1376408-1

Product Specification 108-5701 11JUL07 Rev. F DDR S.O.DIMM Socket 200 Positions 1. Scope : 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of DDR S.O.DIMM Socket 200 Positions Combine to Gold Plating S.O.DIMM. Applicable product description and part numbers are as shown in Appendix 1. 2. Applicable Documents: The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 AMP Specifications : A. 109-5000 Test Specification, General Requirements for Test Methods B. 501-5361 Test Report (Standard profile) 501-5431 Test Report (Standard profile) 501-5435 Test Report (Low profile) 501-5460 Test Report (6.5 Height) 501-5488 Test Report (9.2 Height) 2.2 A. Commercial Standards and Specifications : MIL-STD-202 3. Requirements : 3.1 Design and Construction : Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 Materials : A. Contact : Copper Alloy Finish: Contact area: Gold Plated B. Tine area :Gold Plated Underplate :Nickel Plated Housing : Thermo plastic UL94V-0 Tyco Electronics AMP K.K. (3-5-8 Hisamoto Takatsu-ku Kawasaki, 213-8535) © Copyright 2007 Tyco Electronics AMP K.K. All international rights reserved. Trademark 1 of 5 Product Specification C. 108-5701 Latch : Stainless Steal D. Floating Peg Copper Alloy, Tin Plated 3.3 Ratings : A. Voltage Rating : 25 VAC B. Current Rating : 0.5 A C. Temperature Rating : 3.4 55 °C to 85 °C Performance Requirements and Test Descriptions : The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig. 1. All tests shall be performed in the room temperature, unless otherwise specified. 3.5 Test Requirements and Procedures Summary Para. 3.5.1 Test Items Examination of Product Requirements Procedures Meets requirements of product Visual inspection drawing No physical damage Electrical Requirements 3.5.2 Termination Resistance 30 m (Low Level) ∆R=20 m Max. (Initial) Max. (Final) Subject mated contacts assembled in housing to closed circuit current of 10 mA Max. at open circuit voltage of 20mV Max. obtain resistance value by dividing the measured reading into two. Fig. 3-1,3-2. AMP Spec. 109-5311-1 3.5.3 Dielectric withstanding No creeping discharge nor 0.25 kVAC for 1 minute. Voltage flashover shall occur. Current leakage : 0.5 mA Max. Test between adjacent circuits of unmated connectors. AMP Spec. 3.5.4 Insulation Resistance 250M Min.(Initial) Min.(Final) 50M 109-5301 Impressed voltage 500 V DC. Test between adjacent circuits of unmated connectors. AMP Spec. 109-5302 Para. Test Items Requirements Procedures 3.5.5 Vibration (Low Frequency) No electrical discontinuity greater than 0.1 sec. shall Subject mated connectors to 10-55-10 Hz traversed in 1 minute at 1.52 mm occur. ∆R=20 m amplitude 2 hours each of 3 mutually perpendicular Mechanical Requirements Max. (Final) planes. 100 mA applied. AMP Spec. Rev. F 109-5201 2 of 5 Product Specification 3.5.6 Physical Shock 108-5701 No electrical discontinuity Accelerated Velocity : 490 m/s2 (50 G) greater than 0.1 occur. Waveform : Half sine Duration : 11 m sec. ∆R=20 m sec. shall Max. (Final) Number of Drops: 3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops. AMP Spec. 109-5208 Condition A 3.5.7 P.C.Board Mating Force 200 Pos. : 59.8N (6.1 kgf) Max. Operation Speed : 100 mm/min. Measure the force required to mate connectors.(In this test, the force required to turn PCB before it engages on lacking, is excluded.) AMP Spec. 109-5206 Para. Test Items 3.5.8 Durability (Repeated Requirements Procedures ∆R=20 m Repeated insertion and extraction of P.C.B to and from the connector with the turns to Max. (Final) Mate/Unmating) 3.5.9 Solder ability Condition B lock it and then unlock it for 25 cycles. Wet Solder Coverage : 95 % Min. Solder Temperature : 245 5 °C Immersion Duration : 5 0.5 seconds Flux : Alpha 100 AMP Spec. 109-5203 Environmental Requirements 3.5.10 3.5.11 Resistance to Reflow No physical damage shall Soldering Heat occur Thermal Shock ∆R=20 m Max. (Final) Test connector on P.C.Board :90 30sec. Pre-Heat150 180 Heat 230 Min. :30 10sec. Max. See Fig.4-2 Heat Peak260 OR Apply to JEDEC standard (J-STD-020C) Mated connector 55°C / 30 min., 85°C / 30 min. Making this a cycle, repeat 5 cycles. AMP Spec. 109-5103 Condition A Para. Test Items Procedures 3.5.12 Humidity-Temperature Mated connector, 25 65°C, Cycling 90 95 % R. H. 5 cycles Cold shock 10°C performed ∆ AMP Spec. 109-5106 3.5.13 Salt Spray ∆ Subject mated connectors to 5 % salt concentration for 24 hours : AMP Spec. 3.5.14 Industrial Gas (SO2) ∆ 109-5101 Condition A Mated connector SO2 Gas : 10 ppm, 95 % R. H. 25°C, 24 hours AMP Spec. Rev. F 109-5107 Condition A 3 of 5 Product Specification 3.5.15 Temperature Life ∆ 108-5701 Mated connector (Heat Aging) 85°C, Duration :2 days AMP Spec. 109-5104 Condition A 4. Product Qualification Test Sequence Test Group Test Examination 1 2(b) 3(b) 4 5 6 7 8 9 10 11 12 Test Sequence (a) Examination of Product 1,7 1,5 1,5 1,3 1,5 1,3 1,3 1,5 1,5 1,5 1,5 1,5 Termination Resistance (Low Level) 2,4 2,4 Dielectric withstanding Voltage 3,6 Insulation Resistance 2,5 Vibration (Low Frequency) 2,4 3 Physical Shock 3 Connector Mating Force 2 Durability (Repeated Mate/Unmating) 3 Solderability 2 Resistance to Reflow Soldering Heat 2 Thermal Shock Temperature Humidity Cycling 2,4 2,4 2,4 2,4 2,4 3 4 3 Salt Spray 3 Industrial SO2 Gas 3 Temperature Life (Heat Aging) 3 FIG.2 (a) Numbers indicate sequence in which the tests are performed. (b) Discontinuities shall nit take place in this test group, during tests. Rev. F 4 of 5 Product Specification 108-5701 Fig.3-1 Termination Resistance Mesuring Points. Soldering temperature ( ) Peak temperature 260 Max. 300 260 Max. 250 230 Min. 200 180 150 100 50 Pre-Heating 90 +- 30 sec Heat 30 +- 10 sec Fig.4 Temperature Profile of Reflow Soldering Rev. F 5 of 5