3-331272-9

Sign In Search By: lkji Part Number m n lkj Text m n Tips Go Enter a complete or partial part number... Products Documentation Resources My Account Home > Products > By Type > Sockets/Memory Card Products Product Details for 3 Customer Support > Product Feature Selector About Us > Product Details - 331272 - 9 Quick Links Discrete Sockets Not ELV or RoHS Compliant 3 - 331272 (Find RoHS Compliant Alternates) Product Highlights: ? Socket ? Mating Pin Dia. Range = .46 ? Socket Length = 3.51 mm ? Sleeve Style = Open Bottom ? Tin Sleeve Plating View all Features -9 Pending Obsolescence Contact Product Information Center Check Pricing & Availability Search for Tooling Product Feature Selector Contact Us About This Product - .51 mm Documentation & Additional Information Product Drawings: ? MINIATURE SPRING SOCKET ASSEMBLY, SERIES 2 English) (PDF, Additional Information: ? Product Line Information Related Products: ? Tooling Catalog Pages/Data Sheets: ? None Available Product Specifications: ? None Available Application Specifications: ? None Available Instruction Sheets: ? None Available CAD Files: ? None Available List all Documents Product Features (Please use the Product Drawing for all design activity) Product Type Features: ? Product Type = Socket ? Socket Length (mm [in]) = 3.51 [0.138] ? Sleeve Style = Open Bottom ? Sealant = Without ? Sleeve Material = Copper ? Recommended Hole Size (mm [in]) = 1.32 [0.052] Body Related Features: ? Mating Pin Dia. Range (mm [in]) [0.018 – 0.020] ? Spring Material = Beryllium Copper = 0.46 Contact Related Features: ? Sleeve Plating = Tin ? Contact Spring Plating = Gold (30) ? Contact Material = Beryllium Copper Configuration Related Features: ? Insertion Method = Hand/Semi – 0.51 - Automatic Industry Standards: ? Government/Industry Qualification = No ? RoHS/ELV Compliance = Not ELV/RoHS compliant ? Lead Free Solder Processes = Wave solder capable to 240°C, Wave solder capable to 260° C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin - in - Paste capable to 245°C, Pin in - Paste capable to 260°C Operation/Application: ? Application = Production Packaging Related Features: ? Packaging Method = Loose Piece Other: ? Brand = AMP Languages : English | Deutsch | Español | Português (do Brasil) | ??????? | Italiano Country Sites : China | Japan Home | Customer Support | Supplier | Site Map | Privacy Policy © 2006 Tyco Electronics Corporation All Rights Reserved | ???? ( ?? ) | ?? | Browser Support ( ? ? ) | ??? -