HJ2955

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 1/4 HJ2955 PNP EPITAXIAL PLANAR TRANSISTOR Description The HJ2955 is designed for general purpose of amplifier and switching applications. Absolute Maximum Ratings (Ta=25°C) TO-252 • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ...................................................................................... 150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Tc=25°C)..................................................................................... 20 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage...................................................................................... -70 V BVCEO Collector to Emitter Voltage................................................................................... -60 V BVEBO Emitter to Base Voltage........................................................................................... -5 V IC Collector Current ........................................................................................................... -10 A IB Base Current .................................................................................................................... -6 A Characteristics (Ta=25°C) Symbol BVCEO BVCBO BVEBO ICBO ICEX ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 fT Min. -60 -70 -5 20 5 2 Typ. Max. -20 -20 -50 -0.5 -1.1 -8 -1.8 100 Unit V V V uA uA uA mA V V V Test Conditions IC=-30mA, IB=0 IC=-1mA, IE=0 IE=-1mA, IC=0 VCB=-70V, IE=0 VCE=-70V, VEB(off)=-1.5V VCE=-30V, IB=0 VEB=-5V, IC=0 IC=-4A, IB=-400mA IC=-10A, IB=-3.3A IC=-4A, VCE=-4V IC=-4A, VCE=-4V IC=-10A, VCE=-4V VCE=-10V, IC=-500mA, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% MHz HJ2955 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 hFE @ VCE=4V 10000 VCE(sat) @ IC=10IB Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o Saturation Voltage (mV) 1000 75 C o hFE 100 25 C 75 C o o 100 125 C o 25 C o 10 10 100 1000 10000 10 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 VCE(sat) @ IC=3IB 10000 ON Voltage & Collector Current VBE(ON) @ VCE=4V Saturation Voltage (mV) ON Voltage (mV) 1000 75 C 1000 25 C 125 C o o o 75 C 100 125 C o o o 25 C 10 10 100 1000 10000 100 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Switching Time & Collector Current 10.00 VCC=30V, IC=10IB1 = -10IB2 1000 Capacitance & Reverse-Biased Voltage Switching Times (us).. . 1.00 Tstg Capacitance (pF) 100 Cob Ton 0.10 Tf 0.01 0.1 1.0 10.0 10 0.1 1 10 100 Collector Current (A) Reverse-Biased Voltage (V) HJ2955 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 3/4 Safe Operating Area 100000 PT=1ms Collector Current-IC (mA) 10000 PT=100ms PT=1s 1000 100 10 1 10 100 Forward Voltage-VCE (V) HJ2955 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-252 Dimension A C Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 4/4 Marking: H J 2955 Date Code Control Code B D L F G Style: Pin 1.Base 2.Collector 3.Emitter 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HJ2955 HSMC Product Specification