Part Details for P/N: 104693-1
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Wednesday, 31 August, 2005
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AMPMODU
.050 Inch Centerline Board-to-Board AMPMODU 50/50 Grid
Connector System
104693-1
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Not ELV or RoHS Compliant
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(Corporate P/N: 104693-1)
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Searchable Features:
Brand:
AMP
RoHS/ELV
Compliance:
Not ELV/RoHS
compliant
Lead Free Solder
Processes:
Reflow solder
capable to 245°
C, Reflow solder
capable to 260°C
Product Type:
Other Properties:
Mating Polarization
Method:
Keyed
Voltage (VAC):
30
Temperature Range (°
-65 – +105
C):
Insulation
Resistance (MΩ):
5,000
Housing Material:
Liquid Crystal
Polymer (LCP)
Contact Current
Rating (Amps.):
1–4
Header
Number of
Positions:
10
Terminate To:
Printed Circuit
Board
http://catalog.tycoelectronics.com/TE/bin/TE.Connect?M=BYPN&C=1&PN=104693-1&LG=1&I=13 (1 of 2)8/31/2005 2:24:48 PM
Part Details for P/N: 104693-1
Mount Angle:
Vertical
Special PCB
Retention:
Yes
Special PCB
Retention Method:
Standard
Holddowns
Mating Connector
Lock:
Without
Mating Polarization: Yes
Mated Stack Height
(Vertical) (mm [in]):
9.91 [0.390]
Dielectric
Withstanding
Voltage (V):
300
Approved Standards:
CSA LR7189,
UL E28476
Housing Material
Flammability Rating:
UL 94V-0
Housing Color:
Black
Contact Material:
Phosphor
Bronze
Contact Mating Area
Plating:
Gold (30)
Solder Tail Plating:
Tin-Lead (150)
Contact
Underplating:
Nickel (50)
Hold-Down Post
Material:
Copper Alloy
Hold-Down Post
Plating:
Tin-Lead (150)
over Nickel (50)
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