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Hom e > Products > Data Inter connects > Product Featur e Selector > Product Details
CJ S hare
1- 292303- 6 Product Details
Quick
Univer sal Serial B u s ( USB ) Co nnecto r s
(J A lvtay s EU R o H S/ ELV Complia nt ( St a t e m e nt o f Complia n ce)
1-292303- 6
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Product Highlights:
• USB 2 .0 Industry Standar d
• Size = Sta nda rd
• A Series
• Receptacle
• Without Locking Feature
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T E Internal Number : 1·29230 3·6
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Documentation & Additional Information
Product D rawings:
• None Available
Related Products:
• Tooling
Catalog Pages/ Data Sheets:
• None Available
Product Specifications:
• None Available
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Application Specifications:
• None Available
Instruction Sheets:
• None Available
CAO Files: ( CAD Format & Compression Information)
• 2D Drawing (DXF, V ersion E2)
• 30 Model ( l GES, V ers ion E2)
• 30 Model ( STEP, V ers ion E2)
List all Docum ents
Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
• Size = St andar d
• Gender = Receptacle
• Orientation = Right Angle
• LED = Without
• PCB Mount Retention Type = SMT Hold Down
Housing Features:
• Housing Color = Black
Mechanical Attachment:
• Mount Location = Top
Industry Standards:
• Industry Standar d = USB 2 .0
• RoHS/ ELV Compliance = RoHS compliant, ELV compliant
• Lead Fr ee Solder Processes = Reflow solder capable to 245°C,
Reflow solder capable to 260°C
• RoHS/ ELV Compliance History = Alway s was RoHS compliant
• USB-! F Test ID Number (TIO) = Not Submitted For Testing
Termination Features :
• Contact Termination Type = Surface Mount
• Termination Method = Solder
Body
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Features :
Locking Feature = Without
Panel Gr ound = Without
Shell Plating = Bright Tin
Assembly Process Feature = Without Pick and Place Cov er
Locating Post( s) = With
Contact Features :
• Contact Plating, Mating Area, Mater ial = Gold or Gold Flash ov er
Palladium Nick el
• Contact Plating, Mating A r ea, Thickness ( µm ( µin)) = 0 .76 ( 29 .92)
Configuration Features :
• Number of Ports = 1
• Number of Positions = 4
Conditions for Usage:
• Applies To = Printed Circuit Boar d
Packaging Features :
• Pack aging Method = Tr ay
Other:
• Ser ies = A
• Br and = TE Connectivity
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