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Quick Reference Guide High Speed Backplane Interconnect Solutions The emergence of faster data rates, and decreasing signal rise times, requires better performing, high speed connectors. TE Connectivity’s broad portfolio of high speed backplane connectors provides system designers the flexibility they require to solve their specific performance challenges. INDUSTRY APPLICATIONS • Servers- blade, rack mount and mainframe stackable, carrier grade, core, edge and Metro Ethernet • Switches- Stackable, carrier grade, core, edge and Metro Ethernet • Routers- edge, core, enterprise class, carrier Ethernet, BRAS and Multi Service Edge te.com/products/2Piece-High-Speed • Optical- Transport: carrier grade optical, metro WDM, optical multi-service provisioning, long haul optical and enterprise LAN optical Ethernet TE Connectivity High Speed Backplane Connectors Signal Integrity at TE TE Connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product. Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presence places simulation, modeling, and system layout experts next to the customer. Modeling and Simulation At TE the design process starts with signal integrity. Signal integrity engineers use sophisticated 3D tools to provide accurate connector and footprint via pattern performance prior to production. TE has the tools and expertise to get the right answer. n Ansys  HFSS and CST Microwave Studio Full-wave 3D tools n Both connector and footprint via pattern(s) analyzed before production n S-parameter  and SPICE analysis n Sophisticated  ADS and MATLAB system analysis Test Capability With measurement capabilities beyond 12.5 Gbps and 50 GHz, TE can characterize and provide detailed measurements for its products. Cutting-edge measurement calibration techniques and board design enable accurate de-embedding of test fixtures. TE has also teamed with numerous silicon companies to provide active device measurements that can be invaluable to assure the successful implementation of a design. n Advanced calibration techniques de-embed fixture n Frequency domain to 50 GHz n Time domain eye pattern/BERT to 12.5 Gbps n Active silicon testing – multiple vendors 2 – 10+ Gbps n Both system and “connector only” boards Customer Support and Tools From test boards to simulation models, TE provides a library of tools that help you successfully implement your system. Requests can be easily made through our signal integrity website: www.te.com/documentation/electrical-models n Ansys HFSS and CST Microwave Studio Full-wave 3D tools n Both  connector and footprint via pattern(s) analyzed before production n S-parameter and SPICE analysis n Sophisticated ADS and MATLAB system analysis n Measurement based S-parameter connector models (64+ ports) n Modeling based S-parameter connector models (64+ ports) n Footprint via pattern S-parameter and SPICE models n SPICE connector models n Connector evaluation test boards n System test boards te.com/products/2Piece-High-Speed TE Connectivity High Speed Backplane Connectors STRADA Whisper Connectors n Up  to 40Gb/s performance n Density up to 20 differential pairs per cm (52 DP per in) n Available  in 4, 6, and 8 pairs/column, supporting cardpitch of 16.4 mm (.64"), 20.4 mm (.8"), and 25.4 mm (1") respectively n See back panel for representative part numbers n Website: www.te.com/products/stradawhisper te.com/products/2Piece-High-Speed TE Connectivity High Speed Backplane Connectors Z-PACK HM-Zd and Hm-Zd Plus Connectors n Up  to 12.5 Gb/s performance n Density  up to 16 differential pairs per cm (40 DP per inch), in 25.4 mm (1") slot-pitch n Available  in 2, 3 and 4 pairs/column, fitting 20.32 mm (0.8") slot-pitch for 2 and 3 pair version and 25.4 mm (1") slot-pitch for the 4 pair version n HM-Zd  Plus provides enhanced signal integrity in a design backwards compatible with standard HM-Zd n Advanced  Differential Fabric (ADF) Connector specified in the PICMG 3.X Advanced TCA specifications n See back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" n Website: http://hmzd.te.com Z-PACK HS3 Connectors n Up to 6.25 Gb/s performance n Density  up to 40 high speed signal lines (20 DP) per cm board space, in 25.4 mm (1") slot-pitch n Available in 2 versions: six row and ten row, respectively fitting 20.32 mm (0.8") and 25.40 mm (1") slot-pitches n High-speed  connector designed for both single ended and differential signals n See back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" n Website: http://hs3.te.com MULTIGIG RT Connectors n Up  to 6.25 Gb/s performance n Density  available in 2 versions per tier: 0.8" and 1", respectively fitting 20.32 mm (0.8") and 25.4 mm (1") slot-pitches n Backplane  connector system specified in VME standards: VXS (VITA 41) & VPX (VITA 46) n Pinless  backplane connector utilizes a PCB construction which allows the connector system to have extreme flexibility. 100 Ohm differential, 50 Ohm single ended, open pin field, and power wafers can be mixed within one connector module. n See back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" n Website: http://www.multigigrt.com te.com/products/2Piece-High-Speed TE Connectivity High Speed Backplane Connectors Impact Connectors n Up  to 25 Gb/s performance n Density up to 32 high speed differential pairs per cm (80 DP per inch) n 100 Ohm n Modular  system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns offered in increments of 2 columns n See back panel for representative part numbers n Order catalog 7-1773458-1, "Impact Backplane Connector System" n Website: www.te.com/products/Impact Z-PACK TinMan 100 Ohm and 85 Ohm Connectors n Up to 12.5 Gb/s performance n Density  up to 14 high speed differential pairs per cm (80 DP per inch); 6-16 columns available n Modular system: 3, 4, 5, and 6 pair/column, respectively fitting 16.25mm (.625"), 20.32 mm (0.8") and 25.4 mm (1") slot-pitch n 85  ohm impedance version for QPCle and Intel QPI standards, and other 85 ohm system applications n See back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" n Website: http://www.te.com/ZPackTinMan Z-PACK Slim UHD Connectors n 2 versions n CS (Common Speed) 8 Gb/s n HS (High Speed) 12.5 Gb/s, scalable to 20 Gb/s n Density  (in a 2 DP/Column assignment): 55 lines per cm, 141 lines per inch (in a SE assignment) n Low profile — 12.5 mm wide n Flexible pin assignments n See back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" n Website: http://www.te.com/products/zpackuhd te.com/products/2Piece-High-Speed High Speed Backplane Interconnects Once you have determined which connector description best suits your needs, use the chart below to find a part number to search the TE website. Representative Part Numbers Connector Description STRADA Whisper Connectors Z-Pack HM-Zd Connectors and Z-Pack Hm-Zd Plus Connectors Z-Pack HS3 Connectors MULTIGIG RT Connectors Plug Receptacle 2149967-3 2149968-3 6469002-1 6469001-1 5120658-1 5120790-1 1410187-3 1410142-1 Impact Connectors 2007777-1 2007703-1 Z-Pack TinMan 100 Ohm and 85 Ohm Connectors 1934269-1 1934218-1 2042088-2 1982738-2 Z-Pack Slim UHD Connectors FOR MORE INFORMATION TE Technical Support USA: Canada: Mexico Latin/S. America: Germany: UK: France: Netherlands: China: Center +1 (800) 522-6752 +1 (905) 475-6222 +52 (0) 55-1106-0800 +54 (0) 11-4733-2200 +49 (0) 6251-133-1999 +44 (0) 800-267666 +33 (0) 1-3420-8686 +31 (0) 73-6246-999 +86 (0) 400-820-6015 Part numbers in this brochure are RoHS Compliant*, unless marked otherwise. *as defined www.te.com/leadfree te.com © 2019 Tyco Electronics Corporation, a TE Connectivity Ltd. Company. All Rights Reserved. 1654263-1 CIS LUG FP 3M 08/2019 MULTIGIG RT, TE Connectivity, the TE connectivity (logo), Z-PACK and Z-PACK TinMan are trademarks. Other logos, product and/or company names might be trademarks of their respective owners. Advanced TCA is a trademark of PICMG-PCI Industrial Computer Mfg’s Group. Ansys HFSS is a trademark of Ansoft Corporation. CST Microwave Studio is a trademark of CST Computer Simulation Technology AG. Impact is a trademark of Molex Inc. MATLAB is a trademark of The MathWorks, Inc. VITA is a trademark of VMEbus International Trade Association. te.com/products/2Piece-High-Speed