ZSC31150
Fast Automotive Sensor Signal Conditioner
Brief Description
Benefits
The ZSC31150 is a CMOS integrated circuit for highly accurate
amplification and sensor-specific correction of bridge sensor
signals. Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity is accomplished via an internal
16-bit RISC microcontroller running a correction algorithm, with
calibration coefficients stored in an EEPROM.
The ZSC31150 is adjustable to nearly all bridge sensor types.
Measured values are provided at the analog voltage output or at
the digital ZACwire™ and I2C interface. The digital interface can
be used for a simple PC-controlled calibration procedure in order
to program a set of calibration coefficients into an on-chip
EEPROM. A specific sensor and a ZSC31150 can be mated
digitally: fast, precise, and without the cost overhead associated
with trimming by external devices or a laser.
Features
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Adjustable to nearly all bridge sensor types
Analog gain of up to 420
Output options: ratiometric analog voltage output (5% to 95%
maximum, 12.4-bit resolution) or ZACwire™ (digital one-wireinterface)
Temperature compensation: internal or external diode, bridge
resistance, thermistor
Sensor biasing by voltage or constant current
Sample rate: up to 7.8kHz
High voltage protection up to 33V
Supply current: max. 5.5mA
Reverse polarity and short-circuit protection
Wide operation temperature depending on part number: up to
-40°C to +150°C
Traceability by user-defined EEPROM entries
Safety and diagnostic functions
Evaluation Kits
Application Notes
Mass Calibration System
Physical Characteristics
Supply voltage: 4.5V to 5.5V
Operation temperature: -40°C to 125°C
(-40°C to +150°C extended temperature range)
Available as 14-DFN (5 4 mm; wettable flanks), SSOP14,
and die
ZSC31150 Application Circuit
Out / OWI
C3
47nF
Sensor Bridge
VDDE
7
9 AOUT
VDD
6
n.c.
5
SCL
4
SCL
SDA 3
SDA
10 VBN
11 VBR_B
12 VBP
C4
C5
C2
100nF
8 VSSE
ZSC31150
No external trimming components required
Only a few external protection devices needed
PC-controlled configuration and single pass calibration via
I2C or ZACwire™ interface: simple, cost efficient, quick, and
precise
End-of-line calibration via I2C or ZACwire™ interface
High accuracy (0.25% FSO at -25 to 85°C; 0.5% FSO
at -40°C to 125°C)
Excellent EMC/ESD robustness and AEC-Q100 qualification
Available Support
Datasheet
+4.5V to +5.5V
GND
VSUPP
Serial Interface
13 VBR_T
VSSA 2
14 IRTEMP
VDDA 1
C1
100nF
Temperature Sensor
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
ZSC31150
Block Diagram
PGA
MUX
RAM
ADC
TS
Analog Block
Digital Block
ZACwire™
I2C
EEPROM
CMC
ROM
DAC
BAMP
Digital
Data I/O
Analog
Out
ZSC31150
Ordering Information
Sales Code
Description
Package
ZSC31150GE
ZSC31150 Die – Temperature range: -40°C to +150°C
Unsawn on Wafer: add “B” to sales code
Sawn on Wafer Frame: add “C”
Waffle Pack: add “D”
ZSC31150GEG2-R
ZSC31150 14-DFN (5 4 mm; wettable flanks) – Temperature
range: -40°C to 150°C
Tape and Reel
ZSC31150GAG2-R
ZSC31150 14-DFN (5 4 mm; wettable flanks) – Temperature
range: -40°C to 125°C
Tape and Reel
ZSC31150GAB
ZSC31150 Die – Temperature range: -40°C to +125°C
Unsawn on Wafer
ZSC31150GAC
ZSC31150 Die – Temperature range: -40°C to +125°C
Sawn on Wafer Frame
ZSC31150GEG1
ZSC31150 14-SSOP – Temperature range: -40°C to +150°C
ZSC31150GLG1
ZSC31150 14-SSOP – Temperature range: -40°C to +150°C
(Long life: 5000h @150°C)
Tube: add “-T” to sales code
Tape & Reel: add “-R”
ZSC31150GAG1
ZSC31150 14-SSOP – Temperature range: -40°C to +125°C
ZSC31150KITV1P2
ZSC31150 SSC Evaluation Kit V1.2: Three interconnecting boards, five ZSC31150 SSOP14 samples, USB cable
(software can be downloaded from product page at www.IDT.com/ZSC31150)
ZSC31150MCSV1P1
Modular Mass Calibration System (MSC) V1.1 for ZSC31150: MCS boards, cable, connectors (software can be
downloaded from product page)
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
Contents
1.
Electrical Characteristics ..............................................................................................................................................................................5
1.1 Absolute Maximum Ratings .................................................................................................................................................................5
1.2 Operating Conditions ...........................................................................................................................................................................5
1.3 Electrical Parameters ..........................................................................................................................................................................6
1.3.1
Supply Current and System Operation Conditions ...............................................................................................................6
1.3.2
Analog Front-End (AFE) Characteristics ..............................................................................................................................6
1.3.3
Temperature Measurement [b] ...............................................................................................................................................6
1.3.4
Analog-to-Digital Conversion (ADC) .....................................................................................................................................7
1.3.5
Sensor Connection Check ....................................................................................................................................................7
1.3.6
Digital-to-Analog Conversion (DAC) and Analog Output (AOUT Pin) ..................................................................................7
1.3.7
System Response ................................................................................................................................................................8
1.4 Interface Characteristics and EEPROM ..............................................................................................................................................8
2.
1.4.1
I2C Interface [a] ......................................................................................................................................................................8
1.4.2
ZACwire™ One Wire Interface (OWI) ..................................................................................................................................9
1.4.3
EEPROM ..............................................................................................................................................................................9
Circuit Description ......................................................................................................................................................................................10
2.1 Signal Flow ........................................................................................................................................................................................10
2.2 Application Modes .............................................................................................................................................................................10
2.3 Analog Front End (AFE) ....................................................................................................................................................................11
2.3.1
Programmable Gain Amplifier (PGA) .................................................................................................................................11
2.3.2
Offset Compensation ..........................................................................................................................................................11
2.3.3
Measurement Cycle............................................................................................................................................................12
2.3.4
Analog-to-Digital Converter ................................................................................................................................................13
2.4 Temperature Measurement ...............................................................................................................................................................15
2.5 System Control and Conditioning Calculation ...................................................................................................................................15
2.5.1
Operation Modes ................................................................................................................................................................15
2.5.2
Start Up Phase ...................................................................................................................................................................15
2.5.3
Conditioning Calculation .....................................................................................................................................................16
2.6 Analog Output AOUT.........................................................................................................................................................................16
2.7 Serial Digital Interface .......................................................................................................................................................................16
2.8 Failsafe Features, Watchdog and Error Detection.............................................................................................................................17
2.9 High Voltage, Reverse Polarity, and Short Circuit Protection ............................................................................................................17
3.
Application Circuit Examples ......................................................................................................................................................................18
4.
Pin Configuration, Latch-Up and ESD Protection .......................................................................................................................................20
4.1 Pin Configuration and Latch-up Conditions .......................................................................................................................................20
4.2 ESD Protection ..................................................................................................................................................................................20
5.
Package......................................................................................................................................................................................................21
5.1 SSOP14 Package..............................................................................................................................................................................21
5.2 14-DFNPackage ................................................................................................................................................................................21
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
6.
Quality and Reliability .................................................................................................................................................................................22
7.
Customization .............................................................................................................................................................................................22
8.
Ordering Information...................................................................................................................................................................................23
9.
Related Documents and Tools ...................................................................................................................................................................23
10. Glossary .....................................................................................................................................................................................................24
11. Document Revision History ........................................................................................................................................................................25
List of Figures
Figure 2.1 Block Diagram of the ZSC31150 .......................................................................................................................................................10
Figure 2.2 Measurement Cycle...........................................................................................................................................................................13
Figure 3.1 Bridge in Voltage Mode, External Diode Temperature Sensor ..........................................................................................................18
Figure 3.2 Bridge in Voltage Mode, External Thermistor ....................................................................................................................................19
Figure 3.3 Bridge in Current Mode, Temperature Measurement via Bridge TC .................................................................................................19
Figure 5.1 SSOP14 Pin Diagram ........................................................................................................................................................................21
Figure 5.2 Outline Drawing for 14-DFN Package with Wettable Flanks .............................................................................................................22
List of Tables
Table 1.1 Absolute Maximum Ratings .................................................................................................................................................................5
Table 1.2 Operating Conditions ...........................................................................................................................................................................5
Table 1.3 Electrical Parameters ..........................................................................................................................................................................6
Table 1.4 Interface and EEPROM Characteristics ..............................................................................................................................................8
Table 2.1 Adjustable Gains, Resulting Sensor Signal Spans, and Common Mode Ranges .............................................................................11
Table 2.2 Analog Zero Point Shift Ranges (XZC) ..............................................................................................................................................12
Table 2.3 Analog Output Resolution versus Sample Rate ................................................................................................................................14
Table 3.1 Application Circuit Parameters ..........................................................................................................................................................18
Table 4.1 Pin Configuration and Latch-Up Conditions.......................................................................................................................................20
Table 5.1 14-DFN Package Dimensions ...........................................................................................................................................................22
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
1.
Electrical Characteristics
1.1 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. The ZSC31150 might not function or be operable above the recommended operating
conditions. Stresses exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses
above the recommended operating conditions might affect device reliability. IDT does not recommend designing to the “Absolute Maximum
Ratings.”
Parameters apply in operation temperature range and without time limitations.
Table 1.1
No.
Absolute Maximum Ratings
Parameter
Symbol
Conditions
Min
Max
Unit
1.1.1
Supply voltage [a]
VDDE
To VSSE.
-33
33
VDC
1.1.2
Potential at the AOUT pin [a]
VOUT
Relative to VSSE.
-33
33
VDC
1.1.3
Analog supply voltage [a]
VDDA
Relative to VSSA.
VDDE - VDDA < 0.35V
-0.3
6.5
VDC
1.1.4
Voltage at all analog and
digital IO pins
VA_IO
VD_IO
Relative to VSSA.
-0.3
VDDA + 0.3
VDC
1.1.5
Storage temperature
TSTG
-55
150
C
[a] Refer to the ZSC31150 Technical Note – High Voltage Protection for specification and detailed conditions for high voltage protection.
1.2
Operating Conditions
All voltages are related to VSSA. See important table notes at the end of the table.
Table 1.2 Operating Conditions
No.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
TQE ambient temperature range
TAMB_TQE
[a]
for part numbers ZSC31150xExx
TQE
-40
150
C
TQA ambient temperature range
for part numbers
ZSC31150xAxx [b]
TAMB_TQA
TQA
-40
125
C
TQI ambient temperature range
for advanced performance [b]
TAMB_TQI
TQI
-25
85
C
1.2.2
Supply voltage
VDDE
5.5
VDC
1.2.3
Bridge resistance—Bridge Voltage RBR_V
Mode [b], [c]
25
k
1.2.4
Bridge resistance—Bridge Current
Excitation Mode [b], [c]
RBR_C
See specification 1.2.6 for
IBR_MAX
10
k
1.2.5
Current reference resistor [b],[d]
RIBR
IBR = VDDA / (16 * RIBR)
1.2.6
Maximum bridge current
IBR_MAX
1.2.1
© 2016 Integrated Device Technology, Inc.
4.5
2
5.0
0.07 * RBR
k
2
5
mA
December 6, 2016
ZSC31150 Datasheet
No.
Parameter
Symbol
1.2.7
Maximum bridge top voltage
VBR_TOP
1.2.8
TC current reference resistor [b]
TC RIBR
Conditions
Min
Typ
Max
Unit
( / * VDDA) - 0.3
V
15 16
Behavior influences current
generated
50
ppm/K
[a] Refer to the temperature profile description in the ZSC31150 Technical Note – Die and Package Specifications for operation in temperature
range > 125°C.
[b] No measurement in mass production; parameter is guaranteed by design and/or quality observation.
[c] Symmetric behavior and identical electrical properties (especially with regard to the low pass characteristic) of both sensor inputs of the
ZSC31150 are required. Unsymmetrical conditions of the sensor and/or external components connected to the sensor input pins of ZSC31150
can generate a failure in signal operation.
[d] See application circuit components in Table 3.1.
1.3
Electrical Parameters
All parameter values are valid for operating conditions specified in section 1.2 except as noted. All voltages related to VSSA. See important
table notes at the end of the table.
Table 1.3 Electrical Parameters
No.
1.3.1
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
5.5
mA
4
MHz
Supply Current and System Operation Conditions
1.3.1.1
Supply current
IS
Without bridge and load
current; TAMB_TQA;
fCLK 3MHz
1.3.1.2
Clock frequency [a]
fOSC
Guaranteed adjustment range
(see the ZSC31150 Functional
Description for details);
TAMB_TQA
2
Analog gain: 420 to 2.8
1
275
mV/V
Depends on gain adjust; refer
to section 2.3.1
-300
300
% VIN_SP
Within TAMB_TQE
-10
10
nA
Within TAMB_TQI
-2
2
nA
0.29 *
VDDA
0.65 *
VDDA
V
300
1300
ppm FS
/ (mV/V)
20
A
1.3.2
Analog Front-End (AFE) Characteristics
1.3.2.1
Input span
1.3.2.2
Analog offset compensation
range
1.3.2.3
Parasitic differential input offset
current [a]
IIN_OFF
Common mode input range
VIN_CM
1.3.2.4
1.3.3
3
VIN_SP
Depends on gain adjustment;
no XZC; see section 2.3.1
Temperature Measurement [b]
1.3.3.1
External temperature diode
channel gain
aTSED
1.3.3.2
External temperature diode bias
current
ITSE
© 2016 Integrated Device Technology, Inc.
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6
10
December 6, 2016
ZSC31150 Datasheet
No.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
0
1.5
V
1.3.3.3
External temperature diode
input range [a]
1.3.3.4
External temperature resistor
channel gain
aTSER
1200
3500
ppm FS
/ (mV/V)
1.3.3.5
External temperature resistor /
input voltage range [a]
VTSER
0
600
mV/V
1.3.3.6
Internal temperature diode
sensitivity
STTSI
700
2700
ppm FS
/K
13
16
Bit
0.95
LSB
4
LSB
5
LSB
90
%VDDA
1.3.4
Raw values – without
conditioning
Analog-to-Digital Conversion (ADC)
1.3.4.1
ADC resolution [a]
rADC
1.3.4.2
ADC differential nonlinearity
(DNL) [a]
DNLADC
1.3.4.3
ADC integral nonlinearity (INL)
within TQA [a]
INLADC
1.3.4.4
ADC INL within TQE
INLADC
1.3.4.5
ADC input range
Range
10
100
1.3.5
rADC =13-bit; fCLK=3MHz;
best fit, 2nd order; complete
AFE; with ADC input range
specified in 1.3.4.5
Sensor Connection Check
1.3.5.1
Sensor connection loss
detection threshold
RSCC_min
1.3.5.2
Sensor input short check
RSSC_short
Short detection guaranteed
1.3.5.3
Sensor input no-short threshold
RSSC_pass
A short is not indicated above
this threshold
1.3.6
k
0
50
1000
Digital-to-Analog Conversion (DAC) and Analog Output (AOUT Pin)
1.3.6.1
DAC resolution
rDAC
Analog output, 10-90%
1.3.6.2
Output current sink and source
for VDDE=5V
ISRC/SINK_OUT
VOUT: 5-95%, RLOAD 2kΩ
2.5
mA
VOUT: 10-90%, RLOAD 1kΩ
5
mA
1.3.6.3
Short circuit current
IOUT_max
To VSSE or VDDE [c]
-25
25
mA
1.3.6.4
Addressable output signal
range
VSR_OUT95
@ RLOAD 2k
0.05
0.95
VDDE
VSR_OUT90
@ RLOAD 1k
0.1
0.9
VDDE
1.3.6.5
Output slew rate [a]
SROUT
CLOAD < 50nF
0.1
1.3.6.6
Output resistance in diagnostic
mode
ROUT_DIA
Diagnostic Range:
%, RLOAD 2k
%, RLOAD 1k
82
1.3.6.7
Load capacitance [a]
CLOAD
C3 (see section 3)
150
nF
1.3.6.8
DNL (DAC)
DNLOUT
-1.5
1.5
LSB
1.3.6.9
INL TQA (DAC) [a]
INLOUT
-5
5
LSB
© 2016 Integrated Device Technology, Inc.
Best fit, rDAC =12-bit
7
12
Bit
V/µs
December 6, 2016
ZSC31150 Datasheet
No.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.3.6.10
INL TQE (DAC)
INLOUT
Best fit, rDAC =12-bit
-8
8
LSB
1.3.6.11
Output leak current @150°C
ILEAK_OUT
power or ground loss
-25
25
µA
5
ms
512
µs
1.3.7
System Response
1.3.7.1
Startup time [d]
tSTA
To 1st output; fCLK=3MHz;
no ROM check; ADC 14-bit
and 2nd order
1.3.7.2
Response time (100% jump) [a]
tRESP
fCLK=4MHz; 13-bit, 2nd order;
refer to Table 2.3
1.3.7.3
Bandwidth [a]
1.3.7.4
Analog output noise
peak-to-peak [a]
1.3.7.5
Analog output noise RMS [a]
1.3.7.6
Ratiometricity error
REOUT_5
Maximum error of
VDDE=5V to 4.5/5.5V
1.3.7.7
Overall failure (deviation from
ideal line including the INL,
gain, offset and temperature
errors) [e]
FALL TQI
13-bit, 2nd order ADC;
fCLK 3MHz; XZC=0
No sensor caused effects;
value in parentheses is the
digital readout.
Comparable to analog SSCs
1.4
5
kHz
VNOISE,PP
Shorted inputs;
bandwidth 10kHz
10
mV
VNOISE,RMS
Shorted inputs;
bandwidth 10kHz
3
mV
1000
ppm
FALL TQA
FALL TQE
[a]
[b]
[c]
[d]
[e]
256
0.25
(0.1)
% FS
0.5
(0.25)
% FS
1.0
(0.5)
% FS
No measurement in mass production; parameter is guaranteed by design and/or quality observation.
Refer to section 2.4.
Minimum output voltage to VDDE or maximum output voltage to VSSE.
Depends on resolution and configuration - start routine begins approximately 0.8ms after power on.
XZC is active: additional overall failure of 25ppm/K for XZC=31 at maximum; failure decreases linearly for XZC adjustments lower than 31.
Interface Characteristics and EEPROM
Table 1.4
No.
1.4.1
Interface and EEPROM Characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
I2C Interface [a]
1.4.1.1
Input-high level [b]
VI2C_IN_H
1.4.1.2
Input-low level [b],
VI2C_IN_L
1.4.1.3
Output-low level [b]
VI2C_OUT_L
1.4.1.4
SDA load capacitance [b]
CSDA
© 2016 Integrated Device Technology, Inc.
0.8
Open Drain, IOL 2000V. Additionally, the pins VDDE, VSSE and AOUT have an ESD protection of >4000V.
ESD protection referenced to the Human Body Model is tested with devices during product qualification. The ESD test follows the Human
Body Model with 1.5kΩ/100pF based on MIL 883, Method 3015.7.
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
5. Package
5.1 SSOP14 Package
The standard packages of the ZSC31150 are the SSOP14 green package (5.3mm body width) with a lead pitch of 0.65mm and the DFN14
(4mmx5mm) package with a lead pitch of 0.5mm.
For the SSOP14 package markings shown in Figure 5.1, YYWW refers to the last two digits of the year (YY) and two digits for the work-week
designation (WW). XXXXXXXX refers to the lot number.
Figure 5.1 SSOP14 Pin Diagram
VDDE
AOUT
VDD
VBN
VBR_B
VBP
ZSC
31150GEG1
XXXXXXXX
YYWW
VSSE
14
IRTEMP
SCL
SDA
VSSA
1
VBR_T
N.C.
VDDA
5.2 14-DFNPackage
For the 14-DFN package, the pin assignment is the same as in SSOP14. Refer to the ZSC31150 Technical Note – Die and Package
Specifications for a description of package markings.
Figure 5.2 provides the dimensions for the 14-DFN package option, which are based on JEDEC MO-229. The 14-DFN package has wettable
flanks.
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
A1
A
Figure 5.2 Outline Drawing for 14-DFN Package with Wettable Flanks
0,08
14
8
8
14
Exposed Pad
HD
4.4 x 2.5 mm
Bottom View
L
Top View
1
Table 5.1
HE
7
7
1
e
b
14-DFN Package Dimensions
Dimension
Minimum
Maximum
A
0.8
0.9
A1
0
0.05
b
0.2
0.3
e
0.5 nominal
HD
3.9
4.1
HE
4.9
5.1
L
0.3
0.5
6. Quality and Reliability
The ZSC31150 is qualified according to the AEC-Q100 standard, operating temperature grade 0. A fit rate < 5fit (temperature =55°C, S=60%)
is guaranteed. A typical fit rate of the C7D technology, which is used for ZSC31150, is 2.5fit.
7. Customization
For high-volume applications, which require an upgraded or downgraded functionality compared to the standard ZSC31150, IDT can
customize the circuit design by adding or removing certain functional blocks.
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
For this purpose, IDT has a considerable library of sensor-dedicated circuitry blocks. As a result, IDT can provide a custom solution quickly.
Please contact IDT for further information.
8. Ordering Information
Product Sales Code
Description
Package
ZSC31150GEB
ZSC31150 Die — Temperature range: -40°C to +150°C
Unsawn on Wafer
ZSC31150GEC
ZSC31150 Die — Temperature range: -40°C to +150°C
Sawn on Wafer Frame
ZSC31150GED
ZSC31150 Die — Temperature range: -40°C to +150°C
Waffle Pack
ZSC31150GEG2-R
ZSC31150 14-DFN (5 4 mm with wettable flank—Temperature
range: -40°C to 150°C
Tape & Reel
ZSC31150GAG2-R
ZSC31150 14-DFN (5 4 mm with wettable flank —Temperature
range: -40°C to 125°C
Tape & Reel
ZSC31150GAB
ZSC31150 Die — Temperature range: -40°C to +125°C
Unsawn on Wafer
ZSC31150GAC
ZSC31150 Die — Temperature range: -40°C to +125°C
Sawn on Wafer Frame
ZSC31150GEG1
ZSC31150 SSOP14—Temperature range: -40°C to +150°C
Tube: add “-T” to sales code
Tape & Reel: add “-R”
ZSC31150GLG1
ZSC31150 SSOP14—Temperature range: -40°C to +150°C
(Long life: 5000h @150°C)
Tube: add “-T” to sales code
Tape & Reel: add “-R”
ZSC31150GAG1
ZSC31150 SSOP14—Temperature range: -40°C to +125°C
Tube: add “-T” to sales code
Tape & Reel: add “-R”
ZSC31150KITV1P2
ZSC31150 SSC Evaluation Kit V1.2: three interconnecting boards, five ZSC31150 SSOP14 samples, USB
cable (software can be downloaded from product page at www.IDT.com/ZSC31150)
ZSC31150MCSV1P1
Modular Mass Calibration System (MSC) V1.1 for ZSC31150: MCS boards, cable, connectors
(software can be downloaded from product page at www.IDT.com/ZSC31150)
9. Related Documents and Tools
Visit the ZSC31150 product page www.IDT.com/ZSC31150 on the IDT website at www.IDT.com or contact your nearest sales office for the
latest version of this document and related documents.
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
ZSC31150 Datasheet
10. Glossary
Term
Description
ADC
Analog-to-Digital Converter
AEC
Automotive Electronics Council
AFE
Analog Front End
AOUT
Analog Output
BAMP
Buffer Amplifier
CM
Command Mode
CMC
Calibration Microcontroller
CMV
Common Mode Voltage
CMOS
Complementary Metal Oxide Semiconductor
DAC
Digital-to-Analog Converter
DM
Diagnostic Mode
EEPROM
Electrically Erasable Programmable Read Only Memory
ESD
Electrostatic Device
LDR
Lower Diagnostic Range
MUX
Multiplexer
NOM
Normal Operation Mode
OWI
One Wire Interface
P
Bridge Sensor Measurement; e.g., Pressure Sensor
PGA
Programmable Gain Amplifier
POC
Power on Clear
RAM
Random-Access Memory
RISC
Reduced Instruction Set Computer
RMS
Root-Mean-Square
ROM
Read Only Memory
SCC
Sensor Connection Check
SIF
Serial Interface
SSC+
Positive-biased Sensor Short Check
SSC-
Negative-biased Sensor Short Check
TS
Temperature Sensor
XZC
eXtended Zero Compensation
© 2016 Integrated Device Technology, Inc.
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ZSC31150 Datasheet
11. Document Revision History
Date
Description
September 20, 2008
(Revision 1.01)
Section 6: fit rate added. Section 1.5.2: ROM check time revised/corrected.
Section 5.3.4.3: SC – no detection limit added.
September 20, 2009
(Revision 1.02)
Update to new ZMDI template.
October 2, 2009
(Revision 1.03)
Update to ZMDI denotation.
October 22, 2009
(Revision 1.04)
Formatting and linking issues solved.
February 26, 2010
(Revision 1.05)
Update for ZMDI template, including ZSC31150 Functional Description at page 2 and 3.
Added ordering codes for ZSC31150 and evaluation kits. Extended glossary.
Update for contact information.
July 29, 2010
(Revision 1.06)
Correct “Offset shift per step” and “Approx. maximum offset shift” in Table 2.2 for PGA gain = 105 and 52.5.
Moved 1.4.1.6 “Internal pull-up resistor” into section 1.4.1 in Table 1.2. Redrew of Sensor Bridge in Figure
3.1, Figure 3.2, and Figure 3.3.
Added comment for C4 and C5 in Figure 3.3. Renamed ZMD31150 as ZSC31150.
August 31, 2010
(Revision 1.07)
Connection of RIBR in Figure 3.3 corrected.
August 15, 2011
(Revision 1.08)
Update ordering information with “Long Life Automotive” in “Ordering Information” on page 3 and section 8.
December 15, 2012
(Revision 2.00)
Update for part numbers and IDT contact information. Minor edits.
March 31, 2014
(Revision 2.10)
Revision of specifications in section 1.4.2. Recommended internal signal range revised to 80%. OWI interface
parameters list extended. ADC formula corrected. DFN14 package added. Minor edits for clarity. Updated
contact information. Updated imagery for cover and headings.
April 30, 2014
(Revision 2.20)
Added notation that DFN14 package has wettable flanks.
Update for contact information and addition of CAD model files to section 9.
August 27, 2014
(Revision 2.30)
Minor edits on page 2.
Minor edits for die description in part code tables.
December 3, 2014
(Revision 2.40)
Corrected connection of temperature PTC sensor in Figure 3.2.
Update for contact information.
July 27, 2015
(Revision 2.41)
Update for order code for ZSC31150 SSC Evaluation Kit order code.
Update for contact information.
January 29, 2016
Changed to IDT branding. The document release date is now the revision reference.
December 6, 2016
Added ZSC31150GAB and ZSC31150GAC order codes.
Correction for order codes for kit and MCS.
Updates for formatting and minor edits.
© 2016 Integrated Device Technology, Inc.
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ZSC31150 Datasheet
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DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer pro ducts. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, in cluding, but not limited to, the suitability of IDT's products for any particular purpose,
an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not co nvey any license under intellectual
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Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
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Integrated Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
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December 6, 2016
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