2208165-1

3 PLASTIC MATERIAL WITH 20% REGRIND PORTION Polymer-Werkstoff mit 20% Mahlgut-/ Recyclatanteil 4 DIFFERING TO abweichend zu 1 7 100% ELECTRICAL INSPECTION END OF LINE (CC) 100% Elektrische Endkontrolle (CC) 8 CLEANLINESS ACC. TO TE SPECIFICATION 115-18390 (INCL. VDA Band 19) Sauberkeit gem. TE Spezifikation 115-18390 (inkl. VDA Band 19) 9 PACKAGING: BLISTER-BELT ON REEL Verpackung: Blistergurt auf Rolle 10 MAX. AREA FOR SUCKING-IN TO PICK & PLACE: 0.1MM FLATNESS max. Bereich zum Ansaugen fuer Pick & Place: 0.1mm Ebenheit 11 FONT AREAS AND CHARACTERS MAX. 0.2MM SUNK AND RAISED Schriftbereiche und Zeichen max. 0.2mm vertieft und erhaben TE ASSY REVISON TE Assy Revision (26) CENTER OF GRAVITY Schwerpunkt 1 1.5 min.1 1.8 H3 0.75 (1.5) H3 7.4 (12.6) (0.5) 20x 10 2.715 2x 8) (0.5x45 $ ) 4x 4 0.2 4x C (0.3) CENTER OF GRAVITY Schwerpunkt B 9x 1.8 =(16.2) 6.5 0.2 (SC/STITCH) (22) A-A B EXAMPLE USE WITH PCB AND RECEPCTACLE HSG SHOWN Anwendungsbeispiel mit Leiterplatte und Buchsenstecker (7.2) (5.55) TO PCB SUPPORT ) .2 (R0 4x RECOMMENDED PCB LAYOUT empfohlenes Leiterplattenanschlussbild (4.05) TO PCB SUPPORT B (7.4) (0.4) 20x 4 1.7 0.1 2x Z 22.2 (2.45) 1.8 GX 2x (0.9) CODING Kodierung B (0.9) CODING Kodierung C (0.9) CODING Kodierung D (0.9) CODING Kodierung Z Y (24.1) (22) (1.65) (0.55) 10 6 SOLDER SIDE 3-8µm Sn COPPER-ALLOY WITH NANO-MQS CONTACT PIN 1-3µm Sn OVER 1-2.2µm Ni WITH SWAGE, SOLDER VERSION 3 10 10 10 10 6 SOLDER SIDE 3-8µm Sn COPPER-ALLOY WITH NANO-MQS CONTACT PIN 1-3µm Sn OVER 1-2.2µm Ni WITH SWAGE, SOLDER VERSION 2 1 (21.8) (0.55) 10 1 PCB MOUNTING SURFACE BLACK ACC. RAL 9011 schwarz nach RAL 9011 3 LCP-GF30 20 POS NANO MQS HEADER HOUSING CODE Z 1 NATURAL SIM. RAL1015 natur aehnl. RAL1015 3 LCP-GF30 20 POS NANO MQS HEADER HOUSING CODE B 1 BLACK ACC. RAL 9011 schwarz nach RAL 9011 3 LCP-GF30 20 POS NANO MQS HEADER HOUSING CODE B 1 BLACK ACC. RAL 9011 schwarz nach RAL 9011 3 LCP-GF30 20 POS NANO MQS HEADER HOUSING CODE A 1 Benennung DESCRIPTION ITEM NO 0--9 1--2 0--2 0--1 C A C QTY PER ASSY MATERIAL Werkstoff FINISH C =15N IN A RANGE UP TO 0.2MM WITH 50 MM/MIN AT A PRELOAD OF 5N; MEASURED AT 1 ASSEMBLY EACH CAVITY Kontakt-Ausdrueckkraefte >=15N in einem Bereich bis 0,2mm geprueft mit 50mm/min bei einer Vorkraft von 5N; gemessen an 1 Assemblage je Nest 12 2.5 30NOV2015 (1.1) 6 APVD VARIANT 1-2208165-2 ADDED (1.5) 50:1 DWN (1.1) 1 4x H2 12 C4 C3 DATE (0.55) 0.55 2 H1 2 5 1 H1 C1 CONTACT AREAS ACC. TE SPECIFICATION 114-94201 Kontaktbereiche gem. TE Spezifikation 114-94201 C4 Z DESCRIPTION (1.65) H1 H2 H3 20x (0.5) (26) D DATUMS I1, I2, I3 = INTERFACE --> HERE: A, B, C DATUMS H1, H2, H3 = HEADER LTR C2 1 Stiftwannendesign basiert auf Plattformdesign der "Nano-MQS Market Serie" gem. TE Spezifikation C-114-94160 4x P (1.65) (0.6) 4x 1 - MISSING DIMENSIONS SEE TE SPECIFICATION 114-94000-11 Fehlende Masse siehe TE Spezifikation 114-94000-11 HEADER DESIGN BASED ON PLATFORM DESIGN OF "NANO-MQS MARKET SERIES" ACC. TE SPECIFICATION C-114-94160 (15.4) 3 H1 AI (1.5) GENERAL NOTES allgemeine Bemerkungen REVISIONS DIST SUITABLE TO RECEPTACLE HSG passend zu Buchsenstecker TE PART No. 0-2141404-1 - Tyco Electronics AMP GmbH LOC NOTES Bemerkungen SUITABLE TO RECEPTACLE HSG passend zu Buchsenstecker TE PART No. 0-2141404-2 TE PART No. 1-2141404-2 ALL RIGHTS RESERVED. (1.5) 2012 RELEASED FOR PUBLICATION 1 2 3 SUITABLE TO RECEPTACLE HSG passend zu Buchsenstecker TE PART No. 0-2141404-3 - COPYRIGHT2012 4 5 ALL PINS AT PIN TOP ( n 0.5 = n AB ACC. TE SPEC. C-114-94160) C 6 SUITABLE TO RECEPTACLE HSG passend zu Buchsenstecker TE PART No. 0-2141404-4 - THIS DRAWING IS UNPUBLISHED. 7 SUITABLE TO RECEPTACLE HSG passend zu Buchsenstecker TE PART No. 1-2141404-9 - 8 MATERIAL SEE TABLE TOLERANCES UNLESS OTHERWISE SPECIFIED: 0 PLC 1 PLC 2 PLC 3 PLC 4 PLC ANGLES FINISH - - PRODUCT SPEC 108-94347 APPLICATION SPEC 1 $ - WEIGHT NAME 20pos. 90DEG, PINHEADER ASSY 20pol. 90Grad, Stiftwanne Assy NANO MQS SIZE ca.2.7g CUSTOMER DRAWING CAGE CODE DRAWING NO A0 00779 2208165 SCALE 5:1 SHEET RESTRICTED TO - 1 OF 1 REV C4 A