格&库存

很抱歉,暂时无法提供与“HI1538”相匹配的价格&库存,您可以联系我们找货

免费人工找货