zSFP+
PLUGGABLE
I/O INTERCONNECT
The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28
Gbps NRZ and 56 Gbps PAM-4. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is hotswappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+
connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm
cost savings as this would eliminate the need to fully redesign for higher performance.
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire
product family is offered as a dual source option with Molex. LLC.
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
zSFP+ Pluggable I/O Interconnect
FEATURES
• Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10
Gbps Ethernet and 16 Gbps Fibre Channel
• Surface-mount connector design for single high 1xN cages
• Press-fit 1xN cages and stacked assemblies (connector and
cage) for one-step, easy PCB placement
Light pipe options include:
No light pipes
• Coupled, narrow-edged, blanked- and formed-contact beam
geometry and insert molding for superior signal integrity,
mechanical and electrical performance
All 4 light pipes (shown left)
• Backwards-compatibility: Shares same mating interface and
cage dimensions with the SFP+ connector (connector/single
high cages are also PCB footprint-compatible)
Outer light pipes [standard]
• Elastomeric gasket or spring finger options for EMI
containment
• Single high cages (1xN) for design flexibility; accommodates
belly-to-belly applications for increased density and PCB
space savings; available in 1x1, 1x2, 1x3, 1x4 or 1x6 port
configurations
Inner light pipes
Three light pipes
Outer light pipes [reversed]
• Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12
port
• Heat sinks, LEDs and plating choices offered
• Additional light pipe configurations available
APPLICATIONS
• Telecommunications: Cellular infrastructure, central office
uplink equipment, optical transport equipment, switches/
routers, access equipment (CMTS, PON, DSL, etc)
• Data Center: Data center switches and routers, servers,
storage
• Medical: Medical diagnostic equipment
• Networking: Network interface, switches, routers
• Test and Measurement Equipment
20-Pin Surface-Mount Connector
Electrical
• Voltage (max.): 120V AC
• Current (max.): 0.5A
• Dielectric Withstanding Voltage:
300V AC between contacts
Mechanical
• Mating Force: 25N
• Unmating Force: 11.5N
• Durability (min.): 250 cycles
Physical
• High-temperature thermoplastic housing (glass-filled, UL
94V-0 black)
• High-performance copper alloy contacts
• Plating:
-- Nickel underplating; Tin plating on solder tail area;
Gold plating on mating area
-- Plating options: 15 and 30μ” Gold or Palladium Nickel
• Operating Temperature: -40 to +85oC
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
PAGE 2
zSFP+ Pluggable I/O Interconnect
Connector P/N
Description
2170088-1
30μ” in Au or Au Flash Over PdNi
2170088-2
15μ” in Au or Au Flash Over PdNi
Cages with Elastomeric Gaskets
EMI
Suppression
Light Pipe
Option
1X1
1X2
1X4
1X6
1X8
No
2198709-1*
2198720-1
2198722-1
2198724-1
TBD**
Yes
2198708-1*
2198719-1
2198721-1
2198723-1
TBD**
EMI gasket
Cages with EMI Springs
EMI
Suppression
Light Pipe
Option
Heat Sink
Option
1x1
1x2
1x3
1x4
1x6
1X8
No
Yes
2297033-X
2321406-X**
2349059-1**
2312532-1
2302141-X
2302014-1
2227728-1
2349050-1
2227730-1
2227732-1
2274001-1
No
EMI Spring
Fingers
2291579-1
No
(PCI)
2304921-1
2295325-6
Yes
No
2274000-1
2227727-1
TBD**
2227729-1
2227731-1
2334362-1
Yes
Yes
2318802-1
TBD**
TBD**
2304342-X
2293156-X
2294408-X
*Tooling in process **Not yet tooled, but planned
Ganged 1xN Cages
Mechanical
Physical
• Transceiver insertion force (max.): 34 N without heat sink and clip;
• Cage material: Nickel Silver
45.37 N with heat sink and clip
• PCB thickness (min.): 1.50mm in single sided
• Transceiver extraction force (max.): 12.5 N without heat sink and
applications; 2.25mm (EMI springs) or 3.0mm
(elastomeric gasket) in belly-to-belly applications
clip; 14.36 N with heat sink and clip
• SFP+ module to surface-mount connector and zSFP+ cage.
• Cage press fit insertion force (max.): 44.5 N for single port cage,
• Operating Temperature: -40 to +85oC
54.3 N for ganged cage
• Cage press fit extraction force (min.): 8.9 N for single port and
ganged cages
• Durability (min.): 100 cycles
Ganged SFP+ 1x4 vs. zSFP+ 1x4
Radiated source RF leakage (dB)
0
-10
-20
-30
-40
Ganged SFP+ 1x4 —
Ganged zSFP+ 1x4 —
-50
-60
-70
-80
0
5
10
15
20
25
30
GHz
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
PAGE 3
zSFP+ Pluggable I/O Interconnect
Stacked SFP28 2xN Assemblies
Electrical
Stacked SFP+ vs. zSFP+
0
• Current (max.): 0.5A
• Dielectric Withstanding Voltage: 300V AC
between contacts
Mechanical
• Durability (min.): 100 cycles
Physical
• Cage material: Nickel Silver
-- High-temperature thermoplastic housing
(glass-filled, UL 94V-0 black)
-- High-performance copper alloy contacts
Radiated source RF leakage (dB)
• Voltage (max.): 120V AC
-10
-20
-30
-40
-50
Stacked SFP+ —
Stacked zSFP+ —
-60
-70
-80
-- Plating: Nickel underplating; Tin plating
0
on solder tail area; 30μ” Gold plating on
mating area
5
10
15
20
25
30
GHz
• PCB thickness (min.): 1.57mm
• Operating Temperature: -40 to +85oC
Upper contact row —
Lower contact row —
zSFP+ Stacked Interconnects SFP28 PN list
EMI gasket
EMI
Suppression
Performance
Standard
Thermally
EMI spring fingers
Enhanced
Standard
Thermally
Enhanced
Light Pipe
Configuration
2x1
2x2
2x4
2x6
2x8
2x12
2198318-(x)
2198325-(x)
2180324-(x)
2198339-(x)
2198346-(x)
2288172-(x)
None
2198318-1
2198325-1
2180324-1
2198339-1
2198346-1
2288172-1
All 4
2198318-2
2198325-2
2180324-2
2198339-2
2198346-2
2288172-2
Inner
2198318-3
2198325-3
2180324-3
2198339-3
2198346-3
2288172-3
Outer
2198318-4
2198325-4
2180324-4
2198339-4
2198346-4
2288172-4
3
1-2198318-7
1-2198325-7
1-2180324-7
1-2198339-7
1-2198346-7
1-2288172-7
Outer (reversed)
1-2198318-8
1-2198325-8
1-2180324-8
1-2198339-8
1-2198346-8
1-2288172-8
Multiple
--
--
3-2180324-0
--
--
2227838-8
None
2198318-5
2198325-5
2180324-5
2198339-5
2198346-5
2288172-5
All 4
2198318-6
2198325-6
2180324-6
2198339-6
2198346-6
2288172-6
Inner
2198318-7
2198325-7
2180324-7
2198339-7
2198346-7
2288172-7
Outer
2198318-8
2198325-8
2180324-8
2198339-8
2198346-8
2288172-8
3
1-2198318-9
1-2198325-9
1-2180324-9
1-2198339-9
1-2198346-9
1-2288172-9
Outer (reversed)
2-2198318-0
2-2198325-0
2-2180324-0
2-2198339-0
2-2198346-0
2-2288172-0
Multiple
--
--
3-2180324-1
2291491-1
--
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
2227838-7
2301210-2
PAGE 4
zSFP+ Pluggable I/O Interconnect
zSFP+ Stacked Interconnects SFP56 PN list
Tooled
EMI
EMI Gasket
Suppression
NOT YET TOOLED,
BUT PLANNED
Performance
Standard
Light Pipe
2x1
2x2
2x4
2x6
2x8
2x12
Configuration
2198318-(x)
2198325-(x)
2180324-(x)
2198339-(x)
2198346-(x)
2288172-(x)
NONE
2349202-1
2343522-1
2339978-1
2347721-1
2340033-1
2349201-1
INNER/OUTER
2349202-2
2343522-2
2339978-2
2347721-2
2340033-2
2349201-2
INNER
2349202-3
2343522-3
2339978-3
2347721-3
2340033-3
2349201-3
OUTER
2349202-4
2343522-4
2339978-4
2347721-4
2340033-4
2349201-4
CENTER/
1-2349202-7
1-2343522-7
1-2339978-7
1-2347721-7
1-2340033-7
1-2349201-7
1-2349202-8
1-2343522-8
1-2339978-8
1-2347721-8
1-2340033-8
1-2349201-8
3-2339978-0
3-2347721-0
3-2340033-0
REVERSED
OUTER
REVERSED
OUTER
Airflow Enhanced
Standard
NONE
INNER
3-2340033-2
-
NONE
2349202-5
2343522-5
2339978-5
2347721-5
2340033-5
2349201-5
INNER/OUTER
2349202-6
2343522-6
2339978-6
2347721-6
2340033-6
2349201-6
INNER
2349202-7
2343522-7
2339978-7
2347721-7
2340033-7
2349201-7
OUTER
2349202-8
2343522-8
2339978-8
2347721-8
2340033-8
2349201-8
CENTER/
1-2349202-9
1-2343522-9
1-2339978-9
1-2347721-9
1-2340033-9
1-2349201-9
2-2349202-0
2-2343522-0
2-2339978-0
2-2347721-0
2-2340033-0
2-2349201-0
-
2-2347721-1
-
-
NONE
-
3-2343522-3
3-2339978-1
3-2347721-1
3-2340033-1
2-2349201-1
CENTER/
-
-
3-2339978-2
-
-
-
OUTER
-
-
3-2339978-3
-
-
-
REVERSED
-
-
-
-
-
-
-
-
3-2339978-4
-
3-2340033-3
2-2349201-2
-
-
-
4-2340033-0
-
REVERSED
OUTER
EMI Spring Fingers
REVERSED
OUTER
REVERSED INNER
REVERSED
Airflow Enhanced
OUTER
OUTER
Airflow Enhanced
NONE
& INSULATOR
TAPE
TOP CAGE
NONE
HEATSINK
OPENING
SFP28 Direct Attach Copper Cable Assemblies
TE’s SFP28 passive copper cable assembly features two differential copper pairs, providing one data transmission channel at
speeds up to 28Gbps per channel that meets 25G Ethernet performance requirements. SFP28 is designed for applications in
the data center, networking and telecommunications markets that require a high speed, reliable cable assembly,
Offered in a broad range of wire gages – from 26AWG through 33AWG – this next generation copper cable assembly features
low insertion loss and low cross talk. TE’s SFP28 assemblies share the same mating interface with SFP+ form factors, making
it backward compatible with existing SFP+ I/O ports. SFP28 can be used with legacy 10G Ethernet and 16G Fibre Channel
applications with substantial signal integrity margin.
In addition to SFP28 straight cables, TE offers break out assemblies with a 100G QSFP28 module on one end breaking out
to four SFP28 modules on the opposite end of the assembly. In-line SI based production testing ensures that each cable
assembly meets the electrical performance requirements of the applicable industry standard specification.
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
PAGE 5
zSFP+ Pluggable I/O Interconnect
Features and Benefits
• Compatible with IEEE 802.3by and Fibre Channel industry standards
• Supports single lane data rate up to 28Gbps
• Optimized construction to minimize insertion loss and cross talk
• Customized cable braid termination limits EMI radiation
• Backward compatible with existing SFP+ form factor connectors and cages
• Pull-to-release latch design
• 26AWG through 33AWG cable
• Straight and breakout cable assembly configurations available
SFP28 to SFP28 Straight Cable Assembly
• Customizable EEPROM mapping for cable signature
• RoHS compliant
Industry Standards
• 25G Ethernet (IEEE 802.3by)
• Fibre Channel
• SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)
• SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28)
QSFP28 to 4x SFP28 Breakout Cable
Assembly
Part Number Detail
Base Part Number
Description
2821262
2821222
SFP28 to SFP28 Straight
2821223
Assembly
2821224
2821033
AWG
Dash to Length (meters)
0.5
1
1.5
2
33
-1
-2
-3
-4
30
-5
-3
28
Breakout Assembly
33
-8
30
-1
4
5
-2
-1
-2
-1
-3
-1
-2
-3
-5
-3
26
QSFP28 to 4x SFP28
3
-10
-2
28
-4
26
-12
Contact your TE Representative for customized lengths.
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
PAGE 6
For More Information
te.com/products/zsfp+
TE Technical Support Center
USA:
+1 (800) 522-6752
Canada:
+1 (905) 475-6222
Mexico
+52 (0) 55-1106-0800
Latin/S. America: +54 (0) 11-4733-2200
Germany:
+49 (0) 6251-133-1999
UK:
+44 (0) 800-267666
France:
+33 (0) 1-3420-8686
Netherlands:
+31 (0) 73-6246-999
China:
+86 (0) 400-820-6015
Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.
*as defined www.te.com/leadfree
te.com
© 2019 TE Connectivity Ltd. family of companies. All Rights Reserved.
1-1773707-6 DND PDF 06/19
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.
zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology.
ZXP is a registered trademark of Molex LLC.
Other logos, product and company names mentioned herein may be trademarks of their respective owners.
While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is
error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE
reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied
warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a
particular purpose. The dimensions in this brochure are for reference purposes only and are subject to change without notice. Specifications
are subject to change without notice. Consult TE for the latest dimensions and design specifications.
DATA AND DEVICES /// zSFP+ I/O INTERCONNECT
