827881-2

827881-2 PCB Mount Header, Vertical, Board-to-Board, 26 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, AMPMODU Headers 827881-2  ACTIVE AMPMODU | AMPMODU Headers TE Internal #: 827881-2 PCB Mount Header, Vertical, Board-to-Board, 26 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, AMPMODU Headers View on TE.com > Connectors > PCB Connectors > PCB Headers & Receptacles PCB Connector Assembly Type: PCB Mount Header PCB Mount Orientation: Vertical Connector System: Board-to-Board Number of Positions: 26 Number of Rows: 2 Features Product Type Features PCB Connector Assembly Type PCB Mount Header Connector System Board-to-Board Header Type Fully Shrouded Connector & Contact Terminates To Printed Circuit Board Configuration Features Connector Contact Load Condition Fully Loaded PCB Mount Orientation Vertical Number of Positions 26 Number of Rows 2 Board-to-Board Configuration Parallel Body Features Primary Product Color Natural Contact Features  Mating Square Post Dimension .63 mm[.025 in] PCB Contact Termination Area Plating Material Tin Contact Mating Area Plating Material Tin Contact Type Pin Contact Current Rating (Max) 3A Termination Features For support call+1 800 522 6752 01/02/2024 11:26PM | Page 1 827881-2 PCB Mount Header, Vertical, Board-to-Board, 26 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, AMPMODU Headers Termination Features Square Termination Post & Tail Dimension .63 mm[.025 in] Termination Method to Printed Circuit Board Through Hole - Solder Mechanical Attachment Mating Retention With Mating Retention Type Detent Latching Mating Alignment With Mating Alignment Type Polarization PCB Mount Retention Without PCB Mount Alignment Without Connector Mounting Type Board Mount Housing Features Centerline (Pitch) 2.54 mm[.1 in] Housing Material Polyamide 6.6 GF Dimensions Row-to-Row Spacing 2.54 mm[.1 in] PCB Thickness (Recommended) 1.57 mm[.062 in] Usage Conditions Operating Temperature Range -65 – 105 °C[-85 – 221 °F] Operation/Application Circuit Application Signal Industry Standards UL Flammability Rating UL 94V-0 Packaging Features Packaging Quantity 200 Packaging Type Carton Product Compliance For compliance documentation, visit the product page on TE.com>  EU RoHS Directive 2011/65/EU Compliant EU ELV Directive 2000/53/EC Compliant China RoHS 2 Directive MIIT Order No 32, 2016 No Restricted Materials Above Threshold EU800 REACH Regulation (EC) No. 1907/2006 For support call+1 522 6752 Current ECHA Candidate List: JUNE 2023 11:26PM | Page 2 01/02/2024 827881-2 PCB Mount Header, Vertical, Board-to-Board, 26 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, AMPMODU Headers China RoHS 2 Directive MIIT Order No 32, 2016 No Restricted Materials Above Threshold EU REACH Regulation (EC) No. 1907/2006 Current ECHA Candidate List: JUNE 2023 (235) Candidate List Declared Against: JUNE 2023 (235) Does not contain REACH SVHC Halogen Content Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free Solder Process Capability Wave solder capable to 240°C Product Compliance Disclaimer This information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledge based on the information they provided. This information is subject to change. The part numbers that TE has identified as EU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment products will be CE marked as required by Directive 2011/65/EU. Components may not be CE marked. Additionally, the part numbers that TE has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulation, the information TE provides on SVHC in articles for this part number is based on the latest European Chemicals Agency (ECHA) ‘Guidance on requirements for substances in articles’ posted at this URL: https://echa.europa.eu/guidance-documents/guidance-onreach Compatible Parts TE Part # 926635-1 TE Part # 927690-1 TE Part # 927689-1 TE Part # 926630-1 LOCKING SLIDE 2X13P MOD4 BU GEH 26P MOD4 ABDECKKAPP RELEASE LEVER Also in the Series AMPMODU Headers Connector Caps & Covers(1)  For support call+1 800 522 6752 Connector Contacts(64) Connector Hardware(2) PCB Headers & Receptacles(4681) 01/02/2024 11:26PM | Page 3 827881-2 PCB Mount Header, Vertical, Board-to-Board, 26 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, AMPMODU Headers Wire-to-Board Connector Assemblies & Housings(5) Customers Also Bought TE Part #163083-1 TE Part #828922-1 TE Part #927689-1 TE Part #1624337-1 .062 DIA SOC ASS 3+ 2,5MM CAVITY PLUG FOR 5,4MM DI 26P MOD4 ABDECKKAPP LT73 3000 2A 3K0 5% 4KRL TE Part #965099-1 TE Part #965100-1 CPC KUPPLUNGSRING CPC STAUBKAPPE F14P Documents Product Drawings 2X13P MOD2 ST-STECK English CAD Files 3D PDF English Customer View Model ENG_CVM_827881-2_P1.2d_dxf.zip English Customer View Model ENG_CVM_827881-2_P1.3d_igs.zip English Customer View Model ENG_CVM_827881-2_P1.3d_stp.zip English By downloading the CAD file I accept and agree to the Terms and Conditions of use.  For support call+1 800 522 6752 01/02/2024 11:26PM | Page 4 827881-2 PCB Mount Header, Vertical, Board-to-Board, 26 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, AMPMODU Headers Datasheets & Catalog Pages AMPMODU Interconnetion System AMPMODU Interconnetion System English  For support call+1 800 522 6752 01/02/2024 11:26PM | Page 5