RUGGEDIZED OPTICAL
BACKPLANE INTERCONNECTS
FOR VITA 66.1 AND 66.4
High-Density Optical Modules for Demanding
Embedded Computing Application
AEROSPACE, DEFENSE & MARINE /// RUGGEDIZED OPTICAL BACKPLANE INTERCONNECTS
RUGGEDIZED OPTICAL
BACKPLANE INTERCONNECTS
Support VITA 66.1 and 66.4 Standards
TE Connectivity’s (TE) Ruggedized Optical Backplane interconnect
system provides a high-density, blind-mate optical interconnect in a
backplane/daughtercard configuration. The fiber optic ribbon cable
interconnect feeds through the backplane to removable system modules
using MT ferrules.
The optical module are available in two sizes:
RUGGED RELIABILITY
• Meets VITA 66.1 and 66.4 standards
• Common protective cover is made
of anti-static material
• Receptacle (backplane) connector
includes two robust guide pins for
blind mating
• Connector mounting screws
contain pre-applied Nylok patch to
help withstand vibration
VERSATILE
• Full-size VITA 66.1 or half-size
VITA 66.4 modules
• Plug (daughtercard) connector
housing contains a slot feature to
facilitate cleaning the MT interfaces
• VITA 66.1 modules are full width and accommodate two MT ferrules.
• VITA 66.4 modules are half width and hold a single MT ferrule. Two
modules can be fit into the same space as a VITA 66.1 modules.
Designed for rugged embedded computing applications, the optical
modules are compatible with VPX and other high-performance standards.
MECHANICAL/ENVIRONMENTAL
•M
ating Force (per 12-fiber MT ferrule):
Min: 7.8 N (1.75 lb)
Max: 11.8 N (2.65 lb)
• Durability: 100 cycles, tested per EIA-455-21
• Shock: 50 g, sawtooth, 11 ms pulse duration, tested per TIA/EIA-455-14, condition E
• Random Vibration: 11.95 grms, 50 to 2000 Hz, 2 hr per plane.
Tested per TIA/EIA-455-11, test condition V1-D
• Storage Temperature: -55˚C to +85˚C
• Operating Temperature: -20˚C to +85˚C
• Thermal Aging: 168 hrs at +85˚C
• Humidity, Steady-State: 95% RH at 60˚C
• Temperature Cycling: 21 cycles between -20˚C and +85˚C
MATERIALS
• Locating post features helps ensure
proper position on the backplane
and daughtercard
•C
onnector Shell and Housing: Aluminum alloy 6061, clear-chromate
conversion-coated (RoHS compliant)
•A
lignment Posts and Screws: Stainless steel, 300 series, passivated
(RoHS-compliant)
HIGH PERFORMANCE
STANDARDS AND SPECIFICATIONS
•C
onnectors designed to maximize
optical performance, accommodating
up to two MT ferrules
•T
E Application Specification:
VITA 66.1: 114-32050
VITA 66.4: 114-32144
•T
E Product Specification:
VITA 66.1: 108-2467
VITA 66.4: 108-2467-1
•T
E Qualification Test Report:
VITA 66.1: 501-134012
VITA 66.4: 501-134012-1
•R
eceptacle connector insert
floats relative to the shell, providing
±0.25 mm planar floating
alignment capability
APPLICATIONS
• Embedded Computing
• Avionics and Vetronics
• Secure Communications
• Processing
• Radar
• Imaging and Targeting
TE Components . . . TE Technology . . . TE Know-how . . .
AMP | Agastat | CII | Hartman | Kilovac | Microdot | Nanonics | Polamco | Raychem | Rochester | DEUTSCH
SEACON Phoenix | L.L. Rowe | Phoenix Optix | AFP | SEACON
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AEROSPACE, DEFENSE & MARINE /// RUGGEDIZED OPTICAL BACKPLANE INTERCONNECTS
PAGE 2
Ruggedized Optical Backplane Interconnects
Part Numbering and Dimensions
Interface
Part No.
Backplane
Daughtercard
VITA 66.1
2000973-1
2000974-1
VITA 66.4
2226880-1
2226881-1
MT Ferrule Kit
(12 Fiber, Multimode)
2102866-1
2102866-2
VITA 66.1
(Shown Assembled with Reference MT Cable Assemblies Installed)
Backplane Module
Part No. 2000973-1
Daughtercard Module
Part No. 2000974-1
Protective Cover
Part No. 2102321-1
VITA 66.4
(Shown Assembled with Reference MT Cable Assemblies Installed)
Backplane Module
Part No. 2226880-1
Daughtercard Module
Part No. 2226881-1
AEROSPACE, DEFENSE & MARINE /// RUGGEDIZED OPTICAL BACKPLANE INTERCONNECTS
PAGE 3
LET’S CONNECT
We make it easy to connect with our experts and are ready to
provide all the support you need. Just call your local support number or visit
www.te.com/industrial to chat with a Product Information Specialist.
Technical Support
te.com/support-center
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+1 800 522 6752
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+86 400 820 6015
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044 844 8180
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+61 2 9554 2695
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+31 73 624 6999
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+64 (0) 9 634 4580
India (Toll-Free)
+800 440 5100
te.com/vita66
TE, TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.
Other products, logos, and company names mentioned herein may be trademarks of their respective owners.
Nylok is a trademark of Nylok LLC. Other product or company names mentioned herein may be trademarks of their
respective owners.
While TE has made every reasonable effort to ensure the accuracy of the information herein, nothing herein
constitutes any guarantee that such information is error-free, or any other representation, warranty or guarantee
that the information is accurate, correct, reliable or current. The TE entity issuing this publication reserves the right
to make any adjustments to the information contained herein at any time without notice. All implied warranties
regarding the information contained herein, including, but not limited to, any implied warranties of merchantability
or fitness for a particular purpose are expressly disclaimed. The dimensions herein are for reference purposes only
and are subject to change without notice. Specifications are subject to change without notice.
Consult TE for the latest dimensions and design specifications.
© 2016 TE Connectivity Ltd. family of companies All Rights Reserved.
1-1773708-2 07/16
AEROSPACE, DEFENSE & MARINE /// RUGGEDIZED OPTICAL BACKPLANE INTERCONNECTS
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