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GM72V66841EXX

GM72V66841EXX

  • 厂商:

    HYNIX(海力士)

  • 封装:

  • 描述:

    GM72V66841EXX - 2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM - Hynix Semiconductor

  • 详情介绍
  • 数据手册
  • 价格&库存
GM72V66841EXX 数据手册
GM72V66841ET/ELT 2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM Description T he GM72V66841ET/ELT is a synchronous dynamic random access memory comprised of 67,108,864 memory cells and logic including input and output circuits operating synchronously by referring to the positive edge of the externally provided Clock. The GM72V66841ET/ELT provides four banks of 2,097,152 word by 8 bit to realize high bandwidth with the Clock frequency up to 143 Mhz. Pin Configuration VCC DQ0 VCCQ NC DQ1 VSSQ NC DQ2 VCCQ NC DQ3 VSSQ NC VCC NC /WE /CAS /RAS /CS BA0/A13 BA1/A12 A10,AP A0 A1 A2 A3 VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 JEDEC STANDARD 400 mil 54 PIN TSOP II (TOP VIEW) Features * PC133/PC100/PC66 Compatible -7(143MHz)/-75(133MHz)/-8(125MHz) -7K(PC100,2-2-2)/-7J(PC100,3-2-2) * 3.3V single Power supply * LVTTL interface * Max Clock frequency 143/133/125/100MHz * 4,096 refresh cycle per 64 ms * Two kinds of refresh operation Auto refresh / Self refresh * Programmable burst access capability ; - Sequence:Sequential / Interleave - Length :1/2/4/8/FP * Programmable CAS latency : 2/3 * 4 Banks can operate independently or simultaneously * Burst read/burst write or burst read/single write operation capability * Input and output masking by DQM input * One Clock of back to back read or write command interval * Synchronous Power down and Clock suspend capability with one Clock latency for both entry and exit * JEDEC Standard 54Pin 400mil TSOP II Package VSS DQ7 VSSQ NC DQ6 VCCQ NC DQ5 VSSQ NC DQ4 VCCQ NC VSS NC DQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 VSS Pin Name CLK CKE CS RAS CAS WE A0~A9,A11 A10 / AP BA0/A13 ~BA1/A12 DQ0~DQ7 DQM VCCQ VSSQ V CC VSS NC Clock Clock Enable Chip Select Row Address Strobe Column Address Strobe Write Enable Address input Address input or Auto Precharge Bank select Data input / Data output Data input / output Mask V CC f or DQ V SS f or DQ Power for internal circuit Ground for internal circuit No Connection This document is a general product description and is subject to change without notice. Hynix semiconductor does not assume any -1responsibility for use of circuits described. No patent licenses are implied. Rev. 1.1/Apr.01 GM72V66841ET/ELT Block Diagram A0 to A13 A0 to A8 A0 to A13 Column address counter Column address buffer Row address counter Refresh counter Row decoder Row decoder Row decoder Row decoder Column decoder Sense amplifier & I/O bus Column decoder Sense amplifier & I/O bus Column decoder Sense amplifier & I/O bus Memory array Bank 0 4096 row x 512 column x 8 bit Memory array Bank 1 4096 row x 512 column x 8 bit Memory array Bank 2 4096 row x 512 column x 8 bit Column decoder Sense amplifier & I/O bus Memory array Bank 3 4096 row x 512 column x 8 bit Input buffer Output buffer Control logic & timing generator RAS CAS WE CKE CLK DQ0 to DQ7 DQM -2- Rev. 1.1/Apr.01 CS GM72V66841ET/ELT Absolute Maximum Ratings Parameter Voltage on any pin relative to VSS Supply voltage relative to V SS Short circuit output current Power dissipation Operating temperature Storage temperature Notes : 1. Respect to VS S Symbol VT V CC I OUT PT Topr Tstg Value -0.5 to Vcc+0.5 ( =VCC - 0.2 V IL
GM72V66841EXX
### 物料型号 - GM72V66841ET/ELT

### 器件简介 - GM72V66841ET/ELT是一款同步动态随机存取存储器,包含67,108,864个存储单元和逻辑电路,包括输入和输出电路,它们通过参考外部提供的时钟的正边沿同步运行。

### 引脚分配 - CLK: 时钟信号 - CKE: 时钟使能 - Cs: 芯片选择 - RAS: 行地址选通脉冲 - CAS: 列地址选通脉冲 - WE: 写使能 - A0-A9, A11: 地址输入 - A10/AP: 地址输入或自动预充电 - BA0/A13: 银行选择 - DQ0-DQ7: 数据输入/数据输出 - DQM: 数据输入/输出掩码 - VCCQ: DQ的电源 - VSSQ: DQ的地 - VCC: 内部电路的电源 - VSS: 内部电路的地 - NC: 无连接

### 参数特性 - 兼容性:PC133/PC100/PC66 - 时钟频率:143MHz/133MHz/125MHz/100MHz - 供电电压:3.3V单电源供电 - LVTTL接口 - 最大时钟频率:143/133/125/100MHz - 刷新周期:每64ms进行4,096次刷新 - 刷新操作:自动刷新/自刷新 - 突发访问能力:顺序/交错,长度1/2/4/8/FP - CAS延迟:2/3 - 4个银行可以独立或同时操作 - 突发读/写或突发读/单写操作能力 - 输入和输出掩码:通过DQM输入 - 连续读或写命令间隔的时钟:1个 - 同步掉电和时钟暂停能力:进入和退出时钟延迟均为1个时钟周期 - JEDEC标准54Pin 400mil TSOP II封装

### 功能详解 - 该SDRAM提供4个2,097,152字×8位的存储库,以实现高达143MHz的时钟频率下的高带宽。

### 应用信息 - 该SDRAM适用于需要高速数据访问和大容量存储的应用,如计算机内存、图形处理、网络通信等。

### 封装信息 - JEDEC标准54Pin 400mil TSOP II封装
GM72V66841EXX 价格&库存

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