ZSFP+
PLUGGABLE
I/O INTERCONNECT
The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28
Gbps NRZ and 56 Gbps PAM-4. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is
hotswappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+
connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm
cost savings as this would eliminate the need to fully redesign for higher performance.
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire
product family is offered as a dual source option with Molex. LLC.
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
zSFP+ Pluggable I/O Interconnect
FEATURES
• Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10
• Gbps Ethernet and 16 Gbps Fibre Channel
• Surface-mount connector design for single high 1xN cages
• Press-fit 1xN cages and stacked assemblies (connector and
cage) for one-step, easy PCB placement
• Coupled, narrow-edged, blanked- and formed-contact beam
geometry and insert molding for superior signal integrity,
mechanical and electrical performance
• Backwards-compatibility: Shares same mating interface and
cage dimensions with the SFP+ connector (connector/single
high cages are also PCB footprint-compatible)
• Elastomeric gasket or spring finger options for EMI
containment
Light pipe options include:
No light pipes
All 4 light pipes (shown left)
Inner light pipes
Outer light pipes [standard]
Three light pipes
Outer light pipes [reversed]
• Single high cages (1xN) for design flexibility; accommodates
belly-to-belly applications for increased density and PCB
space savings; available in 1x1, 1x2, 1x3, 1x4 or 1x6 port
configurations
• Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12
port
• Heat sinks, LEDs and plating choices offered
• Additional light pipe configurations available
APPLICATIONS
• Telecommunications: Cellular infrastructure, central office
uplink equipment, optical transport equipment, switches/
routers, access equipment (CMTS, PON, DSL, etc)
• Data Center: Data center switches and routers, servers,
storage
• Medical: Medical diagnostic equipment
• Networking: Network interface, switches, routers
• Test and Measurement Equipment
20-Pin Surface-Mount Connector
Electrical
• Voltage (max.): 120V AC
• Current (max.): 0.5A
• Dielectric Withstanding Voltage:
300V AC between contacts
Mechanical
• Mating Force: 25N
• Unmating Force: 11.5N
• Durability (min.): 250 cycles
Physical
• High-temperature thermoplastic housing (glass-filled, UL
94V-0 black)
• High-performance copper alloy contacts
• Plating:
- Nickel underplating; Tin plating on solder tail area;
Gold plating on mating area
- Plating options: 15 and 30ȝ” Gold or Palladium Nickel
• Operating Temperature: -40 to +85oC
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
Follow IEEE802.3 cd (including trace)
PAGE 2
zSFP+ Pluggable I/O Interconnect
Connector P/N
Description
2170088-1
30ȝ” in Au or Au Flash Over PdNi
2170088-2
15ȝ” in Au or Au Flash Over PdNi
Follow IEEE802.3 cd ( including trace)
Cages with Elastomeric Gaskets
EMI
Suppression
Light Pipe
Option
1X1
1X2
1X4
1X6
1X8
No
2198709-1*
2198720-1
2198722-1
2198724-1
TBD**
Yes
2198708-1*
2198719-1
2198721-1
2198723-1
TBD**
EMI gasket
Cages with EMI Springs
EMI
Suppression
Light Pipe
Option
Heat Sink
Option
No
No
EMI Spring
Fingers
1X1
2274001-1
2291579-1 (PCI)
1X2
1x3
1X4
1X6
1X8
2227728-1
2349050-1
2227730-1
2227732-1
2304921-1
2295325-6
Yes
No
2274000-1
2227727-1
TBD**
2227729-1
2227731-1
TBD**
Yes
Yes
TBD*
TBD**
TBD**
2304342-X
2293156-X
2294408-X
zSFP+ 3 Row Belly-to-Belly Application
Configuration
1X2
1x4
Part Number
2317010-1
2300275-1
*Tooling in process **Not yet tooled, but planned
Ganged 1xN Cages
Mechanical
• Transceiver insertion force (max.): 34 N without heat sink and clip; 45.37 N with heat sink and clip
• Transceiver extraction force (max.): 12.5 N without heat sink and clip; 14.36 N with heat sink and clip
• SFP+ module to surface-mount connector and zSFP+ cage.
• Cage press fit insertion force (max.): 44.5 N for single port cage, 54.3 N for ganged cage
• Cage press fit extraction force (min.): 8.9 N for single port and ganged cages
• Durability (min.): 100 cycles
Ganged SFP+ 1x4 vs. zSFP+ 1x4
Physical
• Cage material: Nickel Silver
• PCB thickness (min.): 1.50mm in single sided applications;
2.25mm (EMI springs) or 3.0mm (elastomeric gasket) in
belly-to-belly applications
• Operating Temperature: -40 to +85 C
o
Ganged SFP+ 1x4 —
Ganged zSFP+ 1x4 —
Radiated source RF leakage (dB)
0
-10
-20
-30
-40
-50
-60
-70
-80
0
5
10
15
20
25
30
GHz
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
PAGE 3
zSFP+ Pluggable I/O Interconnect
Stacked 2xN Assemblies
Electrical
Stacked SFP+ vs. zSFP+
0
• Current (max.): 0.5A
• Dielectric Withstanding Voltage: 300V AC
between contacts
Mechanical
• Durability (min.): 100 cycles
Physical
• Cage material: Nickel Silver
- High-temperature thermoplastic housing
(glass-filled, UL 94V-0 black)
- High-performance copper alloy contacts
Radiated source RF leakage (dB)
• Voltage (max.): 120V AC
-10
-20
-30
-40
-50
Stacked SFP+ —
Stacked zSFP+ —
-60
-70
-80
- Plating: Nickel underplating; Tin plating
0
on solder tail area; 30ȝ” Gold plating on
mating area
5
10
15
20
25
30
GHz
• PCB thickness (min.): 1.57mm
• Operating Temperature: -40 to +85oC
Upper contact row —
Lower contact row —
zSFP+ Stacked Interconnects SFP28 PN list
EMI gasket
EMI
Suppression
Performance
Standard
Thermally
EMI spring fingers
Enhanced
Standard
Thermally
Enhanced
Light Pipe
Configuration
2x1
2x2
2x4
2x6
2x8
2x12
2198318-(x)
2198325-(x)
2180324-(x)
2198339-(x)
2198346-(x)
2288172-(x)
None
2198318-1
2198325-1
2180324-1
2198339-1
2198346-1
2288172-1
All 4
2198318-2
2198325-2
2180324-2
2198339-2
2198346-2
2288172-2
Inner
2198318-3
2198325-3
2180324-3
2198339-3
2198346-3
2288172-3
Outer
2198318-4
2198325-4
2180324-4
2198339-4
2198346-4
2288172-4
3
1-2198318-7
1-2198325-7
1-2180324-7
1-2198339-7
1-2198346-7
1-2288172-7
Outer (reversed)
1-2198318-8
1-2198325-8
1-2180324-8
1-2198339-8
1-2198346-8
1-2288172-8
Multiple
--
--
3-2180324-0
--
--
2227838-8
None
2198318-5
2198325-5
2180324-5
2198339-5
2198346-5
2288172-5
All 4
2198318-6
2198325-6
2180324-6
2198339-6
2198346-6
2288172-6
Inner
2198318-7
2198325-7
2180324-7
2198339-7
2198346-7
2288172-7
Outer
2198318-8
2198325-8
2180324-8
2198339-8
2198346-8
2288172-8
3
1-2198318-9
1-2198325-9
1-2180324-9
1-2198339-9
1-2198346-9
1-2288172-9
Outer (reversed)
2-2198318-0
2-2198325-0
2-2180324-0
2-2198339-0
2-2198346-0
2-2288172-0
Multiple
--
--
3-2180324-1
2291491-1
--
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
2227838-7
2301210-2
PAGE 4
zSFP+ Pluggable I/O Interconnect
zSFP+ Stacked Interconnects SFP56 PN list
NOT YET TOOLED,
BUT PLANNED
EMI
Suppression
Performance
EMI gasket
Tooled
Light Pipe
2x1
2x2
2x4
2x6
2x8
2x12
NONE
2349202-1
2343522-1
2339978-1
2347721-1
2340033-1
2349201-1
INNER/OUTER
2349202-2
234522-2
2339978-2
2347721-2
2340033-2
2349201-2
INNER
2349202-3
2343522-3
2339978-3
2347721-3
2340033-3
2349201-3
OUTER
2349202-4
2343522-4
2339978-4
2347721-4
2340033-4
2349201-4
1-2349202-7
1-2343522-7
1-239978-7
1-2347721-7
1-2340033-7
1-2288172-7
1-2349202-8
1-2343522-8
1-2339978-8
1-2347721-8
1-2340033-8
1-2349201-7
3-2339978-0
3-2347721-0
3-2340033-0
1-2349201-8
--
--
Standard
CENTER/
REVERSED
OUTER
REVERSED
OUTER
NONE
Airflow Enhanced
INNER
3-2340033-2
NONE
2349202-5
234522-5
2339978-5
2347721-5
2340033-5
2349201-5
INNER/OUTER
2349202-6
2343522-6
2339978-6
2347721-6
2340033-6
2349201-6
INNER
2349202-7
2343522-7
2339978-7
2347721-7
2340033-7
2349201-7
OUTER
2349202-8
2343522-8
2339978-8
2347721-8
2340033-8
2349201-8
1-2349202-9
1-2343522-9
12339978-9
1-2347721-9
1-2340033-9
1-2349201-9
2-2349202-0
2-2343522-0
2-2339978-0
2-2347721-0
2-2340033-0
2-2349201-0
--
2-2347721-1
--
--
CENTER/
Standard
REVERSED
OUTER
REVERSED
EMI spring fingers
OUTER
REVERSED
INNER
NONE
-
3-2343522-3
3-2339978-1
3-2347721-1
3-2340033-1
2-2349201-1
-
-
3-2339978-2
-
-
-
-
-
3-2339978-3
-
-
-
-
-
-
-
-
-
NONE
-
-
3-2339978-4
-
3-2340033-3
2-2349201-2
NONE
-
-
-
-
4-2340033-0
-
CENTER/
REVERSED
Airflow
OUTER
Enhanced
OUTER
REVERSED
OUTER
Airflow Enhanced &
Insulator Tape
Top Cage Heatsink
Opening
zSFP+ Stacked Belly-to-Belly
Configuration
2x4
2x12
Part Number
2357514-1
2357518-1
2357514-1
2357518-1
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
PAGE 5
zSFP+ Pluggable I/O Interconnect
SFP28 Direct Attach Copper Cable Assemblies
TE’s SFP28 passive copper cable assembly features two differential copper pairs, providing one data transmission channel at
speeds up to 28Gbps per channel that meets 25G Ethernet performance requirements. SFP28 is designed for applications in
the data center, networking and telecommunications markets that require a high speed, reliable cable assembly,
Offered in a broad range of wire gages – from 26AWG through 33AWG – this next generation copper cable assembly features
low insertion loss and low cross talk. TE’s SFP28 assemblies share the same mating interface with SFP+ form factors, making
it backward compatible with existing SFP+ I/O ports. SFP28 can be used with legacy 10G Ethernet and 16G Fibre Channel
applications with substantial signal integrity margin.
In addition to SFP28 straight cables, TE offers break out assemblies with a 100G QSFP28 module on one end breaking out
to four SFP28 modules on the opposite end of the assembly. In-line SI based production testing ensures that each cable
assembly meets the electrical performance requirements of the applicable industry standard specification.
Features and Benefits
• Compatible with IEEE 802.3by and Fibre Channel industry standards
• Supports single lane data rate up to 28 Gbps
• Optimized construction to minimize insertion loss and cross talk
• Customized cable braid termination limits EMI radiation
• Backward compatible with existing SFP+ form factor connectors and cages
• Pull-to-release latch design
• 30AWG through 32AWG cable
SFP28 to SFP28 Straight Cable Assembly
• Straight and breakout cable assembly configurations available
• Customizable EEPROM mapping for cable signature
• RoHS compliant
Industry Standards
• 25G Ethernet (IEEE 802.3by)
• Fibre Channel
• SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)
• SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28)
QSFP28 to 4x SFP28 Breakout Cable
Assembly
SFP28 Part Number Detail
Base
Part
Number
Description
AWG
2821262
33
2821222
SFP28 to SFP28
30
2821223
Straight Assembly
2821224
0.5
1
1.5
2
-1
-2
-3
-4
-5
-3
28
SFP28
Breakout
Assembly
33
-8
30
-1
3
4
5
-2
-1
-2
-1
-3
-1
-2
-3
-5
-3
26
QSFP28 to 4x
2821033
Dash to Length (meters)
-10
-2
28
-4
26
-12
Contact your TE Representative for customized lengths.
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
PAGE 6
For More Information
te.com/products/zsfp+
TE Technical Support Center
USA:
+1 (800) 522-6752
Canada:
+1 (905) 475-6222
Mexico
+52 (0) 55-1106-0800
Latin/S. America: +54 (0) 11-4733-2200
Germany:
+49 (0) 6251-133-1999
UK:
+44 (0) 800-267666
France:
+33 (0) 1-3420-8686
Netherlands:
+31 (0) 73-6246-999
China:
+86 (0) 400-820-6015
Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.
*as defined www.te.com/leadfree
te.com
© 2019 TE Connectivity Ltd. family of companies. All Rights Reserved.
1-1773707-6 DND PDF 11/19
10/20
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.
zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology.
ZXP is a registered trademark of Molex LLC.
Other logos, product and company names mentioned herein may be trademarks of their respective owners.
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DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT
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