108-1050
Product Specification
11 OCT 18 Rev L
Connector, MTA-100
1.
SCOPE
1.1.
Content
This specification covers performance, tests and quality requirements for the TE Connectivity (TE) MTA100 connector system. This system is mass terminated using insulation displacement technology on
0.100 inch centerlines and mates with 0.025 inch square posts providing a reliable interconnection
between wires and posts mounted on printed circuit boards. The standard system is available in 2
through 28 positions. The MTA-100 connector system is designed to be terminated to 28 AWG to 22
AWG wire, tin plated UL style 1007, 1061 or wire which specifies PVC insulation with temperature rating
compatible with specified operating temperatures, see Figure 4. Wire shall meet application
requirements specified in Application Specification 114-1019. Insulation diameters are: 0.050 inch
maximum outside diameter for mass termination and 0.060 inch maximum outside diameter for single
termination.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used. All
inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was completed between 08Aug96 to 20Jan97
and on 08Jan16. The Qualification Test Report number for this testing is 501-366.
1.4.
Revision Summary
Revisions to this specification include:
Updated mating force requirement in Figure 1.
Updated format to corporate requirements, including new logo and addition of Section 4 and
Paragraphs 1.3, 1.4, and 3.4.
2.
APPLICABLE DOCUMENTS AND FORMS
The following documents form a part of this specification to the extent specified herein. Unless otherwise
specified, the latest edition of the document applies. In the event of conflict between the requirements of
this specification and the product drawing, the product drawing shall take precedence. In the event of
conflict between the requirements of this specification and the referenced documents, this specification
shall take precedence.
2.1.
TE Connectivity Specifications
114-1019
501-366
2.2.
Application Specification
Qualification Test Report
Reference Documents
109-1
109 Series
General Requirements for Testing
Test Specifications as indicated in Figure 1
3.
REQUIREMENTS
3.1.
Design and Construction
Product shall be of the design, construction, materials and physical dimensions specified on the
applicable product drawing.
© 2018 TE Connectivity Ltd. family of companies.
All Rights Reserved.
*Trademark.
PRODUCT INFORMATION 1-800-522-6752
This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at www.te.com.
TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners.
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108-1050
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable TE drawing.
A.
3.3.
3.4.
Contact: Phosphor bronze, tin or tin-lead plating and gold over nickel plating
B.
Header: Thermoplastic polyester, UL 94V-0
C.
Housing: Nylon 6/6 or Nylon 6/12, UL 94V-2 and UL 94V-0
D.
Posts, header: Phosphor bronze, tin plating and gold over nickel plating
Ratings
A.
Voltage Rating: 250 VAC
B.
Current Rating: See Figure 4 for applicable current carrying capability
C.
Temperature Rating: –55°C to +105°C
Performance Requirements and Test Description
The product should meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. All tests shall be performed at ambient environmental conditions otherwise
specified.
3.5.
Test Requirements and Procedure Summary
Test Description
Examination of product
Requirement
Procedure
Meets requirements of product drawing and
Application Spec 114-1019
Visual, dimensional and functional per
applicable quality inspection plan
Electrical
Termination resistance
6 milliohms maximum initial.
ΔR 10 milliohms maximum
TE 109-6-1.
Subject mated contacts assembled in housing to
50 mv maximum open circuit at 100 ma
maximum.
See Figures 3 and 5
Insulation resistance
5000 megohms minimum initial
TE Spec 109-28-4.
Test between adjacent contacts of unmated
samples
Dielectric withstanding voltage
750 vac at sea level.
1 minute hold with no breakdown or
flashover
TE Spec 109-29-1.
Test between adjacent contacts of unmated
samples
Temperature rise vs current
30°C maximum temperature rise at specified
current
TE Spec 109-45-2.
Measure temperature rise vs current.
See Figures 4 and 5
Mechanical
Solderability
Termination tensile strength, parallel,
unmated
Solderable area shall have minimum of 95%
solder coverage
Wire Size (AWG)
Slot Tensile
(Pounds, minimum)
28
4
24
5
22
12
TE Spec 109-11-2.
Subject contacts to solderability
TE Spec 109-16.
Determine slot tensile at maximum rate of 1 inch
per minute. Pull parallel to terminated wire.
See Figure 6
Figure 1 (continued)
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108-1050
Termination tensile strength,
perpendicular, unmated
Wire Size (AWG)
Slot Tensile
(Pounds, minimum)
28
1
24
1
22
3
TE Spec 109-16.
Determine slot tensile at maximum rate of 1 inch
per minute. Pull perpendicular to terminated
wire.
See Figure 6
Vibration, sinusoidal
No discontinuities of 1 microsecond or longer
duration.
See Note
TE Spec 109-21-1.
Subject mated samples to 10-55-10 Hz
traversed in 1 minute at 0.06 inch total
excursion. 2 hours in each of 3 mutually
perpendicular planes
Physical shock
No discontinuities of 1 microsecond or longer
duration.
See Note
TE Spec 109-26-1.
Subject mated samples to 50 G's halfsine shock
pulses of 11 milliseconds duration. 3 shocks in
each direction applied along 3 mutually
perpendicular planes, 18 total shocks
Durability
See Note
TE Spec 109-27.
Manually mate and unmate samples with friction
lock header for 25 cycles
Mating force
2.4 pounds maximum average per contact
TE Spec 109-42, Condition A.
Measure force necessary to mate samples with
friction lock header from point of initial contact to
depth of 0.200 inch at maximum rate of 0.5 inch
per minute
Unmating force
0.8 pound minimum average per contact
TE Spec 109-42, Condition A.
Measure force necessary to unmate samples
from friction lock header at maximum rate of 0.5
inch per minute
Post Retention Force
3 pound minimum average per contact
TE Spec 109-30
Measure post retention force at maximum rate of
0.5 inch per minute
Environmental
Thermal shock
See Note
TE Spec 109-22.
Subject mated samples to 25 cycles between 55 and 105°C
Humidity-temperature cycling
See Note
AMP Spec 109-23-3, Condition B.
Subject mated samples to 10 cycles between 25
and 65°C at 95% RH
Temperature life
See Note
AMP Spec 109-43. Subject mated samples to
temperature life at 85°C for 1000 hours
Mixed flowing gas
See Note
AMP Spec 109-85-3.
Subject mated samples to environmental class
III for 20 days
Resistance to soldering heat
See Note
TE Spec 109-202, Condition C.
The solder bath temperature shall be maintained
at 260 +0/-5℃. The hold time in the solder shall
be 5 +2/-0 seconds
Figure 1 (end)
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108-1050
NOTE
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence Figure 2.
3.6.
Product Qualification and Requalification Test Sequence
TEST OR EXAMINATION
Examination of product
Termination resistance
1
2(c)
1, 9
3, 7
1,9
2,7
Insulation resistance
Dielectric withstanding voltage
3(d)
TEST GROUP (a)
4
5
6
TEST SEQUENCE (b)
1,5
1,8
1,3
1,3
2,4
2,6
3,7
7
8
1,3
1,3
3,8
Temperature rise vs current
2
Solderability
2(f)
Termination tensile strength
Vibration
Physical shock
Durability
Mating force
Unmating force
5
6
4
2
8
6(e)
2
Post retention force
4
5
Thermal shock
Humidity-temperature cycling
Temperature life
4(g)
5
3(g)
Mixed flowing gas
2
Resistance to soldering heat
Figure 2
NOTE
(a) Samples shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test group 1 shall consist of 5, 6 position
standard tin-lead plated samples and 5, 6 position gold plated samples. All samples shall be
terminated to the maximum wire size and mounted on printed circuit board PN 93-660017
(see Figure 5). Test group 2 shall consist of 3, 10 position standard tin-lead plated samples
terminated to 28 AWG wire and mounted on printed circuit board PN 93-660652; and 3, 10
position standard tin-lead plated samples terminated to 22 AWG wire and mounted on
printed circuit board PN 93-660651 (see Figure 5). Test group 3 shall consist of 3, 10
position gold plated samples terminated to 22 AWG wire and mounted on printed circuit
board PN 93-660017. Test group 4 shall consist of 5 unmounted 24 position standard tinlead plated samples terminated to the maximum wire size. Test group 5 shall consist of 6,
10 position standard tin-lead plated samples terminated to 28 AWG wire; 6, 10 position
standard tin-lead plated samples terminated to 24 AWG wire; and 6, 10 position standard
tin-lead plated samples terminated to 22 AWG wire. All samples shall be unmated and
unmounted. Test group 6 shall consist of 5, 6 position 0.100 inch friction lock tin-lead plated
headers.
(b) Numbers indicate sequence in which tests are performed.
(c) Tin-lead plated samples.
(d) Gold plated samples.
(e) Discontinuities shall not be measured. Energize at 18°C level for 100% loadings per Test
Specification 109-151.
(f) Subject half the samples to the parallel tensile test and the remaining half to the
perpendicular tensile test.
(g) Precondition samples with 5 cycles durability
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108-1050
NOTE
(a) Termination resistance equals millivolts divided by test current less resistance of 2 inches of
wire.
(b) After wave soldering, the boards and posts shall be cleaned to remove all flux and
contaminates.
Figure 3: Temperature and Termination Resistance Measurement Points
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108-1050
Figure 4A: Current Carrying Capability
Percent Connector Loading
(10 position In-Line connector)
Single Contact
50
100
Wire Size AWG
28
0.6
0.5
0.3
26
0.7
0.6
0.4
24
0.9
0.7
0.4
22
1
0.8
0.5
NOTE
To determine acceptable current carrying capacity for percentage connector loading and wire
gage indicated, use the Multiplication Factor (F) from the above chart and multiply it times the
Base Rated Current for a single circuit at maximum ambient operating temperature as shown in
Figure 4A.
Figure 4B
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PC Board Used for Termination Resistance Dry Circuit
PC Board Used for Current Rating
Figure 5: Printed Circuit Test Boards
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Figure 6: Termination Tensile Strength
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4.
QUALITY ASSURANCE PROVISIONS
4.1.
Test Conditions
Unless otherwise specified, all the tests shall be performed in any combination of the following test
conditions shown in Figure 7.
Temperature
15°C – 35°C
Relative Humidity
45% – 75%
Atmospheric Pressure
86.6 – 106.6 kPa
Figure 7
4.2.
Qualification Testing
A.
Specimen Selection
Specimens shall be prepared in accordance with applicable instruction sheets and shall be selected at
random from current production. See note in Figure 2.
B.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
4.3.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
4.4.
Acceptance
Acceptance is based on verification that the product meets the requirements in Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
4.5.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing and
this specification.
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