CRGP2010F10K

SMD Precision Pulse Thick Film Chip Resistor Type CRGP Series Key Features Key Features Small size and light weight Suitable for both wave and reflow soldering techniques Supplied on tape Pulse Rated 7 different package sizes Terminal finish matte Sn over Ni AEC-Q200 Compliant TE Connectivity is pleased to introduce this SMD Pulse withstand thick film Chip resistor, suitable for auto placement in volume and for most applications. Available in five different packages and supplied on tape and reel for automatic insertion processes. Standard values – E24 Series and now AEC-Q200 Qualified Characteristics – Electrical Type Power Rating @ 70°C Max. Working Voltage Max. Overload Voltage Dielectric Withstand Temperature Range Ambient Temperature Type Power Rating @ 70°C Max. Working Voltage Max. Overload Voltage Dielectric Withstand Temperature Range Ambient Temperature 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified CRGP0402 0.125W 50V 100V 100V CRGP1210 0.75W 200V 500V 500V CRGP0603 CRGP0805 0.25W 0.33W 50V 150V 100V 300V 300V 500V -55°C ~ +155°C 70°C CRGP1206 0.5W 200V 400V 500V CRGP2010 CRGP2512 1.25W 2W 400V 500V 800V 1000V 500V 500V -55°C ~ +155°C 70°C Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Power derating curve Power rating based on continuous load operation in ambient temperature of 70°C. For resistors operated in ambient temperatures above 70°C, power rating must be derated in accordance with this curve. Dimensions: Type CRGP0402 CRGP0603 CRGP0805 L 1.10±0.10 1.60±0.10 2.00±0.15 CRGP1206 3.10±0.15 CRGP1210 CRGP2010 CRGP2512 3.10±0.10 5.00±0.10 6.35±0.10 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified W 0.50±0.05 0.80±0.10 1.25+0.15 -0.10 1.55+0.15 -0.10 2.60±0.20 2.50±0.20 3.20±0.20 Dimension (mm) H ℓ 0.35±0.05 0.20±0.10 0.45±0.10 0.30±0.20 0.55±0.10 0.40±0.20 ℓ 0.25±0.10 0.30±0.20 0.40±0.20 0.55±0.10 0.45±0.20 0.45±0.20 0.55±0.10 0.55±0.10 0.55±0.10 0.55±0.25 0.60±0.25 0.60±0.25 0.50±0.20 0.50±0.20 0.50±0.20 Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Construction: Power Rating and Resistance Range: Type Power Rating @ 70°C Tolerance Resistance Range CRGP0402 0.125W ±1% ±5% 1R0 – 10M CRGP0603 0.25W ±1% ±5% 1R0 – 10M CRGP0805 0.33W ±1% ±5% 1R0 – 10M 0.5W ±1% ±5% 1R0 – 10M CRGP1210 0.75W ±1% ±5% 1R0 – 10M CRGP2010 1.25W ±1% ±5% 1R0 – 10M CRGP2512 2W ±1% ±5% 1R0 – 10M CRGP1206 Standard Series E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation E24 E96 by negotiation Marking: E24 series 0603 – 2512 3 Digits – first two digits denote significant figures of resistance and third digit denotes number of zeros thereafter. EG 222 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified = Dimensions Shown for reference purposes only. Specifications subject to change 2K2 For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Marking for E96 Series 0805 – 2512 4 digits – First three digits denote significant figures of resistance and fourth digit denotes number of zeros thereafter. EG. 1000 For ohmi alues elo = 100R R letter R denotes decimal point. EG 1R80 = R8 / .8Ω 0402 size chips are not marked 0603 E96 3 digit marking. 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Pulse withstand capacity The single impulse graph is the result of 50 impulses of rectangular shape applied at one-minute intervals. The limit of acceptance was a shift in resistance of less than 1% from the initial value. The power applied was subject to the restrictions of the maximum permissible impulse voltage graph shown. 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Performance Specification: Characteristic Limits Operational life ±5%, ±10%, ±20%: ± %+ . Ω Max. Temperature Coefficient Ω~ Ω : ± PPM/°C . Ω~ MΩ : ± PPM/°C External Visual No Mechanical Damage Physical Dimensions Reference 2.0 Dimension Standards Resistance to Solvent Marking Unsmeared Terminal Strength Terminal Bending Not Broken High Temperature Exposure (Storage) Temperature Cycling ±(1%+0.1Ω)max Solderability 95% coverage Min. Soldering Heat Resistance change rate is ± . %+ . Ω Max. Insulation Resistance 9-1773463-9 Rev. B 07/2021 ± . %± . Ω Max. Resistance change rate is ±5%, ±10%, ±20%: ± . %+ . Ω Max. , MΩ or more Dimensions in millimetres unless otherwise specified Test Methods (AEC-Q200) 125°C, at35% of operating power, 1000H(1.5 hours “ON , . hour OFF . MIL-STD-202) Natural resistance change per temp. degree centigrade R1-R2 --------- x ⁶ PPM/°C R1(t2-t1) R1 resistance value at room temperature (t1) R2 Resistance value at room temperature +100°C (t2) Electrical test not required. Inspect device construction, marking and workmanship (MIL-STD-883 Method 2009) Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical test not required. (JESD22 MH Method JB-100) Note: Add Aqueous wash chemical – OKEM Clean or equivalent. Do not use banned solvents. ( MIL-STD-202 Method 215) Force of 1.8kg for 60 seconds. (JIS-C-6429) Twist of Test Board : Y/X = 5/90 mm for 10 seconds (Sub-clause 4.33) 1000hrs. @T=155°C.Unpowered. Measurement at 24±2 hours after test conclusion. (MIL-STD-202 Method 108) 1000 Cycles (-55°C to +155°C). Measurement at 24±2 hours after test conclusion. (JESD22 Method JA-104) Test temperature of solder : 245 ± 3 ℃ Dwell time in solder : 2 ~ 3 seconds (Sub-clause 4.17) For both leaded & SMD. Electrical test not required. 95% coverage Min. Magnification 50X. Conditions: ( J-STD-002) Dip the resistor into a solder bath having a temperature of 260°C±3°C and hold it for 10±1 seconds (Sub-clause 4.18) Apply 500V DC between protective coating and termination for 1 min, then measure (Sub-clause 5.6) Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Characteristic Limits Test Methods (AEC-Q200) Solder Temp. Reference Electrical characteristics shall be satisfied without distinct deformation in appearance. (95% coverage Min.) Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Suggestion solder temp.: 235 ~ 255 ℃, 10 seconds max. Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec. Peak temp.: 260 ℃ Short term overload Resistance change rate is ± % : ± . % ± . Ω Max. ± % : ± . % ± . Ω Max. Dielectric Withstand Voltage No evidence of flashover, mechanical damage, arcing or insulation breakdown. Resistance change rate is: ± . % + . Ω Max. Humidity 9-1773463-9 Rev. B 07/2021 Load Life In Humidity Resistance change rate is: ± % : ± . % ± . Ω Max. ± % : ± . % ± . Ω Max. Load Life Resistance change rate is: ± % : ± . % ± . Ω Max. ± % : ± . % ± . Ω Max. Dimensions in millimetres unless otherwise specified Hand Soldering 300°C 5 seconds Permanent resistance change after the application of a potential of 2.5 times RCWV for 5 seconds Sub-clause 4.13 Apply 500V AC between protective coating and termination for 1 minute (Sub-clause 4.7) Temporary resistance change after 240 hours exposure in a humidity test chamber controlled at 40±2°C and 90-95% relative humidity (Sub-clause 4.24) Resistance change after 1,000 hours (1.5 hours "on", 0.5 hour "off") at RCWV in a humidity chamber controlled at 40℃ ± 2℃ and 90 to 95 % relative humidity. (Sub-clause 4.24.2.1) Permanent resistance change after 1,000 hours operating at RCWV, with duty cycle of (1.5 hours "on", 0.5 hour "off") at 70℃ ± 2℃ ambient (Sub-clause 4.25.1 Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Packaging Specification Paper taping Type 0402 0603 0805 1206 1210 A± 0.2 0.65 1.10 1.65 2.00 2.80 B± 0.2 1.15 1.90 2.40 3.60 3.50 C± 0.05 2.0 2.0 2.0 2.0 2.0 ØD +0.1 -0 1.5 1.5 1.5 1.5 1.5 E± 0.1 1.75 1.75 1.75 1.75 1.75 F± 0.05 3.5 3.5 3.5 3.5 3.5 G± 0.1 4.0 4.0 4.0 4.0 4.0 W± 0.2 8.0 8.0 8.0 8.0 8.0 T± 0.1 0.45 0.67 0.81 0.81 0.75 ØD1 +0.1 -0 1.5 1.5 E ±0.1 F ±0.05 G ±0.1 W ±0.2 T± 0.1 1.75 1.75 5.5 5.5 4.0 4.0 12.0 12.0 1.0 1.0 Embossed Taping Type A ±0.2 B ±0.2 C ±0.05 2010 2512 2.90 3.50 5.60 6.70 2.0 2.0 ØD +0.1 -0 1.5 1.5 Peeling strength of cover tape: Test condition: 0.1 to 0.7 N at a peel off speed of 300mm / min. 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Reel Dimensions (mm): Type Tape 0402 0603 0805 1206 1210 2010 2512 Paper Paper Paper Paper Paper Embossed Embossed Reel Qty 10,000 5,000 5,000 5,000 5,000 4,000 4,000 A ± 0.5 B ± 0.5 C ± 0.5 D±1 M±2 W±1 2 2 2 2 2 2 2 13 13 13 13 13 13 13 21 21 21 21 21 21 21 60 60 60 60 60 60 60 178 178 178 178 178 178 178 10 10 10 10 10 13.8 13.8 Environment Related Substance This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and Halogen free. Ozone layer depleting substances. Ozone depleting substances are not used in our manufacturing process of this product. This product is not manufactured using Chloro fluorocarbons (CFCs), Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other ozone depleting substances in any phase of the manufacturing process. Storage Condition The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 25°C ± 10°C and a relative humidity of 60%RH ± 10%RH, chemical and dust free atmosphere Even within the above guarantee periods, do not store these products in the following conditions otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help SMD Precision Pulse Thick Film Chip Resistor Solder Profile Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Suggestion solder temp.: 235 ~ 255 ℃, 10 seconds Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 seconds Peak temp.: 260 ℃ Hand Soldering condition: The Soldering iron tip should be less than 300°C and maximum contact time should be 5 seconds How To Order CRGP Common Part CRGP – Pulse Withstand Thick Film Chip Resistor 9-1773463-9 Rev. B 07/2021 Dimensions in millimetres unless otherwise specified 0603 Size J Tolerance 0402 0603 0805 1206 1210 2010 2512 F - ±1% J - ±5% 10K Resistance Value ohm Ω R K ohm Dimensions Shown for reference purposes only. Specifications subject to change Ω 1K0 K ohm 100K M ohm Ω Ω M For Email, phone or live chat, go to: www.te.com/help