5-6450860-0

Application Specification 114-13251 MULTI-BEAM XLE* Connectors 04SEP20 Rev D1 NOTE iNOTE All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of ±0.13 mm [±.005 in.] and angles have a tolerance of ±2°. Figures and illustrations are for identification only and are not drawn to scale. 1. INTRODUCTION This specification covers the requirements for application of MULTI-BEAM XLE connectors onto printed circuit (pc) boards for use in power supplies. These connectors consist of vertical and right-angle receptacle assemblies, and vertical and right-angle plug assemblies. The connectors are available with either precision formed press-fit (compliant pin) contacts or solder type contacts. Each connector consists of a housing with power modules containing one high power or low power contact and signal modules containing four rows of signal contacts, either pin or socket. The signal pin contacts (only in plugs) are available in two contact mating lengths: standard and mate-last break-first (MLBF) (post mate), and the power contacts (only in receptacles) are available in two contact mating lengths: standard and mate-first break-last (MFBL) (pre-mate) for sequencing applications. NOTE iNOTE The amount of power and signal contacts in a connector is customer specified. Any connector configuration can be designed to meet customer requirements-provided it is within the limitations stated in this document. When corresponding with TE Connectivity Personnel, use the terminology provided in this specification to facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1. Orthogonal Plug Assembly Figure on page 7 Figure 1 ©2013 Tyco Electronics Corporation, a TE Connectivity Ltd. company All Rights Reserved *Trademark TOOLING ASSISTANCE CENTER 1-800-722-1111 PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change. For latest revision and Regional Customer Service, visit our website at www.te.com TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or company names may be trademarks of their respective owners. 1 of 16 114-13251 Modules are available with contact centerline spacing and related voltage rating listed in the following table: CONTACT CONFIGURATION INDICATOR CENTERLINE SPACING VOLTAGE RATING ACP 7.62 [.300] 300 P 6.35 [.250] 200 Low Power LP 29.2 [.115] 200 Signal S 2.54 [.100] 60 MODULE TYPE High Power The maximum overall length allowed for the connector is 203 mm [8 in.]. Combinations of up to 36 power contacts and 148 signal contacts can be used-provided the maximum allowable length is not exceeded. End modules and center modules are available with features that provide blind mating, misalignment, and polarization. End modules contain a guide post, guide hole, or latch receiver with key slot and a retention clip, and/or mounting hole, and center modules contain a retention clip or mounting hole. End modules without guides are also available. Guides (posts on receptacles and holes in plugs) have rounded edges for ease of mating and are offset to prevent improper mating of connectors. The latch receiver with key slot ensures proper orientation of connectors when mating and accidental back-out of the connector. The retention clips help to align the connector to the pc board for installation then secure the connector for soldering. The 3.05 mm [.120 in.] diameter mounting holes (which accept commercially-available standard screws) are also used to secure the connector to the pc board. The connectors are supplied in tray form for manual placement. The connectors feature standoffs (one located at each contact) to facilitate pc board cleaning after soldering. Convection windows and cored lances located on the housing provide air flow for power modules. 2. REFERENCE MATERIAL 2.1. Revision Summary Revisions to this application specification include: • Updated document to corporate requirements and changed information in tables in Figures 19 and 20 2.2. Customer Assistance Reference Product Base Part Number 6450830 and Product Code H087 are representative of MULTI-BEAM XLE connectors. Use of these numbers will identify the product line and help you to obtain product and tooling information. Such information can be obtained through a local TE Representative, by visiting our website at www.te.com, or by calling PRODUCT INFORMATION or the TOOLING ASSISTANCE CENTER at the numbers at the bottom of page 1. 2.3. Drawings Customer Drawings for product part numbers are available from the service network. If there is a conflict between the information contained in the Customer Drawings and this specification or with any other technical documentation supplied, call PRODUCT INFORMATION at the number at the bottom of page 1. 2.4. Manuals Manual 402-40 can be used as a guide to soldering. This manual provides information on various flux types and characteristics with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 2.5. Specifications Design Objective 108-2292 provides expected product performance and test information. Test Specification 109-11 provides solderability requirements and evaluation methods. Workmanship Specification 101-21 provides solder fillet requirements. 2.6. Instructional Material Instruction Sheets (408-series) provide assembly instructions and Customer Manuals (409-series) provide machine setup and operation procedures. Documents available which pertain to this product are: 408-8883 Rev D1 Seating Tool Assembly 1725769-[ ] 2 of 16 114-13251 2.7. Standards These connectors comply to Electronic Industries Alliance (EIA)-364, “Electrical Connector Test Procedures Including Environmental Classifications”. These connectors are compatible with Military Standard (MIL-STD)-2166, “Connectors, Electrical, Compliant Pin”. 3. REQUIREMENTS 3.1. Safety Do not stack product shipping containers so high that the containers buckle or deform. 3.2. Limitations The connectors are designed to operate in a temperature range of -40° to 125°C [-40° to 257°F]. Voltage ratings for these connectors are based upon a circuit pad diameter of 1.60 ±0.064 [.063 ±.0025] and UL Material Group IIIb. This material group has a comparative tracking index (CTI) of 100< CTI < 175. Voltage ratings according to contact centerline spacing and circuit pad travel are given in Figure 2. For mating parts 2-6450820-5 and 2-6450880-7 (3LP+16S+4LP), the withstanding voltage is 1500VAC between "LP2" and "LP3" when pitch is .240"; the withstanding voltage is 3000VAC between "LP2" and "signal pins of row 1". 3.3. Material The housing is made of glass filled high temperature nylon, UL 94-V-0, with an oxygen index of 49%. The contacts are made of high-conductivity copper alloy underplated with nickel and plated with gold or palladium nickel; solder tines are plated with tin over nickel. Retention clips are made of plated copper alloy. 3.4. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector material. TYPE Signal High Power Low Power MODULE CONTACT CENTERLINE SPACING 2.54 [.100] 5.08 [.200] 6.35 [.250] 7.62 [.300] 9.53 [.375] 2.92 [.115] Within Primary Circuits --60• 200 300 520 MAXIMUM VOLTAGE RATING IN AC (RMS) OR DC Primary to Primary to Within Secondary Circuits Ground Circuits Secondary Circuits ----60• 60• 60• 60• --200 200 --300 300 --520 520 Not Available at Time of Publication of this Document •Safety Extra Low Voltage (SELV) Circuits Figure 2 B. Shelf Life The connectors should remain in the shipping containers until ready for use to prevent deformation to the contacts. The connectors should be used on a first in, first out basis to avoid storage contamination that could adversely affect performance. C. Chemical Exposure Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in the contacts. Alkalies Amines Ammonia Carbonates Citrates Nitrites Phosphates Citrates Sulfur Nitrites Sulfur Compounds Tartrates 3.5. PC Board A. Material and Thickness The pc board material shall be glass epoxy (FR-4 or G-10). The pc board thickness shall be as stated in Figure 3. Rev D1 3 of 16 114-13251 PC BOARD THICKNESS CONNECTOR WITH PRESS-FIT CONTACTS 1.35 [.053] Min CONNECTOR WITH SOLDER TYPE CONTACTS 2.28 ±0.38 [.090 ±.015] Contact Tine Length 3.43 ±0.38 [.135 ±.015] Contact Tine Length 1.40-1.75 [.055-.069] 2.11-2.62 [.083-.103] Figure 3 B. Hole Dimensions and Durability The contact holes must be drilled and plated through to specific dimensions to prevent stubbing during placement of the connector on the pc board and to ensure optimum continuity for circuits after soldering. If applicable, holes for the retention clips or mounting hardware may be used with or without plated through holes. The drilled hole size, plating types, plating thickness, and finished hole size must be as stated to provide unrestricted insertion. See Figure 4. For connectors with press-fit contacts, the pc board holes cannot withstand connector removal more than three times. The radius of any board hole must not increase more than 0.038 mm [.0015 in.] or decrease less than 0.0508 mm [.002 in.]. C. Pads The pc board circuit pads must be solderable in accordance with Test Specification 109-11. D. Layout The holes in the pc board must be precisely located to ensure proper placement and optimum performance of the connector. The pc board layout must be designed using the dimensions provided on the customer drawing for the specific connector. A sample of the recommended pc board layout is shown in Figure 5. CONNECTOR Header and Receptacle PLATING Tin Organic Solderability Preservative (OSP) “B” DIMENSION 0.008(.0003) Min 0.0002-0.0005(.000008-.00002) Figure 4 Rev D1 4 of 16 114-13251 Figure 5 Rev D1 5 of 16 114-13251 E. Spacing Care must be used to avoid interference between adjacent connectors and other components. In addition, space allowed between pc boards for mating of connectors must be considered when determining distance between pc boards. The minimum allowable distance needed between connectors to ensure full mating of connectors and the allowable distance between pc boards with connectors fully mated is provided in Figure 6. Figure 6 Rev D1 6 of 16 114-13251 Allowable Distance Between PC Boards Note: Connectors must be fully mated End View Figure 6 Continued Figure 1 Continued Rev D1 7 of 16 114-13251 3.6. Connector Placement ! CAUTION Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contacts. A. Registration When placing connectors on the pc board, contacts and, if applicable, retention clips or mounting holes must be aligned and started into the matching holes before seating the connector onto the board. B. Insertion Force The force required to seat the connector with press-fit contacts or retention clips onto the pc board can be calculated by: Number of connector press-fit contacts maximum insertion force per contact = insertion force N [lb] Number of connector retention clips maximum insertion force per retention clip = insertion force N [lb] The maximum amount of insertion force per press-fit contact and retention clip is given in Figure 7. MAXIMUM INSERTION FORCE (N [lb]) PER PRESS-FIT POWER CONTACT PER PRESS-FIT SIGNAL CONTACT 890 [200] PER RETENTION CLIP Receptacle and Right-Angle Plug 111 [25] Vertical Plug 178 [40] 27 [6] Figure 7 3.7. Mounting Hardware Connectors with mounting holes can be secured to the pc board before soldering using commercially-available standard screws. The screw size and maximum torque (applied to the mating face of the connector) is provided in Figure 8. NOTE iNOTE Typically, this method of mounting (or hold-down) serves connectors with solder type contacts and without retention clips. SCREW MOUNTING HOLE DIAMETER SIZE HEAD DIAMETER (Maximum) 3.05 [.120] No. 4 6.35mm [.250] MAXIMUM TORQUE Nm [in.-lb] (Applied to Mating Face) 0.57 [5] Figure 8 3.8. Soldering Observe guidelines and procedures when soldering contacts. Contact solder tines must be soldered, cleaned, and dried according to the following: A. Flux Selection Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is compatible with these connectors are provided in Figure 9. FLUX TYPE ACTIVITY RESIDUE RMA Mild Noncorrosive COMMERCIAL DESIGNATION KESTER ALPHA 186 611 Figure 9 KESTER and ALPHA are trademarks of their respective owners. Rev D1 8 of 16 114-13251 B. Process The connectors can be soldered using wave soldering or equivalent soldering techniques. It is recommended using tin or tin-lead solder for these connectors. Refer to Manual 402-40 for soldering guidelines. The temperatures and exposure time shall be as specified in Figure 10. SOLDERING PROCESS TEMPERATURE TIME (At Max Temperature) Wave 265°C [509°F] (Wave Temperature) 10 Seconds Figure 10 C. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other contaminants. Common cleaning solvents that will not the affect connectors for the time and temperature specified are listed in Figure 11. ! ! DANGER Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental effects. Both are carcinogenic (cancer-causing). CAUTION Even when using “no clean” solder paste, it is imperative that the contact interface be kept clean of flux and residue, since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and therefore, cleaning is necessary. CLEANER TYPE TIME (Minutes) TEMPERATURE (Maximum) ALPHA 2110 Aqueous 1 132°C [270°F] BIOACT EC-7 Solvent 5 100°C [212°F] Butyl CARBITOL Solvent 1 Ambient Room Isopropyl Alcohol Solvent KESTER 5778 Aqueous KESTER 5779 Aqueous LONCOTERGE 520 Aqueous 5 100°C [212°F] LONCOTERGE 530 Aqueous Terpene Solvent NAME Figure 11 NOTE iNOTE If a particular solvent that is not listed, contact PRODUCT INFORMATION at the number at the bottom of page 1. D. Drying When drying cleaned connectors and pc boards, make certain that temperature limitations are not exceeded: -55° to 105°C [-68° to 221°F]. Excessive temperatures may cause housing degradation. 3.9. Checking Installed Connector A. With Press-Fit Contacts The entire “eye” of each press-fit contact must be within the pc board hole. All standoffs must be seated on the pc board within the dimension provided in Figure 12. ALPHA, BIOACT, CARBITOL, LONCOTERGE, and KESTER are trademarks of their respective owners. Rev D1 9 of 16 114-13251 B. With Solder Type Contacts All solder joints should conform to those specified in Workmanship Specification 101-21 and all other requirements specified in this document. Solder fillets must be evenly formed around each contact solder tine. There must be no visible skips or voids. All standoffs must be seated on the pc board within the dimension provided in Figure 12. Figure 12 3.10. Connector Mating ! CAUTION 1. Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contacts. 2. Connectors need to fully mated in usage, for de-mating working application, Please contact TE product engineer. A. Polarization For connectors with guides, polarization is provided by matching the guides of mating connectors. For connectors with latch receivers or without guides, polarization is provided by matching the mating alignment keys with the key slots of mating connectors. B. Mating Force The maximum amount of mating force per contact is given in Figure 13. CONTACT MAXIMUM MATING FORCE PER CONTACT (N [oz-force]) High Power 5 [17.98] Low Power 1 [3.60] Signal 1.7 [6.11] Figure 13 C. Mating Length Contact mating lengths available for the connectors are listed in Figure 14. Rev D1 10 of 16 114-13251 CONTACT MATING LENGTH CONNECTOR High Power Contact Low Power Contact Signal Contact Receptacle Standard and MFBL (Pre-Mate) Standard Standard Plug Standard Standard, MFBL, and MLBF (Post Mate) Standard and MLBF Figure 14 D. Wipe Length Wipe length for these connectors is defined as that portion (length) of the mating contacts that touches (wipes) from the point of engagement to the point of being fully mated. The wipe length depends on the contact (power or signal) and mating length (standard, MFBL, or MLBF) of each individual contact. The minimum wipe length at the level of mating for power and signal contacts is listed in Figure 15. CONTACT High Power Low Power Signal with 3.43 [.135] Solder Tine Signal MATING LENGTH MATING LEVEL WIPE LENGTH (Min) MFBL (Pre-Mate) 1 5.08 [.200] Standard 2 3.81 [.150] MFBL (Pre-Mate) 2 3.81 [.150] Standard 3 2.79 [.110] MLBF (Post Mate) 4 1.27 [.050] MFBL (Pre-Mate) 1 5.08 [.200] Standard 2 3.81 [.150] MLBF (Post Mate) 3 2.54 [.100] Figure 15 E. Sequencing The connectors provide sequencing among contacts with 3 mating levels. The offset distance, measured from the receptacle mating face to the plug mating face at the point of electrical engagement, depends on the contact (power or signal) and mating length (standard, MFBL, or MLBF) of the mating connectors. The offset distance at the level of mating for power and signal contacts is listed in Figure 16. Rev D1 11 of 16 114-13251 CONTACT High Power Low Power Signal with 3.43 [.135] Solder Tine Signal MATING LENGTH MATING LEVEL MFBL (Pre-Mate) OFFSET DISTANCE Dimension Nominal 1 A 6.15 [.242] Standard 2 B 5.18 [.204] MFBL (Pre-Mate) 2 B 5.18 [.204] Standard 3 C 4.04 [.159] MLBF (Post Mate) 4 D 2.46 [.097] MFBL (Pre-Mate) 1 E 5.99 [.236] Standard 2 F 4.72 [.186] MLBF (Post Mate) 3 G 3.45 [.136] Figure 16 Rev D1 12 of 16 114-13251 F. Misalignment When mating connectors, side-to-side and up-and-down misalignment is allowed to the dimensions given in Figure 17. There is no misalignment for connectors with latch receivers. NOTE iNOTE Connectors with guides should be used in applications requiring blind mating. Connectors with latch receivers and connectors without guides should not be used in applications requiring blind mating. Figure 17 3.11. Circuit Testing Unmated receptacles and mated plugs must be tested against hazardous voltages using the test probe specified in UL 1950. Specific areas of the connector must be tested as indicated in Figure 18. Figure 18 (Cont’d) Rev D1 13 of 16 114-13251 AREA TO BE TESTED CONNECTOR Mated Plug Unmated Receptacle Contact Cavities Convection Windows Cored Lances Vertical Receptacle T T T Right-Angle Receptacle T T T Vertical Plug --- T T Right-Angle Plug --- --- T Figure 18 (End) 3.12. Connector Unmating The minimum amount of unmating force per contact is given in Figure 19. CONTACT MINIMUM UNMATING FORCE PER CONTACT (N [oz]) High Power 2.22 [8] Low Power 0.50 [1.8] Signal 0.20 [.72] Figure 19 3.13. Connector Removal A. Solder Type Contacts Connectors with solder type contacts must be removed from the pc board by standard de-soldering methods. After removal from the board, the connector MUST NOT be re-used. B. Press-Fit Contacts Connectors with press-fit contacts must be removed from the pc board using a push bar (or flat rock) and pc board support. ! CAUTION For repairability, the tips of the contacts must extend below the surface of the pc board by at least 1.02 mm [.040 in.]; if not, the connector MUST NOT be removed from the pc board. C. Retention Force The force retaining the connector with press-fit contacts or retention clips on the pc board can be calculated by: Number of connector press-fit contacts minimum retention force per contact = retention force N [lb] Number of connector retention clips minimum retention force per retention clip = retention force N [lb] The minimum amount of retention force per press-fit contact and retention clip is given in Figure 20. MINIMUM RETENTION FORCE (N [lb]) PER PRESS-FIT HIGH POWER CONTACT 53.6[12] PER PRESS-FIT LOW POWER CONTACT 26.8 [6] PER PRESS-FIT SIGNAL CONTACT PER RETENTION CLIP 6.7 [1.5] 13.3 [3] Figure 20 3.14. Repair These connectors are not repairable. Damaged or defective connectors must not be used. 4. QUALIFICATION No qualifying support for MULTI-BEAM XLE connectors was defined at the time of publication of this document. Rev D1 14 of 16 114-13251 5. TOOLING 5.1. Connectors with Solder Type Contacts No tooling is required for placement of the connectors with solder type contacts onto the pc board. 5.2. Vertical Plugs with Press-Fit Contacts Tooling for seating vertical plugs having press-fit contacts is available. A pc board support and application tooling (such as an arbor press) that provides sufficient amount of downward force to insert the contacts into the pc board holes must be used with the seating tool. Part numbers and instructional material packaged with the seating tooling are given in Figure 21. 5.3. Receptacles and Right-Angle Plugs with Press-Fit Contacts A. Application Tooling The application tooling (such as an arbor press) used to seat these connectors must provide sufficient amount of downward force to insert the contacts into the pc board holes. B. PC Board Support A pc board support must be used to prevent bowing of the pc board during the placement of these connectors on the board. The board support must have a flat surface with holes or a channel large enough and deep enough to receive any protruding components. The pc board must be secured to the board support to prevent movement of the board during seating. Refer to Figure 21. The board support must also be used when removing these connectors from the pc board. C. Flat Rock Tooling Commercially available bar stock (flat rock tooling) with a flat surface large enough to cover all contacts must be used with the application tooling to seat these connectors. For vertical receptacles with guides, the flat rock tooling must be sized to fit between the guides. For removing these connectors from the pc board, it is suggested that the pc board be supported from the connector side and that the connector be removed using flat rock tooling. Figure 21 Rev D1 15 of 16 114-13251 6. VISUAL AID The illustration below shows a typical application of this product. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. FIGURE 22. VISUAL AID Rev D1 16 of 16