HMPSA44

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6358 Issued Date : 1993.01.15 Revised Date : 2002.04.16 Page No. : 1/3 HMPSA44 NPN EPITAXIAL PLANAR TRANSISTOR Description The HMPSA44 is designed for application that requires high voltage. Features • High Breakdown Voltage: 400(Min) at IC=1mA • High Current Gain: IC=300mA at 25°C • Complementary to HMPSA94 TO-92 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................................ +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)............................................................................................. 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage.................................................................................................... 400 V VCEO Collector to Emitter Voltage ................................................................................................ 400 V VCBO Emitter to Base Voltage ......................................................................................................... 6 V IC Collector Current .................................................................................................................... 300mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *hFE1 *hFE2 *hFE3 *hFE4 Cob Min. 400 400 6 40 50 45 40 Typ. Max. 100 100 500 350 350 750 750 300 6 Unit V V V nA nA nA mV mV mV mV Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=400V, IE=0 VEB=4V, IC=0 VCE=400V, VBE=0 IC=1mA, IB=0.1mA IC=20mA, IB=2mA IC=50mA, IB=5mA IC=10mA, IB=1mA IC=1mA, VCE=10V IC=10mA, VCE=10V IC=50mA, VCE=10V IC=100mA, VCE=10V VCB=20V, f=1MHz, IE=0 *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% pF Classification Of hFE2 Rank Range N 50-300 SD 70-210 SUM 120-300 HMPSA44 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 hFE @ VCE=10V 1000 VCE(sat) @ IC=10IB Spec. No. : HE6358 Issued Date : 1993.01.15 Revised Date : 2002.04.16 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 125 C o 75 C o 125 C 75 C 100 25 C o o o hFE 100 25 C o 10 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 o Capacitance & Reverse-Biased Voltage 100 25 C Saturation Voltage (mV) 75 C o Capacitance (pF) 10 Cob 125 C VCE(sat) @ IC=10IB o 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (V) Safe Operating Area 10000 PT=1ms PD-Ta 700 600 Collector Current-IC (mA) 1000 PT=1s Power Dissipation-PD (mW) PT=100ms 500 400 300 200 100 100 10 1 1 10 100 1000 0 0 50 100 o 150 200 Forward Voltage-VCE (V) Ambient Temperature-Ta ( C) HMPSA44 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6358 Issued Date : 1993.01.15 Revised Date : 2002.04.16 Page No. : 3/3 α2 Marking: H MP S A44 Control Code α3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G α1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA44 HSMC Product Specification