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108-130028 Product Specification JAN 14 2021 Rev E The product described in this document has not been fully tested to ensure conformance to the requirements outlined below. Therefore, TE Connectivity (TE) makes no representation or warranty, express or implied, that the product will comply with these requirements. Further, TE may change these requirements based on the results of additional testing and evaluation. Contact TE Engineering for further details. Sliver Mini Power Connectors 1. SCOPE 1.1. Content This specification defines performance, test and quality requirements for the Sliver 2.0 Card Edge mini power connectors. 1. Vertical version 2. Right Angle version For perpendicular plug in cards 1.2. For parallel card applications Qualification When tests are performed on the subject product line, procedures specified in testing requirements and procedures shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 1.3. Qualification Test Results for Vertical Version Successful qualification testing on the subject product line was completed on September 20th, 2019. The qualification test report number is 501-32405. This documentation is on file and available from Engineering Practices and Standards. Additional test results can be found in 502-32083. 1.4. Qualification Test Results for Right Angle Version Successful qualification testing on the subject product line was completed on Xxxxx XXth, 2020. The qualification test report number is 501-32xxx. This documentation is on file and available from Engineering Practices and Standards. Additional test results can be found in 502-32xxx. 2. APPLICABLE DOCUMENTS AND FORMS The following documents and forms constitute a part of this specification to the extent specified herein. Unless otherwise indicated, the latest edition of the document applies. 2.1. 2.2. 2.3.       114-130013: Application Specification 501-32405: Qualification Test Report (Vertical) 502-32083: Additional Testing Report (Vertical) 502-32141: Additional Testing Report (Vertical) (Additional Copper content in mating Boards) 501-32xxx: Qualification Test Report (Right Angle) 502-32xxx: Additional Testing Report (Right Angle) (Additional Copper content in mating Boards)  EIA-364  IPC/ECA J-STD-002   109-197 102-950 TE Documents Industry Documents Electrical Connector/Socket Test Procedures Including Environmental Classifications Solderability Reference Document © 2021 TE Connectivity family of companies All Rights Reserved | Indicates Change Test Specification (TE Test Specification vs EIA and IEC Test Methods) Qualification of Separable Interface Connectors This controlled document is subject to change. For latest revision and Regional Customer Service, visit our website at www.te.com PRODUCT INFORMATION 1-800-522-6752 *Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners. 1 of 5 108-130028 3. REQUIREMENTS 3.1. Design and Construction Product shall be of the design, construction, materials and physical dimensions specified on the applicable product drawing. 3.2. Ratings    Voltage: See Figure 1 Current: See Figure 1 Operating Temperature: -55°C to 105°C Voltage Rating (Volts AC) 48V Estimated Current Rating (amperes at 40°C temperature rise) Vertical Right Angle 50 A (25 amperes per contact) 40 A-(20 amperes per contact) Figure #1 3.3. Test Requirements and Procedures Summary Unless otherwise specified, all tests shall be performed at ambient environmental conditions. TEST DESCRIPTION REQUIREMENT PROCEDURE Initial Examination of Product Meets requirements of product drawing. EIA-364-18. Visual examination and dimensional (C of C) inspection per product drawing. Final Examination of Product Meets visual requirements. EIA-364-18. Visual examination ELECTRICAL Low Level Contact 1 mmaximum initial EIA-364-23. Resistance (LLCR) ΔR 1 m maximum Contact Resistance at Rated Current 2.0 mmaximum EIA-364-06 Insulation Resistance 1 GΩ Min EIA-364-21. Max. open voltage 20 mV. Max current 100 mA DC. Test voltage 500V DC. Duration 5 seconds min. Dielectric Withstanding Voltage Maximum leakage current of 2.0 mA. No breakdown or flashover. EIA-364-20, Condition I Test Voltage: 1100 VAC MECHANICAL Random Vibration Rev E No discontinuity≥ 1 microsecond. EIA 364-28, Test Method VII, Test Condition Letter D. Subject mated specimens to 3.10 G RMS between 20 to 500 Hz. Fifteen minutes in each of 3 mutually perpendicular planes. 2 of 5 108-130028 TEST DESCRIPTION REQUIREMENT Mechanical Shock No discontinuity≥ 1 microsecond. See note. EIA 364-27, Test condition A, Subject mated specimens to 50 G half-sine shock. Three shocks applied in each direction of 3 mutually perpendicular axis. 18 total shocks. Mating/Un-Mating Force Minimum of 3 N for both mating and un-mating force values EIA 364-13 Durability See note. PROCEDURE Axial Tension/Compression machine such as an Instron Tensile Tester. Max rate 25.4 mm/min EIA 364-9. Mate and un-mate specimens to within .050”. 200 mate/un-mate cycles. Add in cards shall be replaced after 100 cycles. ENVIRONMENTAL Solderability 95% minimum wetting IPC/ECA J-STD-002 Test A1 Resistance to Reflow Soldering Heat See note. TEC-109-201 Method-A, Condition B. subject SMD connector to 3X reflow curve 260°C peak. Thermal Shock See note. EIA 364-32, Method A, Test Condition VII. Subject mated specimens to 5 cycles between -55°C and 105°C with 30 minute dwells at temperature extremes and 1 minute maximum transition time between temperatures. Humidity/Temperature Cycling See note. EIA 364-31, Method IV. Subject mated specimens to 10 cycles (10 Days) between 25°C and 65°C at 80% to 100% Relative Humidity. Temperature Life See note. EIA 364-17, Method A. Test Subject mated specimens to 105°C for 1000 hours. Mixed Flowing Gas See note. EIA 364-65, Class IIA (4 gas). Subject board mounted specimens to environmental Class IIA for 14 days. One-half of the specimens (receptacle only) unmated for 7 days followed by 7 days mated. The remaining one-half of the specimens mated for 14 days. Rev E 3 of 5 108-130028 TEST DESCRIPTION REQUIREMENT PROCEDURE Temperature Rise Testing Maximum of 40°C above Ambient T-rise. EIA 364-70 Test Method 3, Test Condition II. Note: Rated Current The test specimen(s) shall be energized to generate a temperature rise equal to approximately 30% of the specified requirement. The current shall then be increased in gradual increments and the temperature rise shall be measured and recorded along with the corresponding current after stabilization has been achieved. Incremental increases shall be repeated until the specified temperature rise has been achieved or exceeded. Perform Contact resistance once temperature has stabilized. Vertical = 25 amps per contact Rt Angle = 20 amps per contact NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure 2. Rev E 4 of 5 108-130028 3.4. Product Qualification and Requalification Test Sequence Test or Examination 1 Initial examination of product Low Level Contact Resistance Contact Resistance at Rated Current Insulation resistance Withstanding voltage Random vibration Mechanical shock Durability Connector Mating Force Connector Un-Mating Force Connector solderability Resistance to reflow soldering heat Thermal shock Humidity/temperature cycling Temperature life Temperature Rise Mixed flowing gas Final examination of product 1 4,6,9 Test Group (a) 2 (c) 3 Test Sequence (b) 1 1 4,7,9,11 4 (c) 5 (c) 1 1 5(e) 2,6 3,7 7 8 5 2,10 3,11 10 2 3 2,5 3,6 2 4 4(d) 5 12 8 5(d),12 6 13 8 3 7 NOTE (a) Samples shall be prepared in accordance with applicable instructions and shall be selected at random from current production. Unless otherwise stated all test groups shall consist of a minimum of 10 connectors of which all contacts shall be tested. (b) Numbers indicate sequence in which tests are performed. (c) Groups 4 and 5 shall consist of 6 connectors. Group 2 shall consist of 8 connectors. (d) Connectors for these tests shall be preconditioned by 10 mating and un-mating cycles. (e) Contact resistance at rated current shall be performed after temperature has stabilized during temperature rise testing. Rev E 5 of 5