2013882-2

2013882-2

  • 厂商:

    HUMIREL(泰科)

  • 封装:

    -

  • 描述:

    CONN SCKT BACKPLATE FOR LGA1156

  • 数据手册
  • 价格&库存
2013882-2 数据手册
Introducing Sockets and Hardware for LGA 1156 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s® Core™ i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever mechanism (ILM) generates the Z-axis compression load. A robust bolster plate eliminates PCB bowing during compression. The sockets have been validated to Intel Design Guides. APPLICATIONS Sockets and Hardware for LGA 1156 Processors ・ Desktop computers ・ Low end servers ELECTRICAL ・ Low level bulk contact resistance: 22 milliohms max avg. ・ Insulation resistance: 800 milliohms min. @ 500 VDC MECHANICAL ・ Nominal Deflection: .45 mm ・ Durability: 30 cycles ・ Package mating and unmating operation force of lever: 49N (5kgf) maximum MATERIALS KEY FEATURES ・1156 contacts with a 0.914mm x 0.914mm grid. ・Available with 15 Gold or Gold flash contact plating. ・Socket housing facilitates efficient soldering to the PCB board. ・Socket is supplied with a cap to facilitate vacuum pick and place. ・Backplates are available in zinc or nickel plating. ・ILM, screws and backplate must be ordered separately. Kits are also available for ease in ordering. ・Each ILM assembly requires two ILM screws and one ILM shoulder screw. ・Socket assembly Contact: Copper Alloy, gold plating at contact area on nickel under plating. Base housing: High temperature thermoplastic UL94V-0 Cap: High temperature thermoplastic UL94V-0 ・ ILM load plate and lever: Stainless steel ・ ILM frame, ILM screw and shoulder screw: Steel ・ ILM Insulator: Polycarbonate ・ Backplate assembly: Steel, zinc or nickel plated ・ Backplate Insulator: Polycarbonate APPLICATIONS AND SPECIFICATION ・ Application specification 114-5444 ・ Instruction sheet 411-78321 ・ Product Spec 108-78586 PRODUCT OFFERINGS Part Number Description Plating 2040540-1 LGA 1156 Socket 15 Gold 2040540-2 LGA 1156 Socket Gold Flash 2013882-1 ILM Assembly 2013882-2 ILM Assembly with ILM screws 2013883-1 Back plate assembly Zinc 2013883-2 Back plate assembly Nickel 2013884-1 Shoulder Screw 2040979-1 ILM Screw ILM/Back Plate Kits Tyco Electronics Corporation Technical Support Center Internet: www.tycoelectronics.com/help Part No. 2013882-1 ILM Assembly 2013884-1 Shoulder Screw 2040979-1 ILM Screw 1 2 USA: +1 (800) 522-6752 2069838-1 1 Canada: +1 (905) 470-4425 2069838-3 0 1 1 1 0 1 2 Central America & Mexico +52 (0) 55-1106-0814 2069838-4 South America: +55 (0) 11-2103-6000 2069838-5 Germany: +49 (0) 6251-133-1999 UK: +44 (0) 8706-080208 France: +33 (0) 1-3420-8686 Netherlands: +31 (0) 73-6246-999 China: +86 (0) 400-820-6015 2013883-1 Back Plate Assembly Zinc Plated 2013883-2 Back Plate Assembly Ni Plated 1 0 2 1 0 2 0 1 0 1 Qty per kit www.tycoelectronics.com 2011 Tyco Electronics Corporation. All Rights Reserved. 3-1773455-8 CIS-MS-05/2011 TE Connectivity, TE connectivity (logo) and TE (logo) are trademarks. Other logos, product and/or company names might be trademarks of their respective owners. Other products, logos, and company names mentioned herein may be trademarks of their respective owners. While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied warranties regarding
2013882-2 价格&库存

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2013882-2
  •  国内价格
  • 20+67.59294
  • 50+66.33608
  • 95+65.06290
  • 200+63.78971

库存:265

2013882-2
    •  国内价格
    • 20+72.05671
    • 50+70.72670
    • 95+69.35940
    • 200+68.00453

    库存:265