2381626-8
HPI, PCB Mount Header, Wire-to-Board, 8 Position, .059 in [1.5 mm] Centerline, Fully
Shrouded, Tin, Surface Mount, Power & Signal, Natural
2381626-8
ACTIVE
HPI
TE Internal #: 2381626-8
HPI, PCB Mount Header, Wire-to-Board, 8 Position, .059 in [1.5 mm]
Centerline, Fully Shrouded, Tin, Surface Mount, Power & Signal,
Natural
View on TE.com >
Connectors > PCB Connectors > PCB Headers & Receptacles
Connector System: Wire-to-Board
Number of Positions: 8
Number of Rows: 1
Centerline (Pitch): 1.5 mm [ .059 in ]
Termination Method to Printed Circuit Board: Surface Mount
Features
Product Type Features
Connector System
Wire-to-Board
Header Type
Fully Shrouded
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
PCB Connector Assembly Type
PCB Mount Header
Configuration Features
Number of Positions
8
Number of Rows
1
Electrical Characteristics
Termination Resistance
20 mΩ
Insulation Resistance
1000 MΩ
Dielectric Withstanding Voltage (Max)
500 V
Body Features
Primary Product Color
For support call+1 800 522 6752
Natural
03/21/2022 11:31AM | Page 1
2381626-8
HPI, PCB Mount Header, Wire-to-Board, 8 Position, .059 in [1.5 mm] Centerline, Fully
Shrouded, Tin, Surface Mount, Power & Signal, Natural
Primary Product Color
Natural
Contact Features
Contact Layout
Staggered
PCB Contact Termination Area Plating Material Thickness
2 µm[80 µin]
Contact Underplating Material Thickness
1.27 – 2.7 µm[50 – 106 µin]
Contact Mating Area Plating Material Thickness
2 µm[80 µin]
PCB Contact Termination Area Plating Material Finish
Matte
Contact Mating Area Plating Material Finish
Matte
Contact Underplating Material
Nickel
PCB Contact Termination Area Plating Material
Tin
Contact Base Material
Brass
Contact Mating Area Plating Material
Tin
Contact Type
Pin
Contact Current Rating (Max)
3A
Termination Features
Termination Method to Printed Circuit Board
Surface Mount
Mechanical Attachment
Mating Alignment Type
Polarization
Mating Retention
With
PCB Mount Retention Type
Solder Peg
Mating Retention Type
Latch
Connector Mounting Type
Board Mount
Mating Alignment
With
PCB Mount Alignment
Without
PCB Mount Retention
With
Housing Features
Mating Entry Location
Side
Housing Material
LCP
Centerline (Pitch)
1.5 mm[.059 in]
Usage Conditions
Operating Temperature Range
-40 – 105 °C[-40 – 221 °F]
Operation/Application
Assembly Process Feature
Circuit
Application
For support call+1
800 522
6752
Pick and Place Cover
Power & Signal
03/21/2022 11:31AM | Page 2
2381626-8
HPI, PCB Mount Header, Wire-to-Board, 8 Position, .059 in [1.5 mm] Centerline, Fully
Shrouded, Tin, Surface Mount, Power & Signal, Natural
Assembly Process Feature
Pick and Place Cover
Circuit Application
Power & Signal
Industry Standards
UL Flammability Rating
UL 94V-0
Packaging Features
Packaging Quantity
900
Packaging Type
Carton, Reel
Product Compliance
For compliance documentation, visit the product page on TE.com>
EU RoHS Directive 2011/65/EU
Compliant with Exemptions
EU ELV Directive 2000/53/EC
Not Yet Reviewed
China RoHS 2 Directive MIIT Order No 32, 2016
Restricted Materials Above Threshold
EU REACH Regulation (EC) No. 1907/2006
Current ECHA Candidate List: JAN 2022
(223)
Candidate List Declared Against: JUL 2021
(219)
SVHC > Threshold:
Pb (4% in Component Part)
Article Safe Usage Statements:
Do not eat, drink or smoke when using this product. Wash thoroughly after
handling. Recycle if possible and dispose of the article by following all applicable
governmental regulations relevant to your geographic location.
Halogen Content
Low Halogen - Br, Cl, F, I < 900 ppm per
homogenous material. Also BFR/CFR/PVC
Free
Solder Process Capability
Not reviewed for solder process capability
Product Compliance Disclaimer
This information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledge
based on the information they provided. This information is subject to change. The part numbers that TE has identified as
EU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent
chromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to these
limits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment products
will be CE marked as required by Directive 2011/65/EU. Components may not be CE marked. Additionally, the part
numbers that TE has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous
materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits
as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulation, the information TE provides
on SVHC in articles for this part number is based on the latest European Chemicals Agency (ECHA) ‘Guidance on
requirements for substances in articles’ posted at this URL: https://echa.europa.eu/guidance-documents/guidance-onreach
Compatible Parts
For support call+1 800 522 6752
03/21/2022 11:31AM | Page 3
2381626-8
HPI, PCB Mount Header, Wire-to-Board, 8 Position, .059 in [1.5 mm] Centerline, Fully
Shrouded, Tin, Surface Mount, Power & Signal, Natural
TE Part # 2380312-8
1.5P 8POS WTB CABLE HOUSING
WITH LATCH
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Documents
For support call+1
800 522 6752
03/21/2022 11:31AM | Page 4
2381626-8
HPI, PCB Mount Header, Wire-to-Board, 8 Position, .059 in [1.5 mm] Centerline, Fully
Shrouded, Tin, Surface Mount, Power & Signal, Natural
Documents
Product Drawings
1.5P 8POS WTB R/A BRD W LATCH TIN NAT
English
CAD Files
3D PDF
3D
Customer View Model
ENG_CVM_CVM_2381626-8_1.2d_dxf.zip
English
Customer View Model
ENG_CVM_CVM_2381626-8_1.3d_igs.zip
English
Customer View Model
ENG_CVM_CVM_2381626-8_1.3d_stp.zip
English
By downloading the CAD file I accept and agree to the Terms and Conditions of use.
Product Specifications
Product Specification
English
For support call+1 800 522 6752
03/21/2022 11:31AM | Page 5