CRGP2010F100K

SMD Precision Pulse Thick Film Chip Resistor Type CRGP Series Key Features Small size and light weight Suitable for both wave and reflow soldering techniques Supplied on tape Pulse Rated 7 different package sizes Terminal finish matte Sn over Ni TE Connectivity is pleased to introduce this SMD Pulse withstand thick film Chip resistor, suitable for auto placement in volume and for most applications. Available in five different packages and supplied on tape and reel for automatic insertion processes. Standard values – E24 Series Characteristics – Electrical Type Power Rating @ 70°C Max. Working Voltage Max. Overload Voltage Dielectric Withstand Temperature Range Ambient Temperature Type Power Rating @ 70°C Max. Working Voltage Max. Overload Voltage Dielectric Withstand Temperature Range Ambient Temperature 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified CRGP0402 0.125W 50V 100V 100V CRGP1210 0.75W 200V 500V 500V CRGP0603 CRGP0805 0.25W 0.33W 50V 150V 100V 300V 300V 500V -55°C ~ +155°C 70°C CRGP1206 0.5W 200V 400V 500V CRGP2010 CRGP2512 1.25W 2W 400V 500V 800V 1000V 500V 500V -55°C ~ +155°C 70°C Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Power derating curve Power rating based on continuous load operation in ambient temperature of 70°C. For resistors operated in ambient temperatures above 70°C, power rating must be derated in accordance with this curve. Dimensions: Type CRGP0402 CRGP0603 CRGP0805 L 1.10±0.10 1.60±0.10 2.00±0.15 CRGP1206 3.10±0.15 CRGP1210 CRGP2010 CRGP2512 3.10±0.10 5.00±0.10 6.35±0.10 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimension (mm) W H ℓ 0.50±0.05 0.35±0.05 0.20±0.10 0.80±0.10 0.45±0.10 0.30±0.20 1.25+0.15 0.55±0.10 0.40±0.20 -0.10 1.55+0.15 0.55±0.10 0.45±0.20 -0.10 2.60±0.20 0.55±0.10 0.55±0.25 2.50±0.20 0.55±0.10 0.60±0.25 3.20±0.20 0.55±0.10 0.60±0.25 Dimensions Shown for reference purposes only. Specifications subject to change ℓ 0.25±0.10 0.30±0.20 0.40±0.20 0.45±0.20 0.50±0.20 0.50±0.20 0.50±0.20 For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Construction: Power Rating and Resistance Range: Type Power Rating @ 70°C Tolerance Resistance Range CRGP0402 0.125W ±1% ±5% 1R0 – 10M CRGP0603 0.25W ±1% ±5% 1R0 – 10M CRGP0805 0.33W ±1% ±5% 1R0 – 10M CRGP1206 0.5W ±1% ±5% 1R0 – 10M CRGP1210 0.75W ±1% ±5% 1R0 – 10M CRGP2010 1.25W ±1% ±5% 1R0 – 10M CRGP2512 2W ±1% ±5% 1R0 – 10M Standard Series E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation Marking: E24 series 0603 – 2512 3 Digits – first two digits denote significant figures of resistance and third digit denotes number of zeros thereafter. EG 222 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified = Dimensions Shown for reference purposes only. Specifications subject to change 2K2 For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Marking for E96 Series 0805 – 2512 4 digits – First three digits denote significant figures of resistance and fourth digit denotes number of zeros thereafter. EG. 1000 For oh i alues elo = 100R R letter R de otes de i al poi t. EG 1R80 = R8 / .8Ω 0402 size chips are not marked 0603 E96 3 digit marking. 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor  Marking for E96 series 0603 size with no marking code marked as per E24 values. Pulse withstand capacity The single impulse graph is the result of 50 impulses of rectangular shape applied at one-minute intervals. The limit of acceptance was a shift in resistance of less than 1% from the initial value. The power applied was subject to the restrictions of the maximum permissible impulse voltage graph shown. 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Performance Specification: Characteristic Limits Test Methods (JIS C 5201-1) Temperature Coefficient ±100PPM/°C *0402: Ω- Ω : ± PPM/℃ ΩΩ : ± 200 PPM/℃ > Ω:± PPM/℃ Short term overload Resistance change rate is ± % : ± . % ± . Ω Max. ± % : ± . % ± . Ω Max. Terminal Bending ± Natural resistance change per temp. degree centigrade R1-R2 --------- x ⁶ PPM/°C R1(t2-t1) R1 resistance value at room temperature (t1) R2 Resistance value at room temperature +100°C (t2) (Sub-clause 4.8) Permanent resistance change after the application of a potential of 2.5 times RCWV for 5 seconds Sub-clause 4.13 Twist of Test Board : Y/X = 5/90 mm for 10 seconds (Sub-clause 4.33) Apply 500V DC between protective coating and termination for 1 min, then measure (Sub-clause 5.6) Apply 500V AC between protective coating and termination for 1 minute (Sub-clause 4.7) Dip the resistor into a solder bath having a temperature of 260°C±3°C and hold it for 10±1 seconds (Sub-clause 4.18) Test temperature of solder : 245 ± 3 ℃ Dwell time in solder : 2 ~ 3 seconds (Sub-clause 4.17) Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec. Peak temp.: 260 ℃ Insulation Resistance . %± . , MΩ or Ω Max. ore Dielectric Withstand Voltage Soldering Heat No evidence of flashover, mechanical damage, arcing or insulation breakdown. Resistance change rate is ± . %+ . Ω Max. Solderability 95% coverage Min. Solder Temp. Reference Electrical characteristics shall be satisfied without distinct deformation in appearance. (95% coverage Min.) Hand Soldering 300°C 5 seconds 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Performance Specification (continued) Characteristic Limits Temperature Cycling Resistance change rate is: ±5%: ± %± . Ω Max. ± %: ± . %± . Ω Max. Humidity Resistance change rate is: ± . % + . Ω Max. Load Life In Humidity Resistance change rate is: ± % : ± . % ± . Ω Max. ± % : ± . % ± . Ω Max. Load Life Resistance change rate is: ± % : ± . % ± . Ω Max. ± % : ± . % ± . Ω Max. Test Methods (JIS C 5201-1) Resistance change after continuous 5 cycles for duty specified below: Step Temperature Time 1 -55°C±3°C 30 mins. 2 Room Temp. 10~15 mins. 3 +155°C±2°C 30 mins. 4 Room Temp. 10~15 mins. (Sub-clause 4.19) Temporary resistance change after 240 hours exposure in a humidity test chamber controlled at 40±2°C and 9095% relative humidity (Sub-clause 4.24) Resistance change after 1,000 hours (1.5 hours "on", 0.5 hour "off") at RCWV in a humidity chamber controlled at 40℃ ± 2℃ and 90 to 95 % relative humidity. (Sub-clause 4.24.2.1) Permanent resistance change after 1,000 hours operating at RCWV, with duty cycle of (1.5 hours "on", 0.5 hour "off") at 70℃ ± 2℃ ambient (Sub-clause 4.25.1 Packaging Specification Paper taping Type 0402 0603 0805 1206 1210 9-1773463-9 CIS WR 03/2018 A± 0.2 0.65 1.10 1.65 2.00 2.80 B± 0.2 1.15 1.90 2.40 3.60 3.50 Dimensions in millimetres unless otherwise specified C± 0.05 2.0 2.0 2.0 2.0 2.0 ØD +0.1 -0 1.5 1.5 1.5 1.5 1.5 E± 0.1 1.75 1.75 1.75 1.75 1.75 Dimensions Shown for reference purposes only. Specifications subject to change F± 0.05 3.5 3.5 3.5 3.5 3.5 G± 0.1 4.0 4.0 4.0 4.0 4.0 W± 0.2 8.0 8.0 8.0 8.0 8.0 T± 0.1 0.45 0.67 0.81 0.81 0.75 For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Embossed Taping Type A ±0.2 B ±0.2 C ±0.05 2010 2512 2.90 3.50 5.60 6.70 2.0 2.0 ØD +0.1 -0 1.5 1.5 ØD1 +0.1 -0 1.5 1.5 E ±0.1 F ±0.05 G ±0.1 W ±0.2 T± 0.1 1.75 1.75 5.5 5.5 4.0 4.0 12.0 12.0 1.0 1.0 Peeling strength of cover tape: Test condition: 0.1 to 0.7 N at a peel off speed of 300mm / min. Reel Dimensions (mm): 9-1773463-9 CIS WR 03/2018 Type Tape 0402 0603 0805 1206 1210 2010 2512 Paper Paper Paper Paper Paper Embossed Embossed Dimensions in millimetres unless otherwise specified Reel Qty 10,000 5,000 5,000 5,000 5,000 4,000 4,000 A ± 0.5 B ± 0.5 C ± 0.5 D±1 M±2 W±1 2 2 2 2 2 2 2 13 13 13 13 13 13 13 21 21 21 21 21 21 21 60 60 60 60 60 60 60 178 178 178 178 178 178 178 10 10 10 10 10 13.8 13.8 Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Label: A. TE Product Number C. Quantity E. RoHS Statement B. Product Description D. Lot Number Example: Environment Related Substance This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and Halogen free. Ozone layer depleting substances. Ozone depleting substances are not used in our manufacturing process of this product. This product is not manufactured using Chloro fluorocarbons (CFCs), Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other ozone depleting substances in any phase of the manufacturing process. Storage Condition The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 25°C ± 10°C and a relative humidity of 60%RH ± 10%RH, chemical and dust free atmosphere Even within the above guarantee periods, do not store these products in the following conditions otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Solder Profile Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec. Peak temp.: 260 ℃ Hand Soldering condition: The Soldering iron tip should be less than 300°C and maximum contact time should be 5 seconds How To Order CRGP Common Part CRGP – Pulse Withstand Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified 0603 Size J Tolerance 0402 0603 0805 1206 1210 2010 2512 F - ±1% J - ±5% 10K Resistance Value oh Ω R K oh Dimensions Shown for reference purposes only. Specifications subject to change Ω K K oh 100K M oh Ω Ω M For Email, phone or live chat, go to: www.te.com/help