9-6437275-6

Product Specification 108-9039 22Apr 2016 Rev M Connector, Standard Edge 1. SCOPE 1.1. Content This specification covers perform ance, tests and quality requirem ents for the TE Connectivity (TE) Standard Edge connector. This connector is a m ulti-contact, edge board type assem bly having contacts of various lengths for plug-on, wrap or solder applications. 1.2. Qualification W hen tests are perform ed on subject product line, procedures specified in 109 Series Test Specifications shall be used. All inspections shall be perform ed using the applicable inspection plan and product drawing. 2. APPLICABLE DOCUM ENTS The following docum ents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the docum ent applies. In the event of conflict between the requirem ents of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirem ents of this specification the and referenced docum ents, this specification shall take precedence. 2.1. TE Docum ents ! ! ! 2.2. 109-1: General Requirem ents for Test Specifications 109 Series: Test Specifications as indicated in Figure 1 501-227: Qualification Test Report Military Standard MIL-STD-275: Printed W iring for Electronic Equipm ent 3. REQUIREM ENTS 3.1. Design and Construction Product shall be of the design, construction and physical dim ensions specified on the applicable product drawing. 3.2. Materials ! ! 3.3. Contact: Phosphor bronze, gold plating Housing: Polyester Ratings ! ! Voltage: 400 volts (rm s) at sea level Current: ! Tem perature: -55 to 85°C ©2011 Tyco Electronics Corporation, | Indicates change a TE Connectivity Ltd. Company *Trademark All Rights Reserved TE logo is a trademark. For latest revision, visit our website at www.te.com/documents. For Regional Customer Service, visit our website at www.te.com Other products, logos, and company names might be trademarks of their respective owners. 1 of 7 LOC B 108-9039 3.4. Perform ance and Test Description Product is designed to m eet the electrical, m echanical and environm ental perform ance requirem ents specified in Figure 1. All tests are perform ed at am bient tem perature unless otherwise specified. 3.5. Test Requirem ents and Procedures Sum m ary Test Description Requirem ent Procedure Exam ination of product. Meets requirem ents of product drawing. Visual, dim ensional and functional per applicable quality inspection plan. Term ination resistance, dry circuit. 10 m illiohm s m axim um . TE Spec 109-6-1. Subject m ated contacts assem bled in housing to 50 m v open circuit at 100 m a m axim um . See Figure 3. Dielectric withstanding voltage. Test Voltage Centerline RMS Spacing 1000 .100 1500 .125 5 m illiam peres m axim um leakage. TE Spec 109-29-1. Test between adjacent contacts of unm ated connector assem blies. Insulation resistance. 5000 m egohm s m inim um . TE Spec 109-28-4. Test between adjacent contacts of unm ated connector assem blies. MECHANICAL Vibration, random . No discontinuities greater than 1 m icrosecond. TE Spec 109-21-5, Condition C. Subject m ated connectors to 9 G's rm s for 3 m inutes. See Figure 4. Physical shock. No discontinuities greater than 1 m icrosecond. TE Spec 109-26-1. Subject m ated connectors to 50 G's half-sine shock pulses of 11 m illiseconds duration. 3 shocks in each direction applied along 3 m utually perpendicular planes, 18 total shocks. See Figure 4. Mating force. 19 ounces m axim um per contact pair. TE Spec 109-42, Condition A. Measure force necessary to m ate connector with daughter card from point of initial contact using free floating fixtures at a rate of .5 inch per m inute. Calculate force per contact. Unm ating force. 1.25 ounces m inim um per contact pair. TE Spec 109-42, Condition A. Measure force necessary to unm ate assem blies at a rate of .5 inch per m inute. Calculate force per contact. Figure 1 (continued) Rev M 2 of 7 108-9039 Test Description Requirem ent Procedure Contact retention. Contact shall not dislodge from norm al locking position. TE Spec 109-30. Apply axial load of 8 pounds to contacts. Durability. See Note. TE Spec 109-27. Mate and unm ate connector assem blies using daughter card for 250 cycles for 30 m in gold plating and 100 cycles for 15 m in gold plating at m axim um rate of 500 cycles per hour. See Figure 5. ENVIRONMENTAL Therm al shock. See Note. TE Spec 109-22. Subject unm ated connectors to 5 cycles between -55 and 85°C. Hum idity, steady state. See Note. TE Spec 109-23-2. Subject unm ated connectors to steady state hum idity at 40°C and 90-95% RH for 4 days. Mixed flowing gas. See Note. TE Spec 109-85-2. Subject m ated connectors to environm ental class II for 14 days. Tem perature life. See Note. TE Spec 109-43. Subject m ated connectors to tem perature life at 85°C for 500 hours. NOTE Shall meet visual requirements, show no physical damage and shall meet requirements of additional tests as specified in Test Sequence in Figure 2. Figure 1 (end) Rev M 3 of 7 108-9039 3.6. Connector Qualification and Requalification Tests and Sequences Test Group (a) Test or Exam ination 1 2 3 4 Test Sequence (b) Exam ination of product 1,9 1,5 1,5 Term ination resistance, dry circuit 3,7 2,4 2,4 Dielectric withstanding voltage 4,8 Insulation resistance 3,7 Vibration 5 Physical shock 6 Mating force 2 Unm ating force 8 Contact retention 2 Durability 4 Therm al shock 5 Hum idity, steady state 6 Mixed flowing gas 3(c) Tem perature life NOTE (a) (b) (c) 1,9 3(c) See paragraph 4.1.A. Numbers indicate sequence in which tests are performed. Precondition with 5 cycles durability. Figure 2 Rev M 4 of 7 108-9039 4. QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Sam ple Selection Connector housings and contacts shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. All test groups shall consist of 10 connectors of greatest num ber of positions available. 5 connectors from each of 2 different plating configurations. Test groups 1, 2 and 3 shall be soldered to printed circuit boards. W here individual contact m easurem ents are required, a m inim um of 30 random ly selected contacts distributed am ong the 5 connectors shall be m easured. B. Test Sequence Qualification inspection shall be verified by testing sam ples as specified in Figure 2. 4.2. Requalification Testing If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process, product assurance shall coordinate requalification testing, consisting of all or part of the original testing sequence as determ ined by developm ent/product, quality and reliability engineering. 4.3. Acceptance Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. W hen product failure occurs, corrective action shall be taken and sam ples resubm itted for qualification. Testing to confirm corrective action is required before resubm ittal. 4.4. Quality Conform ance Inspection The applicable quality inspection plan will specify the sam pling acceptable quality level to be used. Dim ensional and functional requirem ents shall be in accordance with the applicable product drawing and this specification. Rev M 5 of 7 108-9039 Figure 3 Term ination Resistance Measurem ent Points Figure 4 Vibration & Physical Shock Rev M 6 of 7 108-9039 NOTE (1) (2) (3) (4) (5) (6) (7) (8) Connector Contact Spacing A BSC Dim ension B Dim ension .100 .100 .052 .125 .125 .078 Dimensions are in inches. Unless otherwise specified, tolerance is ±.005. Test card shall extend 4.00 ±.02 from receptacle after insertion. See Figure 3. Number of contacts shall be same as on corresponding printed wiring connector. Printed circuit test board shall be 2 ounces copper and gold over nickel plating per MIL-STD-275. Dimension shall be minimum connector card slot length minus .008. Conductor configuration optional beyond card slot depth. Printed wiring shall be identical on both sides. Figure 5 Printed Circuit Board Rev M 7 of 7