108-2123
Product
Specification
14Dec04 Rev A
EC 0990-1567-04
DDR2 Press-Fit Tail DIMM Socket
1.
SCOPE
1.1.
Content
This specification covers performance, tests and quality requirements for the Tyco Electronics Double
Data Rate 2 (DDR2) Press-Fit Tail Dual In-line Memory Module (DIMM) socket used to connect modules
to mother boards.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was completed on 12Nov04. The
Qualification Test Report number for this testing is 501-592. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless otherwise
specified, the latest edition of the document applies. In the event of conflict between the requirements of
this specification and the product drawing, the product drawing shall take precedence. In the event of
conflict between the requirements of this specification and the referenced documents, this specification
shall take precedence.
2.1.
Tyco Electronics Documents
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2.2.
109 Series:
Test Specifications as indicated in Figure 1
109-197: AMP Test Specifications vs EIA and IEC Test Methods
114-13094:
Application Specification
501-592: Qualification Test Report
Commercial Standards
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EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
EIA-364-1000.01:
Environmental Test Methodology for Assessing the Performance of
Electrical Connectors and Sockets Used in Business Office Applications
3.
REQUIREMENTS
3.1.
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable product drawing.
©2004 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
* Trademark
| Indicates change
For latest revision call AMP FAX*/Product Info number 1-800-522-6752.
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For Regional Customer Service, visit our website at www.tycoelectronics.com
LOC B
108-2123
3.3.
Ratings
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3.4.
Voltage: 25 volts AC
Current: Signal application only
Temperature: -55 to 105/C
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per EIA-364.
3.5.
Test Requirements and Procedures Summary
Test Description
Requirement
Procedure
Initial examination of product.
Meets requirements of product
drawing.
EIA-364-18.
Visual and dimensional (C of C)
inspection per product drawing.
Final examination of product.
Meets visual requirements.
EIA-364-18.
Visual inspection.
CTF dimensional verification.
See Figure 3.
Measure specimens.
ELECTRICAL
Low level contact resistance.
30 milliohms maximum initial.
EIA-364-23.
Subject specimens mated with
bussed module boards to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
See Figure 4.
Insulation resistance.
1 megohm minimum.
EIA-364-21.
Test between adjacent contacts of
unmated specimens.
Withstanding voltage.
1 minute hold with no breakdown or EIA-364-20,
flashover.
Condition I.
500 volts AC at sea level.
Test between adjacent contacts of
unmated specimens.
Current carrying capacity.
Less than 30/C temperature rise.
)R ± 20 milliohms maximum.
EIA 364-70.
Connect 10 consecutive contacts
on 1 side of the specimen in series
and load with 0.5 ampere. Place a
thermocouple through a small hole
in the housing as close to the
contacts as possible.
MECHANICAL
Reseating.
See Note.
Manually unplug and plug module
card 3 times.
Figure 1 (cont)
Rev A
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108-2123
Test Description
Requirement
Procedure
Vibration, random.
No discontinuities of 1 microsecond EIA-364-28.
or longer duration.
Module weight shall be 35 ± 5 g
See Note.
[1.23 ± .18 oz] with the center of
gravity located 20 to 25 mm [.787 to
.984 in] from the module mating
edge.
Subject 5 continuity and termination
resistance specimens to 3.13 G's
rms between 5-500 Hz, 10 minutes
per axis (PSD 0.01 G2/Hz at 5 Hz,
and 0.02 G2/Hz at 20 and 500 Hz).
See Figure 5
Mechanical shock.
No discontinuities of 1 microsecond EIA-364-27.
or longer duration.
Module weight shall be 35 ± 5 g
See Note.
[1.23 ± .18 oz] with the center of
gravity located 20 to 25 mm [.787 to
.984 in] from the module mating
edge.
Subject 5 continuity and termination
resistance specimens to 50 G's
trapezoidal shock pulses of 11
milliseconds duration. 3 shocks in
each of 3 mutually perpendicular
planes, 18 total shocks. 4.83 m
[190 in] per second velocity change
nominal, 4.32 m [170 in] per second
minimum. 1 ms rise and fall times, 9
ms peak duration.
See Figure 5.
Durability.
Rating of 25 cycles as determined
by EIA-TS-364-1000.1
See Note.
EIA-364-9.
Mate and unmate specimens for 20
cycles at a maximum rate of 500
cycles per hour. Use the same
module card for the 1st and 20th
cycles and subsequent tests. Use a
separate module card for the 2nd
through 19th cycles.
Mating force.
Total force less than 155.7 N
[35.003 lbf] with latches at
maximum module thickness (1.37
+0/-.0.05 mm [.054 +0/-.002 in]).
See Note.
EIA-364-05.
Measure force necessary to mate
specimens with a 1.37 mm [.054 in]
steel gage at a maximum rate of 5
mm [.2 in] per minute without
preconditioning.
See Figure 6.
Unmating force.
38.25 N [8.599 lbf] maximum per
ejector.
See Note.
EIA-364-13.
Measure force necessary to
unmate specimens from a 1.37 mm
[.054 in] steel gage at a maximum
rate of 5 mm [.2 in] per minute.
See Figure 6.
Figure 1 (cont)
Rev A
3 of 10
108-2123
Test Description
Requirement
Procedure
Unmating force per pin pair.
0.14 N [14 gf] minimum average.
EIA-364-13.
With both latches removed,
measure force necessary to
unmate specimens from a standard
1.27 mm [.050 in] thick module card
at a maximum rate of 5 mm [.2 in]
per minute.
See Figure 6.
Contact retention.
Less than 0.381 mm [.015 in]
movement with 2.94 N [.661 lbf]
load per contact.
EIA-364-29.
Apply specified load to pull tail at a
rate of 2.54 mm [.1 in] per minute
and hold for 6 seconds.
Plating thickness.
30 :in minimum gold at contact
point.
EIA-364-48,
Method C.
Maximum force on connector.
Less than 0.076 mm [.003 in]
movement.
Apply 68.1 kg [150 lb] to the top of
a 1.37 mm [.054 in] steel gage after
the gage has been fully seated and
is bottomed out. Maintain force for
30 seconds.
See Figure 6.
Contact backout wipe.
No discontinuity.
Fully seat daisy chain module. Pull
module upward until stopped by
latches while monitoring for
discontinuities.
Press-fit compliant pin/terminal
insertion.
31 N [7 lbf] maximum per pin
average.
AMP Spec 109-41
Measure force necessary to
correctly apply a connector
assembly to a printed circuit board
at a maximum rate of 12.7 mm [.5
in] per minute.
Press-fit compliant pin/terminal
retention.
13.7 N [3 lbf] minimum.
See Note.
AMP Spec 109-30
Apply specified load to a single pin
for 6 seconds in a correctly applied
connector assembly from its printed
circuit board hole at a maximum
rate of 12.7 mm [.5 in] per minute.
ENVIRONMENTAL
Solvent resistance.
See Note.
EIA 364-11.
Thermal shock.
See Note.
EIA-364-32, Test Condition I.
Subject specimens to 10 cycles
between -55 and 85/C.
Humidity-temperature cycling.
See Note.
EIA-364-31, Method III.
Subject specimens to 24 cycles (3
days) between 25/C at 80% RH
and 65/C at 50% RH. Ramp times
shall be .5 hour and dwell times 1
hour.
Figure 1 (cont)
Rev A
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108-2123
Test Description
Requirement
Procedure
Temperature life.
See Note.
EIA-364-17, Method A, Test
Condition 4, Test Time Condition C.
Subject mated specimens to 105/C
for 240 hours.
Thermal disturbance.
See Note.
Subject mated specimens to 10
cycles between 15 ± 3/C and 85 ±
3/C. Ramps shall be a minimum of
2/C per minute. Dwell times shall
ensure that the contacts reach the
temperature extreme (5 minutes
minimum). Humidity is not
controlled.
Mixed flowing gas.
See Note.
EIA-364-65, Class IIA (4 gas).
Three specimens unmated for 5
days, mated for 5 days. Three
specimens mated for 10 days.
Store module cards at ambient
during unmated exposure.
Porosity.
Maximum of 1 pore 0.051 mm [.002 EIA-364-53.
in] maximum diameter per 10
Nitric acid.
random contacts per specimen.
NOTE
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
Figure 1 (end)
Rev A
5 of 10
108-2123
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
1
2
3
4
5
6
7
1
1
9
10
1
1
Test Sequence (b)
Initial examination of product
1
1
1
CTF dimensional verification
2
2
2
Low level contact resistance
3,7,9
3,8,10,14
3,5,7,9
Insulation resistance
4,11
Withstanding voltage
5,12
1
1
2
2,5,7,9,11
Current carrying capacity
3
Mutual inductance between adjacent signals (L12)
Coupling capacitance between adjacent signals (C12)
Reseating
8
13
10
Vibration, random
6
Mechanical shock
8
Durability
5(c)
6(c)
4
3(c)
Mating force
2
Unmating force
3
Unmating force per pin pair
3
Contact retention
2
Plating thickness
2
Maximum force on connector
Contact backout wipe
4
4
Press-fit compliant pin/terminal insertion
2
Press-fit compliant pin/terminal retention
4
Solvent resistance
3
Thermal shock
7
Humidity-temperature cycling
Temperature life
9
6
4(d)
Thermal disturbance
8
Mixed flowing gas
6
Porosity
3
Final examination of product
NOTE
(a)
(b)
(c)
(d)
10
15
10
12
5
4
4
4
5
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Durability preconditioning only 5 cycles required same card, all cycles.
Temperature life preconditioning only 120 hours.
Figure 2
Rev A
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108-2123
4.
QUALITY ASSURANCE PROVISIONS
4.1.
Qualification Testing
A.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test groups 1, 2, 3, 5, 6, 9 and 10 shall each consist
of 5 specimens. Test group 4 shall each consist of 6 specimens. Test group 7 shall consist of 4
specimens.
B.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
4.2.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
4.3.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
4.4.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing and
this specification.
Rev A
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108-2123
Figure 3
CTF Dimensional Verification
Rev A
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Figure 4
Low Level Contact Resistance Measurement Points
Figure 5
Vibration and Mechanical Shock Fixturing
Rev A
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Figure 6
Steel Gage
Rev A
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