V
Contact pin base material change from CuSn (Phosphor bronze)to CuZn
(Brass). Plating change from min. 0.8microns gold plating to min. 0.7
microns Pd Ni + 0.1 microns gold flash at contact area (Area F).
24JUN
2014
TJ
JK
MATING SIDE: MIN 0.7µm PdNi + 0.1µm GOLD FLASH.
SOLDER SIDE: MIN 2.5µm TIN OVER 1.27µm NICKEL.
Cu Zn
108-18012
AMPMODU II PIN HEADER, 90DEGREE,
SINGLE ROW
V
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