2042853-1

108 – 19376 Rev.D 10/sep/2012 Product Specification 1 SCOPE 1.1 Content This specification covers the performance, test and quality requirements for the Tyco Electronics High Speed 8 pairs IO board and cable connector. The cable plug assembly is used to connect the cable to the board connector. 1.2 Qualification When tests are performed on subject product, procedures specified in this Product Specification shall be used. All inspections shall be performed using applicable inspection plan and product drawing. 1.3 Applicable partnumbers The partnumbers of subject products: • X-2042847-x HSIO Cable Plug Assembly • X-2042853-x HSIO Board Connector Assembly, version 1 (referred to as BCv1) • X-1551966-x HSIO Board Connector Assembly, version 2 (referred to as BCv2) 1.4 Completion Qualification testing of the HSIO Board Connector Assembly version 1 has successfully been completed on 20JUL2011 and is reported in Qualification Test Report with number 501-19154. This documentation is on file and available from Engineering Practices and Standards (EPS). Qualification testing of HSIO Board Connector Assembly version 2 is yet to be completed. 2 Applicable Documents The following documents form a part of this specification to extend specified herein. Unless otherwise specified, latest edition of the document applies. In the event of conflict between the requirements in this specification and the product drawing, product drawing shall take precedence. In the event of conflict between requirements of this specification and referenced documents, this specification shall take precedence. 2.1 Tyco Documents 501-19154 Test report. Cable/Board High Speed Connector assembly (version 1). 114-19129 Application specification High Speed Cable/Board Connector System. 2.2 Other Documents IEC 60512 Basic testing procedures and measuring methods for electromechanical components for electronic equipment. J. Smits Tyco Electronics Nederland B.V. All international rights reserved TE Connectivity *Trademark R6-76 (Rev. 03-00) DATE 10 sep 2012 T de Boer This information is confidential and propriety to TE Connectivity and its worldwide subsidiaries and affiliates. It may not be disclosed to anyone, other than TE Connectivity personnel, without written authorization from TE Connectivity Corporation, Harisburg, Pennsylvania USA This specification is a controlled document and subject to change. Contact the Engineering Control Organization for the latest revision. DATE 10 sep 2012 1 of 13 LOC H 108-19376 3 Requirements: 3.1 Design and Construction. Products shall be of design, construction and physical dimensions as specified on the applicable customer product drawings C-2042847 (Cable-connector), C-2042847 (Board Connector version 1) and C-1551966 (Board-connector version 2). 3.2 Materials and Finish. Materials used in the construction of this product shall be as specified on the applicable customer drawing. 3.3 Ratings A. Data-rate (differential) - 10 Gb/s B. Impedance - 100 ohm C. Operating voltage - 30 Volt DC max. D. Current - 0,5 Amp Max. E. Operating temperature - -55°C to 105°C. F. Durability - 100 cycles. Rev. D R6-77 (Rev. 03-00) Page 2 of 13 108-19376 3.4 Performance and Test Description. The product is designed to meet mechanical and environmental performance specified in this paragraph as tested per test sequence specified in paragraph 3.5. Unless otherwise specified, all tests are performed at ambient environmental conditions per IEC specification 60068-1 clause 5.3 and are performed with connectors in mated condition. VISUAL Performance Requirements or Severity 3.4.1. Examination of product Meets requirements of product Drawing and applicable instructions on customer drawing, instruction sheet, application specification. Para Test Description Procedures Visual, dimensional and functional per applicable inspection plan. ELECTRICAL Para 3.4.2 3.4.3 3.4.4 3.4.5 Test Description Performance Requirements or Severity Termination resistance Max. open voltage 20mV. Board connector – Max. current 100 mA DC. Cable connector All contacts to be measured. (signal and ground) Measuring points shall be as indicated in fig.1 Requirement: 30 mΩ max. (Initial; exclusive bulk) 40 mΩ max. (Final; exclusive bulk) Termination resistance Max. open voltage 20mV. Board connector – Max. current 100 mA DC. Cable connector Measuring points shall be as indicated in fig 2. (shield) Requirement: Initial: 10 mΩ max. Final: 20 mΩ max. Insulation resistance Test voltage 100V DC. Duration: 1 minute. Test between adjacent contacts. Voltage proof Requirement: 3 10 MΩ min. Test voltage 300 VDC for adjacent contacts. Duration 1 minute. Procedures In acc. With IEC 60512-2-1 In acc. With IEC 60512-2-1 In acc. with IEC 60512-3-1 In acc. with IEC 60512-4-1 Requirement: no break-down or flash-over 3.4.6 Current temperature de-rating curve Rev. D R6-77 (Rev. 03-00) Temperature rise: 30°C maximum over ambient temperature (65°C) at 0,5 A In acc. with IEC 60512-5-2 / test 5b Page 3 of 13 108-19376 Para MECHANICAL Performance Requirements or Severity Test Description 3.4.10 Signal Contact spring Min. 0,5N force 3.4.11 Shielding Contact Min. 2,5N spring force (outside springs on BCv1) 3.4.12 Shielding Contact spring force Min. 2,5N at A=0,25mm (see figure 3) (outside springs on BCv2) 3.4.13 Shielding Contact spring force Min. 1,0N at B=0,25mm (see figure 4) (inside-bended springs on board connector version 2) 3.4.14 Vibration 10-500 Hz sweeping 1 oct./min., displacement 0,75mm peak/accel. 10 g , 30 minutes in each of 3 mutual perpendicular axes. 3.4.15 Physical shock 3.4.16 Insertion-force during wrong polarization. 3.4.17 Mate / un-mate force without latch. 3.4.18 Mechanical operation (Inclusive latch) Rev. D R6-77 (Rev. 03-00) Requirement: No Physical damage. No discontinuity > 1 µsec. Subject connector to 50 g half sine shock pulses of 11 ms duration. 6 shocks in two directions of 3 mutual perpendicular axes. Apply 100 N straight force at the cable connector (placed upside down) in mating direction during 10 sec. Requirement: No functional damaging and no electrical contacting on signal-traces. Mate and un-mate connector-pair. Speed: 2 mm/sec. rest 30 sec min. Requirement: Total mating force 50 N max. Total un-mating force 10 N min to 40 N max. Mate and un-mate specimens for 100 cycles at a maximum rate of 500 cycles per hour with cage latch operable at room conditions. Procedures At deflection of 0.165 mm. At deflection: till Board connector shield At required deflection to reach dimension A (see figure 3). Maximum deflection to be applied: A=0,15mm. At required deflection to reach dimension B (see figure 5). Maximum deflection to be applied: B=0,15mm. In acc. with IEC 60068-2-6 In acc. with IEC 60512-6-3 In acc. with IEC 60512-15-1 In acc. with IEC 60512-13-2 In acc. With IEC 60512-9-1 Page 4 of 13 108-19376 3.4.19 Side-load in 4 directions (up-downright-left). Cable connector mated on board connector. In acc. with IEC 60512-17-3 BCv1: Apply 40 N on cable-connector in every direction (individually) (at 27mm from edge of pcb), during 10 sec. (see figure 5) BCv2: Apply 60 N on cable-connector in every direction (individually) (at 27mm from edge of pcb), during 10 sec. (see figure 5) Requirement: No functional damage, latch should be in place. 3.4.21 Locking latch strength Apply 100 N straight force at the mated cable connector, in un-mating direction. 3.4.22 Rotational pull force Load cabled module into board-connector. Apply an axial pull-force of 60N on the cable, the pull(not applicable for force will be in a 33 degrees angle with the axial BCv1) direction of the connector. Rotate the load 3 full rotations (1080 degrees) with respect to the axial direction of the connector. In acc. with IEC 60512-15-1 Requirement: plug shall remain mated with no evidence of housing damage. 3.4.23 Mounting-force board- Measure force necessary to push the boardconnector. connector into the host board at a maximum rate of 12.7mm per minute. (not applicable for BCv1) Requirement: 20N maximum. SIGNAL INTEGRITY Para Test Description 3.4.30 Characteristic Impedance 3.4.31 Skew Rev. D R6-77 (Rev. 03-00) Performance Procedures Requirements or Severity Time Domain (TDR) measurement IEC 60512-25-7 Impedance profile : the test board, PCB cable connector and 1000ps cable Rise-time of incident pulse : 30ps (10%-90%) Pairs 15-16 and 18-19 Requirement : 100 Ω +/- 10%; 100 Ω -20% for footprint for time period of 250ps Time Domain (TDT) measurement IEC 60512-25-4 Risetime of incident pulse: 30ps (10%-90%) Pairs 15-16 and 18-19 Samples : 1m and 8m Requirement : 15ps Page 5 of 13 108-19376 3.4.32 Return Loss Frequency Domain (FDR) S-parameter measurement Pairs 15-16 and 18-19 Samples : 1m with AWG26 Requirement : IEEE 802.3ap for 10GBaseKR -3dB. 3.4.33 Insertion Loss 3.4.34 Cross Talk Frequency Domain (FDT) S-parameter measurement Pairs 15-16 and 18-19 Samples : 1m, 4m and 8m with AWG26 Requirement : § IEEE 802.3ap for 10GBaseKR § 1.1dB/GHz -0.5dB @ 1GHz to 5GHz for 1m with AWG26 § Suck out frequency (resonance) > 8GHz Frequency Domain (FDT) S-parameter measurement Samples : 1m, 4m, 8m with AWG26 Requirement on 1m: Pairs 15-16 and 18-19 - NEXT < -30dB up to 1GHz. All pairs - Power sum NEXT and FEXT < -24dB up to 1GHz. 3.4.35 Insertion Loss to Frequency Domain (FDT) S-parameter measurement Cross Talk Ratio Pairs 15-16 and 18-19 over 10Gbps link Samples : 1m, 4m and 8m with AWG26 3.4.36 Screening Attenuation Requirement : Samples 1m and 4m - IEEE 802.3ap for 10GBaseKR Samples 8m - < -55dB up to 100MHz - < -36dB up to 1GHz - < -28dB up to 2.5GHz - < -23dB up to 5.0GHz Samples : 1m with AWG26 Requirement : < -40dB at 0 to 5GHz for cable assembly and PCB connector 3.4.37 Time Delay Rx to Max 400ps asymmetry between pairs (Rx - Tx) Tx Rev. D R6-77 (Rev. 03-00) IEC 60512-25-5 Reference : IEEE Std 802.3ap2007 – Amendment to IEEE Std 802.32005:CSMA/CD – Annex 69B IEC 60512-25-5 Reference : IEEE Std 802.3ap2007 – Amendment to IEEE Std 802.32005:CSMA/CD – Annex 69B IEC 60512-25-1 Calculated values based on 3.4.11 and 3.4.12 IEC 62153-4-4 and IEC 62153-4-7 Measurements to be performed on 1m and 8m cable assemblies Page 6 of 13 108-19376 Para Test Description 3.4.40 Rapid change of Temperature 3.4.41 Climatic sequence Dry heat st 1 Damp heat cycle Cold 2nd Damp heat cycle 3.4.42 Damp/heat steady state 3.4.43 Temperature life. 3.4.44 Corrosion mixed flowing gas 3.4.45 Resistance to soldering heat board connector Rev. D R6-77 (Rev. 03-00) ENVIRONMENTAL Performance Requirements or Severity -40°/90°C, 0,5 hrs / 0,5 hrs, 5 cycles 90°C, 16 hrs 25°/55°C, RH 93%, 24 hrs -40°C, 2 hrs 25°/55°C, RH 93%, 24 hrs Temperature 40°C, RH 93%, Duration: 21 days Subject mated specimens to 105°C for 240 hours without electrical load. Temperature 25°C, RH 75%, Cl2 10 ppb, NO2 200 ppb, H2S 10 ppb, SO2 200 ppb. Duration: 20 days (un-mated) Specimens were subject to the following reflow profile. Fig 6 Procedures In acc. with IEC 60512-11-4 In acc. with IEC 60512-11-1 In acc. with IEC 60512-11-3 In acc. with IEC 60512-11-9 In acc. with IEC 60512-11-7 Tyco 109-201, method C Page 7 of 13 108-19376 Ω Figure 1 Figure 2 Rev. D R6-77 (Rev. 03-00) Page 8 of 13 108-19376 Figure 3 Figure 4 Rev. D R6-77 (Rev. 03-00) Page 9 of 13 108-19376 Figure 5 300 260 250 deg C 200 150 100 50 0 0 30 60 90 120 150 180 210 240 270 300 330 360 sec Figure 6 Rev. D R6-77 (Rev. 03-00) Page 10 of 13 108-19376 3.5 Product Qualification and Requalification Test Sequence 3.5.1 Test sequence applicable for Board Connector version 1 Rev. D R6-77 (Rev. 03-00) Page 11 of 13 108-19376 3.5.2 Test sequence applicable for HSIO Board Connector version 2 Rev. D R6-77 (Rev. 03-00) Page 12 of 13 108-19376 4 QUALITY ASSURANCE PROVISIONS. 4.1 Qualification Testing. Sample Selection. Samples shall be prepared in accordance with applicable instructions and shall be selected random from current production. Unless details to perform test require otherwise, plugs shall be terminated on cables according to applicable instructions and requirements specified in appropriate Application Specification and Instruction Sheet. Unless otherwise specified all test groups shall consist of a minimum of 5 connectors of applicable type. Qualification inspection shall be verified by testing samples as specified in Para 3.5. 4.2 Requalification Testing. If changes significantly affecting form, fit or function are made to product or manufacturing process, product assurance shall coordinate re-qualification testing, consisting of all or part of original testing sequence as determined by product, quality and reliability engineering. 4.3 Acceptance. Acceptance is based on verification that product meets requirements of Para 3.4. Failures attributed to equipment, test set-up, test sub-components or operator deficiencies shall not disqualify the product. When product failure occurs, corrective action shall be taken and samples resubmitted for qualification. Testing to confirm corrective action is required before re-submittal. 4.4 Quality Conformance Inspection. Applicable TYCO Electronics quality inspection plan will specify sampling acceptable quality level to be used. Dimensional and functional requirements shall be in accordance with applicable product drawing and this specification. Rev. D R6-77 (Rev. 03-00) Page 13 of 13