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108-130013 Product Specification 27 FEB 17 Rev A AMPLIMITE* PCB Mounted Connectors 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for D-sub right angle and vertical printed circuit board mounted connectors. Applicable product descriptions and part numbers are as shown on product drawing 1.2. Qualification When tests are performed on the subject product line, procedures specified in Figure 1 shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 1.3. Qualification Test Results Qualification Testing has been successfully completed. See Qualification Test Report 501-32048. 2. APPLICABLE DOCUMENTS AND FORMS The following documents and forms constitute a part of this specification to the extent specified herein. Unless otherwise indicated, the latest edition of the document applies. 2.1. 2.2. TE Documents    114-40010: Application Specification (Right Angle Front Metal Shell Connectors) 114-40023: Application Specification (Straight Posted Front Metal Shell) 501-32048: Qualification Test Report (AMPLIMITE* HD-20 Board Mount Connectors) Industry Documents  EIA-364-XX: EIA Test Specifications 3. REQUIREMENTS 3.1. Design and Construction Product shall be of the design, construction, materials, and physical dimensions specified on the applicable product drawing. 3.2. Ratings Voltage 250 VAC Current Right Angle: 2A Max per Contact Temperature -55 C to 105 C Straight Posted: 1.5A Max per contact Storage: -25 C to 40 C 3.3. Relative Humidity: 15% - 70% Test Requirements and Procedures Summary Unless otherwise specified, all tests shall be performed at ambient environmental conditions. © 2017 TE Connectivity family of companies All Rights Reserved | Indicates Change This controlled document is subject to change. For latest revision and Regional Customer Service, visit our website at www.te.com PRODUCT INFORMATION 1-800-522-6752 *Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners. 1 of 5 108-130013 TEST DESCRIPTION REQUIREMENT PROCEDURE Initial examination of product Meets requirements of product drawing. Visual inspection per product drawing. Per EIA-364-18 Final examination of product Meets visual requirements. Visual inspection per product drawing. Per EIA-364-18 ELECTRICAL Low Level Contact Resistance 25 mΩ max. for 30 μin gold plated product. 30 mΩ max. for 15 μin and gold flash plated product. No creeping discharge or flashover shall occur. Leak current: 1mA Max. Temperature Rise Subject mated contacts assembled in housing to 20 mV open circuit at 100 mA maximum. Per EIA 364-20 Dielectric Withstanding Voltage Insulation Resistance Per EIA 364-23. Apply 1000V AC for 1 minute at sea level at adjacent contacts and between contacts and metal shell of unmated connector assemblies. 5000 MΩ minimum initial. Per EIA 364-21. 1000 MΩ minimum final. 500V DC for 1 minute, test between adjacent contacts of unmated connector assemblies 30C maximum temperature rise at specified current. EIA 364-70 Measure temperature rise vs current. All positions series wired individually forming a single circuit in each connector. Rated current when all contacts are loaded MECHANICAL Vibration, Random No discontinuities greater than 1 microsecond. See Note. Per EIA 364-28,condition V, test letter F Duration 15 minutes. 15 minutes in each of three mutually per planes. Physical Shock No discontinuities greater than 1 microsecond. No physical damage. See Note. Mating Force 150N max. Per EIA 364-27 Subject mated connectors to 50 G's half-sine shock pulses of 11 milliseconds duration. 3 shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. Per EIA 364-13. Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. Unmating Force Rev A 150N max. Per EIA 364-13. 2 of 5 108-130013 Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. Durability See note. Per EIA 364-09 Mate and unmate connector assemblies for 100 cycles for gold flash and 15μin gold plating , 500 cycles for 30 μin gold plating at maximum rate of 200 cycles per hour. ENVIRONMENTAL Solderability Solderable area shall have minimum of 95% solder coverage. Per EIA 364-52 For wave soldering Temperature: 245℃±5℃ Immersion duration : 5 seconds After 1 hour± 5 minutes steam aging Thermal Shock See note. Per EIA 364-32,test condition VII Subject mated connectors to 5 cycles Between –55℃ and +105℃ with each cycle consisting of 30 minute dwells at -55 and 105°C. The transition between temperatures was less than 5 minutes. Humidity See note. Per EIA 364-31 Method II test condition A Subject mated connectors to 96 hours at 40℃ with 90% to 95% RH. Temperature Life See note. Per EIA 364-17 test condition IV Method A Subject mated connectors to temperature life at 105C for 500 hours. Salt Spray See note. Per EIA 364-26 Mated connector Salt concentration: 5%, 35±2° C, 8 hours NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure 2. Rev A 3 of 5 108-130013 3.4. Product Qualification and Requalification Test Sequence TEST GROUP (a) TEST OR EXAMINATION 1 2 3 4 5 6 7 1 1 TEST SEQUENCE (b) Initial examination of product Low Level Contact Resistance 1 1 1 2,5 2,5 2,4 1 1 Dielectric Withstanding Voltage 4 Insulation Resistance 5 Temperature Rise 2 Vibration, Random 3 Physical Shock 4 Mating Force 6 3 Unmating Force 7 4 Durability 3 2 Solderability 2 Thermal Shock 2 Humidity 3 Temperature Life 4 Salt Spray 3 Final examination of product 8 6 5 3 6 3 5 NOTE (a) See paragraph 4.1.A. (b) Numbers indicate sequence in which tests are performed. 4. QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Sample Selection Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. All test groups shall consist of 5 connector pairs. B. Test Sequence Testing shall be performed in the sequence as defined in paragraph 3.4. 4.2. Requalification Testing If changes significantly affecting form, fit or function are made to the product or manufacturing process, product assurance shall coordinate requalification testing, consisting of all or part of the original testing sequence as determined by development/product, quality, and reliability engineering. Rev A 4 of 5 108-130013 4.3. Acceptance Acceptance is based on verification that the product meets the requirements. Failures attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to confirm corrective action is required before resubmitted. Rev A 5 of 5