MS5840-02BA01

MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor DESCRIPTION The MS5840 is an ultra-compact micro altimeter. It is optimized for altimeter and barometer applications. The altitude resolution at sea level is 13 cm of air. The sensor module includes a high-linearity pressure sensor and an ultra-low power 24-bit ΔΣ ADC with internal factory-calibrated coefficients. It provides a precise digital 24-bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. FEATURES            Ceramic - metal package, 3.3 x 3.3 x 1.7mm High-resolution module, 13 cm Supply voltage: 1.5 to 3.6 V Fast conversion down to 0.5 ms Low power, 0.6 µA (standby ≤ 0.1 µA at 25°C) A high-resolution temperature output allows the implementation of an altimeter/thermometer function without any additional sensor. The MS5840 can be interfaced to any microcontroller with I2C-bus interface. The communication protocol is simple, without the need of programming internal registers in the device. The gel protection and antimagnetic stainless-steel cap makes the module water resistant. Small dimensions of only 3.3 mm x 3.3 mm x 1.7 mm allows integration in mobile devices. This sensor module generation is based on leading MEMS technology and latest benefits from TE Connectivity (TE) proven experience and know-how in high volume manufacturing of altimeter modules, which has been widely used for over a decade. Integrated digital pressure sensor (24 bit ΔΣ ADC) Operating range: 300 to 1200 mbar, -20 to +85 °C I2C interface No external components (internal oscillator) Protected against direct sunlight Lid connected to ground option APPLICATIONS   Adventure or multi-mode watches Mobile water depth measurement systems TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 1 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure Maximum Soldering Temperature (2) ESD rating (lid to GND version) Symbol VDD TS Pmax Conditions Tmax (2) ISO 22810(1) Max +4 +85 10 Unit V °C bar 40 sec. max 250 °C -2 +2 kV -100 +100 mA Typ. 3.0 +25 20.09 10.05 5.02 2.51 1.26 0.63 1.25 Max 3.6 +85 Unit V °C 0.01 0.1 Human Body Model JEDEC JESD78 standard Latch up (1) Min. -0.3 -40 Typ. Pressure ramp up/down min 60s Refer to application note 808 ELECTRICAL CHARACTERISTICS Parameter Operating Supply voltage Operating Temperature Supply current (1 sample per sec.) Symbol VDD T IDD Peak supply current Standby supply current Power supply hold off for internal reset (3) VDD Capacitor Resistor value between the lid and the GND (3) Conditions Min. 1.5 -20 8192 4096 2048 OSR 1024 512 256 during conversion at 25°C (VDD = 3.0 V) VDD < 0.1V 200 from VDD to GND Version 02BA2x only 100 µA mA µA ms 470 nF 1000 Ω Supply voltage power up must be continuous from GND to VDD without any step ANALOG DIGITAL CONVERTER (ADC) Parameter Output Word ADC Conversion time (4) (4) Symbol tc Conditions OSR Min. 8192 4096 2048 1024 512 256 Typ. 24 16.44 8.22 4.13 2.08 1.06 0.54 Max 17.2 8.61 4.32 2.17 1.10 0.56 Unit bit ms Maximum values must be used to determine waiting times in I2C communication TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 2 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap PERFORMANCE SPECIFICATIONS (CONTINUED) PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED) Parameter Operating Pressure Range Extended Pressure Range Relative Accuracy (1) (4) Resolution RMS Maximum error with supply voltage (2) Long-term stability Reflow soldering impact Conditions Prange Linear Range of Pext ADC 600...1000 mbar, at 20°C 300...1100 mbar, 0...60°C 300...1100 mbar, -20...85°C 8192 4096 2048 OSR 1024 512 256 Min. 300 Max 1200 Unit mbar 10 2000 mbar -0.5 -2 -4 +0.5 +2 +4 mbar VDD = 1.5 V…3.6 V IPC/JEDEC J-STD-020C (Refer to application note AN808) Recovering time after reflow (3) Typ. 0.016 0.021 0.028 0.039 0.062 0.11 mbar ±2 mbar ±2 mbar/yr ±4 mbar 7 days (1) With autozero at one pressure point (2) With autozero at 3V point (3) Time to recover at least 66% of reflow impact (4) Wet/dry cycle: sensor must be dried typically once a day TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED) Parameter Relative Accuracy Maximum error with supply voltage Resolution RMS Conditions 0…60°C, 600…1100 mbar -20…85°C, 300…1100 mbar VDD = 1.5 V…3.6 V OSR TE CONNECTIVITY SENSORS /// MS5840-02BA 8192 4096 2048 1024 512 256 Min. Typ. ±1 -2 Max +2 Unit °C °C ±0.3 °C 0.002 0.003 0.004 0.006 0.009 0.012 °C 11/2018 Page 3 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap DIGITAL INPUTS (SDA, SCL) Parameter Serial data clock Input high voltage Input low voltage Input leakage current Symbol SCL VIH VIL Ileak Conditions Symbol VOH VOL Conditions Isource = 1 mA Isink = 1 mA Min. Typ. Max 400 100% VDD 20% VDD 0.1 Unit kHz V V µA Typ. Max 100% VDD 20% VDD Unit V V 80% VDD 0% VDD T = 25 °C DIGITAL OUTPUTS (SDA) Parameter Output high voltage Output low voltage TE CONNECTIVITY SENSORS /// MS5840-02BA Min. 80% VDD 0% VDD 11/2018 Page 4 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap TYPICAL PERFORMANCE CHARACTERISTICS RELATIVE PRESSURE ERROR AND TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE (TYPICAL VALUES) TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 5 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap TYPICAL PERFORMANCE CHARACTERISTICS RELATIVE PRESSURE AND TEMPERATURE ERROR VS TEMPERATURE (1ST ORDER AND 2ND ORDER ALGORITHM, TYPICAL VALUES) RELATIVE PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY (TYPICAL VALUES) TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 6 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap PRESSURE AND TEMPERATURE CALCULATION GENERAL The MS5840 consists of a piezo-resistive sensor and a sensor interface integrated circuit. The main function of the MS5840 is to convert the uncompensated analog output voltage from the piezo-resistive pressure sensor to a 24bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and two pressures. As a result, 8 coefficients necessary to compensate for process and temperature variations are calculated and stored in the 112 bits PROM of each module. These bits (stored in 16 bits word from W0 to W6) must be read and used together with the D1 and D2 values to get the compensated pressure and temperature values. The coefficient W0 contains also factory configuration bits and a CRC, as represented in ’’ Figure 10 : Version number in Word 0’’ below. SERIAL I2C INTERFACE The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. This interface type uses only 2 signal lines and does not require a chip select. Module ref MS5840-02BA TE CONNECTIVITY SENSORS /// MS5840-02BA Mode I2 C Pins used SDA, SCL Address (7 bits) 0x76 (1110110 b) 11/2018 Page 7 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap FIRST ORDER PRESSURE AND TEMPERATURE CALCULATION Start Maximum values for calculation results: PMIN = 10mbar PMAX = 2000mbar TMIN = -40°C TMAX = 85°C TREF = 20°C Read calibration data (factory calibrated) from PROM Variable Description | Equation Recommended variable type Size [1] [bit] min max Value Example / Typical C1 Pressure sensitivity | SENS T1 unsigned int 16 16 0 65335 46372 C2 Pressure offset | OFF T1 unsigned int 16 16 0 65335 43981 C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 0 65335 29059 C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 0 65335 27842 C5 C6 Reference temperature | TREF Temperature coefficient of the temperature | TEMPSENS unsigned int 16 unsigned int 16 16 16 0 0 65335 65335 31553 28165 Read digital pressure and temperature data D1 Digital pressure value unsigned int 32 24 0 16777215 6464444 D2 Digital temperature value unsigned int 32 24 0 16777215 8077636 signed int 32 25 -16776960 16777216 68 signed int 32 25 -4000 8500 2000 = 20.00°C Calculate temperature dT TEMP Difference between actual and reference temperature [2] dT = D2 - T REF = D2 - C5 * 2 8 A tual te perature - …8 °C with . °C resolutio TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 2 23 Calculate temperature compensated pressure Offset at actual temperature [2] OFF OFF = OFF T1 + TCO * dT = C2 * 2 17 + dT * C4 / 2 6 Sensitivity at actual temperature SENS SENS = SENS T1 + TCS * dT = C1 * 2 16 + dT * C3 / 2 7 P Te perature o pe sated pressure 0.01mbar resolution) P = (D1 * SENS / 2 21 - OFF) / 2 signed int 64 41 -17179344900 25769410560 5764707214 signed int 64 41 -8589672450 12884705280 303950829 signed int 32 58 1000 120000 110002 = 1100.02 mbar [2] … ar with 15 Display pressure and temperature value Notes: [1] Maximal size of intermediate result during evaluation of variable [2] Min and max have to be defined Figure 1 : Pressure and temperature first order TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 8 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap SECOND ORDER TEMPERATURE COMPENSATION The results of the first order calculation are used as described in the following chart to obtain the 2 nd order pressure and temperature compensated values. Pressure and temperature values first order NO TEMP > 20°C YES High temperature Ti = 0 OFFi = 0 SENSi = 0 NO Very low temperature TEMP > 10°C YES Low temperature Ti = 14 * dT2 / 235 Ti = 12 * dT2 / 235 OFFi = 35 * (TEMP -2000) 2 / 23 OFFi = 30 * (TEMP -2000) 2 / 28 SENSi = 0 SENSi = 63 * (TEMP-2000) 2 / 25 Calculate pressure and temperature TEMP2 = (TEMP - Ti) / 100 OFF2 = OFF - OFFi SENS2 = SENS- SENSi Figure 2 : Second order compensation flowchart TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 9 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap I2C INTERFACE COMMANDS The MS5840 has only five basic commands: 1. Reset 2. Read PROM (112 bit of calibration words) 3. D1 conversion 4. D2 conversion 5. Read ADC result (24-bit pressure / temperature) Size of each command is 1 byte (8 bits) as described in the table ’’Figure 3 : Command structure’’ below. After the PROM read command, sensor responds with 16 bits word. Bits A2, A1 and A0 select PROM addresses. Conversion is started after a “Convert D1” or “Convert D2” with the requested OSR is issued. Conversion time depends on the OSR as shown in the table specifications. Maximum waiting time values need to be used to ensure finished operation. ADC read command will return 24 bits result of the above requested finished conversion. Bit number Bit name Command Reset Convert D1 (OSR=256) Convert D1 (OSR=512) Convert D1 (OSR=1024) Convert D1 (OSR=2048) Convert D1 (OSR=4096) Convert D2 (OSR=256) Convert D2 (OSR=512) Convert D2 (OSR=1024) Convert D2 (OSR=2048) Convert D2 (OSR=4096) ADC Read PROM Read Command byte 0 1 2 PR COV M 3 Typ 4 A2/ Os2 5 A1/ Os1 6 A0/ Os0 7 Stop 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 1 1 1 1 1 0 0 1 0 0 0 0 1 0 0 0 0 1 0 A2 1 0 0 1 1 0 0 0 1 1 0 0 A1 1 0 1 0 1 0 0 1 0 1 0 0 A0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 hex value 0x1E 0x40 0x42 0x44 0x46 0x48 0x50 0x52 0x54 0x56 0x58 0x00 0xA0 to 0xAC Figure 3 : Command structure TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 10 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap RESET SEQUENCE At power on, an internal reset circuitry ensures calibration PROM data gets loaded into the internal register. Reset sequence can be sent once to make sure this operation is successfully done. It can be also used to reset the device PROM from an unknown condition. The reset can be sent at any time. In the event that there is no successful power on reset, maybe caused by the SDA being blocked by the module in the acknowledge state, the only way to get the MS5840 back to function, is to send several SCLs until SDA release, followed by a reset sequence, or to perform a power OFF-ON cycle. 1 1 1 0 1 1 0 0 0 0 0 0 1 1 1 1 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge Figure 4 : I2C Reset Command PROM READ SEQUENCE The read command for PROM must be executed once after reset by the user software to read the content of the calibration PROM and extract / store the calibration coefficients. There are 7 addresses resulting in a total memory content of 112 bits. Memory words contain: factory data, calibration coefficients and CRC. Command sequence is 8 bits wide and slave responses will send back 16 bits result which is clocked with the MSB first. The PROM read command is divided in two parts. Firstly, ASIC is set into PROM read mode and address of the requested word is issued. Then, content of addressed memory word is read. 1 1 1 0 1 1 0 0 0 1 0 1 0 0 1 1 0 0 Device Address command S Device Address cmd byte W A A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge Figure 5 : I2C Command to read memory address= 011 1 1 1 0 1 1 0 1 0 X X X X X X X X 0 X X X X X X X X 0 Device Address data data S Device Address R A Memory bit 15 - 8 A Memory bit 7 - 0 N P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledage Figure 6 : I2C answer from MS5840 TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 11 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. Once finished, raw values are read using “ADC read command”. Result is clocked out with MSB first. If conversion is not finished before sending the “ADC read command”, or the “ADC read command” is repeated, conversion will not stop but issued result will be wrong. Conversion sequence command sent during the already started conversion process will yield incorrect result as well. Once command issued, the ADC will start converting the values from the sensing element into digital 24-bit format. Conversion time is dependent from selected OSR (page 2). After the conversion is performed, the data can be accessed by sending a read command as shown below. 1 1 1 0 1 1 0 0 0 0 1 0 0 1 0 0 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge Figure 7 : I2C command to initiate a pressure conversion (OSR=4096, typ=D1) 1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 Device Address command S Device Address cmd byte W A A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge Figure 8 : I2C ADC read sequence 1 1 1 0 1 1 0 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0 Device Address data data data S Device Address R A Data 23-16 A Data 15 - 8 A Data 7 - 0 N P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge Figure 9 : I2C answer from MS5840 VERSION IDENTIFICATION NUMBER (WORD 0) Depending on product version, bits [11:5] of memory address 0 are programmed with the following fixed values: MS5840-02BA01 Address 0 15 14 crc 13 12 11 0 10 0 9 0 8 0 7 0 6 0 5 0 4 3 2 1 0 factory configuration bits 13 12 11 0 10 1 9 0 8 0 7 1 6 0 5 0 4 3 2 1 0 factory configuration bits MS5840-02BA36 Address 0 15 14 crc Figure 10 : Version number in Word 0 TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 12 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap CYCLIC REDUNDANCY CHECK (CRC) A 4-bits CRC has been implemented to check the data validity in memory. The CRC read in the first four bits of W0 must be equal to the CRC calculated (see algorithm below) with all other PROM bits to ensure memory content integrity. D B 1 5 D B 1 4 D B 1 3 CRC D B 1 2 D B 1 1 D D D D D D D D D D D B B B B B B B B B B B 1 9 8 7 6 5 4 3 2 1 0 0 Version number 0 1 2 3 4 5 6 Factory configuration bits C1 C2 C3 C4 C5 C6 Figure 11 : Memory PROM mapping C CODE EXAMPLE FOR CRC-4 CALCULATION: unsigned char crc4(unsigned int n_prom[]) // n_prom defined as 8x unsigned int (n_prom[8]) { int cnt; // simple counter unsigned int n_rem=0; // crc remainder unsigned char n_bit; n_prom[0]=((n_prom[0]) & 0x0FFF); // CRC byte is replaced by 0 n_prom[7]=0; // Subsidiary value, set to 0 for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes { // choose LSB or MSB if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF); else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8); for (n_bit = 8; n_bit > 0; n_bit--) { if (n_rem & (0x8000)) n_rem = (n_rem 12) & 0x000F); // final 4-bit remainder is CRC code return (n_rem ^ 0x00); } TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 13 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap APPLICATION CIRCUIT MS5840 is a sensor that can be used in conjunction with a microcontroller in mobile altimeter applications. A typical application circuit is presented in ‘’Figure 12 : Typical application circuit’’ Figure 12 : Typical application circuit PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE. UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.15mm 1 2 3 4 GND VDD SCL SDA GROUND POSITIVE SUPPLY I2C CLOCK I2C DATA Figure 13 : Package outlines and pin configuration TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 14 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap RECOMMENDED PAD LAYOUT Pad layout for bottom side of the MS5840 soldered onto printed circuit board. Figure 14 : PCB footprint SHIPPING PACKAGE Figure 15 : Tape dimensions TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 15 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for soldering recommendations. MOUNTING The MS5840 can be processed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly, the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. Gel must stay free of external physical contact when manipulation. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB. This is ideal for small-sized applications. SEALING In applications such as outdoor watches the electronics must be protected against direct water or humidity. For such applications the MS5840 provides the possibility to seal with a gasket or an O-ring. CLEANING The MS5840 has been manufactured under clean-room conditions. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “noclean” shall be used. Warning: cleaning might damage the sensor. ESD PRECAUTIONS The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore essential to ground machines and personal properly during assembly and handling of the device. The MS5840 is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to the power supply. A minimum of 100nF ceramic capacitor must be placed as close as possible to the MS5840 VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy. TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 16 MS5840-02BA Low profile, gel-filled, ultra-compact watertight pressure sensor, with stainless steel cap ORDERING INFORMATION Description Part Number MS5840-02BA01 LP PRESS SENSOR T&R 20000980-00 MS5840-02BA36 LP PRESS SENSOR T&R 20000982-00 Product Description MS5840__ BA__ Pressure range -02 Pressure range Version -01 Standard version -36 High endurance with lid connected to GND NORTH AMERICA EUROPE Tel +1 800 522 6752 customercare.frmt@te.com Tel +31 73 624 6999 customercare.bevx@te.com ASIA Tel +86 0400 820 6015 customercare.shzn@te.com te.com/sensorsolutions Measurement Specialties (MEAS), TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2018 TE Connectivity Ltd. family of companies All Rights Reserved. TE CONNECTIVITY SENSORS /// MS5840-02BA 11/2018 Page 17