SYNCHRONOUS ETHERNET FREQUENCY TRANSLATOR
ICS840271I
General Description
The ICS840271I is a PLL-based Frequency Translator intended for use in telecommunication HiPerClockS™ applications such as Synchronous Ethernet. The internal PLL translates Ethernet clock frequencies such as 125MHz (1Gb Ethernet), 156.25MHz (10GbE XAUI) and 161.1328MHz (10Gb Ethernet) to an output frequency of 25MHz. The PLL does not any require external components. The input frequency is selectable by a 2-pin interface. The ICS840271I is optimized for low cycle-to-cycle jitter on the 25MHz output signal. The input of the device accepts differential (LVPECL, LVDS, LVHSTL, SSTL, HCSL) or single-ended (LVCMOS) signals. The extended temperature range supports telecommunication and networking equipment requirements. The ICS840271I uses a small RoHS 6, 8-pin TSSOP package and is an effective solution for space-constrained applications.
Features
• • • • • • • • • •
Clock frequency translator for Synchronous Ethernet applications One single-ended output (LVCMOS or LVTTL levels), 16Ω output impedance Differential input pair (CLK, nCLK) accepts LVPECL, LVDS, LVHSTL, SSTL, HCSL input levels Supports input clock frequencies of: 125MHz, 156.25MHz or 161.1328MHz Generates a 25MHz output clock signal Internal resistor bias on nCLK pin allows the user to drive CLK input with external single-ended (LVCMOS/LVTTL) input levels Internal PLL is optimized for low cycle-to-cycle jitter at the output Full 3.3V or 2.5V supply voltage -40°C to 85°C ambient operating temperature Available in lead-free (RoHS 6) package
ICS
Block Diagram
CLK nCLK
Pin Assignment
VDDA
Predivider
PLL
Feedback divider Output divider
25 MHz Q
SEL0 CLK nCLK
1 2 3 4
8 7 6 5
VDD Q GND SEL1
SEL(1:0)
Input Control Logic 00 = PLL Bypass 01 = 161.1328125 MHz 10 = 156.2500000 MHz 11 = 125.0000000 MHz
ICS840271I 8 Lead TSSOP 4.40mm x 3.0mm x 0.925mm package body G Package Top View
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Table 1. Pin Descriptions
Number 1 2 3 4 5 6 7 8 Name VDDA SEL0 CLK nCLK SEL1 GND Q VDD Power Input Input Input Input Power Output Power Pulldown Pulldown Pullup/ Pulldown Pullup Type Description Analog supply pin. Selects the input reference frequency and the PLL bypass mode. LVCMOS/LVTTL interface levels. See Table 3. Non-inverting differential clock input. Inverting differential clock input. Internal resistor bias to VDD/2. Selects the input reference frequency and the PLL bypass mode. LVCMOS/LVTTL interface levels. See Table 3. Power supply ground. Single-ended clock output. LVCMOS/LVTTL interface levels. Core supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol CIN RPULLUP Parameter Input Capacitance Input Pullup Resistor Test Conditions Minimum Typical 4 51 51 VDD = 3.465V VDD = 2.625V 16 19 Maximum Units pF kΩ kΩ
RPULLDOWN Input Pulldown Resistor ROUT Output Impedance
Ω Ω
Function Tables
Table 3. SEL[1:0] Function Table
Inputs SEL1 0 0 1 (default) 1 SEL0 0 1 0 (default) 1 CLK, nCLK (MHz) REF 161.1328125 156.25 125 Mode PLL Bypass PLL Enabled PLL Enabled PLL Enabled Output (MHz) REF/ 5 25 25 25
NOTE: REF = Input clock signal frequency
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Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Supply Voltage, VDD Inputs, VI Outputs, IO (LVCMOS) Package Thermal Impedance, θJA Storage Temperature, TSTG Rating 4.6V -0.5V to VDD + 0.5V -0.5V to VDD + 0.5V 129.5°C/W (0 mps) -65°C to 150°C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VDD = 3.3V±5%, TA = -40°C to 85°C
Symbol VDD VDDA IDD IDDA Parameter Core Supply Voltage Analog Supply Voltage Power Supply Current Analog Supply Current Test Conditions Minimum 3.135 VDD – 0.08 Typical 3.3 3.3 Maximum 3.465 VDD 75 8 Units V V mA mA
Table 4B. Power Supply DC Characteristics, VDD = 2.5V±5%, TA = -40°C to 85°C
Symbol VDD VDDA IDD IDDA Parameter Core Supply Voltage Analog Supply Voltage Power Supply Current Analog Supply Current Test Conditions Minimum 2.375 VDD – 0.08 Typical 2.5 2.5 Maximum 2.625 VDD 72 8 Units V V mA mA
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Table 4C. LVCMOS/LVTTL DC Characteristics, VDD = 3.3V±5% or 2.5V±5%, TA = -40°C to 85°C
Symbol VIH Parameter Input High Voltage Test Conditions VDD = 3.3V VDD = 2.5V Input Low Voltage SEL1 IIH Input High Current SEL0 SEL1 IIL Input Low Current SEL0 Output High Voltage Output Low Voltage VDD = 3.3V VDD = 2.5V VDD = VIN = 3.465V or 2.625V VDD = VIN = 3.465V or 2.625V VDD = 3.465V, VIN = 0V VDD = 3.465V, VIN = 0V VDD = 3.465V, IOH = 12mA VDD = 2.625V, IOH = 12mA VDD = 3.465V or 2.625V, IOL = -12mA -150 -5 2.6 1.8 0.5 Minimum 2 1.7 -0.3 -0.3 Typical Maximum VDD + 0.3 VDD + 0.3 0.8 0.7 5 150 Units V V V V µA µA µA µA V V V
VIL
VOH VOL
Table 4D. Differential DC Characteristics, VDD = 3.3V±5% or 2.5V±5%, TA = -40°C to 85°C
Symbol IIH Parameter Input High Current CLK/nCLK CLK IIL Input Low Current nCLK VPP VCMR Peak-to-Peak Voltage; NOTE 1 Common Mode Input Voltage; NOTE 1, 2 Test Conditions VDD = VIN = 3.465V or 2.625V VDD = 3.465V or 2.625V, VIN = 0V VDD = 3.465V or 2.625V, VIN = 0V -5 -150 0.15 GND + 0.5 1.3 VDD – 0.85 Minimum Typical Maximum 150 Units µA µA µA V V
NOTE 1: VIL should not be less than -0.3V. NOTE 2: Common mode input voltage is defined as VIH.
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AC Electrical Characteristics
Table 5A. AC Characteristics, VDD = 3.3V±5%, TA = -40°C to 85°C
Symbol fOUT tjit(cc)) tLOCK tR / tF odc Parameter Output Frequency Cycle-to-Cycle Jitter PLL Lock Time Output Rise/Fall Time Output Duty Cycle SEL0 ≠ SEL1 SEL0 = SEL1 = 1 SEL1 = 0, SEL0 = 1 SEL 1 = 1, SEL0 = X 20% to 80% 200 47 Test Conditions Minimum Typical 25 40 15 1 50 700 53 Maximum Units MHz ps ps s ms ps %
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions.
Table 5B. AC Characteristics, VDD = 2.5V±5%, TA = -40°C to 85°C
Symbol fOUT tjit(cc)) tLOCK tR / tF odc Parameter Output Frequency Cycle-to-Cycle Jitter PLL Lock Time Output Rise/Fall Time Output Duty Cycle SEL0 ≠ SEL1 SEL0 = SEL1 = 1 SEL1 = 0, SEL0 = 1 SEL 1 = 1, SEL0 = X 20% to 80% 200 47 Test Conditions Minimum Typical 25 50 15 1 50 700 53 Maximum Units MHz ps ps s ms ps %
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions.
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Parameter Measurement Information
1.65V±5% 1.65V±5% 1.25V±5% 1.25V±5%
VDD VDDA
SCOPE
LVCMOS
Qx
VDD VDDA
SCOPE
LVCMOS
Qx
GND
GND
-1.65V±5%
-1.25V±5%
3.3V Output Load AC Test Circuit
2.5V Output Load AC Test Circuit
VDD Q nCLK
V
PP
Cross Points
V
t cycle n
➤
CMR
CLK
t jit(cc) = |t cycle n – t cycle n+1| 1000 Cycles
GND
Differential Input Level
Cycle-to-Cycle Jitter
V
Q
DDO
2
t PW
t
PERIOD
80% 20%
Q
odc =
t PW t PERIOD
tR
x 100%
Output Duty Cycle/Pulse Width/Period
Output Rise/Fall Time
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➤
➤
t cycle n+1
➤
80% 20% tF
ICS840271I SYNCHRONOUS ETHERNET FREQUENCY TRANSLATOR
Application Information
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS840271I provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VDD and VDDA should be individually connected to the power supply plane through vias, and 0.01µF bypass capacitors should be used for each pin. Figure 1 illustrates this for a generic VDD pin and also shows that VDDA requires that an additional 10Ω resistor along with a 10µF bypass capacitor be connected to the VDDA pin.
3.3V or 2.5V VDD .01µF VDDA .01µF 10µF 10Ω
Figure 1. Power Supply Filtering
Wiring the Differential Input to Accept Single Ended Levels
Figure 2 shows how the differential input can be wired to accept single ended levels. The reference voltage V_REF = VDD/2 is generated by the bias resistors R1, R2 and C1. This bias circuit should be located as close as possible to the input pin. The ratio of R1 and R2 might need to be adjusted to position the V_REF in the center of the input voltage swing. For example, if the input clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and R2/R1 = 0.609.
VDD
R1 1K Single Ended Clock Input CLK
V_REF nCLK C1 0.1u
R2 1K
Figure 2. Single-Ended Signal Driving Differential Input
Recommendations for Unused Input Pins Inputs:
LVCMOS Control Pins
All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1kΩ resistor can be used.
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Differential Clock Input Interface
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL and other differential signals. Both signals must meet the VPP and VCMR input requirements. Figures 3A to 3F show interface examples for the HiPerClockS CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination requirements. For example, in Figure 3A, the input termination applies for IDT HiPerClockS open emitter LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination recommendation.
3.3V 3.3V 1.8V Zo = 50Ω Zo = 50Ω CLK Zo = 50Ω Zo = 50Ω nCLK nCLK CLK 3.3V
LVPECL HiPerClockS Input
R1 50 R2 50
HiPerClockS Input
LVHSTL IDT HiPerClockS LVHSTL Driver
R1 50 R2 50
R2 50
Figure 3A. HiPerClockS CLK/nCLK Input Driven by an IDT Open Emitter HiPerClockS LVHSTL Driver
Figure 3B. HiPerClockS CLK/nCLK Input Driven by a 3.3V LVPECL Driver
3.3V 3.3V 3.3V Zo = 50Ω CLK CLK Zo = 50Ω nCLK R1 100 R3 125 R4 125 3.3V 3.3V Zo = 50Ω
LVPECL
R1 84 R2 84
HiPerClockS Input
Zo = 50Ω
nCLK
LVDS
Receiver
Figure 3C. HiPerClockS CLK/nCLK Input Driven by a 3.3V LVPECL Driver
Figure 3D. HiPerClockS CLK/nCLK Input Driven by a 3.3V LVDS Driver
2.5V 3.3V 2.5V R3 120 Zo = 60Ω R4 120
2.5V
3.3V
*R3
33
Zo = 50Ω CLK Zo = 50Ω nCLK
CLK Zo = 60Ω nCLK
HCSL
*R4
33 R1 50 R2 50
HiPerClockS Input
SSTL
R1 120 R2 120
HiPerClockS
*Optional – R3 and R4 can be 0Ω
Figure 3E. HiPerClockS CLK/nCLK Input Driven by a 3.3V HCSL Driver
Figure 3F. HiPerClockS CLK/nCLK Input Driven by a 2.5V SSTL Driver
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Schematic Example
Figure 4 shows an example of ICS840271I applications schematic. In this example, the device is operated at VDD = 3.3V. The input is driven by either a 3.3V LVPECL or LVDS driver. One example of LVCMOS termination is shown in this schematic. The decoupling capacitors should be located a close as possible to the power pin.
Logic Input Pin Examples
VDD
Set Logic Input to '1'
RU1 1K
VDD
Set Logic Input to '0'
RU2 Not Install
To Logic Input pins
RD1 Not Install RD2 1K
To Logic Input pins
VDD
VDD
R1
10 C2 0.1u
VDDA U1 C3 10u SEL0 1 2 3 4 VDDA SEL0 CLK nCLK VDD Q GND SEL1 8 7 6 5
C1 0.01u
Q SEL1
R2 33
Zo = 50 Ohm
VDD R3 125 R4 125
LVCMOS
Zo = 50
CLK nCLK
Zo = 50 R5 84 R6 84
LVPECL Driv er
Figure 4. ICS840271I Schematic layout
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Power Considerations
This section provides information on power dissipation and junction temperature for the ICS840271I. Equations and example calculations are also provided. 1. Power Dissipation.
The total power dissipation for the ICS840271I is the sum of the core power plus the analog power plus the power dissipated in the load(s). The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results. • • • Power (core)MAX = VDD_MAX * (IDD + IDDA) = 3.465V *(75mA + 8mA) = 287.6mW Output Impedance ROUT Power Dissipation due to Loading 50Ω to VDD/2 Output Current IOUT = VDD_MAX / [2 * (50Ω + ROUT)] = 3.465V / [2 * (50Ω + 16Ω)] = 26.25mA Power Dissipation on the ROUT per LVCMOS output Power (ROUT) = ROUT * (IOUT)2 = 16Ω * (26.25mA)2 = 11mW per output
Total Power Dissipation • Total Power = Power (core)MAX + Total Power (ROUT) = 287.6mW + 11mW = 298.6mW
2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockS devices is 125°C. The equation for Tj is as follows: Tj = θJA * Pd_total + TA Tj = Junction Temperature θJA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 129.5°C/W per Table 6 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.299W *129.5°C/W = 123.7°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer).
Table 6. Thermal Resistance θJA for 8 Lead TSSOP, Forced Convection
θJA by Velocity Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 129.5°C/W 1 125.5°C/W 2.5 123.5°C/W
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Reliability Information
Table 7. θJA vs. Air Flow Table for a 8 Lead TSSOP
θJA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 129.5°C/W 1 125.5°C/W 2.5 123.5°C/W
Transistor Count
The transistor count for ICS840271I is: 2732
Package Outline and Package Dimensions
Package Outline - G Suffix for 8 Lead TSSOP Table 8. Package Dimensions
All Dimensions in Millimeters Symbol Minimum Maximum N 8 A 1.20 A1 0.5 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 2.90 3.10 E 6.40 Basic E1 4.30 4.50 e 0.65 Basic L 0.45 0.75 α 0° 8° aaa 0.10 Reference Document: JEDEC Publication 95, MO-153
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Ordering Information
Table 9. Ordering Information
Part/Order Number 840271BGILF 840271BGILFT Marking 71BIL 71BIL Package “Lead-Free” 8 Lead TSSOP “Lead-Free” 8 Lead TSSOP Shipping Packaging Tube 2500 Tape & Reel Temperature -40°C to 85°C -40°C to 85°C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and industrial applications. Any other applications, such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
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© 2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA