5-1542004-8

This browser does not have Java enabled . l!! My Cart TE Industries l!ti My Part Lists I Sign Ha ve a Question? .• .a Ch;;,t v.·ith ;;, Product Information Specialist connectivity Products 1 Resources About TE - -~ ....\~ 1. My Account In/ Register 't'M English ( Change) What can we help you find? Innovation Support Center Hom e > Products > Heat Sink s > Product Featur e Selector > Product Details CJ S ha r e 5- 1542004- 8 Product Details ~ - rl ~ ~ Con v erted t o EU R o H S/ ELV Com p lia nt ( St a t e m e nt o f Com p lia n ce) ~ ~ Product Highlights: • Heat Sink • BGA • Pack age Size = 25 (.985) mm [ in) • For Use With BGA Semiconductor Pack ages • Power Air Velocity Thermal Resistance 5 -1542004- 8 P ri nt [g) Email / Quick Links Heat Sink Assemblies (J {2i ~ Pricing & Availability Sear ch for Tooling Product Featur e Selector Contact Us About This Product View all Featur es TE Internal Number: 5· 1542004·8 . / A ctiv e !!ti Add t o My Part Lis t Request Sample (:;? Find Similar Produc t s .Jj Buy Produc t Documentation & Additional Information Product Drawings: • 25mm HS A SS'Y ( HTS768-U) (PDF, English) Additional Information: • Product Line Inform ation Catalog Pages/Data Sheets: • None Available Additional Product Images: • Line Dr a•Ning • Therm al Resistance Chart Product Specifications: • None Available Related Products: • Tooling Application Specifications: • None Available ,. ~ Instruction Sheets: • None Available CAO Files: • None Available List all Documents Product Features (Please use the Product Drawing for all design activity) Product Type Features: • Product Type = Heat Sink • Device Type = BGA • Heat Sink Type = 3 Fin Radial • Finish = Black Anodize Housing Features: • UL Flammability Rating = UL 94V- 0 Industry Standards: • RoHS/ ELV Compliance = RoHS compliant, ELV compliant • Lead Fr ee Solder Processes = Not r elevant for lead fr ee pr ocess • RoHS/ ELV Compliance History = Converted to comply with RoHS dir ective Dimensions: • Diam eter ( mm [ in )) = 34.92 ( 1.375) • Height ( mm [ in )) = 11.86 ( 0 .467) Conditions for Usage: • For Use With = BGA Semiconductor Pack ages Body Features: • Pack age Size ( mm [ in )) = 25 (.985) • Material = Aluminum Other: • Br and = TE Connectivity • Line = ChipCoolers • Comment = Mounting clip does not incr ease over all heat sink height.; Heat sink assembly includes Four Leg Standar d Clip, Part Number 154 2026- 1. Corporate Information Quick Links Customer Support A bout TE Distributor Inventory Em ail or Chat With Us Investor s Product Cr oss Refer ence Find a Phone Number News Room Documents & Dr a•Nings Knowledge Base Supplier Portal Product Compliance Support Center Manage Your Account Car eer s Site Map Keep Me Informed Terms & Conditions Privacy Policy © 20 13 Ty co S ectronics Corporation, a TE Connecti vity Lt d. company. A ll Rights Reserved 4f1r Pro vide Websit e Feedbac k