3-2176069-1

THICK FILM CHIP RESISTORS Type CRG Series Key Features Thick Film Resistors with high power to size ratio, ideally suited to industrial and general purpose use Value range from Ω to MΩ Eight package sizes Terminal finish matte Sn over Ni The resistive element is screen printed and fired, and a passivation layer added. Each resistor is trimmed to tolerance by laser. The pre-scribed tile is then broken into strips, the end plating fired on, and the strips broken into individual components. Final termination finish is electroplated matte Sn over a Ni barrier layer. Electrical Characteristics Type 0201 Power rating (W) 0.05 Resistance Min 1R0 ra ge Ω Max 10M Tolerance (%) 1 Code Letter F Max Working Voltage 25V Max Overload Voltage 50V Dielectric Strength (V) Rated current (Jumper) (A)0.5A Max Overload Current (A) 1A (Jumper) Temperature Range 0402 0.0625 1R0 10M 1 F 50V 100V 100V 1A 0603 0.1 1R0 10M 1 F 75V 150V 300V 1A 0805 0.125 1R0 10M 1 F 150V 300V 500V 2A 1206 0.25 1R0 10M 1 F 200V 400V 500V 2A 1210 0.5 1R0 10M 1 F 200V 500V 500V 2A 2010 0.75W 1R0 10M 1 F 200V 500V 500V 2A 2512 1W 1R0 10M 1 F 200V 500V 500V 2A 2A 2A 5A 10A 10A 10A 10A -55°C ~ 155°C Power rating: Resistors shall have a power rating based on continuous load operation at an ambient temperature of 70 ℃ . For temperature in excess of 70 ℃ , The load shall be derate as shown below 1773204 Rev J 12/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Derating Chart Constuction Dimensions: Type 1773204 Rev J 12/2018 0201 0402 0603 L 0.60±0.03 1.00±0.10 1.60±0.10 0805 2.00±0.15 1206 3.10±0.15 1210 2010 2512 3.10±0.10 5.00±0.10 6.35±0.10 Dimensions in millimetres unless otherwise specified W 0.30±0.03 0.50±0.05 0.80+0.15 -0.10 1.25+0.15 -0.10 1.55+0.15 -0.10 2.60±0.15 2.50±0.15 3.20±0.15 Dimensions (mm) H l1 0.23±0.03 0.10±0.05 0.35±0.05 0.20±0.10 0.45±0.10 0.30±0.20 l2 0.15±0.05 0.25±0.10 0.30±0.20 0.55±0.10 0.40±0.20 0.40±0.20 0.55±0.10 0.45±0.20 0.45±0.20 0.55±0.10 0.55±0.10 0.55±0.10 0.50±0.25 0.60±0.25 0.60±0.25 0.50±0.20 0.50±0.20 0.50±0.20 Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Performance Specification: Characteristic *Insulation Resistance *Dielectric Withstanding Voltage Temperature Coefficient of Resistance (TCR) Specification , MΩ Mi . No evidence of flashover mechanical damage, arcing or insulation break down Ω- Ω:± . Ω- Ω:± PPM/℃ Ω~ MΩ : ± PPM/℃ For :> PPM/℃ Ω:± Short Term Overload Resistance change rate is: ± % . % + . Ω Ma . ± % . % + . Ω Ma . *Solderability 95 % coverage Min. Soldering Temp. Reference Electrical characteristics shall be satisfied without distinct deformation in appearance. (95 % coverage Min.) Soldering Heat 1773204 Rev J 12/2018 PPM/℃ Resistance change rate is: ± %+ . Ω Ma . Dimensions in millimetres unless otherwise specified Test Methods (JIS C 5201-1) Apply 500V DC between protective coating and termination for 1 min, then measure (Sub-clause 4.6) Apply 100V(0402) 300V(0603) & 500V (0805,1206,1210,2010,2512) AC between protective coating and termination for 1 minute (Sub-clause 4.7) Natural resistance change per temp. degree centigrade. R1: Resistance value at room temperature (t1) R2: Resistance value at room temp. plus 100 ℃ (t2) (Sub-clause 4.8) Permanent resistance change after the application of a potential of 2.5 times RCWV for 5 seconds (Sub-clause 4.13) Test temperature of solder : 245 ±3°C Dipping time solder : 2-3 seconds (Sub-clause 4.17) Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Suggestion solder temp.: 235 ~ 255 ℃, 10 sec. (Max.) Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec. Peak temp.: 260 ℃ Hand soldering condition: The soldering iron tip temperature should be less than 300℃and maximum contract time should be 5 sec. Dip the resistor into a solder bath having a temperature of 260°C±3°C and hold it for 10±1 seconds. (Sub-clause 4.18) Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Performance Specification: (Continued) Characteristic Specification Test Methods (JIS C 5201-1) Temperature Resistance change rate is Resistance change after continuous Cycling 5 cycles for duty cycle specified below : ± % . % + . Ω Max. Step Temperature Time ± % . % + . Ω Ma . 1 -55°C±3°C 30 mins 2 Room Temp 10~15 mins 3 155°C±2°C 30 mins 4 Room Temp 10~15 mins (Sub-clause 4.19) Load Life in Resistance change rate is Resistance change after 1,000 hours (1.5 Humidity ± % . % + . Ω Ma . hours "on", 0.5 hour "off" ) at RCWV in a ± % . % + . Ω Ma . humidity chamber controlled at 40℃ ± 2℃ and 90 to 95 % relative humidity (Sub-clause 4.24.2.1) Load Life Resistance change rate is Permanent resistance change after 1,000 ± % . % + . Ω Ma . hours operating at RCWV, with duty cycle ± % . % + . Ω Ma . of (1.5 hours"on", 0.5 hour"off") at 70℃ ± 2℃ ambient (Sub-clause 4.25.1) Terminal Resistance change rate is Twist of Test Board : Bending ± . % + . Ω Ma . Y/X = 5/90 mm for 10 seconds (Sub-clause 4.33) The resistors of Ω o l a do the hara teristi oted of * Environment Related Substance This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and Halogen free. Ozone layer depleting substances are not used in our manufacturing process of this product. This product is not manufactured using Chloro fluorocarbons (CFCs), Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other ozone depleting substances in any phase of the manufacturing process. Storage Condition The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 25°C ± 10°C and a relative humidity of 60%RH ± 10%RH, chemical and dust free atmosphere Even within the above guarantee periods, do not store these products in the following conditions otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight 1773204 Rev J 12/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Marking E24 series 0603 – 2512 3 Digits – first two digits denote significant figures of resistance and third digit denotes number of zeros thereafter. EG 222 = 2K2 Marking for E96 Series 0805 – 2512 4 digits – First three digits denote significant figures of resistance and fourth digit denotes number of zeros thereafter. EG. 1000 For ohmic alues elo = 100R R letter R de otes de i al poi t. EG 1R80 R8 / .8Ω = 0201 and 0402 size chips are not marked 0603 E96 3 digit marking. Resistance Code from table on next page, and Multiplier code from table below Multiplier Code Code Mult. A 10⁰ B 10¹ C 10² Coding Formula XX E 10 F 10 Example G 10 H 10 Dimensions in millimetres unless otherwise specified Multiplier Code X 10⁻¹ Y 10⁻² Z 10⁻³ 10K2 = 102 ↓ 02 X 10² ↓ C = 02C 33R2 = 332 ↓ 51 X ⁻¹ ↓ X = 51X X Res. Code 1773204 Rev J 12/2018 D 10³ Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Resistance Code Label Label shall be marked with the following item : A. Nominal Resistance and Resistance Tolerance B. Power Rating and Size C. Quantity and description D. Part No. E. Lot No. Ex. 1773204 Rev J 12/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Packing Specification: Tape dimensions (mm) A. Paper Taping Type A±0.2 B±0.2 C±0.05 ØD+0.1 -0 E±0.1 F±0.05 G±0.1 W±0.2 T±0.1 0201 0402 0.40 ±0.05 0.65 0.70 ±0.05 1.15 2.0 1.5 1.75 3.5 4.0 8.0 0.42 2.0 1.5 1.75 3.5 4.0 8.0 0.45 Type A±0.2 B±0.2 C±0.05 E±0.1 F±0.05 G±0.1 W±0.2 T±0.1 1.90 2.40 3.60 3.50 2.0 2.0 2.0 2.0 ØD+0.1 -0 1.5 1.5 1.5 1.5 0603 0805 1206 1210 1.10 1.65 2.00 2.80 1.75 1.75 1.75 1.75 3.5 3.5 3.5 3.5 4.0 4.0 4.0 4.0 8.0 8.0 8.0 8.0 0.67 0.81 0.81 0.75 B. Embossed Taping Type 2010 2512 A ±0.2 2.90 3.50 B ±0.2 5.60 6.70 C ±0.05 2.0 2.0 ØD+0.1 -0 1.5 1.5 ØD1+0.1 -0 1.5 1.5 E ±0.1 1.75 1.75 F ±0.05 5.5 5.5 G ±0.1 4.0 4.0 W ±0.2 12.0 12.0 T ±0.1 1.0 1.0 * Peeling Strength of Top Cover Tape Test Condition: 0.1 to 0.7 N at a peel-off speed of 300 mm / min. 1773204 Rev J 12/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help THICK FILM CHIP RESISTORS Reel Dimension (mm) Type Taping 0201 0402 0603 0805 1206 1210 2010 2512 Papar Paper Paper Paper Paper Paper Embossed Embossed Reel Quantity 10,000 10,000 5,000 5,000 5,000 5,000 4,000 4,000 A ±0.5 B ±0.5 C ±0.5 D ±1 M ±1 W ±1 2 2 2 2 2 2 2 2 13 13 13 13 13 13 13 13 21 21 21 21 21 21 21 21 60 60 60 60 60 60 60 60 178 178 178 178 178 178 178 178 10 10 10 10 10 10 13.8 13.8 How To Order CRG Common Part CRG - Thick Film Chip Resistor 1773204 Rev J 12/2018 Dimensions in millimetres unless otherwise specified 0603 Size 0201 0402 0603 0805 1206 1210 2010 2512 F Tolerance 10K Resistance Value oh Ω R K oh Ω K F - ±1% Dimensions Shown for reference purposes only. Specifications subject to change K oh 100K M oh Ω Ω M For Email, phone or live chat, go to: www.te.com/help