2309409-3

2309409-3

  • 厂商:

    HUMIREL(泰科)

  • 封装:

  • 描述:

    DDF SODIMM SOCKET 0.5mm Height

  • 数据手册
  • 价格&库存
2309409-3 数据手册
2309409-3 SO DIMM Sockets, Small Outline (SO), Stack Height .205 in [5.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM 2309409-3  ACTIVE DDR4 DIMM TE Internal #: 2309409-3 SO DIMM Sockets, Small Outline (SO), Stack Height .205 in [5.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM View on TE.com > Connectors > Socket Connectors > Memory Sockets > SO DIMM Sockets > DDR4 SO DIMM Sockets DRAM Type: Small Outline (SO) Stack Height: 5.2 mm [ .205 in ] Module Orientation: Right Angle Number of Positions: 260 Centerline (Pitch): .5 mm [ .02 in ] All DDR4 SO DIMM Sockets (39) Features Product Type Features Connector System Cable-to-Board Connector & Contact Terminates To Printed Circuit Board DRAM Type Small Outline (SO) Configuration Features Number of Keys 1 Number of Rows 2 Module Orientation Right Angle Number of Positions 260 Electrical Characteristics DRAM Voltage 1.2 V Signal Characteristics SGRAM Voltage 1.2 V Body Features  Ejector Location Both Ends Latch Material High Temperature Thermoplastic Retention Post Location Both Ends For support call +1 800 522 6752 06/03/2024 05:32PM |Page  1 2309409-3 SO DIMM Sockets, Small Outline (SO), Stack Height .205 in [5.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM Retention Post Location Both Ends Module Key Type Offset Left Ejector Type Locking Connector Profile Low Contact Features Memory Socket Type Memory Card PCB Contact Termination Area Plating Material Gold Flash Contact Base Material Copper Alloy Contact Current Rating (Max) .5 A Contact Mating Area Plating Material Gold Contact Mating Area Plating Material Thickness .254 µm[10 µin] Termination Features Insertion Style Cam-In Termination Method to Printed Circuit Board Surface Mount Mechanical Attachment Mating Alignment Type Standard Keying PCB Mount Retention With PCB Mount Retention Type Solder Peg Connector Mounting Type Board Mount Housing Features Housing Material High Temperature Thermoplastic Housing Color Black Centerline (Pitch) .5 mm[.02 in] Dimensions Stack Height 5.2 mm[.205 in] Row-to-Row Spacing 8.2 mm[.322 in] Usage Conditions Operating Temperature Range -55 - 85 °C[-67 - 185 °F] Operation/Application Circuit Application Power Industry Standards UL Flammability Rating  For support call +1 800 522 6752 UL 94V-0 06/03/2024 05:32PM |Page  2 2309409-3 SO DIMM Sockets, Small Outline (SO), Stack Height .205 in [5.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM UL Flammability Rating UL 94V-0 Packaging Features Packaging Quantity 800 Packaging Method Tape & Reel Product Compliance For compliance documentation, visit the product page on TE.com> EU RoHS Directive 2011/65/EU Compliant EU ELV Directive 2000/53/EC Compliant China RoHS 2 Directive MIIT Order No 32, 2016 No Restricted Materials Above Threshold EU REACH Regulation (EC) No. 1907/2006 Current ECHA Candidate List: JAN 2024 (240) Candidate List Declared Against: JAN 2024 (240) Does not contain REACH SVHC Halogen Content Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free Solder Process Capability Reflow solder capable to 260°C Product Compliance Disclaimer This information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledge based on the information they provided. This information is subject to change. The part numbers that TE has identified as EU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment products will be CE marked as required by Directive 2011/65/EU. Components may not be CE marked. Additionally, the part numbers that TE has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulation, the information TE provides on SVHC in articles for this part number is based on the latest European Chemicals Agency (ECHA) 'Guidance on requirements for substances in articles' posted at this URL: https://echa.europa.eu/guidance-documents/guidance-onreach Compatible Parts TE Part # 2309413-4 DDR4 SODIMM 260P 9.2H STD  Also in the Series For support call +1 800 522 6752 DDR4 DIMM 06/03/2024 05:32PM |Page  3 2309409-3 SO DIMM Sockets, Small Outline (SO), Stack Height .205 in [5.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM Also in the Series DIMM Sockets(69) DDR4 DIMM SO DIMM Sockets(39) Customers Also Bought TE Part # 2-1827875-3 TE Part # 2-178293-2 TE Part # 2-66104-3 TE Part # 62274-1 DYNAMIC 1200D HDR ASSY V 6P Y BLACK GOLD DYNAMIC D3100 HDR H 3P ASSY III+ SKT,24-20,30AU/FL,STRIP 250 FASTON REC 22-18 AWG TPBR TE Part # 41829 250 FASTON REC 14-12 AWG TPBR Documents Product Drawings DDR4 SODIMM 260P 5.2H STD English CAD Files 3D PDF 3D Customer View Model ENG_CVM_CVM_2309409-3_1.2d_dxf.zip English Customer View Model ENG_CVM_CVM_2309409-3_1.3d_igs.zip English Customer View Model ENG_CVM_CVM_2309409-3_1.3d_stp.zip  English For support call +1 800 522 6752 06/03/2024 05:32PM |Page  4 2309409-3 SO DIMM Sockets, Small Outline (SO), Stack Height .205 in [5.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM English By downloading the CAD file I accept and agree to the Terms and Conditionsof use. Product Specifications Application Specification English  For support call +1 800 522 6752 06/03/2024 05:32PM |Page  5
2309409-3 价格&库存

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2309409-3
  •  国内价格 香港价格
  • 9600+11.288019600+1.46235

库存:0