108- 115019
Product
Specification
Rev A
240 Pin VLP DDR-III Soldertail Sockets
1.
SCOPE
1.1.
Content
This specification covers performance, tests and quality requirements for the Tyco Electronics 240 pin
VLP DDR-III soldertail Connector used primarily in desktop applications where soldering is acceptable.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was proceeding.
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1.
Tyco Electronics Documents
109 series: Test Specification as indicated in Figure 1
109-197: Test Specification (AMP Test Specifications vs EIA and IEC Test Methods)
114-13154: Application Specification
501-115021: Qualification Test Report VLP DDR3 DIMM Connector
2.2.
Industry Standards
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
3.
REQUIREMENTS
3.1.
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
©2008 Tyco Electronics Corporation
PA
All International Rights Reserved.
* Trademark
| Indicates change
For latest revision, visit our website at www.tycoelectronics.com/document.
For Regional Customer Service, visit out website at www.tycoelectronics.com
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108- 115019
3.3.
Ratings
Voltage: 25 volts AC
Current: 0.5 A MAX.
Temperature: -40 to 85
3.4.
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions.
3.5.
Test Requirements and Procedures Summary
Test Item
Examination of
1 Product
Requirement
Meets requirements of product
Visual inspection
drawing.
No physical damage.
Electrical Requirement
2.1 Contact resistance.
30 milliohms Max (Initial)
R 20 milliohms Max (Final)
2.2 Contact resistance.
10 milliohms Max (Initial)
R 10 milliohms Max (Final)
3
Dielectric withstanding
Voltage
No evidence of arc-over
insulation breakdown or
leakage current in excess of 1
mA.
4 Insulation Resistance
1 M-Ohm Min
5 Current Rating
T rise 30
max.
Procedure
Subject mated contacts assembled in housing to
20 mV Max open circuit at 100 mA Max.
EIA-364-23
Subject mated contacts assembled in housing to
20 mV Max open circuit at 100 mA Max.
EIA-364-23
500 VAC for 1 minute
100 V rms at 60 Hz, between terminals and terminals
to case.
The connectors shall be mated but not soldered to a
PCB.
EIA-364-20
500 VDC for 1 minuate
The connectors shall be mated but not soldered to a
printed circuit board
Test between adjacent circuits of unmated
connector.
EIA-364-21A.
Connect 10 pairs contacts in consecutive position
(pins 65~74 and pins 185~194) on the same side of
specimen are in series circuit and load 0.5A.
EIA-364-70
Mechanical Requirement
6 Module insertion force
106.8 N (10.9 Kgf) Max.
7 Module withdraw force
110 N (11.2 Kgf) Min.
8 Durability
Meets requirements of product
drawing.
No physical damage.
9 Durability
No physical damage.
(preconditioning)
Measure module card insertion force with 1.37mm
THK module.
steel gage at rate of 25mm/minute
EIA-364-13
Measure module withdraws force with latch locked.
with 1.17mm THK module.
steel gage at rate of 25mm/minute
EIA-364-13
25 times Mating/Unmating cycles with 1.37mm THK
module at inserting rate of 25 mm/minute.
EIA-364-09
5 times Mating/Unmating cycles with 1.37mm THK
module at inserting rate of 25 mm/minute.
EIA-364-09
Figure 1 (continued)
Rev A
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108- 115019
10 Reseating
No physical damage.
Manually Mating/Unmating test module 3 cycles.
No discontinuities
No evidence of physical
damage
11 Vibration
R 20 milliohms max
R 10 milliohms max (For
Connector with Lower LLCR)
Subject 4 continuity and 4 termination resistance
specimens to input accelsration 3.13g RMS
between 5Hz to 500Hz, 10 minutes per axis to:
2
50 to 20Hz (slope): (0.01g /Hz )@5Hz,
2
(0.02g /Hz )@20Hz
2
20 to 500Hz (flat): (0.02g /Hz )@20Hz
Random control limit tolerance: + 3 dB
Module weight 60g min with center of gravity of
20~25 mm from module mating edge.
10 minutes per axis for all 3 axes on all samples
EIA-364-28
Mechanical Requirement
Test Item
Requirement
No discontinuities.
12.1
Mechanical shock.
(For SMT Type)
No evidence of physical
damage
R 20 milliohms max
R 10 milliohms max (For
Connector with Lower LLCR)
No discontinuities.
Mechanical shock.
12.2
(For T/H Type)
No evidence of physical
damage
R 20 milliohms max
R 10 milliohms max (For
Connector with Lower LLCR)
13 Contact retention force
14.1
Solderability
(For SMT Type)
14.2
Solderability
(For T/H Type)
2.95 N (0.3 Kg) Min. per pin
No physical damage shall
occur
15.2 Resistance to Wave
No physical damage shall
occur
soldering heat
16 Thermal shock
Profile: Trapezoidal shock of 50g±10%
Duration: 11 ms
Minimun velocity change: 212in/sec, ±10%
Module weight 60g min with center of gravity of
20~25 mm from module mating edge.
Three drops in each of 6 directions
EIA-364-27
Profile: Trapezoidal shock of 50g±10%
Duration: 11 ms
Minimun velocity change: 212in/sec, ±10%
Module weight 60g min with center of gravity of
20~25 mm from module mating edge.
Three drops in each of 6 directions
EIA-364-27
Measure the contact retension force with Tensile
strength tester.
EIA-364-29.
Reflow Temperature: 230-245°C
Reflow Time: 50-70 s.
EIA-364-52, Class 1, Category 3
Wet solder coverage: 95%
Min.
No physical damage
Solder Temperature: 245 ±5°C.
Wet solder coverage: 95%
Solder Immersion Time: 5 ±0.5 s.
Min.
EIA-364-52,
Class 1, Category 3
No physical damage
Environmental Requirement
15.1 Resistance to Reflow
soldering heat
Procedure
Moisture Soak Preconditioning: 85°C and 85% RH.
For 168 hours.
Preheat Temp.: 150-200°C, 60-180 s.
Time over liquidus (217°C): 60-150 s.
Peak Temp.: 260 +0/-5°C, 20 s.
Duration: 3 cycles.
Solder Temp.: 265°C ±5°C, 10 +2/-0 s.
Mated connector -55°C (30 minutes), +85°C
(30 minutes)
Perform this a cycles, repeat 10 cycles
EIA-364-32, test condition 1
See Note
Figure 1 (continued)
Rev A
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108- 115019
17
Cyclic Temperature
& Humidity
Specimens shall be mated during test, Cycling the
Connector between 25°C±3°C at 80% RH and
65°C ±3°C at 50% RH,
Ramp times should be 0.5 hour and dwell times be 1
hour.
Perform 24 cycles.
EIA-364-31
See Note.
5 days to simulate a 3 year field life for gold flash
plating.
7 days to simulate a 5 year field life for 10u” gold
plating.
18 Mixed flowing gas
19 Dust
20
Temperature life
(Preconditioning)
21 Thermal cycling
10 days to simulate a 7 year field life for 15u” & 20u”
gold
plating.
14 days to simulate a 10 year product life for 30u”
gold plating.
EIA-364-65, class IIA
See Note
R 20 milliohms max
R 10 milliohms max (For
Connector with Lower LLCR)
R 20 milliohms max
R 10 milliohms max (For
Connector with Lower LLCR)
R 20 milliohms max
R 10 milliohms max (For
Connector with Lower LLCR)
Un-mated 1 hour duration 25°C/50% RH dust mass
3
of 9 g/ft at rate of 300 m/min
EIA-364-91
Subject mated specimens to 105°C for 120 hours
EIA-364-17, method A
Cycle the connector or socket between
15 ±3 and 85 ±3 , as measured on the part.
Ramps should be a minimum of 2 per minute, and
dwell times should insure that the contacts reach the
temperature
extremes (a minimum of 5 minutes).
Humidity is not controlled. Perform 500 such
cycles.
NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure 2.
Figure 1 (end)
Rev A
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108- 115019
3.6.
Product Qualification and Requalification test
Test Group (a)
Test or Examination
1
2
3
4
5
6
7
8
9
1
1
1
2, 4
2, 5, 7, 9
Test Sequence (b)
Initial examination of product
Contact resistance
1
1
1
1
1
2, 8
2, 6
2, 4, 6
2, 4, 7
2, 4
Dielectric withstanding Voltage
5
Insulation Resistance
6
Current Rating
4
Module insertion force
3, 7
Module withdraw force with latch
4, 6
Durability.
1
5
3
Durability(Preconditioning)
3
Reseating
8
Vibration
3
Mechanical shock.
5
Contact retention force
4
Solderability
2
2
Resistance to Reflow/Wave soldering heat
Thermal shock
3
Cyclic Temperature& Humidity
5
Mixed flowing gas
3
Dust
3
Temperature life (Preconditioning)
4
Thermal Cycling
6
Final examination of product
9
7
7
8
5
3
3
5
10
Test specimens
5
5
5
5
5
5
5
5
5
Notes:
(a)
See paragraph 4.1. A
(b)
Numbers indicate sequence in which tests are performed.
Figure 2
Rev A
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108- 115019
4.
QUALITY ASSURANCE PROVISIONS
4.1.
Qualification Testing
A.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. All test groups shall each consist of 5 specimens.
B.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
4.2.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
4.3.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
4.4.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Rev A
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108- 115019
Figure 3
Low Level Contact Resistance
Figure 4
Vibration and Mechanical Shock
Rev A
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108- 115019
Material: Tool steel, ISO 100CrMoV5, hardened.
Tyco Drawing
92-1888081
Description
Maximum Card
“A” Dimension
1.37 +0.000/-0.013 mm
Figure 5
DDR3 DIMM Steel Insertion Gauge
Rev A
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