1-146893-1

1-146893-1

  • 厂商:

    HUMIREL(泰科)

  • 封装:

    SMD,P=1mm

  • 描述:

    板对板连接器 立贴 针脚数:64Pin 间距:1mm 排数:2

  • 详情介绍
  • 数据手册
  • 价格&库存
1-146893-1 数据手册
7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 4 3 2 1 19 REVISIONS ALL RIGHTS RESERVED. BY - P LTR DESCRIPTION REVISED PER ECR-14-016951 M DIM A DATE DWN APVD I.T 11FEB2015 W.H 6 0.05 1 TYP 0.5 2 PLC D 6.05 HOUSING MATERIAL: HIGH TEMPERATURE THERMOPLASTIC, COLOR: BLACK. CONTACT MATERIAL: PHOSPHOR BRONZE. 2 CONTACT FINISH: NICKEL UNDERPLATE ALL OVER, MATING SURFACES PLATED TO MEET PL1 PERFORMANCE REQUIREMENTS OF INDUSTRY SPECIFICATION EIA-700AAAB, SOLDER TAILS PLATED TIN-LEAD. 3 DATUM LOCATIONS AND BASIC DIMENSIONS TO BE ESTABLISHED BY THE CUSTOMER. CONSULT AMP ENGINEERING WHEN PLACING MULTIPLE CONNECTORS ON A PC BOARD. 4. PACKAGED IN TAPE ON REEL PER EIA-481. 5 1.4 # 0.05 DIAMETER HOLE WHEN PLACING BY HAND. 6 SHORTER SOLDER LANDS MAY BE USED PER EIA 700AAAB, HOWEVER 2.4 LENGTH ASSURES OPTIMUM SOLDER FILLET REGARDLESS OF MANUFACTURER OF CONNECTOR. 7 REFERRED TO AS DIM H = 5.30 # 0.1 IN EIA 700AAAB SPECIFICATION. 8. VACUUM COVER NOT SHOWN IN SOME VIEWS FOR CLARITY. 9 5.5 MIN DIAMETER TARGET AREA FOR VACUUM PICK-UP. +0.10 -0.05 -X- 9 DIM B # 0.04 VACUUM COVER -X- 10 -Y- DIM C # 0.1 6.2 0.05 1. 2.92 2 PLC -Y- 45 $ D CONTACT FINISH: 0.002 MINIMUM BRIGHT TIN-LEAD (93-7) ON SOLDER AREA. 0.00127 MINIMUM GOLD ON MATING AREA. BOTH OVER 0.00127 MINIMUM NICKEL ON ENTIRE CONTACT. 11 SQUARE AND DIAMOND SHAPED POSTS. 12 ROUND SHAPED POSTS. 0.25 x MIN TYP -Z- C 7 5.37 C +0.03 -0.10 11 STYLE A POSTS 12 STYLE B POSTS 0.76 0.30 TYP REF -XDIM D # 0.08 0.6 B 0.1 s TYP 0.05 s 5 1.5 MIN U s V s 5 B -VSEE NOTE 5 FOR HAND PLACEMENT HOLE SIZE 1.5 MIN 1.8 -USEE NOTE 5 FOR HAND PLACEMENT HOLE SIZE 6 REF Y.YY 3 12 PC BOARD EDGE 3 -W- 1.8 2.4 0.1 s TYP 0.05 s 12 6 11 U s V s 11 1 TYP A 1.7 DIM A 12 12 11 11 POST STYLE 10 2 10 2 44.4 45.9 44.22 41 8,9,10 84 3-146893-2 44.4 45.9 44.22 41 8,9,10 84 2-146893-2 34.4 10 34.4 2 44.4 34.4 10 44.4 34.4 2 FINISH DIM D 35.9 35.9 45.9 35.9 45.9 35.9 THIS DRAWING IS A CONTROLLED DOCUMENT. DIM C 34.22 34.22 3 X.XX 3 4805 (3/13) -T- mm DIM D RECOMMENDED PC BOARD LAYOUT MATERIAL -1 TOLERANCES UNLESS OTHERWISE SPECIFIED: 0 PLC 1 PLC 2 PLC 3 PLC 4 PLC ANGLES FINISH 0.03 0.003 - SEE TABLE 31 44.22 41 34.22 31 44.22 41 34.22 31 DIM B DWN D.K.SCHRUM CHK DIMENSIONS: 31 CHAD BAKER 31JUL98 DIM A APVD - 8,9,10 - NAME 502-1079 114-25045 - CUSTOMER DRAWING 3-146893-1 64 8,9,10 2-146893-1 84 8,9,10 1-146893-2 64 8,9,10 1-146893-1 84 8,9,10 146893-2 64 STACK HEIGHTS 146893-1 POS AMP PART NUMBER TE Connectivity APPLICATION SPEC WEIGHT 64 31JUL98 PRODUCT SPEC 0 $ 30' 8,9,10 SIZE RECEPTACLE ASSY, W/ VACUUM COVER, 1.0mm FH(IEEE 1386) CONNECTOR CAGE CODE A1 00779 DRAWING NO RESTRICTED TO 146893 SCALE 10:1 SHEET 1 OF - 1 REV M A
1-146893-1
1. 物料型号:未在文档中明确提及具体型号,但提到了AMP(安费诺)品牌。 2. 器件简介: - 封装材料:高温热塑性材料,颜色为黑色。 - 接触材料:磷青铜。 - 接触表面处理:镍底镀层覆盖所有表面,配合表面镀层符合EIA-700AAAB行业规范的PL1性能要求,焊尾镀锡铅。 3. 引脚分配: - 提到了引脚的形状,如正方形和菱形柱子,圆形柱子。 - 引脚的典型参考尺寸,例如2.92mm直径。 4. 参数特性: - 提到了焊盘的长度,建议使用2.4mm长度以确保最佳焊锡填充。 - 真空拾取的目标区域直径至少为5分钟。 - 接触表面的镀层要求:焊锡区域至少0.002英寸亮锡铅(93-7),配合区域至少0.00127英寸金层,整个接触区域至少0.00127英寸镍层。 5. 功能详解: - 描述了连接器的真空盖,但未显示在某些视图中以清晰显示。 - 提到了真空盖的尺寸和形状。 6. 应用信息: - 提到了连接器适用于PCB板上的多连接器布局,建议与AMP工程部门咨询。 - 包装方式:按照EIA-481标准,使用卷带封装。 7. 封装信息: - 描述了连接器的装配信息,包括带有真空盖的插座组件。
1-146893-1 价格&库存

很抱歉,暂时无法提供与“1-146893-1”相匹配的价格&库存,您可以联系我们找货

免费人工找货