HMP512U7FFP8C-S6

240pin DDR2 SDRAM Unbuffered DIMMs based on 512 Mb F ver. This Hynix unbuffered Dual In-Line Memory Module(DIMM) series consists of 512Mb C ver. DDR2 SDRAMs in Fine Ball Grid Array(FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 512Mb C ver. based DDR2 Unbuffered DIMM series provide a high performance 8 byte interface in 133.35mm width form factor of industry standard. It is suitable for easy interchange and addition. FEATURES • JEDEC standard Double Data Rate2 Synchronous DRAMs (DDR2 SDRAMs) with 1.8V +/0.1V Power Supply • All inputs and outputs are compatible with SSTL_1.8 interface • • • • • • 4 Bank architecture Posted CAS Programmable CAS Latency 3 , 4 , 5, 6 • OCD (Off-Chip Driver Impedance Adjustment) • ODT (On-Die Termination) Fully differential clock operations (CK & CK) Lead-free Products are RoHS compliant • • • • • • Programmable Burst Length 4 / 8 with both sequential and interleave mode Auto refresh and self refresh supported Partial Array Self Refresh supported 8192 refresh cycles / 64ms Serial presence detect with EEPROM DDR2 SDRAM Package: 60ball FBGA(64Mx8) 133.35 x 30.00 mm form factor ORDERING INFORMATION Part Name HMP512U6FFP8C-Y5/S5/S6 HMP564U7FFP8C-Y5/S5/S6 HMP512U7FFP8C-Y5/S5/S6 Density 1GB 512MB 1GB Organization 128Mx64 64Mx72 128Mx72 # of DRAMs 16 9 18 # of ranks 2 1 2 Materials Lead free Lead free Lead free ECC None ECC ECC This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 0.1 / Jun 2008 1 1240pin DDR2 SDRAM Unbuffered DIMMs SPEED GRADE & KEY PARAMETERS E3 (DDR2-400) Speed @CL3 Speed @CL4 Speed @CL5 Speed @CL6 CL-tRCD-tRP 400 533 3-3-3 C4 (DDR2-533) 533 533 4-4-4 Y5 (DDR2-667) 400 533 667 5-5-5 S5 (DDR2-800) 400 533 800 800 5-5-5 S6 (DDR2-800) 533 667 800 6-6-6 Unit Mbps Mbps Mbps Mbps tCK ADDRESS TABLE Density 512MB 1GB 1GB Organization Ranks 64M x 72 128M x 64 128M x 72 1 2 2 SDRAMs 64Mb x 8 64Mb x 8 64Mb x 8 # of DRAMs 9 16 18 # of row/bank/column Address 14(A0~A13)/2(BA0~BA1)/10(A0~A9) 14(A0~A13)/2(BA0~BA1)/10(A0~A9) 14(A0~A13)/2(BA0~BA1)/10(A0~A9) Refresh Method 8K / 64ms 8K / 64ms 8K / 64ms Rev. 0.1 / June 2008 2 1240pin DDR2 SDRAM Unbuffered DIMMs Input/Output Functional Description Symbol CK[2:0], CK[2:0] Type SSTL Polarity Differential Crossing Pin Description CK and /CK are differential clock inputs. All the DDR2 SDRAM addr/cntl inputs are sampled on the crossing of positive edge of CK and negative edge of /CK. Output(read) data is reference to the crossing of CK and /CK (Both directions of crossing) Activates the DDR2 SDRAM CK signal when high and deactivates the CK signal when low. By deactivating the clocks, CKE low initiates the Power Down mode or the Self Refresh mode. Enables the associated DDR2 SDRAM command decoder when low and disables the command decoder when high. When the command decoder is disabled, new commands are ignored but previous operations continue. Rank 0 is selected by S0; Rank 1 is selected by S1 CKE[1:0] SSTL Active High S[1:0] SSTL Active Low RAS, CAS, WE ODT[1:0] SSTL SSTL Supply Supply SSTL Active Low Active High /RAS,/CAS and /WE(ALONG WITH S) define the command being entered. Asserts on-die termination for DQ, DM, DQS and DQS signals if enabled via the DDR2 SDRAM mode register. Reference voltage for SSTL18 inputs Power supplies for the DDR2 SDRAM output buffers to provide improved noise immunity. For all current DDR2 unbuffered DIMM designs, VDDQ shares the same power plane as VDD pins. Vref VDDQ BA[2:0] - Selects which DDR2 SDRAM internal bank of four or eight is activated. During a Bank Activate command cycle, Address input defines the row address(RA0~RA15) During a Read or Write command cycle, Address input defines the column address when sampled at the cross point of the rising edge of CK and falling edge of CK. In addition to A[9:0], A10/AP, A[13:11] SSTL - the column address, AP is used to invoke autoprecharge operation at the end of the burst read or write cycle. If AP is high., autoprecharge is selected and BA0-BAn defines the bank to be precharged. If AP is low, autoprecharge is disabled. During a Precharge command cycle., AP is used in conjunction with BA0-BAn to control which bank(s) to precharge. If AP is high, all banks will be precharged regardless of the state of BA0-BAn inputs. If AP is low, then BA0-BAn are used to define which bank to precharge. DQ[63:0], CB[7:0] SSTL - Data and Check Bit Input/Output pins. DM is an input mask signal for write data. Input data is masked when DM is sampled High DM[8:0] SSTL Active High coincident with that input data during a write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. Power and ground for the DDR2 SDRAM input buffers, and core logic. VDD and VDDQ pins are tied to VDD/VDDQ planes on these modules. Data strobe for input and output data. For Rawcards using x16 organized DRAMs, DQ0~7 connect to the LDQS pin of the DRAMs and DQ8~15 connect to the UDQS pin of the DRAM These signals are tied at the system planar to either VSS or VDD to configure the serial SPD EEPROM. This is a bidirectional pin used to transfer data into or out of the SPD EEPROM. A resister must be connected to VDD to act as a pull up. This signal is used to clock data into and out of the SPD EEPROM. A resistor may be connected from SCL to VDD to act as a pull up on the system board. Power supply for SPD EEPROM. This supply is separate from the VDD/VDDQ power plane. EEPROM supply is operable from 1.7V to 3.6V. VDD,VSS DQS[8:0], DQS[8:0] SA[2:0] SDA SCL VDDSPD Supply Differential crossing Supply SSTL Rev. 0.1 / June 2008 3 1240pin DDR2 SDRAM Unbuffered DIMMs PIN CONFIGURATION Front Side 1 pin 64 pin 65 pin 120 pin 121 pin 184 pin 185 pin 240 pin Back Side PIN ASSIGNMENT Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Name VREF VSS DQ0 DQ1 VSS DQS0 DQS0 VSS DQ2 DQ3 VSS DQ8 DQ9 VSS DQS1 DQS1 VSS NC NC VSS DQ10 DQ11 Pin 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 Name VSS NC(CB0)* NC(CB1)* VSS NC(DQS8)* NC(DQS8)* VSS NC(CB2)* NC(CB3)* VSS VDDQ CKE0 VDD BA2 NC VDDQ A11 A7 VDD A5 A4 VDDQ Pin 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 Name DQ33 VSS DQS4 DQS4 VSS DQ34 DQ35 VSS DQ40 DQ41 VSS DQS5 DQS5 VSS DQ42 DQ43 VSS DQ48 DQ49 VSS SA2 NC,TEST1 Pin 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 Name VSS DQ4 DQ5 VSS DM0 NC VSS DQ6 DQ7 VSS DQ12 DQ13 VSS DM1 NC VSS CK1 CK1 VSS DQ14 DQ15 VSS Pin 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 Name NC(CB4)* NC(CB5)* VSS NC(DM8)* NC VSS NC(CB6)* NC(CB7)* VSS VDDQ CKE1 VDD A15 A14 VDDQ A12 A9 VDD A8 A6 VDDQ A3 Pin 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 Name VSS DM4 NC VSS DQ38 DQ39 VSS DQ44 DQ45 VSS DM5 NC VSS DQ46 DQ47 VSS DQ52 DQ53 VSS CK2 CK2 VSS * The pin names in parenthesizes are applied to DIMM with ECC only. Rev. 0.1 / June 2008 4 1240pin DDR2 SDRAM Unbuffered DIMMs PIN ASSIGNMENT(Continued) Pin 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Name VSS DQ16 DQ17 VSS DQS2 DQS2 VSS DQ18 DQ19 VSS DQ24 DQ25 VSS DQS3 DQS3 VSS DQ26 DQ27 Pin 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Name A2 VDD VSS VSS VDD NC VDD A10/AP BA0 VDDQ WE CAS VDDQ S1 ODT1 VDDQ VSS DQ32 Pin 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 Name VSS DQS6 DQS6 VSS DQ50 DQ51 VSS DQ56 DQ57 VSS DQS7 DQS7 VSS DQ58 DQ59 VSS SDA SCL Pin 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 Name DQ20 DQ21 VSS DM2 NC VSS DQ22 DQ23 VSS DQ28 DQ29 VSS DM3 NC VSS DQ30 DQ31 VSS Pin 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 Name A1 VDD CK0 CK0 VDD A0 VDD BA1 VDDQ RAS S0 VDDQ ODT0 A13 VDD VSS DQ36 DQ37 Pin 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 Name DM6 NC VSS DQ54 DQ55 VSS DQ60 DQ61 VSS DM7 NC VSS DQ62 DQ63 VSS VDDSPD SA0 SA1 *NC=No connect Notes : 1. The TEST pin is reserved for bus analysis tools and is not connected on standard memory module products(DIMMs). 2. NC Pins should not be connected to anything, including bussing within the NC group. Rev. 0.1 / June 2008 5 1240pin DDR2 SDRAM Unbuffered DIMMs FUNCTIONAL BLOCK DIAGRAM 512MB(64Mbx72) : HMP564U7FFP8C /S0 /DQS0 DQS0 DM0 DM /CS DQS /DQS /DQS4 DQS4 DM4 DM /CS DQS /DQS DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 /DQS1 DQS1 DM1 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D0 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 /DQS5 DQS5 DM5 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D4 DM /CS DQS /DQS DM /CS DQS /DQS DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 /DQS2 DQS2 DM2 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D1 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 /DQS6 DQS6 DM6 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D5 DM /CS DQS /DQS DM /CS DQS /DQS DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 /DQS3 DQS3 DM3 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D2 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 /DQS7 DQS7 DM7 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D6 DM /CS DQS /DQS DM /CS DQS /DQS DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 /DQS8 DQS8 DM8 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D3 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D7 Clock Signal Loads DM /CS DQS /DQS SCL SCL WP Serial PD A1 SA1 A1 SA2 A1 SDA Clock Input CK0, /CK0 CK1, /CK1 CK2, /CK2 SDRAMs 3 3 3 CB0 CB1 CB2 CB3 CB4 CB5 CB6 CB7 BA0-BA1 A0-A13 /RAS /CAS CKE0 /WE ODT0 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D8 A0 SA0 SDRAMS D0-7,D8 SDRAMS D0-7,D8 SDRAMS D0-7,D8 SDRAMS D0-7,D8 SDRAMS D0-7,D8 SDRAMS D0-7,D8 SDRAMS D0-7,D8 VDD SPD VDD /VDDQ VREF VSS Serial PD DO-D8 DO-D8 DO-D8 Notes: 1. DQ,DM,DQS,/DQS resistors : 22 Ω +/- 5 %. 2. Bax,Ax,/RAS,/CAS,/WE resistors : 5.1 Ω +/- 5 %. Rev. 0.1 / June 2008 6 1240pin DDR2 SDRAM Unbuffered DIMMs FUNCTIONAL BLOCK DIAGRAM 1GB(128Mbx64) : HMP512U6FFP8C /S1 /S0 / DQS0 DQS0 DM0 DM /CS DQS /DQS / I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM /CS DQS /DQS / DQS4 DQS4 DM4 DM /CS DQS /DQS DM I/ O 0 I/ O 1 I/ O 2 /CS DQS /DQS DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 / DQS1 DQS1 DM1 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D0 D8 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 / DQS5 DQS5 DM5 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D4 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D12 DM /CS DQS /DQS I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM /CS DQS /DQS DM /CS DQS /DQS DM I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 /CS DQS /DQS DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 / DQS2 DQS2 DM2 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D1 D9 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 / DQS6 DQS6 DM6 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D5 D13 DM /CS DQS /DQS I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM /CS DQS /DQS DM /CS DQS /DQS DM I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 /CS DQS /DQS DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 / DQS3 DQS3 DM3 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D2 D10 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 / DQS7 DQS7 DM7 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D6 D14 DM /CS DQS /DQS DM I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 /CS DQS /DQS DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D3 D11 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D7 D15 BA0-BA1 A0-A15 CKE0 CKE1 /CAS /RAS /WE ODT0 ODT1 SDRAMS D0-D15 SDRAMS D0-D15 SDRAMS D0-D7 SDRAMS D8-D15 SDRAMS D0-D15 SDRAMS D0-D15 SDRAMS D0-D15 SDRAMS D0-D7 SDRAMS D8-D15 SCL SCL WP A0 SA0 Serial PD A1 SA1 A1 SA2 Serial PD DO-D15 DO-D15 DO-D15 SDA Clock Signal Loads Clock Input CK0, /CK0 CK1, /CK1 CK2, /CK2 4SDRAMs 4 6 6 6 6 VDD SPD VDD /V DDQ V REF VSS Notes: 1. DQ,DM,DQS,/DQS resistors : 22 Ω +/- 5 %. 2. Bax,Ax,/RAS,/CAS,/WE resistors : 7.5 Ω +/- 5 %. Rev. 0.1 / June 2008 7 1240pin DDR2 SDRAM Unbuffered DIMMs FUNCTIONAL BLOCK DIAGRAM 1GB(128Mbx72) : HMP512U7FFP8C /S1 /S0 / DQS0 DQS0 DM0 DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S / DQS4 DQS4 DM4 DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 DM / CS DQ S / DQ S D Q0 D Q1 D Q2 D Q3 D Q4 D Q5 D Q6 DQ7 / DQS1 DQS1 DM1 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D0 D9 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ 39 / DQS5 DQS5 DM5 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D4 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D13 DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S D Q8 D Q9 DQ 10 DQ 11 DQ 12 DQ 13 DQ 14 DQ 15 / DQS2 DQS2 DM2 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D1 D10 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ 47 / DQ S6 DQ S6 DM6 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D5 D14 / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S DM / CS DQS / DQS I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S DQ 16 DQ 17 DQ 18 DQ 19 DQ 20 DQ 21 DQ 22 DQ 23 / DQS3 DQS3 DM3 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D2 D11 DQ 48 DQ 49 DQ 50 DQ 51 DQ 52 DQ 53 DQ 54 DQ 55 / DQS7 DQS7 DM7 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D6 D15 DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 DM / CS DQ S / DQ S DQ 24 DQ 25 DQ 26 DQ 27 DQ 28 DQ 29 DQ 30 DQ 31 / DQS8 DQS8 DM8 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D3 D12 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ 63 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D7 D 16 V D D S PD DM / CS DQ S / DQ S I/ O 0 I/ O 1 I/ O 2 V REF DM / CS DQ S / DQ S V DD /V D DQ Serial PD DO-D 17 DO-D 17 DO-D 17 Clock Signal Loads C lock Input C K0, /C K0 C K1, /C K1 C K2, /C K2 SDR AM s 6 6 6 C B0 C B1 C B2 C B3 C B4 C B5 C B6 CB7 BA0-BA1 A0-A13 CKE0 CKE1 /CAS /RAS /W E ODT0 ODT1 I/ O 0 I/ O 1 I/ O 2 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D8 I/ O 3 I/ O 4 I/ O 5 I/ O 6 I/ O 7 D17 S CL VSS SCL WP A0 S erial PD A1 S A1 A1 SA2 SDA SDR AM S D 0-D 17 SDR AM S D0-D 17 SDRAM S D 0-D8 SDR AM S D 9-D 17 SDR AM S D0-D 17 SDR AM S D 0-D 17 SDR AM S D 0-D 17 SD RAM S D0-D8 SDR AM S D9-D 17 SA0 Notes: 1. D Q ,DM ,DQ S,/DQ S resistors : 22 Ω + /- 5 % . 2. Bax,Ax,/R AS,/CAS,/W E resistors : 7.5 Ω + /- 5 % . Rev. 0.1 / June 2008 8 1240pin DDR2 SDRAM Unbuffered DIMMs ABSOLUTE MAXIMUM RATINGS Parameter Voltage on VDD pin relative to Vss Voltage on VDDQ pin relative to Vss Voltage on any pin relative to Vss Storage Temperature Storage Humidity(without condensation) Symbol VDD VDDQ VIN, VOUT TSTG HSTG Value - 1.0 V ~ 2.3 V - 0.5 V ~ 2.3 V - 0.5 V ~ 2.3 V -50 ~ +100 5 to 95 Unit V V V o Note 1 1 1 1 1 C % Note : 1. Stress greater than those listed may cause permanent damage to the device. This is a stress rating only, and device functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating con ditions for extended periods may affect reliablility. OPERATING CONDITIONS Parameter Symbol Rating Units o Notes DIMM Operating temperature(ambient) DIMM Barometric Pressure(operating & storage) DRAM Component Case Temperature Range TOPR PBAR TCASE 0 ~ +55 105 to 69 0 ~+95 C 1 2 K Pascal o C Notes : 1. Up to 9850 ft. 2. If the DRAM case temperature is Above 85oC, the Auto-Refresh command interval has to be reduced to tREFI=3.9us. For Measurement conditions of TCASE, please refer to the JEDEC document JESD51-2. DC OPERATING CONDITIONS Parameter Power Supply Voltage Input Reference Voltage EEPROM Supply Voltage Termination Voltage Input leakage current; any input 0V VIN VDD; all other balls not under test = 0V) Output leakage current; 0V VOUT VDDQ; DQ and ODT disabled Notes : (SSTL_1.8) Symbol VDD VDDQ VREF VDDSPD VTT II IOZ Min 1.7 1.7 0.49 x VDDQ 1.7 VREF-0.04 -2 -5 Max 1.9 1.9 0.51 x VDDQ 3.6 VREF+0.04 2 5 Unit V V V V V uA uA Note 1 2 3 1. VDDQ must be less than or equal to VDD. 2. Peak to peak ac noise on VREF may not exceed +/-2% VREF(dc) 3. VTT of transmitting device must track VREF of receiving device. Rev. 0.1 / June 2008 9 1240pin DDR2 SDRAM Unbuffered DIMMs INPUT DC LOGIC LEVEL Parameter Input High Voltage Input Low Voltage Symbol VIH(DC) VIL(DC) Min VREF + 0.125 -0.30 Max VDDQ + 0.3 VREF - 0.125 Unit V V Note INPUT AC LOGIC LEVEL DDR2 400, 533 Parameter AC Input logic High AC Input logic Low Symbol Min VIH(AC) VIL(AC) VREF + 0.250 Max VREF - 0.250 Min VREF + 0.200 Max VREF - 0.200 V V DDR2 667, 800 Unit Note AC INPUT TEST CONDITIONS Symbol VREF VSWING(MAX) SLEW Notes: 1. 2. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the device under test. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(ac) min for rising edges and the range from VREF to VIL(ac) max for falling edges as shown in the below figure. 3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions and VIH(ac) to VIL(ac) on the negative transitions. Condition Input reference voltage Input signal maximum peak to peak swing Input signal minimum slew rate Value 0.5 * VDDQ 1.0 1.0 Units V V V/ns Notes 1 1 2, 3 VSWING(MAX) VDDQ VIH(ac) min VIH(dc) min VREF VIL(dc) max VIL(ac) max VSS delta TR Rising Slew = VIH(ac) min - VREF delta TR delta TF < Figure : AC Input Test Signal Waveform > VREF - VIL(ac) max delta TF Falling Slew = Rev. 0.1 / June 2008 10 1240pin DDR2 SDRAM Unbuffered DIMMs Differential Input AC logic Level Symbol VID (ac) VIX (ac) Notes: 1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK, CK, DQS, DQS, LDQS, LDQS, UDQS and UDQS. 2. VID(DC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input (such as CK, DQS, LDQS or UDQS) level and VCP is the complementary input (such as CK, DQS, LDQS or UDQS) level. The minimum value is equal to VIH(DC) - VIL(DC). Parameter ac differential input voltage ac differential cross point voltage Min. 0.5 0.5 * VDDQ - 0.175 Max. VDDQ + 0.6 0.5 * VDDQ + 0.175 Units V V Note 1 2 VDDQ VTR VID VCP VSSQ < Differential signal levels > Notes: 1. VID(AC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal (such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as CK, DQS, LDQS or UDQS). The minimum value is equal to V IH(AC) - VIL(AC). 2. The typical value of VIX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VIX(AC) is expected to track variations in VDDQ . VIX(AC) indicates the voltage at whitch differential input signals must cross. Crossing point VIX or VOX DIFFERENTIAL AC OUTPUT PARAMETERS Symbol VOX (ac) Note: 1. The typical value of VOX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VOX(AC) is expected to track variations in VDDQ . VOX(AC) indicates the voltage at whitch differential output signals must cross. Parameter ac differential cross point voltage Min. 0.5 * VDDQ - 0.125 Max. 0.5 * VDDQ + 0.125 Units V Note 1 Rev. 0.1 / June 2008 11 1240pin DDR2 SDRAM Unbuffered DIMMs OUTPUT BUFFER LEVELS OUTPUT AC TEST CONDITIONS Symbol VOTR Note: 1. The VDDQ of the device under test is referenced. Parameter Output Timing Measurement Reference Level SSTL_18 0.5 * VDDQ Units V Notes 1 OUTPUT DC CURRENT DRIVE Symbol IOH(dc) IOL(dc) Notes: 1.VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ and VDDQ - 280 mV. 2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV. 3. The dc value of VREF applied to the receiving device is set to VTT 4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test device drive current capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are delivered to an SSTL_18 receiver. The actual current values are derived by shifting the desired driver operating point along a 21 ohm load line to define a convenient driver current for measurement. Parameter Output Minimum Source DC Current Output Minimum Sink DC Current SSTl_18 - 13.4 13.4 Units mA mA Notes 1, 3, 4 2, 3, 4 Rev. 0.1 / June 2008 12 1240pin DDR2 SDRAM Unbuffered DIMMs PIN Capacitance (VDD=1.8V,VDDQ=1.8V, TA=25℃. f=1MHz ) 512MB : HMP564U7FFP8C Pin CK, CK CKE, ODT,CS Address, RAS, CAS, WE DQ, DM, DQS, DQS Symbol Min Max Unit pF pF pF pF CCK CI1 CI2 CIO 22 63 43 6 30 85 66 9 1GB : HMP512U6FFP8C Pin CK, CK CKE, ODT,CS Address, RAS, CAS, WE DQ, DM, DQS, DQS Symbol Min Max Unit pF pF pF pF CCK CI1 CI2 CIO 22 64 50 8 35 87 88 13 1GB : HMP512U7FFP8C Pin CK, CK CKE, ODT,CS Address, RAS, CAS, WE DQ, DM, DQS, DQS Symbol Min Max Unit pF pF pF pF CCK CI1 CI2 CIO 23 65 52 9 35 89 92 13 Notes : 1. Pins not under test are tied to GND. 2. These value are guaranteed by design and tested on a sample basis only. Rev. 0.1 / June 2008 13 1240pin DDR2 SDRAM Unbuffered DIMMs IDD SPECIFICATIONS(TCASE : 0 to 95oC) 512MB, 64M x 72 ECC U - DIMM : HMP564U7FFP8C Symbol IDD0 IDD1 IDD2P IDD2Q IDD2N IDD3P(F) IDD3P(S) IDD3N IDD4W IDD4R IDD5B IDD6 IDD7 DDR2 667 675 765 72 315 360 270 108 495 900 990 990 72 1485 DDR2 800 720 810 72 315 360 270 108 495 1035 1125 1035 72 1575 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA 1 note 1GB, 128M x 64 U - DIMM : HMP512U6FFP8C Symbol IDD0 IDD1 IDD2P IDD2Q IDD2N IDD3P(F) IDD3P(S) IDD3N IDD4W IDD4R IDD5B IDD6 IDD7 DDR2 667 920 1000 128 560 640 480 192 880 1120 1200 1200 128 1640 DDR2 800 960 1040 128 560 640 480 192 880 1240 1320 1240 128 1720 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA 1 note Note : 1. IDD6 current values are guaranteed up to Tcase of 85℃ max. Rev. 0.1 / June 2008 14 1240pin DDR2 SDRAM Unbuffered DIMMs 1GB, 128M x 72 ECC U - DIMM : HMP512U7FFP8C Symbol IDD0 IDD1 IDD2P IDD2Q IDD2N IDD3P(F) IDD3P(S) IDD3N IDD4W IDD4R IDD5B IDD6 IDD7 DDR2 667 1035 1125 144 630 720 540 216 990 1260 1350 1350 144 1845 DDR2 800 1080 1170 144 630 720 540 216 990 1395 1485 1395 144 1935 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA 1 note Note : 1. IDD6 current values are guaranteed up to Tcase of 85℃ max. Rev. 0.1 / June 2008 15 1240pin DDR2 SDRAM Unbuffered DIMMs IDD MEASUREMENT CONDITIONS Symbol IDD0 Conditions Operating one bank active-precharge current; tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRASmin(IDD);CKE is HIGH, CS is HIGH between valid commands;Address bus inputs are SWITCHING;Data bus inputs are SWITCHING Operating one bank active-read-precharge curren ; IOUT = 0mA;BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD = tRCD(IDD) ; CKE is HIGH, CS is HIGH between valid commands ; Address bus inputs are SWITCHING ; Data pattern is same as IDD4W Precharge power-down current ; All banks idle ; tCK = tCK(IDD) ; CKE is LOW ; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING Precharge quiet standby current;All banks idle; tCK = tCK(IDD);CKE is HIGH, CS is HIGH; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING Precharge standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING Active power-down current; All banks open; tCK = tCK(IDD); CKE is Fast PDN Exit MRS(12) = 0 LOW; Other control and address bus inputs are STABLE; Data bus inputs Slow PDN Exit MRS(12) = 1 are FLOATING Active standby current; All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP =tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING;; Data pattern is same as IDD4W Burst refresh current; tCK = tCK(IDD); Refresh command at every tRFC(IDD) interval; CKE is HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING Self refresh current; CK and CK at 0V; CKE ≤ 0.2V; Other control and Normal address bus inputs are FLOATING; Data bus inputs are FLOATING. IDD6 Low Power current values are guaranteed up to Tcase of 85℃ max. Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), tRC = tRC(IDD), tRRD = tRRD(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; - Refer to the following page for detailed timing conditions Units mA IDD1 IDD2P IDD2Q IDD2N IDD3P mA mA mA mA mA mA mA IDD3N IDD4W mA IDD4R mA IDD5B mA IDD6 mA IDD7 mA Notes: 1. IDD specifications are tested after the device is properly initialized 2. Input slew rate is specified by AC Parametric Test Condition 3. IDD parameters are specified with ODT disabled. 4. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met with all combinations of EMRS bits 10 and 11. 5. Definitions for IDD LOW is defined as Vin ≤ VILAC(max) HIGH is defined as Vin ≥ VIHAC(min) STABLE is defined as inputs stable at a HIGH or LOW level FLOATING is defined as inputs at VREF = VDDQ/2 SWITCHING is defined as: inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control signals, and inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including masks or strobes. Rev. 0.1 / June 2008 16 1240pin DDR2 SDRAM Unbuffered DIMMs Electrical Characteristics & AC Timings Speed Bins and CL,tRCD,tRP,tRC and tRAS for Corresponding Bin Speed Bin(CL-tRCD-tRP) Parameter CAS Latency tRCD tRP tRAS tRC DDR2-800 5-5-5 min 5 12.5 12.5 45 57.25 DDR2-800 6-6-6 min 6 15 15 45 60 DDR2-667 4-4-4 min 4 12 12 45 57 DDR2-667 5-5-5 min 5 15 15 45 60 DDR2-533 3-3-3 min 3 11.25 11.25 45 56.25 DDR2-400 4-4-4 min 5 15 15 40 55 Unit ns ns ns ns ns AC Timing Parameters by Speed Grade DDR2-400 Parameter Symbol Min Data-Out edge to Clock edge Skew DQS-Out edge to Clock edge Skew Clock High Level Width Clock Low Level Width Clock Half Period System Clock Cycle Time DQ and DM input setup time(differential strobe) DQ and DM input hold time(differential strobe) DQ and DM input setup time(single ended strobe) DQ and DM input hold time(single ended strobe) Control & Address input Pulse Width for each input DQ and DM input pulse witdth for each input Data-out high-impedance window from CK, /CK DQS low-impedance time from CK/CK DQ low-impedance time from CK/CK DQS-DQ skew for DQS and associated DQ signals DQ hold skew factor DQ/DQS output hold time from DQS First DQS latching transition to associated clock edge DQS input high pulse width DQS input low pulse width tAC tDQSCK tCH tCL tHP tCK tDS tDH tDS1 tDH1 tIPW tDIPW tHZ tLZ(DQS) tLZ(DQ) tDQSQ tQHS tQH tDQSS tDQSH tDQSL Max Min Max DDR2-533 Unit Note -600 -500 0.45 0.45 min(tCL,tCH) 5000 150 275 25 25 0.6 0.35 tAC min 2*tAC min tHP - tQHS -0.25 0.35 0.35 +600 +500 0.55 0.55 8000 tAC max tAC max tAC max 350 450 + 0.25 - -500 -500 0.45 0.45 min (tCL,tCH) 3750 100 225 -25 -25 0.6 0.35 tAC min 2*tAC min tHP - tQHS -0.25 0.35 0.35 500 450 0.55 0.55 8000 tAC max tAC max tAC max 300 400 + 0.25 - ps ns CK CK ns ps ps ps ps ps tCK tCK ps ps ps ps ps ps tCK tCK tCK 1 1 1 1 Rev. 0.1 / June 2008 17 1240pin DDR2 SDRAM Unbuffered DIMMs - continued DDR2-400 Parameter Symbol Min DQS falling edge to CK setup time DQS falling edge hold time from CK Mode register set command cycle time Write postamble Write preamble Address and control input setup time Address and control input hold time Read preamble Read postamble Auto-Refresh to Active/Auto-Refresh command period Row Active to Row Active Delay for 1KB page size Row Active to Row Active Delay for 2KB page size Four Activate Window for 1KB page size Four Activate Window for 2KB page size CAS to CAS command delay Write recovery time Auto Precharge Write Recovery + Precharge Time Write to Read Command Delay Internal read to precharge command delay Exit self refresh to a non-read command Exit self refresh to a read command Exit precharge power down to any non-read command Exit active power down to read command Exit active power down to read command (Slow exit, Lower power) CKE minimum pulse width (high and low pulse width) ODT turn-on delay ODT turn-on ODT turn-on(Power-Down mode) ODT turn-off delay ODT turn-off t DDR2-533 Unit Max Min Max Note tDSS tDSH tMRD tWPST tWPRE tIS tIH tRPRE tRPST tRFC tRRD tRRD tFAW tFAW tCCD tWR tDAL tWTR tRTP tXSNR tXSRD tXP tXARD tXARDS tCKE tAOND t 0.2 0.2 2 0.4 0.35 350 475 0.9 0.4 105 7.5 10 37.5 50 2 15 WR+tRP 10 7.5 tRFC + 10 200 2 2 6 - AL 3 2 tAC(min) tAC(min)+2 2.5 tAC(min) 2.5 0.6 1.1 0.6 - 0.2 0.2 2 0.4 0.35 250 375 0.9 0.4 105 7.5 10 37.5 50 2 0.6 1.1 0.6 - tCK tCK tCK tCK tCK ps ps tCK tCK ns ns ns ns ns tCK - 15 tWR+tRP 7.5 7.5 tRFC + 10 - ns tCK ns ns ns - 200 2 2 6 - AL 3 - tCK tCK tCK tCK tCK 2 tAC(max)+1 2tCK+ tAC(max)+1 2.5 tAC(max)+0 .6 2.5 2 tAC(min) tAC(min)+2 2.5 tAC(min) tAC(min)+2 2 tAC(max)+1 2tCK+tAC(m ax)+1 2.5 tAC(max)+ 0.6 2.5tCK+tAC( max)+1 tCK ns ns tCK ns AON AONPD t AOFD t AOF ODT turn-off (Power-Down mode) t AOFPD ns Rev. 0.1 / June 2008 18 1240pin DDR2 SDRAM Unbuffered DIMMs - continued DDR2-400 Parameter Symbol Min ODT to power down entry latency tANPD Max Min Max tCK DDR2-533 Unit Note tAC(min) tAC(min)+2 3 8 - tAC(max)+0. 6 2.5tCK+ tAC(max)+1 3 8 0 tIS+tCK+tIH 12 ODT power down exit latency OCD drive mode output delay Minimum time clocks remains ON after CKE asynchronously drops LOW Average periodic Refresh Interval tAXPD tOIT tDelay tREFI tREFI tCK ns ns 7.8 3.9 - 7.8 3.9 us us 2 3 Notes : 1. For details and notes, please refer to the relevant HYNIX component datasheet (HY5PS12[8,16]21CFP). 2. 0°C ≤ TCASE ≤ 85°C 3. 85°C ＜ TCASE ≤ 95°C Rev. 0.1 / June 2008 19 1240pin DDR2 SDRAM Unbuffered DIMMs Parameter DQ output access time from CK/CK DQS output access time from CK/CK CK high-level width CK low-level width CK half period Clock cycle time, CL=x DQ and DM input setup time (differential strobe) Symbol tAC tDQSCK tCH tCL tHP tCK tDS tDH tIPW tDIPW tHZ tLZ(DQS) tLZ(DQ) tDQSQ tQHS tQH tDQSS tDQSH tDQSL tDSS tDSH tMRD tWPST tWPRE tIS tIH tRPRE tRPST tRAS tRRD tRRD tFAW tFAW DDR2-667 min -450 -400 0.45 0.45 min(tCL, tCH) 3000 100 175 0.6 0.35 tAC min 2*tAC min tHP - tQHS - 0.25 0.35 0.35 0.2 0.2 2 0.4 0.35 200 275 0.9 0.4 45 7.5 10 37.5 50 max +450 +400 0.55 0.55 8000 tAC max tAC max tAC max 240 340 + 0.25 0.6 1.1 0.6 70000 - DDR2-800 min -400 -350 0.45 0.45 min(tCL, tCH) 2500 50 125 0.6 0.35 tAC min 2*tAC min tHP - tQHS - 0.25 0.35 0.35 0.2 0.2 2 0.4 0.35 175 250 0.9 0.4 45 7.5 10 35 45 tAC max tAC max tAC max 200 300 + 0.25 0.6 1.1 0.6 70000 max +400 +350 0.55 0.55 - Unit ps ps tCK tCK ps ps ps ps tCK tCK ps ps ps ps ps ps tCK tCK tCK tCK tCK tCK tCK tCK ps ps tCK tCK ns ns ns ns ns Note 1 1 DQ and DM input hold time (differential strobe) Control & Address input pulse width for each input DQ and DM input pulse width for each input Data-out high-impedance time from CK/CK DQS low-impedance time from CK/CK DQ low-impedance time from CK/CK DQS-DQ skew for DQS and associated DQ signals DQ hold skew factor DQ/DQS output hold time from DQS First DQS latching transition to associated clock edge DQS input high pulse width DQS input low pulse width DQS falling edge to CK setup time DQS falling edge hold time from CK Mode register set command cycle time Write postamble Write preamble Address and control input setup time Address and control input hold time Read preamble Read postamble Activate to precharge command Active to active command period for 1KB page size products Active to active command period for 2KB page size products Four Active Window for 1KB page size products Four Active Window for 2KB page size products Rev. 0.1 / June 2008 20 1240pin DDR2 SDRAM Unbuffered DIMMs - continued Parameter CAS to CAS command delay Write recovery time Auto precharge write recovery + precharge time Internal write to read command delay Internal read to precharge command delay Exit self refresh to a non-read command Exit self refresh to a read command Exit precharge power down to any non-read command Exit active power down to read command Exit active power down to read command (Slow exit, Lower power) CKE minimum pulse width (high and low pulse width) ODT turn-on delay ODT turn-on ODT turn-on(Power-Down mode) ODT turn-off delay ODT turn-off ODT turn-off (Power-Down mode) ODT to power down entry latency ODT power down exit latency OCD drive mode output delay Minimum time clocks remains ON after CKE asynchronously drops LOW Average periodic Refresh Interval Symbol tCCD tWR tDAL tWTR tRTP tXSNR tXSRD tXP tXARD tXARDS tCKE t DDR2-667 min 2 15 WR+tRP 7.5 7.5 tRFC + 10 200 2 2 7 - AL 3 2 tAC(min) tAC(min)+2 2.5 tAC(min) tAC(min) +2 3 8 0 tIS+tCK+tIH 7.8 3.9 12 2 tAC(max) +0.7 2tCK+ tAC(max)+1 2.5 tAC(max)+ 0.6 2.5tCK+ tAC(max)+1 max 2 15 DDR2-800 min max - Unit Note tCK ns tCK ns ns ns WR+tRP 7.5 7.5 tRFC + 10 200 2 2 8 - AL 3 2 tAC(min) tAC(min) +2 2.5 tAC(min) tAC(min) +2 3 8 0 tIS+tCK +tIH - - tCK tCK tCK tCK tCK AOND tAON 2 tAC(max) +0.7 2tCK+ tAC(max)+1 2.5 tAC(max) +0.6 2.5tCK+ tAC(max)+1 tCK ns ns tCK ns ns tCK tCK tAONPD t AOFD t AOF tAOFPD tANPD tAXPD tOIT tDelay tREFI tREFI 12 ns ns 7.8 3.9 us us 2 3 Notes : 1. For details and notes, please refer to the relevant HYNIX component datasheet (HY5PS12[8,16]21CFP). 2. 0°C ≤ TCASE ≤ 85°C 3. 85°C ＜ TCASE ≤ 95°C Rev. 0.1 / June 2008 21 1240pin DDR2 SDRAM Unbuffered DIMMs PACKAGE OUTLINE 64Mx 72 - HMP564U7FFP8C Front 133.35 128.95 Side 2.7 max (Front) 4.0±0.1 30.0 Detail-A 5.175 63.0 (2) 2.5 5.0 Detail-B 5.175 55.0 1.27 ± 0.10 Back 17.80 10.0 3.0 3.0 Detail of Contacts A 0.20 0.20 Detail of Contacts B 2.50 3.80 1.50± 0.10 5.00 1.0 0.8± 0.05 Note) All dimensions are in millimeters unless otherwise stated. Rev. 0.1 / June 2008 2.50± 22 1240pin DDR2 SDRAM Unbuffered DIMMs PACKAGE OUTLINE 128Mx 64 - HMP512U6FFP8C Front 133.35 128.95 Side 4.00 max. 4.0±0.1 30.0 Detail-A 5.175 63.0 (2) 2.5 5.0 Detail-B 5.175 55.0 1.27 ± 0.10 Back 17.80 10.0 3.0 3.0 Detail of Contacts A 0.20 0.20 Detail of Contacts B 2.50 3.80 ± 1.50 0.10 5.00 1.0 0.8± 0.05 Note) All dimensions are in millimeters unless otherwise stated. Rev. 0.1 / June 2008 2.50± 23 1240pin DDR2 SDRAM Unbuffered DIMMs PACKAGE OUTLINE 128Mx 72 - HMP512U7FFP8C Front 133.35 128.95 Side 4.00 max. 4.0±0.1 30.0 Detail-A 5.175 63.0 (2) 2.5 5.0 Detail-B 5.175 55.0 1.27 ± 0.10 Back 17.80 10.0 3.0 3.0 Detail of Contacts A 0.20 0.20 Detail of Contacts B 2.50 3.80 1.50± 0.10 5.00 1.0 0.8± 0.05 Note) All dimensions are in millimeters unless otherwise stated. Rev. 0.1 / June 2008 2.50 ± 24 1240pin DDR2 SDRAM Unbuffered DIMMs REVISION HISTORY Revision 0.1 History First Version Release Date June. 2008 Remark Rev. 0.1 / June 2008 25