DATASHEET
VERSACLOCK® LOW POWER CLOCK GENERATOR Description
The IDT5P49EE502 is a programmable clock generator intended for low power, battery operated consumer applications. There are four internal PLLs, each individually programmable, allowing for up to five differrent output frequencies. The frequencies are generated from a single reference clock. The reference clock can come from either a TCXO or fundamental mode crystal. The IDT5P49EE502 can be programmed through the use of the I2C interfaces. The programming interface enables the device to be programmed when it is in normal operation or what is commonly known as in system programmable. An internal EEPROM allows the user to save and restore the configuration of the device without having to reprogram it on power-up. Each of the four PLLs has an 8-bit reference divider and a 11-bit feedback divider. This allows the user to generate four unique non-integer-related frequencies. The PLL loop bandwidth is programmable to allow the user to tailor the PLL response to the application. For instance, the user can tune the PLL parameters to minimize jitter generation or to maximize jitter attenuation. Spread spectrum generation is supported on one of the PLLs. Spread spectrum generation is supported on one of the PLLs. The device is specifically designed to work with display applications to ensure that the spread profile remains consistent for each HSYNC in order to reduce ROW noise. It also may operate in standard spread sepctrum mode. There are total four 8-bit output dividers. The outputs are connected to the PLLs via the switch matrix. The switch matrix allows the user to route the PLL outputs to any output bank. This feature can be used to simplify and optimize the board layout. In addition, each output's slew rate and enable/disable function can be programmed.
IDT5P49EE502
Features
• Four internal PLLs • Internal non-volatile EEPROM • Internal I2C EEPROM master interface • FAST (400kHz) mode I2C serial interfaces • Input Frequencies
– TCXO: 10 MHz to 40 MHz – Crystal: 8 MHz to 30 MHz
• Output Frequency Ranges: kHz to 120 MHz • Each PLL has an 8-bit reference divider and a 11-bit
feedback-divider
• 8-bit output-divider blocks • One of the PLLs support Spread Spectrum generation
capable of configuration to pixel rate, with adjustable modulation rate and amplitude to support video clock with no visible artifacts
• I/O Standards:
– Outputs - 1.8V/2.5V/3.3 V LVTTL/ LVCMOS
• • • • • •
2 independent adjustable VDDO groups. Programmable Slew Rate Control Programmable Loop Bandwidth Settings Programmable output inversion to reduce bimodal jitter Individual output enable/disable Power-down/Sleep mode – 10μA max in power down mode
• 1.8V VDD Core Voltage • Available in 20pin 3x3mm QFN packages • -40 to +85 C Industrial Temp operation
Target Applications • • • • • •
Smart Mobile Handset Personal Navigation Device (PND) Camcorder DSC Portable Game Console Personal Media Player
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Functional Block Diagram
VDD
VDDO1
VDDO2
S R C 0 XIN/ REF PLLA S R C 1 S R C 2 S R C 3 S R C 4 PLLD
/ DIV0
OUT0
XOUT
/DIV1
OUT1
/DIV2
OUT2
PLLB(SS) SDA SCL SEL Control Logic
/DIV3
OUT3
PLLC
/DIV4
OUT4
GND
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Pin Assignment
GND VDD VDDO2 SDA XOUT XIN/REF GND OUT3 SEL0
11 6
OUT4
16
1
OUT0 SCLK GND SEL1 OUT1
VDD VDDx VDDO1 GND
20- pin QFN
Pin Descriptions
Pin Name
XOUT XIN/ REF GND OUT3 SEL0 VDD VDDx VDDO1
Pin #
1 2 3 4 5 6 7 8
I/O
O I
Pin Type
LVTTL LVTTL Power
OUT2
Pin Description
MHz CRYSTAL_OUT -- Reference crystal feedback. MHz CRYSTAL_IN -- Reference crystal input or external reference clock input. Connect to Ground. Buffered reference clock output. Single-ended output voltage levels are register controlled by either VDDO1 or VDDO2. Configuration select pin. Weak internal pull down resistor. Device power supply. Connect to 1.8V. Device power supply. Connect to 1.8V. Device power supply. Connect to 1.8 to 3.3V. VDDO1 must be the highest voltage on the device. Using register settings, select output voltage levels for OUT0-OUT3. Connect to Ground. Configurable clock output 2. Single-ended output voltage levels are register controlled by either VDDO1 or VDDO2. Configurable clock output 1. Single-ended output voltage levels are register controlled by either VDDO1 or VDDO2. Configuration select pin. Weak internal pull down resistor. Connect to Ground. I2C clock.
O I
OUTPUT LVTTL Power Power Power
GND OUT2 OUT1 SEL1 GND SCLK
9 10 11 12 13 14 I O O I
Power Adjustable Adjustable LVTTL Power LVTTL
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OUT0 OUT4 SDA VDDO2 VDD GND
15 16 17 18 19 20
O O I/O
Adjustable Adjustable
Configurable clock output 0. Single-ended output voltage levels are register controlled by either VDDO1 or VDDO2. Configurable clock output 8. Single-ended output voltage levels controlled by VDDO2.
Open Drain Bidirectional I2C data. Power Power Power Device power supply. Connect to 1.8 to 3.3V. Using register settings, select output voltage levels for OUT0-OUT4. Device power supply. Connect to 1.8V. Connect to Ground.
Note 1: Outputs are user programmable to drive single-ended 1.8V/2.5V/3.3V LVTTL as indicated above. Alway completely power up VDD and VDDx prior to applying VDDO power. Note 2: Default configuration CLK3=Buffered Reference output. All other outputs are off.
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PLL Features and Descriptions
8-bit
D
VCO
1-bit
11-bit
A
M
PLL Block Diagram
Ref-Divider (D) Values
Feedback Pre-Divider (XDIV) Values
1 or 41 4 1 or 8 bit divide2 1 or 41
Feedback (M) Values
Programmable Spread Spectrum Loop Bandwidth Generation Capability
PLLA PLLB PLLC PLLD
1 - 255 1 - 255 1 - 255 1 - 255
6 - 2047 6 - 2047 6 - 2047 6 - 2047
Yes Yes Yes Yes
No Yes No No
1.XDIVA or XDIVD=0, A=1. XDIVA or XDIVD=1, A=4. 2.XDIVC =0, A=1. XDIVC=1 turns on 8 bit predivide multiplier, A=FBC2[7:0]. Total feedback divide equals FBC[10:0] *FBC2[7:0].
Crystal Input (XIN/REF)
The crystal oscillators should be fundamental mode quartz crystals; overtone crystals are not suitable. Crystal frequency should be specified for parallel resonance with 50Ω maximum equivalent series resonance.
Reference Pre-Divider, Reference Divider, Feedback-Divider and Post-Divider
Each PLL incorporates an 8-bit reference-scaler and a 11-bit feedback divider which allows the user to generate four unique non-integer-related frequencies. PLLA and PLLD each have a feedback pre-divider that provides additional multiplication for kHz reference clock applications. Each output divider supports 8-bit post-divider. The following equation governs how the output frequency is calculated.
Crystal Load Capacitors
The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) between the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The crystal cpacitors are internal to the device and have an effective value of 8pF.
FOUT = FIN * (
A*M ) D ODIV
(Eq. 2)
Where FIN is the reference frequency, A is the feedback pre-divider value, M is the feedback-divider value, D is the reference divider value, ODIV is the total post-divider value, and FOUT is the resulting output frequency. Programming any of the dividers may cause glitches on the outputs.
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SPREAD SPECTRUM GENERATION (PLLB)
PLLB has spread spectrum generation capability, which users have the option of turning on and off. Spread spectrum profile, frequency, and spread are fully programmable (within limits). The programmable spread spectrum generation parameters are NC[10:0], MOD[12:0], and NSS[10:0] bits. To enable spread spectrum, set SSENB_B=0. The spread spectrum circuitry was specifically developed to accommodate video display applications. The spread modulation frequency can be defined to exactly equal the horizontal line frequency (HSYNC)
Modulation frequency:
FMOD = FMID / NC (Eq. 11)
Video Example
FREF = 27 MHz, FOUT = 27 MHz, 640 pixels per line, center spread of ±1%. Using FVCO=432MHz, find the necessary spread spectrum register settings. FMID = FVCO/8 NC = 640 (integer number of spread periods/screen) MOD = (25MHz * 640)/(2 * 54MHz) = 160 NSS = (640/2)+(640/8)*(27.27MHz-26.73MHz)/27MHz = 321. FMOD = 27MHz/640 = 11.8kHz.
NC[10:0]
These bits are used to determine the number of pulses per spread spectrum cycle. For video applications, NC is the number of pixels on the horizontal display row (or integer multiple of displayed pixels in a row). By matching the spread period to the screen, no tearing or “shimmer” will be apparent. NC must be an even number to insure that the upward spread transition has the same number of steps as the downward spread transition. For non-video applications, this can also be seen as the number of clock cycles for a complete spread spectrum period.
Non-Video Example
FREF = 25MHz, FOUT = 27 MHz, 31.25kHz modulation rate, center spread of ±1%. Find the necessary spread spectrum register settings. FMID = FVCO/ 8 FMOD = 31.25kHz = 50.625MHz/NC. NC = 1620 MOD = (25MHz * 1620)/(2 * 50.625MHz) = 400
MOD[12:0]
These bits relate the VCO frequency to the target average spread output frequency (FMID). FMID = (FVCO) / 8 FMAX = FMID + (SS% * FMID) FMIN = FMID - (SS% * FMID) MOD = (FREF* NC) / (2 * FMID) NSS = (1620/2)+(1620/8)*(27.27MHz-26.73MHz)/27MHz = 814.
NSS[10:0]
These bits control the amplitude of the spread modulation. NSS = (NC / 2) + (NC / 8) * (FMAX - FMIN) / FMID
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VSYNC, HSYNC, DOT_CLK – Modulation Rate Relationship
VSYNC
HSYNC Integer multiple of HSYNC periods
DOT_CLK
Modulation Rate X/2 X/2
X X = Number of cycles of DOT_CLK per HSYNC period. X/2 = Number of cycles of DOT_CLK that the modulation edge rises/falls.
X
Zero capacitor (Cz) = 280pF
LOOP FILTER
The loop filter for each PLL can be programmed to optimize the jitter performance. The low-pass frequency response of the PLL is the mechanism that dictates the jitter transfer characteristics. The loop bandwidth can be extracted from the jitter transfer. A narrow loop bandwidth is good for jitter attenuation while a wide loop bandwidth is best for low jitter generation. The specific loop filter components that can be programmed are the resistor via the RZ[4:0] bits, zero capacitor via the CZ[2:0] bits, pole capacitor via the CP[1:0] bits, and the charge pump current via the IP#[2:0] bits. The following equations govern how the loop filter is set:
Pole capacitor (Cp) = 30pF Charge pump (Ip) = IP#[2:0] uA VCO gain (KVCO) = 350MHz/V * 2π
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Example
Fc = 150KHz is the desired loop bandwidth. The total A*M value is 160. The ζ(damping factor) target should be 0.7, meaning the loop is critically damped. Given Fc and A*M, an optimal loop filter setting needs to be solved for that will meet both the PLL loop bandwidth and maintain loop stability. Choose a mid-range charge pump from register table Icp= 11.9uA. Kφ * KVCO = 300MHz/V * 40uA = 12000A/Vs
PLL Loop Bandwidth:
Charge pump gain (Kφ⎞) = Ip / 2π VCO gain (KVCO) = 950MHz/V * 2π M = Total multiplier value (See the PRE-SCALERS, FEEDBACK-DIVIDERS, POST-DIVIDERS section for more detail) ωc = (Rz * Kφ * KVCO * Cz)/(M * (Cz + Cp)) Fc = ωc / 2π Note, the phase/frequency detector frequency (FPFD) is typically seven times the PLL closed-loop bandwidth (Fc) but too high of a ratio will reduce your phase margin thus compromising loop stability. To determine if the loop is stable, the phase margin (φm) would need to be calculated as follows.
ωc = 2π * Fc = 9.42x105 s-1 ωp = (Cz + Cp)/(Rz * Cz * Cp) = ωz (1 + Cz / Cp) Solving for Rz, the best possible value Rz=30kOhms (RZ[1:0]=10) gives ζ= 1.2 Solving back for the PLL loop bandwidth, Fc=149kHz. The phase margin must be checked for loop stability. φm = (360 / 2π) * [tan-1 (9.42x105 s-1 / 1.19x105s-1) - tan-1(9.42x105 s-1/ 1.23x106 s-1)] = 45° The phase margin would be acceptable with a fairly stable loop.
Phase Margin:
ωz = 1 / (Rz * Cz) ωp = (Cz + Cp)/(Rz * Cz * Cp) φm = (360 / 2π) * [tan-1(ωc/ ωz) - tan-1(ωc/ ωp)] To ensure stability in the loop, the phase margin is recommended to be > 60° but too high will result in the lock time being excessively long. Certain loop filter parameters would need to be compromised to not only meet a required loop bandwidth but to also maintain loop stability.
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SEL[1:0] Function
The IDT5P49EE502 can support up to three unique configurations. Users may pre-programmed all these configurations, and select the configurations using SEL[1:0] pins. Alternatively, users may use I2C interface to configure these registers on- the-fly. SEL1
0 0 1 1
Always power with SEL1=1 and/or SEL0=1. Power Down/Sleep Mode is selected by the No_PD bit. No_PD=0 enables Power Down mode with no outputs. No_PD=1 enables sleep mode with 32kHz output on OUT4.
SEL0
0 1 0 1 Select CONFIG0 Select CONFIG1 Select CONFIG2
Configuration Selections
Power Down/Sleep Mode
Configuration OUTx IO Standard
Users can configure the individual output IO standard from a single 1.8V power supply. Each output can support 1.8V/
2.5V or 3.3V LVCMOS. VDDO1 must have the highest voltage of any pin on the device. VDDO2 may have any value between 1.8V and VDDO1.
Programming the Device
I2C may be used to program the IDT5P49EE502. – Device (slave) address = 7'b1101010 The frame formats are shown in the following illustration.
I2C Programming
The IDT5P49EE502 is programmed through an I2C-Bus serial interface, and is an I2C slave device. The read and write transfer formats are supported. The first byte of data after a write frame to the correct slave address is interpreted as the register address; this address auto-increments after each byte written or read. Framing
First Byte Transmitted on I2C Bus
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External I2C Interface Condition
EEPROM Interface
The IDT5P49EE502 can store its configuration in an internal EEPROM. The contents of the device's internal programming registers can be saved to the EEPROM by issuing a save instruction (ProgSave) and can be loaded back to the internal programming registers by issuing a restore instruction (ProgRestore). To initiate a save or restore using I C, only two bytes are transferred. The Device Address is issued with the read/write bit set to “0”, followed by the appropriate command code. The save or restore instruction executes
2
after the STOP condition is issued by the Master, during which time the IDT5P49EE502 will not generate Acknowledge bits. The IDT5P49EE502 will acknowledge the instructions after it has completed execution of them. During that time, the I2C bus should be interpreted as busy by all other users of the bus. On power-up of the IDT5P49EE502, an automatic restore is performed to load the EEPROM contents into the internal programming registers. The IDT5P49EE502 will be ready to accept a programming instruction once it acknowledges its 7-bit I2C address.
Progwrite
Progwrite Command Frame Writes can continue as long as a Stop condition is not sent and each byte will increment the register address.
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Progread
Note: If the expected read command is not from the next higher register to the previous read or write command, then set a known “read” register address prior to a read operation by issuing the following command:
Prior to Progread Command Set Register Address The user can ignore the STOP condition above and use a repeated START condition instead, straight after the slave acknowledgement bit (i.e., followed by the Progread command):
Progread Command Frame
Progsave
Note: PROGWRITE is for writing to the IDT5P49EE502 registers. PROGREAD is for reading the IDT5P49EE502 registers. PROGSAVE is for saving all the contents of the IDT5P49EE502 registers to the EEPROM. PROGRESTORE is for loading the entire EEPROM contents to the IDT5P49EE502 registers.
Progrestore
During PROGRESTORE, outputs will be turned off to ensure that no improper voltage levels are experienced before initialization.
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I2C Bus DC Characteristics
Symbol
VIH VIL VHYS IIN VOL
Parameter
Input HIGH Level Input LOW Level Hysteresis of Inputs Input Leakage Current Output LOW Voltage
Conditions
Min
0.7xVDD 0.05xVDD
Typ
Max
5.5 0.3xVDD
Unit
V V V µA V
VDD = 0V IOL = 3 mA
±1.0 0.4
I2C Bus AC Characteristics for Standard Mode1
Symbol
FSCLK tBUF tSU:START tHD:START tSU:DATA tHD:DATA tOVD CB tR tF tHIGH tLOW tSU:STOP
Parameter
Serial Clock Frequency (SCL) Bus free time between STOP and START Setup Time, START Hold Time, START Setup Time, data input (SDA) Hold Time, data input (SDA)2 Output data valid from clock Capacitive Load for Each Bus Line Rise Time, data and clock (SDA, SCLK) Fall Time, data and clock (SDA, SCLK) HIGH Time, clock (SCLK) LOW Time, clock (SCLK) Setup Time, STOP
Min
0 4.7 4.7 4 250 0
Typ
Max
100
Unit
kHz µs µs µs ns µs
3.45 400 1000 300 4 4.7 4
µs pF ns ns µs µs µs
1) No activity is allowed on I2C lines until VDD>1.62V. 2) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHMIN of the SCLK signal) to bridge the undefined region of the falling edge of SCLK.
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I2C Bus AC Characteristics for Fast Mode1
Symbol
FSCLK tBUF tSU:START tHD:START tSU:DATA tHD:DATA tOVD CB tR tF tHIGH tLOW tSU:STOP
Parameter
Serial Clock Frequency (SCL) Bus free time between STOP and START Setup Time, START Hold Time, START Setup Time, data input (SDA) Hold Time, data input (SDA) Output data valid from clock Capacitive Load for Each Bus Line Rise Time, data and clock (SDA, SCL) Fall Time, data and clock (SDA, SCL) HIGH Time, clock (SCL) LOW Time, clock (SCL) Setup Time, STOP
1
Min
0 1.3 0.6 0.6 100 0
Typ
Max
400
Unit
kHz µs µs µs ns µs
0.9 400 20 + 0.1xCB 20 + 0.1xCB 0.6 1.3 0.6 300 300
µs pF ns ns µs µs µs
1) No activity is allowed on I2C lines until VDD>1.62V. 2) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHMIN of the SCL signal) to bridge the undefined region of the falling edge of SCL.
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Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the IDT5P49EE502. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Symbol
VDD VI VO TJ TSTG Input Voltage
Description
Internal Power Supply Voltage Output Voltage (not to exceed 4.6 V) Junction Temperature Storage Temperature
Max
-0.5 to +4.6 -0.5 to +4.6 -0.5 to VDD+0.5 150 -65 to +150
Unit
V V V °C °C
Recommended Operation Conditions
Symbol
VDD TA
Parameter
Power supply voltage for VDD Operating temperature, ambient
Min
1.62 -40
Typ
1.8
Max
1.98 +85 15 8
Unit
V °C pF pF MHz ms
CLOAD_OUT Maximum load capacitance (3.3V LVTTL only) CLOAD_OUT Maximum load capacitance (1.8V or 2.5V LVTTL only) FIN tPU External reference crystal External reference clock CLKIN Power up time for all VDDs to reach minimum specified voltage (power ramps must be monotonic) 8 1 0.05
30 40 5
Capacitance (TA = +25 °C, f = 1 MHz, VIN = 0V)
Symbol
CIN XTAL_FREQ XTAL_MIN XTAL_MAX XTAL_VPP Input Capacitance Crystal frequency Minimum crystal load capacitance Maximum crystal load capacitance Voltage swing (peak-to-peak, nominal) 1.5 8 TBD 35.4 2.3 3.2 Crystal Specifications 30 MHz pF pF V
Parameter
Min
Typ
3
Max
Unit
pF
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DC Electrical Characteristics for 3.3 Volt LVTTL 1
Symbol
VOH VOL VIH VIL IOZDD
Parameter
Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage
Test Conditions
IOH = 33mA IOH = 33mA
Min
2.4 2
Typ
Max
VDDO 0.4 0.8 5
Unit
V V V V µA
Output Leakage Current 3-state outputs
DC Electrical Characteristics for 2.5Volt LVTTL 1
Symbol
VOH VOL IOZDD
Parameter
Output HIGH Voltage Output LOW Voltage
Test Conditions
IOH = 25mA IOH = 25mA
Min
2.1
Typ
Max
VDDO 0.4 5
Unit
V V µA
Output Leakage Current 3-state outputs
DC Electrical Characteristics for 1.8Volt LVTTL 1
Symbol
VOH VOL IOZDD
Parameter
Output HIGH Voltage Output LOW Voltage
Test Conditions
VDD = 1.71V to 1.89V
Min
0.65*VDDO
Typ
Max
VDDO 0.35*VDDO 5
Unit
V V µA
Output Leakage Current 3-state outputs
Power Supply Characteristics for LVTTL Outputs
Symbol
ITOT
Parameter
Total Power VDD Supply Current
Test Conditions
FREFERENCE CLOCK = 25 MHz, CL = 7 pF
Typ
TBD
Max
Unit
mA
1: See “Recommended Operating Conditions” table. Alway completely power up VDD and VDDx prior to applying VDDO power.
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AC Timing Electrical Characteristics
(Spread Spectrum Generation = OFF)
Symbol
fIN 1 / t1
Parameter
Input Frequency Output Frequency
Test Conditions
Input Frequency Limit (CLKIN) Single Ended Clock output limit (LVTTL) 3.3V Single Ended Clock output limit (LVTTL) 2.5V Single Ended Clock output limit (LVTTL) 1.8V
Min.
11 0.001
Typ.
Max.
40 120 110 100
Units
MHz MHz MHz MHz MHz MHz % % V/ns
fVCO fPFD t2 t3 t4
VCO Frequency PFD Frequency Input Duty Cycle Output Duty Cycle Slew Rate, SLEWx(bits) = 00
VCO operating Frequency Range PFD operating Frequency Range Duty Cycle for Input Measured at VDD/2 Single-Ended 3.3V LVCMOS Output clock rise and fall time, 20% to 80% of VDD (Output Load = 7 pF) Single-Ended 3.3V LVCMOS Output clock rise and fall time, 20% to 80% of VDD (Output Load = 7 pF) Single-Ended 3.3V LVCMOS Output clock rise and fall time, 20% to 80% of VDD (Output Load = 7 pF) Single-Ended 3.3V LVCMOS Output clock rise and fall time, 20% to 80% of VDD (Output Load = 7 pF) Peak-to-peak period jitter, CLK outputs measured at VDD/2; fPFD >= 10 MHz Single output frequency only. Peak-to-peak period jitter, CLK outputs measured at VDD/2; fPFD >= 10 MHz Multiple output frequencies switching.
100 0.5 40 45 3.5
1
475 20 60 55
Slew Rate, SLEWx(bits) = 01
2.75
Slew Rate, SLEWx(bits) = 10
2
Slew Rate, SLEWx(bits) = 11
1.25
t5
Clock Jitter
100
ps
200
ps
t6 t7
Output Skew Lock Time
Skew between any output (Same freq and IO type, FOUT >10MHz) PLL Lock Time from Power-up (using MHz reference clock)2 PLL Lock time from shutdown mode 5
200 20 5
ps ms ms
1.Input clock (square wave) may be used at 1 MHz. 2.Time from supply voltage crosses VDD=1.62V to PLLs are locked.
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Spread Spectrum Generation Specifications
Symbol
fIN fMOD fSPREAD
Parameter
Input Frequency Input Frequency Limit Mod Frequency Spread Value Modulation Frequency
Description
Min
11 32
Typ
Max
40 120
Unit
MHz kHz %fOUT
Amount of Spread Value (programmable) - Down Spread Amount of Spread Value (programmable) - Center Spread
Programmable Programmable
1) Practical lower frequency is determined by loop filter settings.
Test Circuits and Conditions 1
Test Circuits for DC Outputs
Other Termination Scheme (Block Diagram)
LVTTL Output Load: ~7pF for each output
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Programming Registers Table
Default Register Addr Hex Value
0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 04 00 00 00 00 00 00 00 00 00 00 00 00 00 00 Reserved INV[4] SLEW4[0:1] Reserved Reserved Reserved Reserved REFA[7:0] Configuration0 REFA[7:0] - Reference Divide PLLA FBA[10:0] - Feedback Divide PLLA FBA[2:0) IPA[2:0] Reserved XDIVA - FB predivide PLLA; 0 - /1; 1 - /4 RZA[1:0] - Zero Resistor PLLA 00 - 5kOhm 01 - 10kOhm 10 - 30kOhm 11 - 80kOhm IPA[2:0] - charge Pump Current PLLA 100 - 6.3uA 101 -11.9 uA 110 - 17.7 uA 111 - 22.7uA REFB[7:0] - Reference Divide PLLB FBB[10:0] - Feedback Divide PLLB FBB[2:0] MOD[12:5] NC[10:3] NSS[4:0] NSS[12:5] Reserved Reserved IPB[2:0] RZB[1:0] SSENB_B RZB[1:0] - Zero Resistor PLLB 00 - 5kOhm 01 - 10kOhm 10 - 30kOhm 11 - 80kOhm IPB[2:0] - charge Pump Current PLLB 000 - 0.37uA, 100 - 6.3uA 001 - 1.1uA, 101 - 11.9uA 010 - 1.8 uA, 110 - 17.7uA 011 - 3.4uA, 111 - 22.7uA REFC[7:0] - Reference Divide PLLC FBC[10:0] - Feedback Divide PLLC FBC[2:0] FBC2[7:0] FBC2 - Feedback Predivide PLLC Turn on using XDIVC=1 NC[2:0] PLLB Spread Parameters MOD[12:0] NC[10:0] NSS[12:0] INV[1] INV[2] INV[3] SLEW1[0:1] SLEW2[0:1] SLEW3[0:1]
Bit # 7
ONXTALB INV[0] SLEW1[0:1] Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved PS1[2:1] PS2[2:1] PS3[2:1] Reserved Reserved Reserved
6
5
4
3
Reserved PS0[2:1]
2
1
0
Description
ONXTALB - MHz Crystal active low
Reserved
INV[#] - Invert output# SLEW#[0:1] - output# slew setting 0 0 - 5.1V/ns 0 1 - 4.4V/ns 1 0 - 2.8V/ns 1 1 - 1.8V/ns PS#[2:1] -Power Select 00 - Reserved 01 - OUT# connects to VDDO1 10 - OUT# connects to VDDO2 11 - Reserved CLK4 is tied to VDD02
0x0F 0x10 0x11
00 00 00 Reserved XDIVA Reserved RZA[1:0]
FBA[10:3)
0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A
00 00 00 00 00 00 00 20 00 MOD[4:0]
REFB[7:0] FBB[10:3]
0x1B 0x1C 0x1D 0x1E
00 00 00 00 Reserved
REFC[7:0] FBC[10:3]
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
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IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
Default Register Addr Hex Value
0x1F 00
Bit # 7 6
IPC[2:0]
5
4
RZC[1:0]
3
2
Reserved
1
XDIVC
0
Reserved
Description
RZC[1:0] - Zero Resistor PLLC 00 - 5kOhm 01 - 10kOhm 10 - 30kOhm 11 - 80kOhm IPC[2:0] - charge Pump Current PLLC 100 - 6.3uA 101 -11.9 uA 110 - 17.7 uA 111 - 22.7uA REFD[7:0] - Reference Divide PLLD FBD[10:0] - Feedback Divide PLLD
0x20 0x21 0x22 0x23
00 00 00 00 XDIVD Reserved RZD[1:0]
REFD[7:0] FBD[10:3] FBD[2:0] IPD[2:0] Reserved
XDIVD - FB predivide PLLD; 0 - /1; 1 - /4 RZD[1:0] - Zero Resistor PLLD 00 - 5kOhm 01 - 10kOhm 10 - 30kOhm 11 - 80kOhm IPD[2:0] - charge Pump Current PLLD 100 - 6.3uA 101 -11.9 uA 110 - 17.7 uA 111 - 22.7uA
0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D
00 00 00 00 00 00 00 00 00 00 SCR4[1:0]
OD0[7:0] Reserved Reserved OD1[7:0] OD2[7:0] OD3[7:0] Reserved Reserved OD4[7:0] Reserved SCR3[1:0] SRC3[1:0] - OD4 source 00 - off; 10 - PLLA 01 - Reference; 11 - PLLD SRC4[1:0] - OD4 source 00 - off; 10 - PLLC 01 - PLLA; 11 - Reference SRC1[1:0] - OD1 source 00 - off; 10 - PLLB 01 - PLLA; 11 - PLLD SRC2[1:0] - OD2 source 00 - off; 10 - PLLC 01 - PLLA; 11 - PLLD SRC0[1:0] - OD0 source 00 - off; 10 - PLLC 01 - PLLB; 11 - PLLD Reserved OE[1] PDB[1] Reserved Reserved OE[0] PDB[0] PDB[4:0] - Powerdown OUT#. PDB#=0, OUT# driven low OE[4:0] - Output enable OUT#. OE#=0, OUT# tri-stated. If PDB#=OE#=0, OUT# driven low
0x2E
00
SCR2[1:0]
SCR1[1:0]
Reserved
0x2F 0x30 0x31 0x32 0x33
00 00 00 00 00
SCR0[1:0] Reserved PDB[4] Reserved Reserved Reserved OE[3] PDB[3] OE[4] OE[2] PDB[2]
Reserved
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
19
IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
Default Register Addr Hex Value
0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 00 00 00 00 00 00 00 00 00 00 00 40 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
Bit # 7 6 5 4
REFA[7:0] FBA[10:3) Reserved Reserved XDIVA RZA[1:0] REFB[7:0] FBB[10:3] MOD[4:0] MOD[12:5] NC[10:3] NSS[4:0] NSS[12:5] Reserved Reserved REFC[7:0] FBC[10:3] Reserved FBC2[7:0] IPC[2:0] RZC[1:0] REFD[7:0] FBD[10:3] Reserved XDIVD RZD[1:0] IPD[2:0] OD0[7:0] Reserved Reserved OD1[7:0] OD2[7:0] OD3[7:0] Reserved Reserved OD4[7:0] SCR4[1:0] SCR2[1:0] SCR0[1:0] Reserved PDB[4] Reserved Reserved Reserved OE[3] PDB[3] OE[4] OE[2] PDB[2] OE[1] PDB[1] Reserved Reserved Reserved OE[0] PDB[0] SCR1[1:0] Reserved Reserved Reserved SCR3[1:0] FBD[2:0] Reserved Reserved XDIV Reserved FBC[2:0] IPB[2:0] Reserved RZB[1:0] SSENB_B NC[2:0] FBB[2:0] IPA[2:0] FBA[2:0) Reserved
3
2
1
0
Description
Configuration1 (See definitions from Configuration0 above)
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
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IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
Default Register Addr Hex Value
0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 0x60 0x61 0x62 0x63 0x64 0x65 0x66 0x67 0x68 0x69 0x6A 0x6B 0x6C 0x6D 0x6E 0x6F 0x70 0x71 0x72 0x73 0x74 0x75 0x76 0x77 0x78 0x79 0x7A 0x7B 0x7C 0x7D 0x7E 0x7F 00 00 00 00 00 00 00 00 00 00 00 40 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
Bit # 7 6 5 4
REFA[7:0] FBA[10:3) Reserved Reserved XDIVA RZA[1:0] REFB[7:0] FBB[10:3] MOD[4:0] MOD[12:5] NC[10:3] NSS[4:0] NSS[12:5] Reserved Reserved REFC[7:0] FBC[10:3] Reserved FBC2[7:0] IPC[2:0] RZC[1:0] REFD[7:0] FBD[10:3] Reserved XDIVD RZD[1:0] IPD[2:0] OD0[7:0] Reserved Reserved OD17:0] OD2[7:0] OD3[7:0] Reserved Reserved OD4[7:0] SCR4[1:0] SCR2[1:0] SCR0[1:0] Reserved PDB[4] Reserved Reserved Reserved OE[3] PDB[3] OE[4] OE[2] PDB[2] OE[1] PDB[1] Reserved Reserved Reserved OE[0] PDB[0] SCR1[1:0] Reserved Reserved Reserved SCR3[1:0] FBD[2:0] Reserved Reserved XDIV Reserved FBC[2:0] IPB[2:0] Reserved RZB[1:0] SSENB_B NC[2:0] FBB[2:0] IPA[2:0] FBA[2:0) Reserved
3
2
1
0
Description
Configuration2 (See definitions from Configuration0 above)
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
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IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
Marking Diagram (ND20)
YYWW 2DGI
Notes: 1. “Z” is the device step (1 to 2 characters). 2. YYWW is the last two digits of the year and week that the part was assembled. 3. “$” is the assembly mark code. 4. “G” after the two-letter package code designates RoHS compliant package. 5. “I” at the end of part number indicates industrial temperature range. 6. Bottom marking: country of origin if not USA.
Thermal Characteristics 20-pin VFQFPN
Parameter
Thermal Resistance Junction to Ambient
Symbol
θJA θJA θJA θJC
Conditions
Still air 1 m/s air flow 3 m/s air flow
Min.
Typ.
Max. Units
° C/W ° C/W ° C/W ° C/W
Thermal Resistance Junction to Case
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
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IDT5P49EE502
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IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
20-pin QFN Solder Mask
ZDMAX = 3.26 mm D2 = 1.75 mm
ZEMAX = 3.26 mm GEMIN = 2.05 mm
AEMAX = 1.83 mm E2 = 1.75 mm
ADMAX = 1.83 mm GDMIN = 2.05 mm
Y = 0.61 mm
X = 0.23 mm
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
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IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
Package Outline and Package Dimensions (20-pin QFN)
Package dimensions are kept current with JEDEC Publication No. 95
Seating Plane Index Area N 1 2 A1 A3 (ND -1)x e (Ref) L N 1 Sawn Singulation Top View A E2
C0.35
(Ref) ND & NE Even e (Typ) If ND & NE 2 are Even (NE -1)x e (Ref)
2
E
E2
2 b
D
(Ref) ND & NE Odd
e D2 2 D2
Thermal Base
C
0.08 C
Symbol Min Millimeters Max
A A1 A3 b e N ND NE D x E BASIC D2 E2 L
0.80 1.00 0 0.05 0.25 Reference 0.15 0.23 0.40 BASIC 20 5 5 3.00 x 3.00 1.55 1.75 1.55 1.75 0.30 0.50
Ordering Information
Part / Order Number
5P49EE502NDGI 5P49EE502NDGI8
Marking
See page 22 See page 22
Shipping Packaging
Tubes Tape and Reel
Package
20pin VFQFPN 20pin VFQFPN
Temperature
-40 to +85° C -40 to +85° C
Parts that are ordered with a “G” after the two-letter pacakage code are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
24
IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
Revision History
Rev.
-A B C D
Originator
R.Willner R.Willner R.Willner R. Willner
Date
10/27/09 11/10/09 3/25/10 6/11/10 07/26/10
Description of Change
Initial Preliminary Datasheet Revised pinout. Typographical changes. Register corrections. Correct spread spectrum calculations. Default configuration. Clarification of OUT4 is tied to VDDO2. Updated thermal pad and dimensions on package drawing.
IDT® VERSACLOCK® LOW POWER CLOCK GENERATOR
25
IDT5P49EE502
REV D 072610
IDT5P49EE502 VERSACLOCK® LOW POWER CLOCK GENERATOR
EEPROM CLOCK GENERATOR
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© 2010 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, ICS, and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA