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Connectors PCB Connectors Wire-To-Board Connectors Headers & Receptacles
1-1734829-1
1.25 WTB HDR DIP, 11 POS
TE Internal #: 1-1734829-1
TE Internal Description: 1.25 WTB HDR DIP,
11 POS
PCB Connector Assembly Type : PCB Mount
Header
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PCB Mount Orientation : Right Angle
Connector System : Wire-to-Board
Number of Positions : 11
Centerline (Pitch) : 1.25 mm [ .049 in ]
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Compatible Parts & Tooling
Documents
Product Drawings
Features
Product Compliance
1.25 WTB HDR DIP, 11 POS
1.25 WTB HDR DIP, 11 POS (TIFF AVAILABLE)
English
CAD Files
PCB Design
CAD Models from Ultra Librarian
3D PDF
3D_CVM_CVM_1-1734829-1_A.pdf 3D
Customer View Model
ENG_CVM_CVM_1-1734829-1_A.2d_dxf.zip
English
ENG_CVM_CVM_1-1734829-1_A.3d_igs.zip
English
ENG_CVM_CVM_1-1734829-1_A.3d_stp.zip
English
Datasheets &
Catalog Pages
1-17737132_HIGH_PERFORMANCE_INTERCONNECT_QUICK_R
EFERRENCE_GUIDE_EN
ENG_DS_1-1773713-2_HPI_QRG_EN_0114_11773713-2HPI_Connectors_0114.pdf English
Product
Specifications
Wire To Board Connector
ENG_SS_108-57499_A.tif English
Product Specification
ENG_SS_108-57499_A.pdf English
Please review product documents or contact us for the latest agency approval
information. Please Note: Use the Product Drawing for all design activity.
Product Type
Features
PCB Connector Assembly Type : PCB Mount Header
Connector System : Wire-to-Board
Header Type : Partially Shrouded
Sealable : No
Connector & Contact Terminates To : Printed Circuit Board
Wire/Cable Type : Discrete Wire
Configuration
Features
Connector Contact Load Condition : Fully Loaded
PCB Mount Orientation : Right Angle
Number of Positions : 11
Number of Rows : 1
Electrical
Characteristics
Operating Voltage (VAC): 125
Contact Features
Contact Base Material : Phosphor Bronze
Operating Voltage (VDC): 125
PCB Contact Termination Area Plating Material : Tin
Contact Mating Area Plating Material : Nickel
Contact Mating Area Plating Material Finish : Matte
Contact Mating Area Plating Material Thickness :
2.54 µm [ 100 µin ]
Contact Type : Pin
Contact Current Rating (Max) (A): 3
PCB Contact Termination Area Plating Thickness :
2.54 µm [ 100 µin ]
PCB Contact Termination Area Plating Material Finish : Matte
Contact Layout : Inline
Termination
Features
Termination Method to Printed Circuit Board : Through Hole
Termination Method to Wire & Cable : Crimp
Termination Post & Tail Length : 2.3 mm [ .091 in ]
Terminations per Post (Max) : 3
Mechanical
Attachment
PCB Mount Alignment : Without
Mating Retention : Without
PCB Mount Retention : Without
Connector Mounting Type : Board Mount
Strain Relief : Without
Contact Retention : Without
Housing Features
Centerline (Pitch) : 1.25 mm [ .049 in ]
Housing Color : Natural
Housing Material : Thermoplastic
Dimensions
Wire Size (AWG): 32 – 26
Length : 15.5 mm [ .61 in ]
Height : 3.2 mm [ .126 in ]
Width : 4.7 mm [ .185 in ]
Usage Conditions
Operating Temperature Range : -25 – 85 °C [ -13 – 185 °F ]
Operation/Application Circuit Application :
Signal
Industry
Standards
UL Flammability Rating : UL 94V-0
Packaging
Features
Packaging Quantity : 39
Packaging Method : Tube, Tube/Box
EU RoHS
Directive
2011/65/EU
This declaration covers EU Directive 2011/65/EU incl. Delegated Directive 2015/863/EU. The restrictions
under 2015/863/EU apply as of 22 July 2021 for EEE categories 8 (medical devices) and 9 (monitoring and
control equipment).
EU ELV Directive
2000/53/EC
China RoHS 2
Directive MIIT
Order No 32, 2016
EU REACH
Regulation (EC)
No. 1907/2006
Current ECHA Candidate List: JAN 2019 (197)
Candidate List Declared Against: JUN 2013 (144)
Halogen Content
Solder Process
Capability
Wave solder capable to 265°C
Statement of
Compliance
Statement of Compliance pdf
Compliance
Documents
There may be Environmental Compliance related
Disclaimer
This information is provided based on reasonable
documents on the DOCUMENTATION Tab
inquiry of our suppliers and represents our current
actual knowledge based on the information they
provided. This information is subject to change. The
part numbers that TE has identified as EU RoHS
compliant have a maximum concentration of 0.1% by
weight in homogenous materials for lead,
hexavalent chromium, mercury, PBB, PBDE, DBP, BBP,
DEHP, DIBP, and 0.01% for cadmium, or qualify for an
exemption to these limits as defined in the Annexes
of Directive 2011/65/EU (RoHS2). Finished electrical
and electronic equipment products will be CE
marked as required by Directive 2011/65/EU.
Components may not be CE marked. Additionally,
the part numbers that TE has identified as EU ELV
compliant have a maximum concentration of 0.1% by
weight in homogenous materials for lead,
hexavalent chromium, and mercury, and 0.01% for
cadmium, or qualify for an exemption to these limits
as defined in the Annexes of Directive 2000/53/EC
(ELV). Regarding the REACH Regulations, TE’s
information on SVHC in articles for this part number
is still based on the European Chemical Agency
(ECHA) ‘Guidance on requirements for substances
in articles’(Version: 2, April 2011), applying the 0.1%
weight on weight concentration threshold at the
finished product level. TE is aware of the European
Court of Justice ruling of September 10th, 2015
also known as O5A (Once An Article Always An
Article) stating that, in case of ‘complex object’, the
threshold for a SVHC must be applied to both the
product as a whole and simultaneously to each of
the articles forming part of its composition. TE has
evaluated this ruling based on the new ECHA
“Guidance on requirements for substances in
articles” (June 2017, version 4.0) and will be
updating its statements accordingly.
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