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IDT6T39007A

IDT6T39007A

  • 厂商:

    IDT

  • 封装:

  • 描述:

    IDT6T39007A - CLOCK DISTRIBUTION CIRCUIT - Integrated Device Technology

  • 数据手册
  • 价格&库存
IDT6T39007A 数据手册
DATASHEET CLOCK DISTRIBUTION CIRCUIT Description The IDT6T39007A is a low-power, four output clock distribution circuit. The device takes a TCXO or 1.8 V to 2.5 V LVCMOS input and generates four high-quality LVDS outputs, and two programmable divided outputs. It includes a redundant input with automatic glitch-free switching when the primary reference is removed. The primary input may be selected by the user by pulling the SEL pin low or high. If the primary input is removed and brought back, it will not be re-selected until 1024 cycles have passed. The IDT6T39007A specifically addresses the needs of handheld applications in both performance and package size. The device is packaged in a small 4mm x 4mm 24-pin QFN, allowing optimal use for limited board space. IDT6T39007A Features • • • • • Packaged in 24-pin QFN TCXO sine wave input +2.5 V operating voltage Four buffered LVDS outputs Two programmable outputs for power control up to 3.0 V LVCMOS levels based on VDDO1/VDDO2 • Individual output enables controlled via I2C or OEx • Pb-free, RoHS compliant package • Industrial temperature range (-40°C to +85°C) Block Diagram VDD 2.5 V 3 SEL SCLK SDATA LVCMOS_INB OE1 OUT1 LVDS OE2 OUT2 LVDS OUT3 LVDS OUT4 LVDS VDDO1 PWRCTRL_CLK1 VDDO2 PWRCTRL_CLK2 TCXO_INA ±100mVpp MUX Divide Logic 2 GND IDT™ CLOCK DISTRIBUTION CIRCUIT 1 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Pin Assignment TCXO_INA SEL LVCMOS_INB SEL Pin Configuration Table SEL 0 GND VDD Primary Input LVCMOS_INB TCXO_INA VDDO1 1 OE Pin Configuration Table PWRCTRL_CLK1 PWRCTRL_CLK2 SCLK SDATA VDDO2 VDD 1 Thermal pad connected to silicon substrate. Connect to ground plane. 19 OUT1 OUT1B OUT2 OUT2B OUT3 OEx 0 1 OUTx LVDS Disabled Enabled 7 13 OUT3B OUT4 GND VDD OUT4B 24- pin QFN Pin Descriptions Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Pin Name PWRCTRL_CLK1 PWRCTRL_CLK2 SCLK SDATA VDDO2 VDD GND VDD OUT4B OUT4 Pin Type Output Output Input Input Power Power Power Power Output Output OE2 OE1 Pin Description Programmable power control output 1. See I2C table. Programmable power control output 2. See I2C table. I2C clock input. I2C data input. Connect to +3.0 V. Connect to +2.5 V. Connect to ground. Connect to +2.5 V. Buffered LVDS output. Outputs tri-state when disabled. Buffered LVDS output. Outputs tri-state when disabled. Output enable control for OUT2 LVDSpins. Internal pull-up resistor. See table above. Output enable control for OUT1 LVDSpins. Internal pull-up resistor. See table above. Buffered LVDS output. Outputs tri-state when disabled. Buffered LVDS output. Outputs tri-state when disabled. Buffered LVDS output. Outputs tri-state when disabled. OE2 OE1 OUT3B OUT3 OUT2B Input Input Output Output Output IDT™ CLOCK DISTRIBUTION CIRCUIT 2 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Pin Number 16 17 18 Pin Name OUT2 OUT1B OUT1 GND VDD LVCMOS_INB SEL TCXO_INA VDDO1 Pin Type Output Output Output Power Power Input Input Input Power Pin Description Buffered LVDS output. Outputs tri-state when disabled. Buffered LVDS output. Outputs tri-state when disabled. Buffered LVDS output. Outputs tri-state when disabled. Connect to ground. Connect to +2.5 V. Connect to primary LVCMOS input INB. See table above. Select pin for primary inputs. See table above. Internal pull-up resistor. Connect to TCXO input. Connect to +3.0 V. 19 20 21 22 23 24 IDT™ CLOCK DISTRIBUTION CIRCUIT 3 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS General I2C Serial Interface How to Write: • • • • • • • • • • Controller (host) sends a start bit Controller (host) sends the write address D4(H) IDT clock will acknowledge Controller (host) sends the beginning byte location =N IDT clock will acknowledge Controller (host) sends the data byte count = X IDT clock will acknowledge Controller (host) starts sending Byte N through Byte N + X - 1 (see Note 2) IDT clock will acknowledge each byte one at a time Controller (host) sends a Stop bit How to Read: • • • • • • • • • • • • • • Controller (host) sends a start bit Controller (host) sends the write address D4(H) IDT clock will acknowledge Controller (host) sends the beginning byte location =N IDT clock will acknowledge Controller (host) will send a separate start bit Controller (host) sends the read address D5(H) IDT clock will acknowledge Controller (host) sends the data byte count = X IDT clock sends Byte N + X - 1 IDT clock sends Byte 0 through byte X (if X(H) was written to byte 8) Controller (host) will need to acknowledge each byte Controller (host) will send a not acknowledge bit Controller (host) will send a stop bit Index Block Read Operation Index Block Write Operation Controller (Host) T WR starTbit WRite ACK Beginning Byte = N ACK Data Byte Count = X ACK Beginning Byte = N O O O Byte N + X - 1 ACK P stoP bit . X B Y T E ACK O O O ACK . ACK O O O N P X B Y T E Beginning Byte N O O O Byte N + X - 1 Data Byte Count = X RT RD Slave Address D4(H) Beginning Byte = N ACK IDT (Slave/Receiver) Controller (Host) T WR starTbit Slave Address D4(H) WRite ACK IDT (Slave/Receiver) Repeat starT ReaD ACK Slave Address D5(H) Not acknowledge stoP bit IDT™ CLOCK DISTRIBUTION CIRCUIT 4 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS I2C Address The IDT6T39007A is a slave-only device that supports block read and block write protocol using a single 7 bit address and read/write bit. A block write (D4(H)) or block read (D5(H)) is made up of seven (7) bits and one (1) read/write bit. A6 1 A5 1 A4 0 A3 1 A2 0 A1 1 A0 0 R/W# X In applications where the indexed block write and block read are used, the dummy byte (bit 11-18) functions as a register-offset (8 bits) pointer. Byte 0: Control Register Bit 7 6 5 4 3 2 1 0 Description Reserved Reserved OE for OUT3 OE for OUT4 Reserved Reserved Reserved Reserved Type R R RW RW R R R R Power Up Condition Undefined Undefined 1 1 Undefined Undefined Undefined Undefined Output(s) Affected Not applicable Not applicable Notes LVDS clock output LVDS clock output Not applicable Not applicable Not applicable Not applicable 1=enabled 0=disabled 1=enabled 0=disabled IDT™ CLOCK DISTRIBUTION CIRCUIT 5 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Byte 1: Control Register Bit 7 Description PWRCTRL_CLK1 Divider SEL bit 7 Type RW Power Up Condition 0 Output(s) Affected PWRCTRL_CLK1 Notes Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz Default is /15 to get 866.666 kHz from 13 MHz 6 PWRCTRL_CLK1 Divider SEL bit 6 RW 0 PWRCTRL_CLK1 5 PWRCTRL_CLK1 Divider SEL bit 5 RW 0 PWRCTRL_CLK1 4 PWRCTRL_CLK1 Divider SEL bit 4 RW 0 PWRCTRL_CLK1 3 PWRCTRL_CLK1 Divider SEL bit 3 RW 1 PWRCTRL_CLK1 2 PWRCTRL_CLK1 Divider SEL bit 2 RW 1 PWRCTRL_CLK1 1 PWRCTRL_CLK1 Divider SEL bit 1 RW 1 PWRCTRL_CLK1 0 PWRCTRL_CLK1 Divider SEL bit 0 RW 1 PWRCTRL_CLK1 Byte 2: Control Register Bit 7 Description PWRCTRL_CLK2 Divider SEL bit 7 Type RW Power Up Condition 0 Output(s) Affected PWRCTRL_CLK2 Notes Default is /46 to get 282.6kHz from 13 MHz Default is /46 to get 282.6kHz from 13 MHz Default is /46 to get 282.6kHz from 13 MHz Default is /46 to get 282.6kHz from 13 MHz Default is /46 to get 282.6kHz from 13 MHz 6 PWRCTRL_CLK2 Divider SEL bit 6 RW 0 PWRCTRL_CLK2 5 PWRCTRL_CLK2 Divider SEL bit 5 RW 1 PWRCTRL_CLK2 4 PWRCTRL_CLK2 Divider SEL bit 4 RW 0 PWRCTRL_CLK1 3 PWRCTRL_CLK2 Divider SEL bit 3 RW 1 PWRCTRL_CLK1 IDT™ CLOCK DISTRIBUTION CIRCUIT 6 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS 2 PWRCTRL_CLK2 Divider SEL bit 2 RW 1 PWRCTRL_CLK1 Default is /46 to get 282.6kHz from 13 MHz Default is /46 to get 282.6kHz from 13 MHz Default is /46 to get 282.6kHz from 13 MHz 1 PWRCTRL_CLK2 Divider SEL bit 1 RW 1 PWRCTRL_CLK1 0 PWRCTRL_CLK2 Divider SEL bit 0 RW 0 PWRCTRL_CLK1 Byte 3: Control Register Bit 7 to 0 Description Reserved Type R Power Up Condition Undefined Output(s) Affected Not applicable Notes Byte 4 through 5: Control Register Bit 7 to 0 Description Reserved Type R Power Up Condition Undefined Output(s) Affected Not applicable Notes Byte 6: Control Register Bit 7 6 5 4 3 2 1 0 Description Revision ID bit 3 Revision ID bit 2 Revision ID bit 1 Revision ID bit 0 Vendor ID bit 3 Vendor ID bit 2 Vendor ID bit 1 Vendor ID bit 0 Type R R R R R R R R Power Up 0 0 0 0 0 0 0 1 Output(s) Affected Not applicable Not applicable Not applicable Not applicable Not applicable Not applicable Not applicable Not applicable Notes IDT™ CLOCK DISTRIBUTION CIRCUIT 7 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Applications Information External Components A minimum number of external components are required for proper operation. Decoupling Capacitors Decoupling capacitors of 0.01 µF should be connected between VDD and GND as close to the device as possible. Do not share ground vias between components. Route power from power source through the capacitor pad and then into IDT pin. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1. Each 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. 2. No vias should be used between decoupling capacitor and VDD pin. 3. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical. 4. An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers (any ferrite beads and bulk decoupling capacitors can be mounted on the back). Other signal traces should be routed away from the IDT6T39007A.This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. IDT™ CLOCK DISTRIBUTION CIRCUIT 8 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the IDT6T39007A. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Max Supply Voltage, VDD LVCMOS_INB, SCLK and SDATA Inputs All Other Inputs and Outputs Ambient Operating Temperature Storage Temperature Junction Temperature Peak Soldering Temperature 5V -0.5 V to +3.3 V Rating -0.5 V to VDD+0.5 V -40 to +85° C -65 to +150° C 125° C 260° C Recommended Operation Conditions Parameter Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) Output Supply Voltage (VDDO1, VDDO2) Min. -40 +2.25 VDD Typ. +2.5 +3.0 Max. +85 +2.75 +3.15 Units °C V V DC Electrical Characteristics Unless otherwise specified, VDD =2.5 V ±10%, VDDO1 = VDDO2 = 3.0 V ±5%, Ambient Temp. -40 to +85° C Parameter Operating Supply Voltage Output Supply Voltage Input High Voltage Input Low Voltage High-Level Output Voltage Low-Level Output Voltage Operating Supply Current Symbol VDD VDDO VIH VIL VOH VOL IDD Conditions VDDO1, VDDO2 SEL, OEx, LVCMOS_INB SCLK and SDATA SEL, OEx, LVCMOS_INB SCLK and SDATA IOH = -4 mA IOL = 4 mA No load, all outputs switching at 13 MHz All outputs disabled Single-ended clocks Min. +2.25 VDD 0.75xVDD 0.7xVDD Typ. +2.5 3.0 Max. +2.75 3.15 Units V V V 0.35xVDD 0.3xVDD 1.7 0.7 15 TBD ±70 18 V V V mA mA mA Short Circuit Current IOS IDT™ CLOCK DISTRIBUTION CIRCUIT 9 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Parameter Output Impedance Internal Pull-Up Resistance Input Capacitance Symbol ZO Rpu CIN Conditions All clock outputs, OEx=1 SEL, OEx All input pins Min. Typ. 15 500 6 Max. Units Ω kΩ pF AC Electrical Characteristics - Single-Ended Outputs Unless otherwise stated, VDD =2.5 V ±10%, VDDO1 = VDDO2 = 3.0 V ±5%, Ambient Temp. -40 to +85° C Parameter Input Frequency Variance Input Frequencies Time Switch Clock Inputs TCXO Input Swing Output Frequency Error Output Rise Time Output Fall Time Output Clock Duty Cycle Output Enable time Clock Stabilization Time from Power Up Symbol FIN Conditions LVCMOS_INB, TCXO_INA, Note 2 LVCMOS_INB, TCXO_INA, Note 3 TCXO_INA Min. 12.6 Typ. 13 Max. 13.4 0.4 Units MHz MHz µs 80 ±100 0 1 1 45 50 ±900 1.5 1.5 55 1 3 10 mV ppm ns ns % ms ms tOR tOF 20% to 80%, Note 1 80% to 20%, Note 1 Measured at VDDO/2, Note 1 OE goes high, output within 1% of final frequency Power up, output within 1% of final frequency Note 1: CL = 8 pF. Note 2: Delta from 13 MHz. Note 3: By removing primary input and then bringing back primary input. IDT™ CLOCK DISTRIBUTION CIRCUIT 10 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS AC Electrical Characteristics - LVDS Outputs Unless otherwise stated, VDD = 2.5 V ±10%, Ambient Temperature -40 to +85° C Parameter Differential Output Voltages | VOD | ∆ VOD Offset Voltage (VOS) Output CLock Duty Cycle ∆ VOS Output Short Circuit Current (IOS) Output Rise Time Output Fall Time Conditions RL = 100Ω VOD Magnitude Change Measured at VOS VOS Magnitude Change 20% to 80%, RL = 100Ω 20% to 80%, RL = 100Ω Min. 250 -40 1.125 45 Typ. 350 0 1.25 50 3 -10 0.5 0.5 Max. 450 40 1.375 55 25 Units mV mV V % mV mA 1.0 1.0 ns ns IDT™ CLOCK DISTRIBUTION CIRCUIT 11 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Parameter Measurement Information VDD = 2.5V±5% Z = 50 LVDS Z = 50 Qx SCOPE 50 80% 80% VOD nQx 50 Clock Outputs 20% tOR tOF 20% 2.5V OUTPUT LOAD AC TEST CIRCUIT OUTPUT RISE/FALL TIME nCLK VDD CLK Pulse Width out DC Input tPERIOD LVDS 100 VOD/ VOD out tPW & tPERIOD VOD SETUP nCLK VOH CLK t(φ ) VOL V DD o ut tjit(φ ) = t(φ ) - t(φ )mean = Phase Jitter DC Input LVDS out 50 50 V OS/ VOS PHASE JITTER VDD nCLK Cross Points CLK VOS GND VOD V OS S ETUP DIFFERENTIAL INPUT LEVEL IDT™ CLOCK DISTRIBUTION CIRCUIT 12 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Marking Diagram TBD Notes: 1. “Z” is the device step (1 to 2 characters). 2. YYWW is the last two digits of the year and week that the part was assembled. 3. “$” is the assembly mark code. 4. “G” after the two-letter package code designates RoHS compliant package. 5. “I” at the end of part number indicates industrial temperature range. 6. Bottom marking: country of origin if not USA. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Symbol θJA θJA θJA θJC Conditions Still air 1 m/s air flow 2.5 m/s air flow Min. Typ. 29.1 22.8 21.0 41.8 Max. Units ° C/W ° C/W ° C/W ° C/W Thermal Resistance Junction to Case IDT™ CLOCK DISTRIBUTION CIRCUIT 13 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Package Outline and Package Dimensions (24-pin QFN) Package dimensions are kept current with JEDEC Publication No. 95 Seating Plane Index Area N 1 2 A1 A3 (ND-1)x e (Ref) L N 1 2 Sawn Singulation Top View A E2 (Ref) ND & NE Even e (Typ) If ND & NE 2 are Even (NE-1)x e (Ref) E E2 2 b e D2 2 D2 D (Ref) ND & NE Odd Thermal Base 0.08 C Symbol Min Millimeters Max C A A1 A3 b e N ND NE D x E BASIC D2 E2 L 0.80 1.00 0 0.05 0.25 Reference 0.18 0.30 0.50 BASIC 24 6 6 4.00 x 4.00 2.3 2.55 2.3 2.55 0.30 0.50 Ordering Information Part / Order Number 6T39007ANLGI 6T39007ANLGI8 Marking TBD Shipping Packaging Tubes Tape and Reel Package 24-pin QFN 24-pin QFN Temperature -40 to +85° C -40 to +85° C “G” after the two-letter package code are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ CLOCK DISTRIBUTION CIRCUIT 14 IDT6T39007A REV G 111009 IDT6T39007A CLOCK DISTRIBUTION CIRCUIT DISTRIBUTION CIRCUITS Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales 800-345-7015 408-284-8200 Fax: 408-284-2775 For Tech Support www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA
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