MS5837-02BA
Gel-filled, ultra-compact, water resistant
digital pressure and temperature sensor
Take your devices to the next level with our MS5837-02BA
pressure and temperature sensor module. This ultra-compact
(3.3 x 3.3 x 2.75 mm), gel-filled sensor is optimized for
consumer devices such as fitness trackers, drones and
wearables, providing a robust sensor package to withstand the
harsh environments often encountered in these applications.
Expanding on TE Connectivity's (TE) MS5837 series of ultracompact, digital altimeters, our 2 bar models offers options for
shielding and high chemical endurance.
APPLICATIONS
Fitness Trackers
Drones
This MEMS based sensor includes a high-linearity pressure
sensor with low power (0.6µA), 24-bit digital output (I2C) and an
altitude resolution at sea level of 13 cm. This enables high
resolution measurements such as counting flights of stairs. The
board level design delivers sensing accuracy for both pressure
(±0.5mbar) and temperature (±2ºC) measurements. Lid shield
option reduces signal noise and interference that may be
experienced with sensors installed in plastic housings or high
electrical noise environments with integrated shielding.
(Non-shielded models should only be recommended for use in
applications with metal housings.)
Our MS5837-02BA provides exceptional performance, reliability
and accurate performance from a brand you can trust.
Bike Computers
Mobile Altimeter/Barometer Systems
FEATURES
Wearables
High resolution module: 13 cm
E-cigarettes
Ceramic and metal package: 3.3 x 3.3 x 2.75mm
Supply voltage: 1.5 to 3.6 V
Low power: 0.6 µA (standby ≤ 0.1 µA at 25°C)
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Operating range: 300 to 1,200 mbar, -20 to +85 °C
I2C interface
No external components (internal oscillator)
Water resistant sealing with 1.8 x 0.8mm O-ring
Shielded metal lid option
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
PREFORMANCE SPECIFCIATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Storage temperature
Overpressure
Maximum Soldering
Temperature (2)
ESD rating (lid to GND version)
Symbol
VDD
TS
Pmax
Conditions
Tmax
(2)
ISO 22810(1)
Max
+4
+85
10
Unit
V
°C
bar
40 sec. max
250
°C
-2
+2
kV
-100
+100
mA
Typ.
3.0
+25
20.09
10.05
5.02
2.51
1.26
0.63
1.25
Max
3.6
+85
Unit
V
°C
0.01
0.1
Human Body Model
JEDEC JESD78
standard
Latch up
(1)
Min.
-0.3
-40
Typ.
Pressure ramp up/down min 60s
Refer to application note 808
ELECTRICAL CHARACTERISTICS
Parameter
Operating Supply voltage
Operating Temperature
Supply current
(1 sample per sec.)
Symbol
VDD
T
IDD
Peak supply current
Standby supply current
Power supply hold off for
internal reset (3)
VDD Capacitor
Resistor value between the lid
and the GND
(3)
Conditions
Min.
1.5
-20
8192
4096
2048
OSR
1024
512
256
during conversion
at 25°C
(VDD = 3.0 V)
VDD < 0.1V
from VDD to GND
Version 02BA2x
only
200
100
µA
mA
µA
470
ms
nF
1000
Ω
Supply voltage power up must be continuous from GND to VDD without any step
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Output Word
ADC Conversion time (4)
(4)
Symbol
tc
Conditions
OSR
Min.
8192
4096
2048
1024
512
256
Typ.
24
16.44
8.22
4.13
2.08
1.06
0.54
Max
17.2
8.61
4.32
2.17
1.10
0.56
Unit
bit
ms
Maximum values must be used to determine waiting times in I 2C communication
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
PERFORMANCE SPECIFICATIONS (Continued)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Operating Pressure Range
Extended Pressure Range
Relative Accuracy (1) (4)
Resolution RMS
Maximum error with supply
voltage (2)
Long-term stability
Reflow soldering impact
Conditions
Prange
Linear Range of
Pext
ADC
600...1000 mbar, at 20°C
300...1100 mbar, 0...60°C
300...1100 mbar, -20...85°C
8192
4096
2048
OSR
1024
512
256
Min.
300
Max
1200
Unit
mbar
10
2000
mbar
-0.5
-2
-4
+0.5
+2
+4
mbar
VDD = 1.5 V…3.6 V
IPC/JEDEC J-STD-020C
(Refer to application note AN808)
Recovering time after reflow (3)
Typ.
0.016
0.021
0.028
0.039
0.062
0.11
mbar
±2
mbar
±2
mbar/yr
±4
mbar
7
days
(1)
With autozero at one pressure point
(2)
With autozero at 3V point
(3)
Time to recover at least 66% of reflow impact
(4)
Wet/dry cycle: sensor must be dried typically once a day
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Relative Accuracy
Maximum error with supply
voltage
Resolution RMS
Conditions
-20…85°C, 300…1100 mbar
Min.
-2
VDD = 1.5 V…3.6 V
OSR
8192
4096
2048
1024
512
256
Typ.
Max
+2
Unit
°C
±0.3
°C
0.002
0.003
0.004
0.006
0.009
0.012
°C
DIGITAL INPUTS (SDA, SCL)
Parameter
Serial data clock
Input high voltage
Input low voltage
Input leakage current
Symbol
SCL
VIH
VIL
Ileak
Conditions
Symbol
VOH
VOL
Conditions
Isource = 1 mA
Isink = 1 mA
Min.
Typ.
Max
400
100% VDD
20% VDD
0.1
Unit
kHz
V
V
µA
Typ.
Max
100% VDD
20% VDD
Unit
V
V
80% VDD
0% VDD
T = 25 °C
DIGITAL OUTPUTS (SDA)
Parameter
Output high voltage
Output low voltage
TE CONNECTIVITY SENSORS /// MS5837-02BA
Min.
80% VDD
0% VDD
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
TYPICAL PERFORMANCE CHARACTERISTICS
RELATIVE PRESSURE ERROR AND TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE
(TYPICAL VALUES)
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
TYPICAL PERFORMANCE CHARACTERISTICS
RELATIVE PRESSURE AND TEMPERATURE ERROR VS TEMPERATURE
(1ST ORDER AND 2ND ORDER ALGORITHM, TYPICAL VALUES)
RELATIVE PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
(TYPICAL VALUES)
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
PRESSURE AND TEMPERATURE CALCULATION
GENERAL
The MS5837 consists of a piezo-resistive sensor and a sensor interface integrated circuit. The main function of the
MS5837 is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a
24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 112bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller software
and used in the program converting D1 and D2 into compensated pressure and temperature values.
COMMUNICATION INTERFACE
The MS5837 has been built with I2C serial interface.
Module ref
Mode
Pins used
MS5837-02BA01
I2 C
SDA, SCL
The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The
sensor responds on the same pin SDA which is bidirectional for the I 2C bus interface. So this interface type uses
only 2 signal lines and does not require a chip select.
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
PRESSURE AND TEMPERATURE CALCULATION
Start
Maximum values for calculation results:
PMIN = 10mbar P MAX = 2000mbar
TMIN = -40°C T MAX = 85°C T REF = 20°C
Read
calibration
data
(factory
calibrated)
PROMof W1 to W4)
Convert
calibration
data
into
coefficients
(see from
bit pattern
[1]
Value
Recommended
variable type
Size
[bit]
min
max
Example /
Typical
Pressure sensitivity | SENS T1
unsigned int 16
16
0
65535
46372
Pressure offset | OFF T1
unsigned int 16
16
0
65535
43981
C3
Temperature coefficient of pressure sensitivity | TCS
unsigned int 16
16
0
65535
29059
C4
Temperature coefficient of pressure offset | TCO
unsigned int 16
16
0
65535
27842
C5
Reference temperature | T
REF
unsigned int 16
16
0
65535
31553
C6
Temperature coefficient of the temperature | TEMPSENS
unsigned int 16
16
0
65535
28165
Variable
Description | Equation
C1
C2
Read
Read
digital
digital
pressure
pressure
and
and
temperature
temperature
data
data
D1
Digital pressure value
unsigned int 32
24
0
16777216
6465444
D2
Digital temperature value
unsigned int 32
24
0
16777216
8077636
signed int 32
25
-16776960
16777216
68
signed int 32
41
-4000
8500
Calculate temperature
dT
Difference between actual and reference temperature
8
dT = D2 - T REF = D2 - C5 * 2
TEMP
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 223
[2]
2000
= 20.00 °C
Calculate
temperature
compensated
pressure
Calculate
temperature
compensated
pressure
OFF
Offset at actual temperature [3]
OFF = OFFT1 + TCO * dT = C2 * 217 + (C4 * dT ) / 26
signed int 64
41
-17179344900
25769410560
5764707214
3039050829
[4]
SENS
Sensitivity at actual temperature
SENS = SENS T1 + TCS * dT = C1 * 2 16 + (C3 * dT ) / 27
signed int 64
41
-8589672450
12884705280
P
Temperature compensated pressure (10…1200mbar with
0.01mbar resolution)
21
15
P = D1 * SENS - OFF = (D1 * SENS / 2
- OFF) / 2
signed int 32
58
1000
120000
110002
= 1100.02 mbar
Pressure and temperature value first order
Notes
[1]
[2]
[3]
[4]
Maximal size of intermediate result during evaluation of variable
min and max have to be defined
min and max have to be defined
min and max have to be defined
Flow chart for pressure and temperature reading and software compensation
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
SECOND ORDER TEMPERATURE COMPENSATION
The results of the last first order calculation are entered in the following chart to obtain the pressure and temperature
compensated with the 2nd order: P2 and TEMP2.
Flow chart for pressure and temperature to the optimum accuracy
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
I2C INTERFACE
COMMANDS
The MS5837 has only five basic commands:
1. Reset
2. Read PROM (112 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Each I2C communication message starts with the start condition and it is ended with the stop condition. The MS5837
address is 1110110x (write: x=0, read: x=1).
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands, the device will
return 24 bit result and after the PROM read 16 bit results. The address of the PROM is embedded inside of the
PROM read command using the a2, a1 and a0 bits.
Bit number
Bit name
Command
Reset
Convert D1 (OSR=256)
Convert D1 (OSR=512)
Convert D1 (OSR=1024)
Convert D1 (OSR=2048)
Convert D1 (OSR=4096)
Convert D1 (OSR=8192)
Convert D2 (OSR=256)
Convert D2 (OSR=512)
Convert D2 (OSR=1024)
Convert D2 (OSR=2048)
Convert D2 (OSR=4096)
Convert D2 (OSR=8192)
ADC Read
PROM Read
Command byte
0
1
2
PRO CO M
NV
3
Typ
4
5
6
7
Ad2/ Ad1/ Ad0/ Stop
Os2 Os1 Os0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
1
0
0
0
0
1
1
0
0
0
0
1
1
0
Ad2
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
hex value
1
0
0
1
1
0
0
0
0
1
1
0
0
0
Ad1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
Ad0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x1E
0x40
0x42
0x44
0x46
0x48
0x4A
0x50
0x52
0x54
0x56
0x58
0x5A
0x00
0xA0 to
0xAE
Command structure
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device PROM from an unknown condition.
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by
the SDA being blocked by the module in the acknowledge state. The only way to get the MS5837 to function is to
send several SCLs followed by a reset sequence or to repeat power on reset.
1 1 1 0 1 1 0 0 0 0 0 0 1 1 1 1 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C Reset Command
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the calibration
PROM and to calculate the calibration coefficients. There are in total 7 addresses resulting in a total memory of 112
bit. Addresses contain factory data and the setup, calibration coefficients, the serial code and CRC. The command
sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. The PROM Read command consists
of two parts. First command sets up the system into PROM read mode. The second part gets the data from the
system.
1 1 1 0 1 1 0 0 0 1 0 1 0 0 1 1 0 0
Device Address
command
S
Device Address
cmd byte
W A
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C Command to read memory address= 011
1 1 1 0 1 1 0 1 0 X X X X X X X X 0 X X X X X X X X 0
Device Address
data
data
S
Device Address
Memory bit 15 - 8
Memory bit 7 - 0
R A
A
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledage
I2C answer from MS5837
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the
conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as
the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not
stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will
yield incorrect result as well. A conversion can be started by sending the command to MS5837. When command is
sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by
sending a Read command, when an acknowledge is sent from the MS5837, 24 SCL cycles may be sent to receive
all result bits. Every 8 bits the system waits for an acknowledge signal.
1 1 1 0 1 1 0 0 0 0 1 0 0 1 0 0 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C command to initiate a pressure conversion (OSR=4096, typ=D1)
1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0
Device Address
command
S
Device Address
cmd byte
W A
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C ADC read sequence
1 1 1 0 1 1 0 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0
Device Address
data
data
data
S
Device Address
R A
Data 23-16
A
Data 15 - 8
A
Data 7 - 0
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C answer from MS5837
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
Version PROM Word 0 programming
For product type, the bits [11:5] of memory address 0 must be programmed with the following fixed values:
MS5837-02BA01
Address
0
15
14
crc
13
12
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
3
2
1
factory settings
0
13
12
11
0
10
0
9
1
8
0
7
1
6
0
5
1
4
3
2
1
factory settings
0
MS5837-02BA21
Address
0
15
14
crc
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
CYCLIC REDUNDANCY CHECK (CRC)
MS5837 contains a PROM memory with 112-Bit. A 4-bit CRC has been implemented to check the data validity in
memory.
MS5837-02BA
A
d
d
D
B
1
5
D
B
1
4
0
1
2
3
4
5
6
D
B
1
3
CRC
D
B
1
2
D
B
1
1
D
D D D D D D D D D D
B
B B B B B B B B B B
1
9 8 7 6 5 4 3 2 1 0
0
Version defined
C1
C2
C3
C4
C5
C6
Factory defined
Memory PROM mapping
C Code example for CRC-4 calculation:
unsigned char crc4(unsigned int n_prom[])
// n_prom defined as 8x unsigned int (n_prom[8])
{
int cnt;
// simple counter
unsigned int n_rem=0;
// crc remainder
unsigned char n_bit;
n_prom[0]=((n_prom[0]) & 0x0FFF);
// CRC byte is replaced by 0
n_prom[7]=0;
// Subsidiary value, set to 0
for (cnt = 0; cnt < 16; cnt++)
// operation is performed on bytes
{
// choose LSB or MSB
if (cnt%2==1)
n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF);
else
n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8);
for (n_bit = 8; n_bit > 0; n_bit--)
{
if (n_rem & (0x8000))
n_rem = (n_rem 12) & 0x000F);
// final 4-bit remainder is CRC code
return (n_rem ^ 0x00);
}
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
APPLICATION CIRCUIT
The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
Figure: Typical application circuit
PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.15mm
1
GND
GROUND
2
VDD
POSITIVE SUPPLY
3
SCL
I2C CLOCK
4
SDA
I2C DATA
Figure: Package outlines and Pin configuration
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board.
Figure
SHIPPING PACKAGE
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for soldering recommendations.
MOUNTING
The MS5837 can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged
by the vacuum.
Due to the low stress assembly, the sensor does not show pressure hysteresis effects. It is important to solder all
contact pads. Gel must stay free of external physical contact when manipulation.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In applications such as outdoor watches the electronics must be protected against direct water or humidity. For
such applications the MS5837 provides the possibility to seal with an O-ring. The O-ring shall be placed at the
groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are
recommended:
O-ring inner diameter
1.8 ± 0.05 mm
O-ring cross-section diameter
0.8 ± 0.03 mm
Housing bore diameter
3.07 ± 0.03 mm
Please refer to the application note AN523 available on our website for O-ring mounting recommendations.
CLEANING
The MS5837 has been manufactured under clean-room conditions. It is therefore recommended to assemble the
sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor
opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “noclean” shall be used. Warning: cleaning might damage the sensor.
ESD PRECAUTIONS
The electrical contact pads are protected against ESD. It is therefore essential to ground machines and personnel
properly during assembly and handling of the device. The MS5837 is shipped in antistatic transport boxes. Any test
adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic
material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100nF minimum ceramic capacitor
must be placed as close as possible to the MS5837 VDD pin. This capacitor will stabilize the power supply during
data conversion and thus, provide the highest possible accuracy.
SHIELDING
This option is recommended for sensors installed in plastic housings or in high electrical noise environments in
order to reduce signal noise and interference that may be experienced.
TE CONNECTIVITY SENSORS /// MS5837-02BA
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MS5837-02BA
Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor
ORDERING INFORMATION
PART NUMBER
DESCRIPTION
MS583702BA01-50
MS5837-02BA01 2BA T&R PRESSURE SEN
20000979-00
MS5837-02BA21 2BA LS T&R PRESSURE SEN
NORTH AMERICA
SHIELDING
EUROPE
Tel +1 800 522 6752
customercare.frmt@te.com
Tel +31 73 624 6999
customercare.bevx@te.com
X
ASIA
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TE Connectivity Ltd. family of companies
All Rights Reserved.
TE CONNECTIVITY SENSORS /// MS5837-02BA
REV A8 12/2019
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