V
Contact pin base material change from CuSn (Phosphor bronze)to CuZn
(Brass). Plating change from min. 0.8microns gold plating to min. 0.7
microns Pd Ni + 0.1 microns gold flash at contact area (Area F).
24JUN
2014
TJ
JK
MATING SIDE: MIN 0.7µm PdNi + 0.1µm GOLD FLASH.
SOLDER SIDE: MIN 2.5µm TIN OVER 1.27µm NICKEL.
Cu Zn
108-18012
AMPMODU II PIN HEADER, 90DEGREE,
SINGLE ROW
V
很抱歉，暂时无法提供与“825437-8”相匹配的价格&库存，您可以联系我们找货
免费人工找货- 国内价格 香港价格
- 1+18.227491+2.33910
- 10+15.2336010+1.95490
- 25+13.7366625+1.76280
- 50+12.9441650+1.66110
- 80+12.5038880+1.60460
- 100+12.15166100+1.55940
- 250+11.09500250+1.42380
- 500+10.30250500+1.32210
- 1250+9.157781250+1.17520
- 国内价格
- 150+13.38711
- 300+13.10122
- 550+12.82776
- 1100+12.69103
