2354935-1

THERMAL BRIDGE TECHNOLOGY FOR INPUT/OUTPUT (I/O) APPLICATIONS BENEFITS Thermal bridge technology is the latest thermal innovation • 2x better thermal resistance from TE Connectivity (TE) and provides up to 2x better thermal • Better reliability and durability resistance over traditional thermal technologies such as gap pads • Improved application serviceability or thermal pads. This solution was developed as our customers seek ways to dissipate more heat associated with increasing APPLICATIONS • High performance computing (HPC) • Ethernet switches • 5G/wireless • Servers • Ethernet SP routing power requirements, specifically in applications with restricted airflow, liquid cooling or cold plate applications. In addition to superior thermal performance over comparable thermal solutions in the market, thermal bridge technology provides better reliability thanks to an elastic compression design that is resistant to set and relaxation over time. This helps ensure consistent, longer-lasting performance and reduces component replacement during servicing. te.com/thermalbridge DATA AND DEVICES /// THERMAL BRIDGE TECHNOLOGY Thermal Bridge Technology For Input/Output (I/O) Applications HOW THERMAL BRIDGE WORKS Technical Features & Benefits • An interleaved series of highly parallel plates allows heat to pass from the I/O module to the cooling area • Integrated mechanical springs provide interface force and 1.0 mm of compression travel • Spring loaded bridge offers 1.0mm (typical) of z-axis compression • Near-zero plate gap for compressibility and thermal transfer • Comes pre-assembled on I/O cage • Interface may be greased (optional) • Individual plate actuation allows for surface conformability in the x-axis • Dual-spring design allows for tilt conformability in the y-axis • At 3 points of contact per plate, a typical bridge will have 150+ points of contact to adjacent surface Heatsink • Dry interface resistance 20-40% lower than most traditional riding heatsinks Product Specification • Document #: 108-130042 Application Specification • View specification documents for each individual part number (see page 3) Thermal bridge Heat transfer parallel plates Cage/module Heatsink Thermal bridge Plug Connector Cage/module DATA AND DEVICES /// THERMAL BRIDGE TECHNOLOGY PAGE 2 Thermal Bridge Technology For Input/Output (I/O) Applications AVAILABLE CAGE ASSEMBLIES WITH THERMAL BRIDGE TE Part Number Form Factor Configuration 2358986-1 SFP+ 1x1 2354751-1 QSFP-DD 1x1 2359309-1 QSFP28 1x1 2354935-1 QSFP28 1x4 2355519-1 QSFP28 1x6 Image Contact TE for custom design options. DATA AND DEVICES /// THERMAL BRIDGE TECHNOLOGY PAGE 3 Thermal Bridge Technology For Input/Output (I/O) Applications TE Technical Support Center USA: 1.800.522.6752 Canada: 1 .905.475.6222 Mexico: 52.0.55.1106.0800 Latin/S. America: 54.0.11.4733.2200 Germany: 49.0.6251.133.1999 UK: 44.0.800.267666 France: 33.0.1.3420.8686 Netherlands: 31.0.73.6246.999 China: 86.0.400.820.6015 te.com TE Connectivity, TE Connectivity (logo) and Every Connection Counts are trademarks owned or licensed by the TE Connectivity family of companies. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2019 TE Connectivity Ltd. family of companies All Rights Reserved. 9-1773982-4  11/19   Original