16-Lane 4-Port
Gen2 PCI Express® Switch
89HPES16T4AG2
Data Sheet
®
Device Overview
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC motherboards
– Supports Hot-Swap
The 89HPES16T4AG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES16T4AG2 is a 16-lane, 4port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connectivity and switching functions between a PCI Express upstream port and
up to three downstream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x8 or x4 upstream port
• Up to three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Port
Arbitration
Route Table
Scheduler
Transaction Layer
Transaction Layer
Transaction Layer
Transaction Layer
Data Link Layer
Data Link Layer
Data Link Layer
Data Link Layer
Multiplexer / Demultiplexer
Multiplexer / Demultiplexer
Multiplexer / Demultiplexer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
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DSC 6928
IDT 89HPES16T4AG2 Data Sheet
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Support PCI Express Power Management Interface specification (PCI-PM 2.0)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Specification, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Seven General Purpose Input/Output Pins
– Each pin may be individually configured as an input or output
– Each pin may be individually configured as an interrupt input
– Some pins have selectable alternate functions
Packaged in a 19mm x 19mm, 324-ball Flip Chip BGA with
1mm ball spacing
Product Description
Utilizing standard PCI Express interconnect, the PES16T4AG2
provides the most efficient fan-out solution for applications requiring high
throughput, low latency, and simple board layout with a minimum
number of board layers. It provides 16 GBps (128 Gbps) of aggregated,
full-duplex switching capacity through 16 integrated serial lanes, using
proven and robust IDT technology. Each lane provides 5 Gbps of bandwidth in both directions and is fully compliant with PCI Express Base
Specification, Revision 2.0.
The PES16T4AG2 is based on a flexible and efficient layered architecture. The PCI Express layer consists of SerDes, Physical, Data Link
and Transaction layers in compliance with PCI Express Base specification Revision 2.0. The PES16T4AG2 can operate either as a store and
forward or cut-through switch and is designed to switch memory and I/O
transactions. It supports eight Traffic Classes (TCs) and one Virtual
Channel (VC) with sophisticated resource management to enable efficient switching and I/O connectivity for servers, storage, and embedded
processors with limited connectivity.
Processor
Processor
Memory
Memory
Memory
Memory
North
Bridge
x8/x4
PES16T4AG2
x4
x4
PCI Express
Slot
I/O
10GbE
x4
I/O
10GbE
I/O
SATA
I/O
SATA
Figure 2 I/O Expansion Application
SMBus Interface
The PES16T4AG2 contains two SMBus interfaces. The slave interface provides full access to the configuration registers in the
PES16T4AG2, allowing every configuration register in the device to be
read or written by an external agent. The master interface allows the
default configuration register values of the PES16T4AG2 to be overridden following a reset with values programmed in an external serial
EEPROM. The master interface is also used by an external Hot-Plug I/O
expander.
Two pins make up each of the two SMBus interfaces. These pins
consist of an SMBus clock pin and an SMBus data pin. The Master
SMBus address is hardwired to 0x50, and the slave SMBus address is
hardwired to 0x77.
As shown in Figure 3, the master and slave SMBuses may be used
in a unified or split configuration. In the unified configuration, shown in
Figure 3(a), the master and slave SMBuses are tied together and the
PES16T4AG2 acts both as a SMBus master as well as a SMBus slave
on this bus. This requires that the SMBus master or processor that has
access to PES16T4AG2 registers supports SMBus arbitration. In some
systems, this SMBus master interface may be implemented using
general purpose I/O pins on a processor or micro controller, and may
not support SMBus arbitration. To support these systems, the
PES16T4AG2 may be configured to operate in a split configuration as
shown in Figure 3(b).
In the split configuration, the master and slave SMBuses operate as
two independent buses and thus multi-master arbitration is never
required. The PES16T4AG2 supports reading and writing of the serial
EEPROM on the master SMBus via the slave SMBus, allowing in
system programming of the serial EEPROM.
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IDT 89HPES16T4AG2 Data Sheet
PES16T4AG2
Processor
SMBus
Master
Serial
EEPROM
...
Other
SMBus
Devices
PES16T4AG2
SSMBCLK
SSMBDAT
SSMBCLK
SSMBDAT
MSMBCLK
MSMBDAT
MSMBCLK
MSMBDAT
Processor
SMBus
Master
...
Other
SMBus
Devices
Serial
EEPROM
(b) Split Configuration and Management Buses
(a) Unified Configuration and Management Bus
Figure 3 SMBus Interface Configuration Examples
Hot-Plug Interface
The PES16T4AG2 supports PCI Express Hot-Plug on each downstream port. To reduce the number of pins required on the device, the
PES16T4AG2 utilizes an external I/O expander, such as that used on PC motherboards, connected to the SMBus master interface. Following reset
and configuration, whenever the state of a Hot-Plug output needs to be modified, the PES16T4AG2 generates an SMBus transaction to the I/O
expander with the new value of all of the outputs. Whenever a Hot-Plug input changes, the I/O expander generates an interrupt which is received on
the IOEXPINTN input pin (alternate function of GPIO) of the PES16T4AG2. In response to an I/O expander interrupt, the PES16T4AG2 generates an
SMBus transaction to read the state of all of the Hot-Plug inputs from the I/O expander.
General Purpose Input/Output
The PES16T4AG2 provides 7 General Purpose Input/Output (GPIO) pins that may be used by the system designer as bit I/O ports. Each GPIO pin
may be configured independently as an input or output through software control. Some GPIO pins are shared with other on-chip functions. These
alternate functions may be enabled via software, SMBus slave interface, or serial configuration EEPROM.
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IDT 89HPES16T4AG2 Data Sheet
Pin Description
The following tables list the functions of the pins provided on the PES16T4AG2. Some of the functions listed may be multiplexed onto the same
pin. The active polarity of a signal is defined using a suffix. Signals ending with an “N” are defined as being active, or asserted, when at a logic zero
(low) level. All other signals (including clocks, buses, and select lines) will be interpreted as being active, or asserted, when at a logic one (high) level.
Signal
Type
Name/Description
PE0RP[3:0]
PE0RN[3:0]
I
PCI Express Port 0 Serial Data Receive. Differential PCI Express receive
pairs for port 0. Port 0 is the upstream port.
PE0TP[3:0]
PE0TN[3:0]
O
PCI Express Port 0 Serial Data Transmit. Differential PCI Express transmit pairs for port 0. Port 0 is the upstream port.
PE1RP[3:0]
PE1RN[3:0]
I
PCI Express Port 1 Serial Data Receive. Differential PCI Express receive
pairs for port 1.
PE1TP[3:0]
PE1TN[3:0]
O
PCI Express Port 1 Serial Data Transmit. Differential PCI Express transmit pairs for port 1.
PE2RP[3:0]
PE2RN[3:0]
I
PCI Express Port 2 Serial Data Receive. Differential PCI Express receive
pairs for port 2.
PE2TP[3:0]
PE2TN[3:0]
O
PCI Express Port 2 Serial Data Transmit. Differential PCI Express transmit pairs for port 2.
PE3RP[3:0]
PE3RN[3:0]
I
PCI Express Port 3 Serial Data Receive. Differential PCI Express receive
pairs for port 3.
PE3TP[3:0]
PE3TN[3:0]
O
PCI Express Port 3 Serial Data Transmit. Differential PCI Express transmit pairs for port 3.
PEREFCLKP
PEREFCLKN
I
PCI Express Reference Clock. Differential reference clock pair input. This
clock is used as the reference clock by on-chip PLLs to generate the clocks
required for the system logic and on-chip SerDes. The frequency of the differential reference clock is set at 100 MHz.
Table 1 PCI Express Interface Pins
Signal
Type
Name/Description
MSMBCLK
I/O
Master SMBus Clock. This bidirectional signal is used to synchronize
transfers on the master SMBus which operates at 400 KHz.
MSMBDAT
I/O
Master SMBus Data. This bidirectional signal is used for data on the master SMBus which operates at 400 KHz.
SSMBCLK
I/O
Slave SMBus Clock. This bidirectional signal is used to synchronize transfers on the slave SMBus.
SSMBDAT
I/O
Slave SMBus Data. This bidirectional signal is used for data on the slave
SMBus.
Table 2 SMBus Interface Pins
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IDT 89HPES16T4AG2 Data Sheet
Signal
Type
Name/Description
GPIO[0]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: P2RSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port 2.
GPIO[1]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
GPIO[2]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: IOEXPINTN0
Alternate function pin type: Input
Alternate function: I/O expander interrupt 0 input.
GPIO[7]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: GPEN
Alternate function pin type: Output
Alternate function: General Purpose Event (GPE) output
GPIO[8]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: P1RSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port 1
GPIO[9]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: P3RSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port 3
GPIO[10]
I/O
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Table 3 General Purpose I/O Pins
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IDT 89HPES16T4AG2 Data Sheet
Signal
Type
Name/Description
CCLKDS
I
Common Clock Downstream. The assertion of this pin indicates that all
downstream ports are using the same clock source as that provided to
downstream devices.This bit is used as the initial value of the Slot Clock
Configuration bit in all of the Link Status Registers for downstream ports.
The value may be overridden by modifying the SCLK bit in each downstream port’s PCIELSTS register.
CCLKUS
I
Common Clock Upstream. The assertion of this pin indicates that the
upstream port is using the same clock source as the upstream device. This
bit is used as the initial value of the Slot Clock Configuration bit in the Link
Status Register for the upstream port. The value may be overridden by
modifying the SCLK bit in the P0_PCIELSTS register.
P01MERGEN
I
Port 0 and 1 Merge. P01MERGEN is an active low signal. It is pulled high
internally via a 92K ohm resistor.
When this pin is low, port 0 is merged with port 1 to form a single x8 port.
The Serdes lanes associated with port 1 become lanes 4 through 7 of port
0. When this pin is high, port 0 and port 1 are not merged, and each operates as a single x4 port.
P23MERGEN
I
Port 2 and 3 Merge. P23MERGEN is an active low signal. It is pulled high
internally via a 92K ohm resistor.
When this pin is low, port 2 is merged with port 3 to form a single x8 port.
The Serdes lanes associated with port 3 become lanes 4 through 7 of port
2. When this pin is high, port 2 and port 3 are not merged, and each operates as a single x4 port.
PERSTN
I
Fundamental Reset. Assertion of this signal resets all logic inside
PES16T4AG2 and initiates a PCI Express fundamental reset.
SWMODE[2:0]
I
Switch Mode. These configuration pins determine the PES16T4AG2
switch operating mode.
0x0 - Normal switch mode
0x1 - Normal switch mode with Serial EEPROM initialization
0x2 - through 0x7 Reserved
These pins should be static and not change following the negation of
PERSTN.
Table 4 System Pins
Signal
Type
Name/Description
JTAG_TCK
I
JTAG Clock. This is an input test clock used to clock the shifting of data
into or out of the boundary scan logic or JTAG Controller. JTAG_TCK is
independent of the system clock with a nominal 50% duty cycle.
JTAG_TDI
I
JTAG Data Input. This is the serial data input to the boundary scan logic or
JTAG Controller.
Table 5 Test Pins (Part 1 of 2)
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IDT 89HPES16T4AG2 Data Sheet
Signal
Type
Name/Description
JTAG_TDO
O
JTAG Data Output. This is the serial data shifted out from the boundary
scan logic or JTAG Controller. When no data is being shifted out, this signal
is tri-stated.
JTAG_TMS
I
JTAG Mode. The value on this signal controls the test mode select of the
boundary scan logic or JTAG Controller.
JTAG_TRST_N
I
JTAG Reset. This active low signal asynchronously resets the boundary
scan logic and JTAG TAP Controller. An external pull-up on the board is
recommended to meet the JTAG specification in cases where the tester
can access this signal. However, for systems running in functional mode,
one of the following should occur:
1) actively drive this signal low with control logic
2) statically drive this signal low with an external pull-down on the board
Table 5 Test Pins (Part 2 of 2)
Signal
Type
Name/Description
REFRES0
I/O
Port 0 External Reference Resistor. Provides a reference for the Port 0
SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resistor should be connected from this pin to ground.
REFRES1
I/O
Port 1 External Reference Resistor. Provides a reference for the Port 1
SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resistor should be connected from this pin to ground.
REFRES2
I/O
Port 2 External Reference Resistor. Provides a reference for the Port 2
SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resistor should be connected from this pin to ground.
REFRES3
I/O
Port 3 External Reference Resistor. Provides a reference for the Port 3
SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resistor should be connected from this pin to ground.
VDDCORE
I
Core VDD. Power supply for core logic.
VDDI/O
I
I/O VDD. LVTTL I/O buffer power supply.
VDDPEA
I
PCI Express Analog Power. Serdes analog power supply (1.0V).
VDDPEHA
I
PCI Express Analog High Power. Serdes analog power supply (2.5V).
VDDPETA
I
PCI Express Transmitter Analog Voltage. Serdes transmitter analog
power supply (1.0V).
VSS
I
Ground.
Table 6 Power, Ground, and SerDes Resistor Pins
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IDT 89HPES16T4AG2 Data Sheet
Pin Characteristics
Note: Some input pads of the PES16T4AG2 do not contain internal pull-ups or pull-downs. Unused inputs should be tied off to appropriate
levels. This is especially critical for unused control signal inputs which, if left floating, could adversely affect operation. Also, any input pin left
floating can cause a slight increase in power consumption.
Function
I/O
Type
Internal
Resistor1
Type
Buffer
PE0RN[3:0]
I
Serial Link
PE0RP[3:0]
I
PCIe
differential2
PE0TN[3:0]
O
PE0TP[3:0]
O
PE1RN[3:0]
I
PE1RP[3:0]
I
PE1TN[3:0]
O
PE1TP[3:0]
O
PE2RN[3:0]
I
PE2RP[3:0]
I
PE2TN[3:0]
O
PE2TP[3:0]
O
PE3RN[3:0]
I
PE3RP[3:0]
I
PE3TN[3:0]
O
PE3TP[3:0]
O
PEREFCLKN
I
HCSL
PEREFCLKP
I
Diff. Clock
Input
MSMBCLK
I/O
STI3
pull-up on board
MSMBDAT
I/O
STI
pull-up on board
SSMBCLK
I/O
STI
pull-up on board
SSMBDAT
I/O
STI
pull-up on board
General Purpose I/O
GPIO[10:7, 2:0]
I/O
LVTTL
STI,
High Drive
pull-up
System Pins
CCLKDS
I
LVTTL
Input
pull-up
CCLKUS
I
Input
pull-up
P01MERGEN
I
PCI Express Interface
SMBus
EJTAG / JTAG
Pin Name
Notes
Refer to Table 8
pull-up
P23MERGEN
I
PERSTN
I
STI
pull-up
SWMODE[2:0]
I
Input
pull-down
JTAG_TCK
I
STI
pull-up
STI
pull-up
LVTTL
JTAG_TDI
I
JTAG_TDO
O
JTAG_TMS
I
STI
pull-up
JTAG_TRST_N
I
STI
pull-up
Table 7 Pin Characteristics (Part 1 of 2)
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IDT 89HPES16T4AG2 Data Sheet
Type
Buffer
I/O
Type
REFRES0
I/O
Analog
Input
REFRES1
I/O
REFRES2
I/O
REFRES3
I/O
Function
SerDes Reference
Resistors
Pin Name
Internal
Resistor1
Notes
Table 7 Pin Characteristics (Part 2 of 2)
1.
Internal resistor values under typical operating conditions are 92K Ω for pull-up and 90K Ω for pull-down.
2. All receiver pins set the DC common mode voltage to ground. All transmitters must be AC coupled to the media.
3. Schmitt Trigger Input (STI).
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IDT 89HPES16T4AG2 Data Sheet
Logic Diagram — PES16T4AG2
Reference
Clocks
PEREFCLKP
PEREFCLKN
PE0TP[0]
PE0TN[0]
PE0RP[0]
PE0RN[0]
PE0RP[3]
PE0RN[3]
PE0TP[3]
PE0TN[3]
PCI Express
Switch
SerDes Input
Port 1
PE1RP[0]
PE1RN[0]
PE1TP[0]
PE1TN[0]
PE1RP[3]
PE1RN[3]
PE1TP[3]
PE1TN[3]
PCI Express
Switch
SerDes Input
Port 2
PE2RP[0]
PE2RN[0]
PE2TP[0]
PE2TN[0]
PE2RP[3]
PE2RN[3]
PE2TP[3]
PE2TN[3]
PCI Express
Switch
SerDes Input
Port 3
PE3RP[0]
PE3RN[0]
PE3TP[0]
PE3TN[0]
...
...
PCI Express
Switch
SerDes Input
Port 0
...
...
...
...
...
...
PE3RP[3]
PE3RN[3]
PE3TP[3]
PE3TN[3]
PES16T4AG2
7
Master
SMBus Interface
Slave
SMBus Interface
System
Pins
MSMBCLK
MSMBDAT
JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_TRST_N
SSMBCLK
SSMBDAT
CCLKDS
CCLKUS
P01MERGEN
P23MERGEN
PERSTN
SWMODE[2:0]
GPIO[10:7,2:0]
REFRES0
REFRES1
REFRES2
REFRES3
3
PCI Express
Switch
SerDes Output
Port 0
PCI Express
Switch
SerDes Output
Port 1
PCI Express
Switch
SerDes Output
Port 2
PCI Express
Switch
SerDes Output
Port 3
General Purpose
I/O
JTAG Pins
SerDes
Reference
Resistors
VDDCORE
VDDI/O
VDDPEA
VDDPEHA
VSS
Power/Ground
VDDPETA
Figure 4 PES16T4AG2 Logic Diagram
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IDT 89HPES16T4AG2 Data Sheet
System Clock Parameters
Values based on systems running at recommended supply voltages and operating temperatures, as shown in Tables 12 and 14.
Parameter
Description
Condition
Min
Typical
Max
Unit
100
1001
MHz
RefclkFREQ
Input reference clock frequency range
TC-RISE
Rising edge rate
Differential
0.6
4
V/ns
TC-FALL
Falling edge rate
Differential
0.6
4
V/ns
VIH
Differential input high voltage
Differential
+150
VIL
Differential input low voltage
Differential
VCROSS
Absolute single-ended crossing point
voltage
Single-ended
VCROSS-DELTA
Variation of VCROSS over all rising clock
edges
Single-ended
VRB
Ring back voltage margin
Differential
-100
TSTABLE
Time before VRB is allowed
Differential
500
TPERIOD-AVG
Average clock period accuracy
-300
2800
ppm
TPERIOD-ABS
Absolute period, including spread-spectrum and jitter
9.847
10.203
ns
TCC-JITTER
Cycle to cycle jitter
150
ps
VMAX
Absolute maximum input voltage
+1.15
V
VMIN
Absolute minimum input voltage
-0.3
Duty Cycle
Duty cycle
40
Rise/Fall Matching
Single ended rising Refclk edge rate versus falling Refclk edge rate
ZC-DC
Clock source output DC impedance
mV
+250
-150
mV
+550
mV
+140
mV
+100
mV
ps
V
60
20
%
%
40
60
Ω
Table 8 Input Clock Requirements
1.
The input clock frequency is set at 100 MHz.
AC Timing Characteristics
Parameter
Gen 1
Description
Gen 2
Min1
Typ1
Max1
Min1
Typ1
Max1
399.88
400
400.12
199.94
200
200.06
Units
PCIe Transmit
UI
Unit Interval
TTX-EYE
Minimum Tx Eye Width
TTX-EYE-MEDIAN-toMAX-JITTER
Maximum time between the jitter median and maximum
deviation from the median
TTX-RISE, TTX-FALL
TX Rise/Fall Time: 20% - 80%
TTX- IDLE-MIN
Minimum time in idle
0.75
0.75
0.125
ps
UI
UI
0.125
0.15
UI
20
20
UI
Table 9 PCIe AC Timing Characteristics (Part 1 of 2)
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IDT 89HPES16T4AG2 Data Sheet
Parameter
Gen 1
Description
Min1
1
Typ
Gen 2
1
Max
1
Min
Typ1
Max1
Units
TTX-IDLE-SET-TO-IDLE Maximum time to transition to a valid Idle after sending
an Idle ordered set
8
8
ns
TTX-IDLE-TO-DIFF-
8
8
ns
1.3
1.3
ns
Maximum time to transition from valid idle to diff data
DATA
TTX-SKEW
Transmitter data skew between any 2 lanes
TMIN-PULSED
Minimum Instantaneous Lone Pulse Width
NA
TTX-HF-DJ-DD
Transmitter Deterministic Jitter > 1.5MHz Bandwidth
NA
0.15
UI
TRF-MISMATCH
Rise/Fall Time Differential Mismatch
NA
0.1
UI
200.06
ps
0.9
UI
PCIe Receive
UI
Unit Interval
399.88
400
400.12
TRX-EYE (with jitter)
Minimum Receiver Eye Width (jitter tolerance)
TRX-EYE-MEDIUM TO
Max time between jitter median & max deviation
0.3
TRX-SKEW
Lane to lane input skew
20
TRX-HF-RMS
1.5 — 100 MHz RMS jitter (common clock)
TRX-HF-DJ-DD
0.4
199.94
0.4
UI
UI
MAX JITTER
8
ns
NA
3.4
ps
Maximum tolerable DJ by the receiver (common clock)
NA
88
ps
TRX-LF-RMS
10 kHz to 1.5 MHz RMS jitter (common clock)
NA
4.2
ps
TRX-MIN-PULSE
Minimum receiver instantaneous eye width
NA
0.6
UI
Table 9 PCIe AC Timing Characteristics (Part 2 of 2)
1.
Minimum, Typical, and Maximum values meet the requirements under PCI Specification 2.0
Signal
Symbol
Reference
Min Max Unit
Edge
Timing
Diagram
Reference
GPIO
GPIO[10:7,2:0]1
Tpw2
None
50
—
ns
Table 10 GPIO AC Timing Characteristics
1.
GPIO signals must meet the setup and hold times if they are synchronous or the minimum pulse width if
they are asynchronous.
2.
The values for this symbol were determined by calculation, not by testing.
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IDT 89HPES16T4AG2 Data Sheet
Signal
Symbol
Reference
Edge
Min
Max
Unit
Timing
Diagram
Reference
Tper_16a
none
50.0
—
ns
See Figure 5.
10.0
25.0
ns
2.4
—
ns
1.0
—
ns
—
20
ns
—
20
ns
25.0
—
ns
JTAG
JTAG_TCK
Thigh_16a,
Tlow_16a
JTAG_TMS1,
JTAG_TDI
Tsu_16b
JTAG_TCK rising
Thld_16b
JTAG_TDO
Tdo_16c
Tdz_16c
JTAG_TRST_N
JTAG_TCK falling
2
Tpw_16d2
none
Table 11 JTAG AC Timing Characteristics
1. The
JTAG specification, IEEE 1149.1, recommends that JTAG_TMS should be held at 1 while the signal applied at JTAG_TRST_N
changes from 0 to 1. Otherwise, a race may occur if JTAG_TRST_N is deasserted (going from low to high) on a rising edge of JTAG_TCK
when JTAG_TMS is low, because the TAP controller might go to either the Run-Test/Idle state or stay in the Test-Logic-Reset state.
2. The values for this symbol were determined by calculation, not by testing.
Tlow_16a
Tper_16a
Thigh_16a
JTAG_TCK
Thld_16b
Tsu_16b
JTAG_TDI
Thld_16b
Tsu_16b
JTAG_TMS
Tdo_16c
Tdz_16c
JTAG_TDO
Tpw_16d
JTAG_TRST_N
Figure 5 JTAG AC Timing Waveform
13 of 32
June 2, 2015
IDT 89HPES16T4AG2 Data Sheet
Recommended Operating Supply Voltages
Symbol
Parameter
Minimum
Typical
Maximum
Unit
0.9
1.0
1.1
V
VDDCORE
Internal logic supply
VDDI/O
I/O supply except for SerDes LVPECL/CML
3.135
3.3
3.465
V
VDDPEA1
PCI Express Analog Power
0.95
1.0
1.1
V
2
PCI Express Analog High Power
2.25
2.5
2.75
V
1
VDDPETA
PCI Express Transmitter Analog Voltage
0.95
1.0
1.1
V
VSS
Common ground
0
0
0
V
VDDPEHA
Table 12 PES16T4AG2 Operating Voltages
VDDPEA and VDDPETA should have no more than 25mVpeak-peak AC power supply noise superimposed on the 1.0V nominal DC
value.
1.
2. V PEHA should have no more than 50mV
DD
peak-peak AC power supply noise superimposed on the 2.5V nominal DC value.
Absolute Maximum Voltage Rating
Core Supply
PCIe Analog
Supply
PCIe Analog
High Supply
PCIe
Transmitter
Supply
I/O Supply
1.5V
1.5V
4.6V
1.5V
4.6V
Table 13 PES16T4AG2 Absolute Maximum Voltage Rating
Warning: For proper and reliable operation in adherence with this data sheet, the device should not exceed the recommended operating voltages
in Table 12. The absolute maximum operating voltages in Table 13 are offered to provide guidelines for voltage excursions outside the recommended
voltage ranges. Device functionality is not guaranteed at these conditions and sustained operation at these values or any exposure to voltages outside
the maximum range may adversely affect device functionality and reliability.
Power-Up/Power-Down Sequence
During power supply ramp-up, VDDCORE must remain at least 1.0V below VDDI/O at all times. There are no other power-up sequence requirements for the various operating supply voltages.
The power-down sequence can occur in any order.
Recommended Operating Temperature
Grade
Temperature
Commercial
0°C to +70°C Ambient
Industrial
-40°C to +85°C Ambient
Table 14 PES16T4AG2 Operating Temperatures
14 of 32
June 2, 2015
IDT 89HPES16T4AG2 Data Sheet
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 12
(and also listed below).
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 12 (and also listed below).
Core Supply
PCIe Analog
Supply
PCIe Analog
High Supply
PCIe Termination Supply
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
2.5V
Max
2.75V
Typ
1.0V
Max
1.1V
Typ
3.3V
Max
3.465V
mA
413
905
901
963
110
123
360
429
2
2
Watts
0.41
1.0
0.90
1.06
0.28
0.34
0.36
0.47
0.007
0.007
mA
413
905
901
963
110
123
180
215
2
2
Watts
0.41
1.0
0.90
1.06
0.28
0.34
0.18
0.24
0.01
0.01
Number of active
Lanes per Port
8/4/4
4/4/4/4
I/O Supply
Total
Typ
Power
Max
Power
1.96
2.87
1.78
2.64
Table 15 PES16T4AG2 Power Consumption
Thermal Considerations
This section describes thermal considerations for the PES16T4AG2 (19mm2 FCBGA324 package). The data in Table 16 below contains information that is relevant to the thermal performance of the PES16T4AG2 switch.
Symbol
TJ(max)
TA(max)
θJA(effective)
Parameter
Value
Units
Conditions
125
oC
Maximum
70
oC
Maximum
16.8
oC/W
Zero air flow
10.1
oC/W
1 m/S air flow
9.2
oC/W
2 m/S air flow
Junction Temperature
Ambient Temperature
Effective Thermal Resistance, Junction-to-Ambient
θJB
Thermal Resistance, Junction-to-Board
4.1
oC/W
θJC
Thermal Resistance, Junction-to-Case
0.3
o
P
Power Dissipation of the Device
2.87
Watts
C/W
Maximum
Table 16 Thermal Specifications for PES16T4AG2, 19x19 mm FCBGA324 Package
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the TJ(max) value
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (θJA) for the worst case scenario must be
maintained below the value determined by the formula:
θJA = (TJ(max) - TA(max))/P
Given that the values of TJ(max), TA(max), and P are known, the value of desired θJA becomes a known entity to the system designer. How to
achieve the desired θJA is left up to the board or system designer, but in general, it can be achieved by adding the effects of θJC (value
provided in Table 16), thermal resistance of the chosen adhesive (θCS), that of the heat sink (θSA), amount of airflow, and properties of the
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4”x12” AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
15 of 32
June 2, 2015
IDT 89HPES16T4AG2 Data Sheet
DC Electrical Characteristics
Values based on systems running at recommended supply voltages, as shown in Table 12.
Note: See Table 7, Pin Characteristics, for a complete I/O listing.
I/O Type
Serial Link
Parameter
Description
Gen1
Min1
Typ1
Gen2
Max1
Min1
Typ1
Unit
Conditions
Max1
PCIe Transmit
VTX-DIFFp-p
Differential peak-to-peak output
voltage
800
1200
800
1200
mV
VTX-DIFFp-p-LOW
Low-Drive Differential Peak to
Peak Output Voltage
400
1200
400
1200
mV
VTX-DE-RATIO-
De-emphasized differential output
voltage
-3
-4
-3.0
-3.5
-4.0
dB
-5.5
-6.0
-6.5
dB
3.6
V
3.5dB
6.0dB
De-emphasized differential output
voltage
VTX-DC-CM
DC Common mode voltage
VTX-CM-ACP
RMS AC peak common mode
output voltage
VTX-DE-RATIO-
NA
0
3.6
0
20
mV
VTX-CM-DC-active- Abs delta of DC common mode
voltage between L0 and idle
idle-delta
100
100
mV
Abs delta of DC common mode
voltage between D+ and D-
25
25
mV
delta
VTX-Idle-DiffP
Electrical idle diff peak output
20
20
mV
RLTX-DIFF
Transmitter Differential Return
loss
10
10
dB
0.05 - 1.25GHz
8
dB
1.25 - 2.5GHz
RLTX-CM
Transmitter Common Mode
Return loss
6
6
dB
ZTX-DIFF-DC
DC Differential TX impedance
80
120
Ω
VTX-CM-ACpp
Peak-Peak AC Common
100
mV
VTX-DC-CM
Transmit Driver DC Common
Mode Voltage
3.6
V
600
mV
VTX-CM-DC-line-
100
NA
0
3.6
VTX-RCV-DETECT The amount of voltage change
allowed during Receiver Detection
ITX-SHORT
Transmitter Short Circuit Current
Limit
120
0
600
0
90
90
mA
Table 17 DC Electrical Characteristics (Part 1 of 2)
16 of 32
June 2, 2015
IDT 89HPES16T4AG2 Data Sheet
I/O Type
Serial Link
(cont.)
Parameter
Description
Gen1
Min1
Typ1
Gen2
Max1
Min1
1200
120
Typ1
Unit
Conditions
Max1
PCIe Receive
VRX-DIFFp-p
Differential input voltage (peak-topeak)
175
RLRX-DIFF
Receiver Differential Return Loss
10
1200
mV
10
dB
8
RLRX-CM
Receiver Common Mode Return
Loss
6
ZRX-DIFF-DC
Differential input impedance (DC)
80
100
ZRX--DC
DC common mode impedance
40
50
ZRX-COMM-DC
Powered down input common
mode impedance (DC)
200k
350k
1.25 - 2.5GHz
6
dB
120
Refer to return loss spec
Ω
60
40
60
Ω
50k
Ω
ZRX-HIGH-IMP-DC- DC input CM input impedance for
V>0 during reset or power down
POS
50k
50k
Ω
ZRX-HIGH-IMP-DC- DC input CM input impedance for
V
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