SOSA ALIGNED INTERCONNECT
SOLUTIONS
INCREASE POWER, SPEED AND BANDWIDTH WITH OPEN
ARCHITECTURE SOLUTIONS
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
SOSA Aligned
Interconnect Solutions
VITA 46 MULTIGIG RT Connector System with Data Rates to
32+ Gb/s (Modular)
The Sensor Open Systems Architecture (SOSA) Consortium is
developing a common framework for transitioning sensor systems
to an open systems architecture, based on key interfaces and
open standards established by industry-government consensus.
These systems are targeted for platforms across all major U.S.
military branches. Using OpenVPX as its basis, SOSA helps
ensure interoperability, improved subsystem SWaP-C, and rapid
technology upgrades.
Setting the Standard
TE Connectivity (TE) has been a leader in interconnect solutions
for OpenVPX and an active member of the SOSA Consortium.
The products in this brochure are aligned with the SOSA™
Technical Standard and targeted for design for next generation
sensor systems and rugged embedded computing applications.
SWaP: Reduce Size and Weight
RUGGED
• The standard for VITA 46 applications
•M
odular connector system features a
protected backplane connector
The MULTIGIG RT connector, the standard for VITA 46, represents
a huge step forward in the world of rugged computing and C5ISR
enabling technology. The connector series supports speeds to
32+ Gb/s, providing a comfortable performance margin in VPX
applications. This modular connector system features a protected
pinless backplane connector and wafer-based design in place of
pin contacts. Wafers, available for differential, single-ended, and
power needs, can be easily modified to support specific customer
needs for characteristic impedance, propagation delay, and other
electrical parameters. This lightweight connector system also
offers built in ESD features, enabling field serviceability, and is fully
qualified for VITA 47 environment classes.
FAST
•S
upports speeds up to 32+ Gb/s,
providing a comfortable performance
margin in VPX applications
FLEXIBLE
Increase Power, Speed and Bandwidth with
Open Architecture Solutions
Next-generation processors need next-generation connectivity
to keep pace with the growing demand for bandwidth even as
space, weight, and power savings become critical.
TE has been pushing the bandwidth envelope by adapting highspeed technology and combining it with our expertise in rugged
packaging. The results are board-level interconnects that give you
more performance in harsh military and aerospace applications.
• Wafers are easily modified to
support the need for propagation
delay, characteristic impedance, and
other electrical parameters
• Lightweight connector offers
built-in ESD features enabling
field serviceability
VITA 46 MULTIGIG RT 2-R Connectors (Ultra Rugged)
Beyond Speed
TE is also reducing size through higher contact densities and
supporting RF and optical interconnects at the board level
allowing compact, high-speed box-to-box connectivity. TE has
a full range of copper and fiber I/O connectors supporting data
rates up to 32+ Gb/s.
Meeting the Needs of Battlespaces
We are meeting the demanding needs of battlespaces with
ruggedized copper and fiber interconnect and cable assemblies.
And we are helping to protect systems with lightweight shielding
and EMI-immune datapaths.
TE is focusing our technology to minimize size, weight and
power consumption, to increase bandwidth, and to enable open
architecture systems.
EXTREME RUGGEDNESS
•P
asses extreme requirements of
VITA 72 Study Group
•F
eatures a quad-redundant contact
system for greater reliability in a high
vibration environment
•S
pecified for VITA 78 SpaceVPX
applications
MULTIGIG RT 2-R connectors are an evolution of MULTIGIG RT 2
connectors, designed to offer even more ruggedness and
reliability in demanding high-vibration environments. They
go beyond VITA 47 environmental performance to meet the
demanding vibration requirements of VITA 72. These connectors
are specified for VITA 78 SpaceVPX fault-tolerant interoperable
backplanes and modules. The lightweight connectors offer
low outgassing and resist the growth of tin whiskers for high
reliability in the challenging environment of space. Backward
compatible to all existing VITA 46 daughtercards, rugged
MULTIGIG RT 2-R connectors have a pinless interface tested
to 10,000 mating/unmating cycles. The connector has been
tested to extreme vibration levels, including a 6U VPX test unit
by exposing a 6U VPX test unit to random vibration levels of
0.2 g2/Hz for 12 hours.
ULTRA FLEXIBLE
• Compatible with standard
MULTIGIG RT-2 connectors for VITA 46
• Optimized footprints for signal
integrity and ease of board design
• Low outgassing
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
PAGE 2
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
PAGE 3
VITA 46 MULTIGIG RT 2-S and MULTIGIG RT 3 Connectors
(Higher Speed)
VITA 46 VPX PART NUMBERS
RT 2
Position
TE Connectivity’s (TE) MULTIGIG RT 2-S and MULTIGIG RT 3
connectors are the next generation lightweight, rugged, high
speed backplane connectors and meet the interface dimensions
for VITA 46 VPX connectors. They are backward compatible
with legacy MULTIGIG RT products and offer the same reliable
ruggedized interface as MULTIGIG RT 2-R connectors. The new
contact and wafer designs optimize signal integrity, extending
data rates to 16-32+ Gb/s – supporting protocols such as PCIe
Gen 4, Gen 5 and 100GBASE-KR4 Ethernet.
Differential
P0
Single
Ended
1410189-3
P1, 2, 3, 4, 5, 6
1410187-3
RT 2-S
RT 3
RT 3 Highspeed
with Power
Differential
Differential
Differential
2102772-1
2102772-1
2332816-1
2302317-1
2302785-1
RT 2-R
1410190-3
Differential
Single
Ended
2102772-1
2102771-1
2102847-1
JO
1410186-1
2102735-1
2102735-1
2102735-1
J1, 3, 4, 5
1410140-1
2102736-1
2102736-1
2302789-1
J2, 6
1410142-1
2102737-1
2102737-1
2302790-1
2332817-1
See p. 6 for guide module and pin options.
MULTIGIG RT 2-S connectors are plug-in module only, and mate with RT 2, RT 2-R and RT 3 backplane connectors.
Part numbers with tin-lead plated tails are listed above. See TE drawings for RoHS options.
THIN WALL RIGHT END
BACKPLANE CONNECTORS
Thinner End Wall
FAST
•E
nhanced PCB wafer and contact
design supports increased
bandwidth up to 32+ Gb/s
FLEXIBLE
An alternate right end
backplane connector module
with a thinner end wall can be
utilized to eliminate this risk of
damage to the plug-in module
•M
eets interface requirements
for VITA 46 connectors allowing
backward compatibility with legacy
VPX products
• Customizable to meet unique
application requirements
MULTIGIG
Series
Part
Number
RT 2-R
2371552-1
RT 3
2364030-1
MODULAR
•M
odular design enables numerous
configurations by interchanging
higher-speed MULTIGIG RT 3
connectors with the legacy
MULTIGIG RT 2 and MULTIGIG
RT 2-R connectors.
RUGGED
•C
ontact design utilizes quad
redundant contacts for optimum
performance in shock and vibration
DURABLE
•H
igh durability tested for 10,000
mating/unmating cycle
SPEEDS
RUGGEDIZED
MATING CYCLES
QUAD-REDUNDANT CONTACT SYSTEM
FLEXIBILITY WITH WAFER CONFIGURATION
VITA 46 INTERMATEABLE
MULTIGIG RT 2-R
Connector
MULTIGIG RT 2-S
Connector
MULTIGIG RT 3
Connector
10+ Gb/s
16+ Gb/s
32+ Gb/s
500
500
500
Position
RT 2
(10 Gb/s)
RT 2-S
(16+ Gb/s)
RT 3
(32+ Gb/s)
RT 2-R
(Rugged
10 Gb/s)
P0 + P1A
1410326-3
2286250-1
2345723-1
2313237-1
J0 + J1A
1410140-1
2102736-1
2102736-1
(RT 2-R)
2313238-1
P1B + P2A
1410187-3
2102771-1
2302317-1
2302785-1
J1B + J2A
1410142-1
2102737-1
(or thin wall
2371552-1)
2102737-1
(or thin wall
2371552-1)
2302790-1
(or thin wall
2364030-1)
PCB HOLE DIAMETER
BACKPLANE (in mm)
0.56 (ref)
PCB HOLE DIAMETER
DAUGHTERCARD (in mm)
0.46 (ref)
RELEASE DATE
OPEN VPX STANDARD
0.56 (ref)
0.46 (ref)
MODULES FOR VITA 66 AND 67 HALF MODULE 3U APPLICATIONS
0.37 (ref)
0.32 (ref)
2013
2019
2019
VITA 46.0
VITA 46.0
VITA 46.30
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
PAGE 4
P1B + P2A
P0 + P1A
VITA 66 or 67 Half Module
See p. 6 for guide module and pin options.
MULTIGIG RT 2-S connectors are plug-in module only, and mate with RT 2, RT 2-R and RT 3 backplane connectors.
Part numbers with tin-lead plated tails are listed above. See TE drawings for RoHS options.
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
PAGE 5
Guide Hardware
VITA 66 (Optical) Connector Modules
TE Connectivity’s (TE) Ruggedized Optical Backplane VITA 66
interconnect system provides a high-density, high-bandwidth,
blind-mate optical interconnect in a backplane/daughtercard
configuration. The fiber optic ribbon cable interconnect feeds
through the backplane to removable system modules using MT
ferrules. Designed for rugged embedded computing applications,
the fiber optic connectors are compatible with VPX and other
high-performance standards. Connector module designs support
half and full size modules, with new, higher density variants
now available.
VITA 46 GUIDE MODULES - KEYING OPTIONS
Key Orientation
(Degrees)
Standard
(Diecast)
Rugged
(Machined
Aluminum)
Rugged
(Machined
Stainless Steel)
0
1-1469492-1
2000713-1
2000713-7
45
1-1469492-2
2000713-2
2000713-8
90
1-1469492-3
2000713-3
2000713-9
135
1-2000713-4
—
180
1-2000713-5
—
225
1-2000713-6
—
270
1-1469492-7
2000713-4
1-2000713-0
315
1-1469492-8
2000713-5
1-2000713-3
Without Keying
1-1469492-9
2000713-6
1-2000713-2
RUGGED RELIABILITY
• Receptacle (backplane) connector
includes two robust guide pins for
blind mating
VERSATILE
VITA 46 GUIDE PINS
External Thread
Shoulder Depth
into Backplane
(DimJ)
Thread
Length
(Dim K)
Thread
Type
(External)
Rugged
(Stainless
Steel)
Internal Thread
Diecast
Internal
Thread
Max Depth
Thread
Type
(Internal)
Rugged
(Stainless Steel)
1.32
7.25
10-32 UNF
2000676-1
5.67
8-36 UNF
2327906-2
2.60
7.25
10-32 UNF
2000676-2
1-1469491-2
6.95
8-36 UNF
2327906-4
4.20
7.25
10-32 UNF
2000676-3
1-1469491-3
8.55
8-36 UNF
2327906-6
5.70
7.25
10-32 UNF
2000676-4
1-1469491-4
10.05
8-36 UNF
2327906-8
11.65
8-36 UNF
1-2327906-0
7.30
7.25
10-32 UNF
2000676-5
5.70
10.35
10-32 UNF
2000676-6
3.40
9.00
M5 x 0.8 - 6g
2000676-7
7.75
M2 .5X.45
1-2327906-4
2.40
6.30
M5 x 0.8 - 6g
2000676-9
6.75
M2 .5X.45
1-2327906-8
• Modules support VITA 66.1, 66.4, and
66.5 draft standard
• Locating post features helps ensure
proper positioning
• Ribbon cable feeds through backplane
to removable system modules
VITA 67 (RF) Connector Modules
VITA 67 RF modules from TE are modular systems designed for
backplane/daughtercard multi-coax contact mating within a
robust platform to withstand the mechanical rigors of military
and aerospace applications. They are also fully compatible with
VPX packaging to make it easy and convenient to achieve RF
connectivity within an open architecture.
Dim J
Dim K
The contacts have radial and axial float for reliable blind
mating and excellent RF performance. They are housed in
robust stainless steel or aluminum modules, providing RFI/EMI
shielding between the RF contacts with channel isolation of at
least 100 dB up through 40-70 GHz.
Dim J
External Thread Guide Pins
Internal Thread Guide Pins
VERSATILE
• Modular design fully compatible with
VPX packaging permits application
specific configuration
• Available with SMPM contacts/
modules and new higher density
NanoRF modules
RELIABLE
• Float mounted jack maintains
positive RF ground
• Contacts tolerate generous
misalignment to allow blind mating
• Contacts housed in robust stainless
steel or aluminum modules
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
TE’s broad product line offers many possible configurations,
including front panel MT connections to on board optical
modules, direct attachment of transceivers to the bottom MT
port, or to using a combination of optics and RF connections,
all in a ruggedized blind mate structure.
PAGE 6
TE offers SMPM contacts/modules and new higher density
NanoRF modules, supporting 2-3 times the density of VITA 67
SMPM RF modules. The NanoRF interface features a floating
insert to pre-align RF contacts before engagement. RF contact
types are illustrated below.
SMPM Front Washer
Contacts and Modules
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
NanoRF
SMPM Snap-In
Contacts and Modules
PAGE 7
RF and Optical Connector Modules
RF and Optical Connector Modules
Full Module VITA 65 Aperture H Backplane per VITA 67.3C
VITA 65
Module
Designation
6.4.5.6.1
(Legacy SOSA
profiles)
6.4.5.6.2
6.4.5.6.3
6.4.5.6.4
6.4.5.6.8
6.4.5.6.9
6.4.5.6.10
Connector
Module
Part Number
RF Contact
Part Number
(.086" Cable)
RF Contact
Part Number
(.047" Cable)
MT Ferrule Kit
Part Number
Optical Plug-In
Card Interface
Plug-In
Module
2157339-4 (P2A)
2226881-1 (P2B)
1996390-1
1996771-1
2102866-2 (Std Grade)
2313212-2 (Low Loss)
Cabled MT
Backplane
2828423-1 (SMPM
Rear Cable Attach)
2828775-1 (OSMM
Rear Cable Attach)
—
—
2102866-1 (Std Grade)
2313212-1 (Low Loss)
—
Plug-In
Module
2332834-3
2101012-1
2157248-1
—
—
Backplane
(Snap-In
Contacts)
2365211-1
2332676-1
2332676-2
—
Backplane
(Front
Washer
Contacts)
2332832-2
1996390-1
1996771-1
—
Plug-In
Module
2323863-3
2101012-1
2157248-1
—
—
Backplane
(Snap-In
Contacts)
2332706-1
2332676-1
2332676-2
—
—
Backplane Module
Layout
VITA 67.1
and VITA
66.4
Hybrid
9 Pos
SMPM
10 Pos
SMPM
14 Pos
SMPM
2 Style
C 66.5
inserts
with 10
NanoRF
1 Style
C 66.5
insert
with 14
NanoRF
2 Style
C 66.5
inserts
with 20
NanoRF
6 Optical
Connector
Module
Part Number
RF Contact
Part Number
(.086" Cable)
RF Contact
Part Number
(.047" Cable)
MT Ferrule Kit
Part Number
Optical Plug-In
Card Interface
Plug-In
Module
2226881-1
—
—
2102866-2 (Std Grade)
2313212-2 (Low Loss)
Cabled MT
Backplane
2828736-1
—
—
2102866-1 (Std Grade)
2313212-1 (Low Loss)
—
Plug-In
Module
2357976-1
—
2302339-1
(9 ea)
—
—
—
Backplane
2357971-1
2332772-1
(8 ea)
2302345-1
(1 ea)
—
—
Plug-In
Module
2359407-1
—
2302339-1
(5 ea)
12-Fiber: 2355002-1
24-Fiber: 2355002-2
Cabled MT
—
2358435-1
—
2302339-1
(5 ea)
—
Transceiver
2358431-1
2332772-1
(4 ea)
2302345-1
(1 ea)
2359410-1
—
2302339-1
(10 ea)
2313388-1
—
2302339-1
(10 ea)
2313391-1
—
2302345-1
(10 ea)
2388442-1
—
—
2388440-1
—
—
2388438-1
—
—
Plug-In
Module
2332829-3
1996390-1
1996771-1
—
2101012-1
2157248-1
—
Plug-In
Module
Style C 66.5
Insert with
10 NanoRF
—
2332676-2
—
—
Backplane
(Front
Washer
Contacts)
2332827-2
1996390-1
1996771-1
—
—
—
2302339-1
(10 ea)
2332772-1 (8 ea)
2302345-1
(2 ea)
Plug-In
Module
Style D 66.5
Insert
(3 MT)
6.4.5.7.6
Backplane
Plug-In
Module
2359407-1 (2 ea)
Backplane
2358791-1
Backplane
Backplane
Backplane
2332676-1
Plug-In
Module
Style C 66.5
Insert with
5 NanoRF
—
2361107-1
Backplane
9 Pos
NanoRF
6.4.5.7.4
Backplane
(Snap-In
Contacts)
Plug-In
Module
VITA 66.4
(1 MT)
6.4.5.7.3
2323763-2
Backplane
Backplane Module
Layout
6.4.5.7.2
Backplane
(Front
Washer
Contacts)
Plug-In
Module
VITA 65
Module
Designation
6.4.5.7.1
2358435-1 (2 ea)
2359407-1 +
2357976-1
—
2302339-1
(14 ea)
2332772-1
(12 ea)
2302345-1
(2 ea)
2358435-1 +
2378047-1
2359410-1 (2 ea)
—
2313388-1 (2 ea)
2378048-1
—
2302339-1
(20 ea)
2302345-1
(20 ea)
2388442-1 (2 ea)
6.4.5.6.11
Half Module VITA 65 Aperture J Backplane per VITA 67.3D
—
—
2388440-1 (2 ea)
2388444-1
12-Fiber: 2355002-1
24-Fiber: 2355002-2
—
12-Fiber: 2332756-1
24-Fiber: 2332756-2
12-Fiber: 2355002-1
24-Fiber: 2355002-2
—
12-Fiber: 2332756-1
24-Fiber: 2332756-2
12-Fiber: 2355002-1
24-Fiber: 2355002-2
—
12-Fiber: 2332756-1
24-Fiber: 2332756-2
12-Fiber: 2375154-1
24-Fiber: 2375154-2
12-Fiber: 2375154-1
24-Fiber: 2375154-2
—
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
—
12-Fiber: 2375153-1
24-Fiber: 2375153-2
12-Fiber: 2332756-1
24-Fiber: 2332756-2
12-Fiber: 2355002-1
24-Fiber: 2355002-2
—
12-Fiber: 2332756-1
24-Fiber: 2332756-2
12-Fiber: 2375154-1
24-Fiber: 2375154-2
12-Fiber: 2375154-1
24-Fiber: 2375154-2
12-Fiber: 2375153-1
24-Fiber: 2375153-2
—
Cabled MT
Transceiver
—
3 Cabled MT
2 Cabled MT &
1 Transceiver
—
Cabled MT
Transceiver
VITA 66.5 TRANSCEIVER KITS
—
Cabled MT
Transceiver
—
Cabled MT
Transceiver
—
Application
Plug Kit
Part Number:
Included in
Transceiver Kit
Part Number
Mating
Backplane
Connector
Part Number
Half Width
Mating
Backplane
Connector
Part Number
Full Width
66.5
Style
28
1 MT + 5 nanoRF
2358435-1
2358431-1
2358791-1
C-Hybrid
28
3 MT
2388440-1
2388438-1
2388444-1
D
—
28
3 MT
2388440-1
2388438-1
2388444-1
D
Rx
-7.5
28
3 MT
2388440-1
2388438-1
2388444-1
D
4
TxRx
-12
10
1 MT + 10 nanoRF
2313388-1
2313391-1
2363793-1
C-Hybrid
Transceiver
Kit TE
Part Number
Channel
Count
2394052-4
2393875-1
Tx/Rx
Rx Sens
(dBm)
Max Data
Rate G
12
Rx
-7.5
4
TxRx
-7.5
2393875-3
12
Tx
2393875-4
12
2394053-1
2 Cabled MT
per Insert
2394053-2
4
TxRx
-9
10
1 MT + 10 nanoRF
2313388-1
2313391-1
2363793-1
C-Hybrid
1 Cabled MT &
1 Transceiver
per Insert
2394053-3
12
Tx
—
10
1 MT + 10 nanoRF
2313388-1
2313391-1
2363793-1
C-Hybrid
2394053-4
12
Rx
-12
10
1 MT + 10 nanoRF
2313388-1
2313391-1
2363793-1
C-Hybrid
2394054-1
4
TxRx
-12
10
1 MT + 5 nanoRF
2358435-1
2358431-1
2358791-1
C-Hybrid
2394054-2
4
TxRx
-9
10
1 MT + 5 nanoRF
2358435-1
2358431-1
2358791-1
C-Hybrid
2394054-3
12
Tx
—
10
1 MT + 5 nanoRF
2358435-1
2358431-1
2358791-1
C-Hybrid
2394054-4
12
Rx
-12
10
1 MT + 5 nanoRF
2358435-1
2358431-1
2358791-1
C-Hybrid
2394055-1
4
TxRx
-12
10
3 MT
2388440-1
2388438-1
2388444-1
D
2394055-2
4
TxRx
-9
10
3 MT
2388440-1
2388438-1
2388444-1
D
2394055-3
12
Tx
—
10
3 MT
2388440-1
2388438-1
2388444-1
D
2394055-4
12
Rx
-12
10
3 MT
2388440-1
2388438-1
2388444-1
D
—
PAGE 8
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
PAGE 9
Rugged Mezalok VITA 61 XMC Connectors
RUGGED
•S
urface-mount mezzanine connector
with 500 mating cycle durability
• Superior thermal cycling stability—
2000 thermal shock cycles -55°C
to +125°C
• Anti-stubbing design prevents
mis-mating
VERSATILE
• 1 14 position in 10, 12, 15, 17 and 18 mm
stack heights
• Support single-width and
double-width mezzanine cards
HIGH PERFORMANCE
VITA 62 Power Supply Connectors
TE’s Mezalok mezzanine connectors are designed for stacking
or mezzanine applications for rugged embedded computing.
The connectors incorporate a multi-point redundant box contact
system for a separable interface, and the 114 position connectors
are compliant with VITA 61.0 XMC standard. Stack height options
are 10, 12, 15, 17 and 18 mm. Mezalok connectors are shock and
vibration resistant per VITA 47 and 72 HALT test requirements.
Featuring a wide operating temperature range, excellent
thermal stability, and data rates to 32+ Gb/s, these rugged and
highly versatile connectors are ideal for high-speed embedded
computing applications. Installation of Mezalok connectors is
easily accomplished using standard ball grid array (BGA) surface
mount processes.
•R
edundant box contact system
provides four points of contact for
ultra-reliability
• High-temperature polymer housings
offer superior thermal stability and
low outgassing
• Compliant BGA board-attach
supports standard surface mount
processing and thermal stability
• Supports data rates up to 32+ Gb/s
• HSLF products offer up to 50%
lower extraction force
60
114
320
Connector and
Stack Height (mm)
50 Microinch Gold Mating
Tin-Lead
BGA
Lead Free
BGA
High Speed (HS)
50 Microinch Gold Mating
Tin-Lead
BGA
Lead Free
BGA
VITA 62.0
Tin-Lead
BGA
Lead Free
BGA
2102079-1
2102079-2
2102079-1
10
2369022-1
2369022-2
2102080-1
12
2369022-3
2369022-4
2102080-3
Pin Connector
2102060-1
2102060-2
2102060-1
2102060-2
2102060-3
2102060-4
10
2355825-1
2355825-2
2102061-1
2102061-2
2102061-5
2102061-6
12
2355825-3
2355825-4
2102061-3
2102061-4
2102061-7
2102061-8
1-2102061-3
1-2102061-4
1-2102061-5
1-2102061-6
Socket
Connector
15
2102079-2
17
1-2355825-7
1-2355825-8
1-2102061-7
1-2102061-8
18
2355825-9
1-2355825-0
2102061-9
1-2102061-0
Pin Connector
2102429-1
Socket
Connector
• 20 A and 50 A power contacts, plus
signal contacts
• 3-beam high-conductivity-copper
contact design
• Hot-plug capable
• 270VDC applications supported
by connectors with isolating fins
(VITA 62.2)
• 3-phase power configurations
(VITA 62.1)
30 Microinch Gold Mating
Pin Connector
Socket
Connector
HIGH PERFORMANCE
Higher input voltage of 270V DC is required for select
applications, including altitudes of 60-70k ft for military
avionics. New VITA 62.1 (3-phase) and 62.2 (standard)
connector variations meet creep/clearance distance
requirements, with slots required in the boards between
contacts. “Fins” are inserted between power contacts
and penetrate through the board slots to
increase breakdown voltage.
Fins
270V DC Connector
High Speed Low Extraction
Force (HSLF)
Position
Size
The MULTI-BEAM XLE power connector, specified for the
VPX VITA 62 power supply standard, offers 50 A and 20 A
power contacts as well as signal pins within the same connector
assembly. The design is hot pluggable, tolerates mating
misalignment, and supports VPX architecture.
2102429-1
1-2102061-1
1-2102061-2
2102429-4
10
2355827-1
2355827-2
2102430-1
2102430-6
18
2355827-9
1-2355827-0
2102430-9
1-2102430-2
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
PAGE 10
VITA 62.2
270VDC
VITA 62.1
3-phase
Slot
Size
Position
Part Type
Contact Tail
Part No
3U
P0
RA Header
Solder Tail
2317477-1
3U
P0
RA Header
Compliant Pin
2314578-2
3U
J0
Vert Recpt
Compliant Pin
2309390-1
6U
P0
RA Header
Solder Tail
2314579-1
6U
P1
RA Header
Solder Tail
2314580-1
6U
P0
RA Header
Compliant Pin
2314577-1
6U
P1
RA Header
Compliant Pin
2314578-1
6U
J0
Vert Recpt
Compliant Pin
2314581-1
6U
J1
Vert Recpt
Compliant Pin
2309390-2
3U
P0
RA Header
Solder Tail
2313443-1
2313445-1 (2 per)
3U
P0
RA Header
Compliant Pin
2313442-1
2313445-1 (2 per)
3U
J0
Vert Recpt
Compliant Pin
2313441-1
2313444-1 (2 per)
6U
P0
RA Header
Solder Tail
2364867-1
2313445-1 (6 per)
6U
P0
RA Header
Compliant Pin
2348886-1
2313445-1 (6 per)
6U
J0
Vert Recpt
Compliant Pin
2348888-1
2313444-1 (6 per)
3U
P0
RA Header
Solder Tail
2332791-1
2313445-1 (6 per)
3U
P0
RA Header
Compliant Pin
2332793-1
2313445-1 (6 per)
3U
J0
Vert Recpt
Compliant Pin
2332795-1
2313444-1 (6 per)
AEROSPACE, DEFENSE & MARINE / SOSA ALIGNED INTERCONNECT SOLUTIONS
Fins for Higher
Voltage Application
PAGE 11
I/O Interconnect
SENSOR CLASSES
CLASS 1 AND 2
Class
Sensor Package Diameter
Class 1
>19 in.
Class 2
13 to
工商网监
湘ICP备2023018690号
