1-338084-6

4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2011 2 3 1 2011 LOC TE CONNECTIVITY REVISIONS DIST IR ALL RIGHTS RESERVED. - P Z 10 1,5±0,8 5 PIN 1 1.27 7.8 TYP. 1,4±0,8 2 CONTACT PLATING: OVERALL: Ni 1.27µm MIN. ALL OVER THE CONTACTS SOLDER ZONE: Sn 3.5-5.0µm ON THE SOLDER ZONE OF THE CONTACT MATING ZONE: PLATING CONFIRMS TO PRODUCT REQUIREMENTS AS PER SPECIFICATION 108-19117 4 APVD 06JAN2012 PS RRP 13JUN2016 AD SH 5 3.4 C 2 14.0 MATERIALS: HOUSING: 30% G.F. LCP COLOR BLACK, UL 94V-0. CONTACTS: PHOSPHOR BRONZE SOLDER BRACKET: TIN PLATED BRASS WITH NICKEL UNDERPLATE. THIS JACK CAN ALSO BE APPLIED HANGING THROUGH A HOLE, IN A PRINTED CIRCUIT BOARD. SEE LEFT PCB LAYOUT. 6 SURFACE CAN TYPE II SMD MEASURED AT COPLANARITY 7 TAPE AND REEL PACKAGING ACCORDING TO EIA 481-3 SPECIFICATIONS. 8 INCLUDES KAPTON TAPE (10x11,5mm) ON TOP SURFACE AS PICK AND PLACE FEATURE. 9 OBSOLETE PARTS: OBSOLETE CIS STREAMLINING PER D.RENAUD/D.SINSI 5 4.6 DWN D TOLERANCES UNLESS OTHERWISE SPECIFIED: # 0.15. 3 REF. ECO-16-001320 1 11,5 2.2 DATE NOTES: 5 +0.10 5.60 0 DESCRIPTION HOUSING RIB STRENGTHENED AND RAWMATERIAL CHANGED TO PA4T AA D 13.35±0.10 LTR BE USED FOR PICKING THE MODULAR JACK WITH, MACHINE. HEEL OF CONTACTS AT TIPS OF CONTACTS MAX. 0.18mm C 2.3 12.7 8.0 B 6.75 11.8 2.5 2.2 5 0.10 6 0.10 SECTION 19.4 2.8 19.4 14.6 8.8 9 4.5 0.6 3.2 0.6 1.27 PAD FOR PIN 1 TYP. 2.5 13.8 ±0.1 1.27 8.8 0.4R MAX. HOLE FOR BOTTOM ENTRY APPLICATION PRINTED CIRCUIT BOARD LAYOUT (BOTTOM ENTRY APPL.) 1471-9 (3/11) PAD FOR PIN 1 TYP. 9 2.5 4 POS./4 CONT. 750 PCS ON n 560 mm OD REEL. BOTTOM ENTRY ORIENTATION PER DETAIL B2 2-338084-5 4 POS./4 CONT. 750 PCS ON n 560 mm OD REEL. TOP ENTRY ORIENTATION PER DETAIL B1 2-338084-3 4 POS./4 CONT. 300 PCS ON n 360 mm OD REEL. TOP ENTRY ORIENTATION PER DETAIL B1 8 1-338084-6 4 POS./4 CONT. 300 PCS ON n 360 mm OD REEL. BOTTOM ENTRY ORIENTATION PER DETAIL B2 1-338084-5 4 POS./4 CONT. 300 PCS ON n 360 mm OD REEL. TOP ENTRY ORIENTATION PER DETAIL B1 1-338084-3 REMARKS PACKAGING DWN THIS DRAWING IS A CONTROLLED DOCUMENT. 0.70 4 PLC A B A-A REQUIRED SOLDER PASTE THICKNESS 0.1mm MIN. REQUIRED SOLDER PASTE THICKNESS 0.1mm MIN. 0.4 1.5 6.8 x7.2mm E.v.ELJK 30-Sep-96 DASHLINE INDICATES OUTLINE OF JACK, CONTACTS AND BRACKET PRINTED CIRCUIT BOARD LAYOUT (TOP ENTRY APPL.) mm 0 PLC 1 PLC 2 PLC 3 PLC 4 PLC ANGLES MATERIAL SEE NOTE 3 E.STELLINGA TOLERANCES UNLESS OTHERWISE SPECIFIED: DIMENSIONS: - FINISH - SEE NOTE 2 - APVD R.SMEETS PRODUCT SPEC 108-19117 APPLICATION SPEC - 114-19041 WEIGHT TE Connectivity DEC.'96 CHK 0.7 4 PLC PART NUMBER 7 INVERTIBLE MODULAR JACK, 4 POSITION HANDSET SURFACE MOUNT APPLICATION SIZE 1.92 gr - CUSTOMER DRAWING A NAME CAGE CODE A2 00779 DRAWING NO 338084 SCALE 5:1 SHEET 1 RESTRICTED TO OF - 2 REV AA 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2011 OVAL HOLE D TE CONNECTIVITY 2 3 1 2011 LOC IR ALL RIGHTS RESERVED. REVISIONS DIST - P LTR - DESCRIPTION DATE SEE SHEET 1 DWN APVD - - - D 20 REF. B DETAIL SEE 37 REF SEE DETAIL B1 32 REF. & B2 13 REF. C C ROUND HOLE TOP ENTRY ORIENTATION. DETAIL SCALE B1 4:1 OVAL HOLE B B 5 TYPICAL DWN THIS DRAWING IS A CONTROLLED DOCUMENT. E.v.ELJK 30-Sep-96 BOTTOM ENTRY ORIENTATION. ROUND HOLE DETAIL SCALE 4:1 B2 mm 0 PLC 1 PLC 2 PLC 3 PLC 4 PLC ANGLES MATERIAL FINISH 1471-9 (3/11) E.STELLINGA TOLERANCES UNLESS OTHERWISE SPECIFIED: DIMENSIONS: - - APVD R.SMEETS PRODUCT SPEC 108-19117 APPLICATION SPEC - 114-19041 WEIGHT TE Connectivity DEC.'96 CHK A INVERTIBLE MODULAR JACK, 4 POSITION HANDSET SURFACE MOUNT APPLICATION SIZE 1.92 gr - CUSTOMER DRAWING A NAME CAGE CODE A2 00779 DRAWING NO 338084 SCALE 5:1 SHEET 2 RESTRICTED TO OF - 2 REV AA