1888371-1

7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 4 21.27 [.84 ] 28.96 0.15 [1.140 .006 ] 29.76 [1.17 ] 28.83 0.25 [1.135 .009 ] CONTACT #1 PC BOARD DIM L DIM M 0.30 [.012 ] 1.00 REF [.039 ] 3.94 [.155 ] 2.12 [.083 ] 1.27 TYP [.050 ] -V- APVD D REVISED PER ECO-16-016643 17NOV2016 LL SH E ECO-16-018208 19DEC2016 LL SH MATERIAL: DATUM AND BASIC DIMENSION ESTABLISHED BY CUSTOMER 3 RECOMMENDED PC BOARD THICKNESS OF 1.57[.062] FOR 1888371-1. RECOMMENDED PC BOARD THICKNESS OF 2.36[.093] FOR 1888371-2. 4 RJ45 JACK CAVITY CONFORMS TO FCC RULES AND REGULATIONS, PART 68 SUBPART F 5 BEFORE INSERTION IN PANEL CUTOUT D C OUTER SHIELD 2 2.30 0.08 2 PLC [.091 .003 ] 2 BSC 1.14 0.08 8 PLC [.045 .003 ] DWN 10.61 [.418 ] PANEL CUTOUT SHOWN IN VIEW FOR DIMENSIONAL LOCATION C DATE 2 PANEL CUTOUT 4.17 [.164 ] DESCRIPTION HOUSING: PLASTIC HOUSINGS: UL94V-0/5V THERMOPLASTIC, COLOR: BLACK TERMINAL: USB: 0.251±0.013 THICK PHOSPHOR BRONZE PLATED WITH 1.27µm NICKEL. IN LOCALIZED GOLD PLATE AREA 0.076µm MIN GOLD OVER 0.76µm MIN PALLADIUM-NICKEL IS ADDED OVER NICKEL UNDERPLATE. IN SOLDER AREA 3.8µm MIN TIN IS ADDED OVER NICKEL UNDERPLATE. RJ45: 0.318 THICK PHOSPHOR BRONZE PLATED WITH 1.27µm MIN THICK NICKEL. IN LOCALIZED GOLD PLATE AREA 1.27µm MIN THICK GOLD IS ADDED OVER NICKEL UNDERPLATE. IN SOLDER AREA 3.8µm MIN TIN IS ADDED OVER NICKEL UNDERPLATE. SHIELD: OUTER: 0.254 THICK COPPER-ZINC ALLOY PREPLATED WITH TIN 2µm TO 3.8µm THICK. INNER: 0.318 THICK COPPER-ZINC ALLOY PREPLATED WITH TIN 2µm TO 3.8µm THICK. USB: 0.318 THICK PHOSPHOR-BRONZE PREPLATED WITH 5.1µm MIN TIN CONTACT #1 & USB LTR 4.70 [.185 ] 5 1.25 [.049 ] 4 P 1. D 1 REVISIONS 20.02 0.15 [.788 .006 ] ASSEMBLY 2 20 ALL RIGHTS RESERVED. BY - 3 2.06 [.081 ] -W- 2.30 0.08 [.091 .003 ] -A- 0.92 0.08 8 PLC [.036 .003 ] 2.54 [.100 ] B 12.68 [.499 ] 10.05 [.396 ] 14.15 [.557 ] 2.62 [.103 ] B 5.68 [.224 ] 2.71 [.107 ] 2.30 0.08 [.091 .003 ] -U- 2 1.40 0.08 4 PLC [.055 .003 ] 2.50 [.098 ] 2.50 [.098 ] 2 EDGE OF PRINTED CIRCUIT BOARD 3.07 [.121 ] -B- BSC 2.00 [.079 ] 13.13 [.517 ] 19.25 [.758 ] A RECOMMENDED PCB LAYOUT 3 THIS DRAWING IS A CONTROLLED DOCUMENT. DIMENSIONS: mm[INCHES] MATERIAL SEE NOTE 1 4805 (3/13) TOLERANCES UNLESS OTHERWISE SPECIFIED: 0 PLC 1 PLC 2 PLC 3 PLC 4 PLC ANGLES FINISH 0.13[.005] 1° SEE NOTE 1 2.85 [.112 # 0.25 # .009] 2.85 [.112 # 0.25 # .009] 1888371-2 2.29 [.090 # 0.25 # .009] 2.25 [.089 # 0.25 # .009] 1888371-1 DIM L 16FEB2006 B. H/L.A.MAYER CHK 16FEB2006 J.WESTMAN APVD 16FEB2006 S.FLICKINGER DWN PRODUCT SPEC - DIM M PART NUMBER TE Connectivity NAME ASSEMBLY, RJ-45 MODULAR JACK OVER STACKED USB RECEPTACLE APPLICATION SPEC - WEIGHT SIZE - CUSTOMER DRAWING CAGE CODE A1 00779 DRAWING NO RESTRICTED TO 1888371 SCALE 4:1 SHEET 1 OF - 1 REV E A