TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
TABLE OF CONTENTS
Introduction........................................................................................................................................................................................ 2
Description ..................................................................................................................................................................................... 2
Features and Benefits .................................................................................................................................................................... 2
Product Applications ...................................................................................................................................................................... 2
Industry Standards ......................................................................................................................................................................... 2
Technical Documents ..................................................................................................................................................................... 2
Part Numbers .................................................................................................................................................................................... 3
Table 1. Part Number Selection Guide ........................................................................................................................................... 3
Product Specifications ....................................................................................................................................................................... 3
Table 2. Material Specifications ...................................................................................................................................................... 3
Table 3. Electrical/Mechanical Specifications ................................................................................................................................. 3
Table 4. Environmental Specifications ............................................................................................................................................ 4
Table 5. Bulk Cable Specifications ................................................................................................................................................. 4
Table 6. Operating Specifications ................................................................................................................................................... 4
Pin Configurations ............................................................................................................................................................................. 5
microQSFP Straight Cable Assembly ............................................................................................................................................. 5
microQSFP to 2x microQSFP Breakout Assembly ......................................................................................................................... 6
microQSFP to QSFP28 Hybrid Assembly....................................................................................................................................... 7
microQSFP to 4x SFP28 Breakout Assembly ................................................................................................................................. 8
ASHREA............................................................................................................................................................................................ 8
Guidelines ...................................................................................................................................................................................... 8
Plot ................................................................................................................................................................................................ 9
microqsfp Cable Assembly Mechanical Schematics......................................................................................................................... 10
microQSFP Straight Cable Assembly ........................................................................................................................................... 10
microQSFP to 2x microQSFP Breakout Assembly ....................................................................................................................... 10
microQSFP to QSFP28 Hybrid Assembly..................................................................................................................................... 10
microQSFP to 4x SFP28 Breakout Assembly ............................................................................................................................... 10
EEPROM Memory Map ................................................................................................................................................................... 11
Description of Memory Map and Control Functions ...................................................................................................................... 11
Table 7. Lower Memory Map ........................................................................................................................................................ 11
Table 8. Upper Memory Map 00h ................................................................................................................................................. 12
Signal Integrity Performance............................................................................................................................................................ 13
QSFP28 to QSFP28 DAC Signal Integrity Performance Plots ...................................................................................................... 13
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 1 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
INTRODUCTION
Description
TE Connectivity’s (TE) microQSFP passive copper cable assembly is a high density 4x28G solution that provides 33% higher
density than existing form factors such as QSFP. microQSFP cables feature eight differential copper pairs and four 28G data
transmission channels in a SFP-sized form factor. This type of density allows more ports (up to 72) on a standard line card, saving
significant design space. A Multi-Source Agreement (MSA) defines the mechanical features of the cable plug, receptacle connector
and cage to provide a standard interface. The microQSFP copper cable assembly is compatible with 25G/100G Ethernet, 25G/50G
Ethernet Consortium and InfiniBand Enhanced Data Rate (EDR) electrical performance requirements.
Offered in a broad range of wire gages – from 28AWG through 32AWG – this 28G copper cable assembly features low insertion
loss and low cross talk. The cable plug incorporates cooling fins to enhance thermal performance in order to keep energy costs low
and maximize reliability.
Designed for 28G applications in the data center, networking and telecommunications markets that require a high density, high
speed, reliable cable assembly. The MSA standardized form factor supports next generation 56G performance and ensures
backwards compatibility to 28G.
Features and Benefits
•
•
•
•
•
•
•
•
•
•
Compatible with 25G/100G Ethernet, 25G/50G Ethernet Consortium and InfiniBand EDR
Supports aggregate data rates of 100Gbps in SFP sized form factor
One-third more dense than existing QSFP form factor
Cooling fins integrated into cable plug module enhances thermal management
Optimized construction to minimize insertion loss and cross talk
Customized cable braid termination limits EMI radiation
Straight, breakout and hybrid assembly configurations available
Pull-to-release spring latch design
28AWG through 32AWG cable
RoHS compliant
Product Applications
•
•
•
•
•
Switches, servers and routers
Data Center networks
Storage area networks
High performance computing
Telecommunication and wireless infrastructure
Industry Standards
•
•
•
•
µQSFP Multi-Source Agreement (MSA)
25G/100G Ethernet
25G/50G Ethernet Consortium
InfiniBand EDR
Technical Documents
Product Specification
108-32124 microQSFP Copper Module Direct Attach Cable Assembly
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 2 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
PART NUMBERS
Table 1. Part Number Selection Guide
Cable Assembly Length (meters)
TEPN
2821236
2821310
Description
microQSFP to microQSFP Cable
Assembly
AWG
0.5
1
2
3
32
-1
-2
-3
30
-1
-2
-3
-4
-4
2821313
28
-1
-2
-3
2821644
32
-1
-2
-3
30
-1
-2
-3
-4
28
-1
-2
-3
-4
32
-1
-2
-3
30
-1
-2
-3
-4
28
-1
-2
-3
-4
32
-1
-2
-3
30
-1
-2
-3
-4
28
-1
-2
-3
-4
2821635
microQSFP to (4x) SFP28
Breakout Assembly
2821645
2821779
2821781
microQSFP to QSFP28 Cable
Assembly
2821782
2821783
2821784
microQSFP to (2x) microQSFP
Breakout Assembly
2821785
4
-5
-5
-5
-5
Contact TE for customized lengths.
PRODUCT SPECIFICATIONS
Table 2. Material Specifications
PCB
Halogen Free low loss laminate
IPC Class 3
Contact
30µin min hard Gold plated contact pads
Backshell
Nickel plated zinc diecast
Latch Spring
Stainless steel
Pull Tab
Molded santoprene
Silver plated copper conductor
Bulk Cable
Metallized shielding tape
Flexible PVC jacket
Table 3. Electrical/Mechanical Specifications
Impedance
100Ω
Data Rate
Up to 28Gb/s NRZ
Durability
200 cycles
Mating Force
40N mating force maximum
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 3 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
Table 4. Environmental Specifications
Rated Temperature
80°C
Flammability Rating
VW-1
Safety Certifications
RoHS compliant
REACH compliant
Table 5. Bulk Cable Specifications
32AWG= 31 mm
8-pair Bend Radius
30AWG= 37 mm
28AWG= 43 mm
32AWG= 25 mm
4-pair Bend Radius
30AWG= 25 mm
28AWG= 31 mm
32AWG= 19 mm
2-pair Bend Radius
30AWG= 25 mm
28AWG= 25 mm
32AWG= 6.2 mm
8 pair Cable OD
30AWG= 6.9 mm
28AWG= 8.38 mm
32AWG= 4.5 mm
4 pair Cable OD
30AWG= 5.6 mm
28AWG= 6.4 mm
32AWG= 4.2 mm
2 pair Cable OD
30AWG= 4.6 mm
28AWG= 4.95 mm
32AWG= 6.53 dB/m
Attenuation at 12.89 GH
30AWG= 5.5 dB/m
28AWG= 4.25 dB/m
Table 6. Operating Specifications
Parameter
Min
Nominal
Max
Unit
Operating Voltage
3.13
3.3
3.46
V
400
kHz
Two-Wire SCL Frequency
Passive microQSFP Power (per connector)
4.7
Operating Data Rate
0.01
5.1
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
11
mW
28
Gbps
Page 4 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
PIN CONFIGURATIONS
microQSFP Straight Cable Assembly
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 5 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
microQSFP to 2x microQSFP Breakout Assembly
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 6 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
microQSFP to QSFP28 Hybrid Assembly
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 7 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
microQSFP to 4x SFP28 Breakout Assembly
ASHREA
Guidelines
ASHRAE stands for the American Society of Heating, Refrigerating, and Air-Conditioning Engineers. Founded in 1894, it is a global
society advancing human well-being through sustainable technology for the built environment. ASHRAE focuses on building
systems, energy efficiency, indoor air quality, refrigeration and sustainability.
ASHRAE publishes a well-recognized series of standards and guidelines relating to HVAC systems and issues. These standards
are often referenced in building codes, and are considered useful standards for use by consulting engineers, mechanical
contractors, architects, and government agencies. These building codes are commonly accepted standards for architects and
engineers.
ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment, brings together the
interests of the data center industry in the area of data center cooling technologies. ASHRAE developed the Thermal Guidelines for
Data Processing Environments that establishes a framework for cooling requirements in the data center. These Guidelines define
four classes of data center equipment (A1 through A4) based on the equipment's operating temperature and relative humidity
requirements.
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 8 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
The ASHRAE recommended A1 range defines the range where the most reliable and power efficient operation of the data center
can be achieved based on ITE manufacturers' input. The ASHRAE A4 range (free cooling) is the broadest range in terms of
temperature and relative humidity extremes.
TE tested 25G bulk cable at max and min recommended operating temperatures and plotted the results versus ASHRAE A1 and A4
classes. At both extreme temperatures, TE bulk cable exceeds ASHRAE recommended guidelines at the free cooling A4 range.
Plot
ASHRAE Data Center Guidelines vs TurboTwin 25G Bulk Cable Tests
80
70
60
Temperature (°C)
50
40
30
20
10
0
-10
-20
0
20
40
60
80
100
Relative Humidity (%)
Ashrae A4 (Free Cooling)
Ashrae Recommended
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Bulk Cable Test
Page 9 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
microQSFP CABLE ASSEMBLY MECHANICAL SCHEMATICS
microQSFP Straight Cable Assembly
microQSFP to 2x microQSFP Breakout Assembly
microQSFP to QSFP28 Hybrid Assembly
microQSFP to 4x SFP28 Breakout Assembly
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 10 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
EEPROM MEMORY MAP
Description of Memory Map and Control Functions
TE's microQSFP cables utilize EEPROM mapping protocol defined by SFF-8636 (QSFP28). The lower 128 bytes of A0h of the 2wire serial bus address space, Table 7, is used to access a variety of measurements and diagnostic functions, a set of control
functions, and a means to select which of the various upper memory map pages are accessed on subsequent reads. This portion of
the address space is always directly addressable and thus chosen for monitoring and control functions that may need to be
repeatedly accessed. Table 8 shows the upper 128 byte address space 00h.
Table 7. Lower Memory Map
Byte Address
Description
Description
0
Identifier (1 Byte)
Identifier (1 Byte)
1
Revision Compliance
Revision Compliance
2
Status
Status
3-21
Interrupt Flags (19 Bytes)
Interrupt Flags (19 Bytes)
22-33
Module Monitors (12 Bytes)
Module Monitors (12 Bytes)
34-81
Channel Monitors (48 Bytes)
Channel Monitors (48 Bytes)
82-85
Reserved (4 Bytes)
Reserved (4 Bytes)
86-97
Control (12 Bytes)
Control (12 Bytes)
98-99
Reserved (4 Bytes)
Reserved (4 Bytes)
100-106
Module and Channel Masks (7 Bytes)
Module and Channel Masks (7 Bytes)
107-118
Reserved (12 Bytes)
Reserved (12 Bytes)
119-122
Reserved (4 Bytes)
Reserved (4 Bytes)
123-126
Reserved (4 Bytes)
Reserved (4 Bytes)
127
Page Select Byte
Page Select Byte
1-1773899-6 Rev 12/16
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TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 11 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
Table 8. Upper Memory Map 00h
Byte
Address
Name
Description
128
Identifier (1 Byte)
Identifier type of serial transceiver
129
Ext. Identifier (1 Byte)
Extended identifier of serial transceiver
130
Connector (1 Byte)
Code for connector type
131-138
Transceiver (8 Bytes)
Code for electronic or optical comp ability
139
Encoding (1 Byte)
Code for serial encoding algorithm
140
BR nominal (1 Byte)
Nominal bit rate units of 100 Mbps
141
Ext. Rate Sel Comp (1 Byte)
Tags for extended rate select compliance
142
Length SMF (1 Byte)
Link length supported for SM fiber in km
143
Length E-50um (1 Byte)
Link length supported for EBW 50/125um fiber units of 2m
144
Length 50um (1 Byte)
Link length supported for 50/125um fiber units of 1m
145
Length 62.5um (1 Byte)
Link length supported for 62.5/125um fiber units of 1m
146
Length Copper (1 Byte)
Link length supported copper units of 1m
147
Device Technology (1 Byte)
Device technology
148-163
Vendor Name (16 Bytes)
microQSFP Vendor name (ASCII)
164
Ext. Transceiver (1 Byte)
Extended transceiver codes for InfiniBand
165-167
Vendor OUI (3 Bytes)
microQSFP vendor IEEE vendor company ID
168-183
Vendor PN (16 Bytes)
Part number provided by microQSFP vendor (ASCII)
184-185
Vender Rev. (2 Bytes)
Revision level for part number provided by vendor (ASCII)
186-187
Copper Cable Attenuation
188-189
Copper Cable Attenuation
190
Max. Case Temp (1 Byte)
Maximum case temperature in degrees C
191
CC_BASE (1 Byte)
Check code for Base ID fields (addresses 12-190)
192-195
Options (4 Bytes)
Rate select, Tx disable, Tx fault, LOS
196-211
Vendor SN (16 Bytes)
Serial number provided by vendor (ASCII)
212-219
Date Code (8 Bytes)
Vendor’s manufacturing code
220
Diag Monitor Type (1 Byte)
Indicates which type of diagnostic monitoring is implemented
221
Enhanced Options (1 Byte)
Indicates which optional enhanced features are implemented
222
Reserved (1 Byte)
Reserved
223
CC_EXT (1 Byte)
Check code for the extended ID fields (addresses 192- 222)
224-255
Vendor Specific (32 Bytes)
copper cable attenuation in dB at 2.5 GHz (Byte 186) and 5.0 GHz (Byte
187)
copper cable attenuation in dB at 7.0 GHz (Byte 188) and 12GHz (Byte
189)
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 12 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
To access select detailed EEPROM memory mapping for these cable assemblies, please click on the following hyperlinks:
•
EEPROM Map microQSFP Straight Assembly (100G Ethernet)
SIGNAL INTEGRITY PERFORMANCE
microQSFP to microQSFP DAC Signal Integrity Performance Plots
Insertion Loss (SDD21) of 3m 30AWG microQSFP
Mode Conversion (SCD21) of 3m 30AWG microQSFP
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 13 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
Return Loss (SDD11) of 3m 30AWG microQSFP
Return Loss (SDD22) of 3m 30AWG microQSFP
Insertion Loss (SDD21) of 4m 28AWG microQSFP
1-1773899-6 Rev 12/16
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TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 14 of 15
TE Connectivity Technical Datasheet
microQSFP Pluggable Passive Copper Cable Assemblies
Conversion Mode (SCD21) of 4m 28AWG microQSFP
Return Loss (SDD11) of 4m 28AWG microQSFP
Return Loss (SDD22) of 4m 28AWG microQSFP
While TE has made every reasonable effort to ensure the
accuracy of the information in this document, TE does not
guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is
accurate, correct, reliable or current. TE reserves the right to
make any adjustments to the information contained herein at
any time without notice. TE EXPRESSLY DISCLAIMS ALL
IMPLIED WARRANTIES REGARDING THE INFORMATION
CONTAINED HEREIN, INCLUDING, BUT NOT LIMITED TO,
ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR
FITNESS FOR A PARTICULAR PURPOSE. In no event will TE
be liable for any direct, indirect, incidental, special or
consequential damages arising from or related to recipient’s use
of the information. It is the sole responsibility of recipient of this
information to verify the results of this information using their
engineering and product environment. Recipient assumes any
and all risks associated with the use of the information.
1-1773899-6 Rev 12/16
© 2016 TE Connectivity Family of Companies. All Rights Reserved.
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Page 15 of 15
