IDT70V3399S166BFI

HIGH-SPEED 3.3V 256/128K x 18 IDT70V3319/99S SYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed data access – Commercial: 3.6ns (166MHz)/4.2ns (133MHz) (max.) – Industrial: 4.2ns (133MHz) (max.) Selectable Pipelined or Flow-Through output mode – Due to limited pin count PL/FT option is not supported on the 128-pin TQFP package. Device is pipelined outputs only on each port. Counter enable and repeat features Dual chip enables allow for depth expansion without additional logic Full synchronous operation on both ports – 6ns cycle time, 166MHz operation (6Gbps bandwidth) – Fast 3.6ns clock to data out – 1.7ns setup to clock and 0.5ns hold on all control, data, and address inputs @ 166MHz ◆ ◆ ◆ ◆ ◆ ◆ ◆ – Data input, address, byte enable and control registers – Self-timed write allows fast cycle time Separate byte controls for multiplexed bus and bus matching compatibility Dual Cycle Deselect (DCD) for Pipelined Output mode LVTTL- compatible, single 3.3V (±150mV) power supply for core LVTTL compatible, selectable 3.3V (±150mV) or 2.5V (±100mV) power supply for I/Os and control signals on each port Industrial temperature range (-40°C to +85°C) is available at 133MHz. Available in a 128-pin Thin Quad Flatpack, 208-pin fine pitch Ball Grid Array, and 256-pin Ball Grid Array Supports JTAG features compliant to IEEE 1149.1 – Due to limited pin count, JTAG is not supported on the 128-pin TQFP package. Functional Block Diagram UBL LBL UBR LBR FT/PIPEL 1/0 0a 1a a 0b 1b b 1b 0b b 1a 0a a 1/0 FT/PIPER R/WL CE0L CE1L 1 0 1/0 BB WW 01 LL BB WW 10 RR 1 0 1/0 R/WR CE0R CE1R OEL Dout0-8_L Dout9-17_L Dout0-8_R Dout9-17_R OER 1b 0b 1a 0a 0a 1a 0b 1b 0/1 , FT/PIPE R FT/PIPEL 0/1 ab ba 256K x 18 MEMORY ARRAY I/O0L - I/O17L Din_L Din_R I/O0R - I/O17R CLKL A17L(1) A0L REPEATL ADSL CNTENL CLKR , A17R(1) Counter/ Address Reg. ADDR_L ADDR_R Counter/ Address Reg. A0R REPEATR ADSR CNTENR 5623 tbl 01 TDI NOTE: 1. A17 is a NC for IDT70V3399. JTAG TDO TCK TMS TRST MAY 2003 1 DSC 5623/7 ©2003 Integrated Device Technology, Inc. IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges The IDT70V3319/99 is a high-speed 256/128K x 18 bit synchronous Dual-Port RAM. The memory array utilizes Dual-Port memory cells to allow simultaneous access of any address from both ports. Registers on control, data, and address inputs provide minimal setup and hold times. The timing latitude provided by this approach allows systems to be designed with very short cycle times. With an input data register, the IDT70V3319/99 has been optimized for applications having unidirectional Description: or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3319/99 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) remains at 3.3V. Pin Configuration(1,2,3,4,5) 08/01/02 1 I/O9L 2 NC 3 VSS 4 TDO 5 NC 6 A16L 7 A12L 8 A8L 9 NC 10 11 VDD CLKL 12 CNTENL 13 14 A4L A0L 15 OPTL 16 17 NC VSS A B C D E F G H J K L M N P R T U NC VSS NC TDI A17L(1) A13L A9L NC CE0L VSS ADSL A5L A1L VSS VDDQR I/O8L NC VDDQL I/O9R VDDQR PIPE/FTL NC A14L A10L UBL CE1L VSS R/WL A6L A2L VDD I/O8R NC VSS NC VSS I/O10L NC A15L A11L A7L LBL VDD OEL REPEATL A3L VDD NC VDDQL I/O7L I/O7R I/O11L NC VDDQR I/O10R I/O6L NC VSS NC VDDQL I/O11R NC VSS VSS I/O6R NC VDDQR NC VSS I/O12L NC NC VDDQL I/O5L NC VDD NC VDDQR I/O12R 70V3319/99BF BF-208(6) 208-Pin fpBGA Top View(7) VDD NC VSS I/O5R VDDQL VDD VSS VSS VSS VDD VSS VDDQR I/O14R VSS I/O13R VSS I/O3R VDDQL I/O4R VSS NC I/O14L VDDQR I/O13L NC I/O3L VSS I/O4L VDDQL NC I/O15R VSS VSS NC I/O2R VDDQR NC VSS NC I/O15L I/O1R VDDQL NC I/O2L I/O16R I/O16L VDDQR NC TRST A16R A12R A8R NC VDD CLKR CNTEN R A4R NC I/O1L VSS NC VSS NC I/O17R TCK A17R(1) A13R A9R NC CE0R VSS ADSR A5R A1R VSS VDDQL I/O0R VDDQR NC I/O17L VDDQL TMS NC A14R A10R UBR CE1R VSS R/WR A6R A2R VSS NC VSS NC VSS NC PIPE/FTR NC A15R A11R A7R LBR VDD OER REPEATR A3R A0R VDD OPTR NC I/O0L 5623 drw 02c NOTES: 1. A17 is a NC for IDT70V3399. 2. All VDD pins must be connected to 3.3V power supply. 3. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is set to VIL (0V). 4. All VSS pins must be connected to ground supply. 5. Package body is approximately 15mm x 15mm x 1.4mm with 0.8mm ball pitch. 6. This package code is used to reference the package diagram. 7. This text does not indicate orientation of the actual part-marking. 62 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Pin Configuration(1,2,3,4,5) (con't.) 70V3319/99BC BC-256(6) 08/01/02 A1 A2 A3 A4 A5 A6 A7 256-Pin BGA Top View(7) A8 A9 A10 A11 A12 A13 A14 A15 A16 NC B1 TDI B2 NC B3 A17L(1) A14L B4 B5 A11L B6 A8L B7 NC B8 CE1L B9 OEL CNTENL B10 B11 A5L B12 A2L B13 A0L B14 NC B15 NC B16 NC C1 NC C2 TDO C3 NC C4 A15L C5 A12L C6 A9L C7 UBL C8 CE0L R/WL REPEATL C9 C10 C11 A4L C12 A1L C13 VDD C14 NC C15 NC C16 NC D1 I/O9L D2 VSS D3 A16L D4 A13L D5 A10L D6 A7L D7 NC D8 LBL D9 CLKL ADSL D10 D11 A6L D12 A3L D13 OPTL D14 NC D15 I/O8L D16 NC E1 I/O9R E2 NC E3 PIPE/FTL VDDQL VDDQL VDDQR VDDQR VDDQL VDDQL VDDQR VDDQR VDD E4 E5 E6 E7 E8 E9 E10 E11 E12 E13 NC E14 NC E15 I/O8R E16 I/O10R I/O10L F1 F2 NC F3 VDDQL F4 VDD F5 VDD F6 VSS F7 VSS F8 VSS F9 VSS F10 VDD F11 VDD VDDQR F12 F13 NC F14 I/O7L F15 I/O7R F16 I/O11L G1 NC G2 I/O11R VDDQL G3 G4 VDD G5 VSS G6 VSS G7 VSS G8 VSS G9 VSS G10 VSS G11 VDD VDDQR I/O6R G12 G13 G14 NC G15 I/O6L G16 NC H1 NC H2 I/O12L VDDQR H3 H4 VSS H5 VSS H6 VSS H7 VSS H8 VSS H9 VSS H10 VSS H11 VSS H12 VDDQL I/O5L H13 H14 NC H15 NC H16 NC J1 I/O12R J2 NC J3 VDDQR VSS J4 J5 VSS J6 VSS J7 VSS J8 VSS J9 VSS J10 VSS J11 VSS J12 VDDQL J13 NC J14 NC J15 I/O5R J16 I/O13L I/O14R I/O13R VDDQL K1 K2 K3 K4 VSS K5 VSS K6 VSS K7 VSS K8 VSS K9 VSS K10 VSS K11 VSS K12 VDDQR I/O4R I/O3R K13 K14 K15 I/O4L K16 NC L1 NC L2 I/O14L VDDQL L3 L4 VSS L5 VSS L6 VSS L7 VSS L8 VSS L9 VSS L10 VSS L11 VSS L12 VDDQR L13 NC L14 NC L15 I/O3L L16 I/O15L M1 NC M2 I/O15R VDDQR VDD M3 M4 M5 VSS M6 VSS M7 VSS M8 VSS M9 VSS M10 VSS M11 VDD M12 VDDQL I/O2L M13 M14 NC M15 I/O2R M16 I/O16R I/O16L N1 N2 NC N3 VDDQR N4 VDD N5 VDD N6 VSS N7 VSS N8 VSS N9 VSS N10 VDD N11 VDD N12 VDDQL I/O1R N13 N14 I/O1L N15 NC N16 NC P1 I/O17R P2 NC P3 PIPE/FT R VDDQR VDDQR VDDQL VDDQL VDDQR VDDQR VDDQL VDDQL P4 P5 P6 P7 P8 P9 P10 P11 P12 VDD P13 NC P14 I/O0R P15 NC P16 NC R1 I/O17L TMS R2 R3 A16R R4 A13R R5 A10R R6 A7R R7 NC R8 LBR R9 CLKR ADSR R10 R11 A6R R12 A3R R13 NC R14 NC R15 I/O0L R16 NC T1 NC T2 TRST T3 NC T4 A15R T5 A12R T6 A9R T7 UBR T8 CE0R R/WR REPEATR T9 T10 T11 A4R T12 A1R T13 OPTR T14 NC T15 NC T16 , NC TCK NC A17R(1) A14R A11R A8R NC CE1R OER CNTENR A5R A2R A0R NC NC 5623 drw 02d , NOTES: 1. A17 is a NC for IDT70V3399. 2. All VDD pins must be connected to 3.3V power supply. 3. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is set to VIL (0V). 4. All VSS pins must be connected to ground supply. 5. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch. 6. This package code is used to reference the package diagram. 7. This text does not indicate orientation of the actual part-marking. 63 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges 08/06/02 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 A13L A12L A11L A10L A9L A8L A7L UBL LBL CE1L CE0L VDD VDD VSS VSS CLKL OEL R/WL ADSL CNTENL REPEATL A6L A5L A4L A3L A2L Pin Configuration(1,2,3,4,5,8,9) (con't.) A14L A15L A16L A17L(1) IO9L IO9R VDDQL VSS IO10L IO10R VDDQR VSS IO11L IO11R IO12L IO12R VDD VDD VSS VSS IO13R IO13L IO14R IO14L IO15R IO15L VDDQL VSS IO16R IO16L VDDQR VSS IO17R IO17L A17R(1) A16R A15R A14R 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 70V3319/99PRF PK-128(6) 128-Pin TQFP Top View(7) 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 A1L A0L OPTL VSS IO8L IO8R VSS VSS VDDQL IO7L IO7R VSS VDDQR IO6L IO6R IO5L IO5R VDD VDD VSS VSS IO4R IO4L IO3R IO3L IO2R IO2L VSS VDDQL IO1R IO1L VSS VDDQR IO0R IO0L OPTR A0R A1R 5623 drw 02a 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 NOTES: 1. A17 is a NC for IDT70V3399. 2. All VDD pins must be connected to 3.3V power supply. 3. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is set to VIL (0V). 4. All VSS pins must be connected to ground supply. 5. Package body is approximately 14mm x 20mm x 1.4mm. 6. This package code is used to reference the package diagram. 7. This text does not indicate orientation of the actual part-marking. 8. PIPE/FT option in PK-128 is not supported due to limitation in pin count. Device is pipelined outputs only on each port. 9. Due to the limited pin count, JTAG is not supported in the PK-128 package. A13R A12R A11R A10R A9R A8R A7R UBR LBR CE1R CE0R VDD VDD VSS VSS CLKR OER R/WR ADSR CNTENR REPEATR A6R A5R A4R A3R A2R . 64 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Pin Names Left Port CE0L, CE 1L R/ WL OEL A 0L - A17L (1) Right Port CE0R, CE1R R/ WR OER A0R - A17R (1) Names Chip Enables (6) Read/Write Enable Output Enable Address Data Input/Output Clock (5) I/O0L - I/O17L CLK L PIPE/ FTL ADSL CNTENL REPEATL UBL LBL VDDQL OPTL (5) I/O0R - I/O17R CLKR PIPE/ FTR ADSR CNTENR REPEATR UBR LBR V DDQR OPTR V DD V SS TDI TDO TCK TMS TRST Pipeline/Flow-Through Address Strobe Enable Counter Enable Counter Repeat(4) Upper Byte Enable (I/O9-I/O17)(6) Lower Byte Enable (I/O0-I/O8)(6) Power (I/O Bus) (3.3V or 2.5V)(2) Option for selecting VDDQX(2,3) Power (3.3V)(2) Ground (0V) Test Data Input Test Data Output Test Logic Clock (10MHz) Test Mode Select Reset (Initialize TAP Controller) 5623 tbl 01 NOTES: 1. A17 is a NC for IDT70V3399. 2. VDD, OPTX, and VDDQX must be set to appropriate operating levels prior to applying inputs on the I/Os and controls for that port. 3. OPTX selects the operating voltage levels for the I/Os and controls on that port. If OPTX is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V levels and VDDQX must be supplied at 3.3V. If OPTX is set to VIL (0V), then that port's I/Os and address controls will operate at 2.5V levels and VDDQX must be supplied at 2.5V. The OPT pins are independent of one another—both ports can operate at 3.3V levels, both can operate at 2.5V levels, or either can operate at 3.3V with the other at 2.5V. 4. When REPEATX is asserted, the counter will reset to the last valid address loaded via ADS X. 5. PIPE/FT option in PK-128 package is not supported due to limitation in pin count. Device is pipelined output mode only on each port. 6. Chip Enables and Byte Enables are double buffered when PL/FT = VIH, i.e., the signals take two cycles to deselect. 65 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Truth Table I—Read/Write and Enable Control(1,2,3) OE X X X X X X L L L H CLK ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ CE0 H X L L L L L L L L CE1 X L H H H H H H H H UB X X H H L L H L L L LB X X H L H L L H L L R/W X X X L L L H H H X Upper Byte I/O9-17 High-Z High-Z High-Z High-Z DIN DIN High-Z DOUT DOUT High-Z Lower Byte I/O0-8 High-Z High-Z High-Z DIN High-Z DIN DOUT High-Z DOUT High-Z MODE Deselected–Power Down Deselected–Power Down Both Bytes Deselected Write to Lower Byte Only Write to Upper Byte Only Write to Both Bytes Read Lower Byte Only Read Upper Byte Only Read Both Bytes Outputs Disabled 5623 tbl 02 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. ADS, CNTEN , REPEAT = VIH. 3. OE is an asynchronous input signal. Truth Table II—Address Counter Control(1,2) External Address X An An X Previous Internal Address X X Ap Ap Internal Address Used An An Ap Ap + 1 CLK ↑ ↑ ↑ ↑ ADS X L(4) H H CNTEN X X H L (5) REPEAT(6) L(4) H H H I/O(3) DI/O(0) DI/O (n) DI/O(p) DI/O(p+1) MODE Counter Reset to last valid ADS l oad External Address Used External Address Blocked—Counter disabled (Ap reused) Counter Enabled—Internal Address generation 5623 tbl 03 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. Read and write operations are controlled by the appropriate setting of R/W, CE0, CE1, UB, LB and OE. 3. Outputs configured in flow-through output mode: if outputs are in pipelined mode the date out will be delayed by one cycle. 4. ADS and REPEAT are independent of all other memory control signals including CE0, CE1 and UB, LB. 5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other memory control signals including CE0, CE1, UB, LB. 6. When REPEAT is asserted, the counter will reset to the last valid address loaded via ADS. This value is not set at power-up: a known location should be loaded via ADS during initialization if desired. Any subsequent ADS access during operations will update the REPEAT address location. 66 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Recommended Operating Temperature and Supply Voltage(1) Grade Commercial Industrial Ambient Temperature 0 C to +70 C O O Recommended DC Operating Conditions with VDDQ at 2.5V Symbol Parameter Core Supply Voltage I/O Supply Voltage (3) Ground Input High Voltage (Address & Control Inputs) Input High Voltage - I/O(3) Input Low Voltage Min. 3.15 2.4 0 1.7 1.7 -0.3(1) Typ. 3.3 2.5 0 ____ Max. 3.45 2.6 0 V DDQ + 100mV (2) Unit V V V V V V 5623 tbl 05a GND 0V 0V VDD 3.3V + 150mV 3.3V + 150mV 5623 tbl 04 V DD VDDQ V SS VIH VIH VIL -40 C to +85 C O O NOTES: 1. This is the parameter TA. This is the "instant on" case temperature. ____ ____ V DDQ + 100mV(2) 0.7 Absolute Maximum Ratings(1) Symbol VTERM(2) TBIAS(3) TSTG TJN IOUT Rating Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Junction Temperature DC Output Current Commercial & Industrial -0.5 to +4.6 -55 to +125 -65 to +150 +150 50 Unit V o NOTES: 1. Undershoot of VIL > -1.5V for pulse width less than 10ns is allowed. 2. VTERM must not exceed VDDQ + 100mV. 3. To select operation at 2.5V levels on the I/Os and controls of a given port, the OPT pin for that port must be set to VIL (0V), and VDDQX for that port must be supplied as indicated above. C C C Recommended DC Operating Conditions with VDDQ at 3.3V Symbol V DD VDDQ V SS VIH VIH VIL Parameter Core Supply Voltage I/O Supply Voltage (3) Ground Input High Voltage (Address & Control Inputs)(3) Input High Voltage - I/O(3) Input Low Voltage Min. 3.15 3.15 0 2.0 2.0 -0.3(1) Typ. 3.3 3.3 0 ____ o o Max. 3.45 3.45 0 VDDQ + 150mV (2) Unit V V V V V V 5623 tbl 05b mA 5623 tbl 06 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VDD + 150mV for more than 25% of the cycle time or 4ns maximum, and is limited to < 20mA for the period of VTERM > VDD + 150mV. 3. Ambient Temperature Under Bias. No AC Conditions. Chip Deselected. ____ ____ VDDQ + 150mV(2) 0.8 NOTES: 1. Undershoot of VIL > -1.5V for pulse width less than 10ns is allowed. 2. VTERM must not exceed VDDQ + 150mV. 3. To select operation at 3.3V levels on the I/Os and controls of a given port, the OPT pin for that port must be set to VIH (3.3V), and VDDQX for that port must be supplied as indicated above. 67 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Capacitance(1)(TA = +25°C, F = 1.0MHZ) Symbol CIN COUT (3) Parameter Input Capacitance Output Capacitance Conditions(2) VIN = 3dV VOUT = 3dV Max. 8 10.5 Unit pF pF 5623 tbl 07 NOTES: 1. These parameters are determined by device characterization, but are not production tested. 2. 3dV references the interpolated capacitance when the input and output switch from 0V to 3V or from 3V to 0V. 3. COUT also references CI/O. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V ± 150mV) 70V3319/99S Symbol |ILI| |ILO | VOL (3.3V) VOH (3.3V) VOL (2.5V) VOH (2.5V) Parameter Input Leakage Current (1) (1) Test Conditions VDDQ = Max., VIN = 0V to V DDQ CE0 = VIH or CE1 = VIL, VOUT = 0V to V DDQ IOL = + 4mA, VDDQ = Min. IOH = -4mA, VDDQ = Min. IOL = + 2mA, VDDQ = Min. IOH = -2mA, VDDQ = Min. Min. ___ ___ ___ Max. 10 10 0.4 ___ Unit µA µA V V V V 5623 tbl 08 Output Leakage Currentt Output Low Voltage(2) Output High Voltage (2) Output Low Voltage (2) (2) 2.4 ___ 0.4 ___ Output High Voltage 2.0 NOTE: 1. At VDD < 2.0V leakages are undefined. 2. VDDQ is selectable (3.3V/2.5V) via OPT pins. Refer to p.5 for details. 68 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(3) (VDD = 3.3V ± 150mV) 70V3319/99S166 Com'l Only Symbol IDD Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports - CMOS Level Inputs) Full Standby Current (One Port - CMOS Level Inputs) CEL and C ER= VIL, Outputs Disabled, f = fMAX(1) CEL = C ER = VIH, Outputs Disabled, f = fMAX(1) CE"A" = VIL and C E"B" = VIH(5) Active Port Outputs Disabled, f=fMAX(1) Both Ports Outputs Disabled CEL and C ER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0(2) CE"A" < 0.2V and CE"B" > VDD - 0.2V(5) VIN > VDD - 0.2V or VIN < 0.2V Active Port, Outp uts Disabled , f = f MAX(1) Test Condition Version COM'L IND COM'L IND COM'L IND COM'L IND COM'L IND S S S S S S S S S S Typ.(4) 370 ____ 70V3319/99S133 Com'l & Ind Typ. (4) 320 320 115 115 220 220 15 15 220 220 Max. 400 480 160 195 290 350 30 40 290 350 5623 tbl 09 Max. 500 ____ Unit mA ISB1 125 ____ 200 ____ mA ISB2 250 ____ 350 ____ mA ISB3 15 ____ 30 ____ mA ISB4 250 ____ 350 ____ mA NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of GND to 3V. 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. VDD = 3.3V, TA = 25°C for Typ, and are not production tested. IDD DC(f=0) = 120mA (Typ). 5. CEX = V IL means CE0X = VIL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X - 0.2V "X" represents "L" for left port or "R" for right port. 69 .42 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges AC Test Conditions (VDDQ - 3.3V/2.5V) Input Pulse Levels (Address & Controls) Input Pulse Levels (I/Os) Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V/GND to 2.4V GND to 3.0V/GND to 2.4V 2ns 1.5V/1.25V 1.5V/1.25V Figures 1 and 2 5623 tbl 10 2.5V 833Ω DATAOUT 770Ω 5pF* , 3.3V 590Ω 50Ω DATAOUT 50Ω 1.5V/1.25 10pF (Tester) , DATAOUT 435Ω 5pF* 5623 drw 03 Figure 1. AC Output Test load. 5623 drw 04 , Figure 2. Output Test Load (For tCKLZ , tCKHZ, tOLZ, and tOHZ). *Including scope and jig. 10.5pF is the I/O capacitance of this device, and 10pF is the AC Test Load Capacitance. 7 6 5 4 ∆tCD (Typical, ns) 3 2 1 • • 20.5 • 30 • 50 80 100 200 , -1 Capacitance (pF) 5623 drw 05 Figure 3. Typical Output Derating (Lumped Capacitive Load). 6.42 10 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing)(2,3) (VDD = 3.3V ± 150mV, TA = 0°C to +70°C) 70V3319/99S166 Com'l Only Symbol tCYC1 tCYC2 tCH1 tCL1 tCH2 tCL2 tSA tHA tSC tHC tSB tHB tSW tHW tSD tHD tSAD tHAD tSCN tHCN tSRPT tHRPT tOE tOLZ tOHZ tCD1 tCD2 tDC tCKHZ tCKLZ Clock Cycle Time (Flow-Through)(1) Clock Cycle Time (Pipelined) (1) (1) 70V3319/99S133 Com'l & Ind Min. 25 7.5 7 7 2.6 2.6 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 ____ Parameter Min. 20 6 6 6 2.1 2.1 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 ____ Max. ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ Max. ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Clock High Time (Flow-Through) Clock Low Time (Flow-Through) Clock High Time (Pipelined) (2) (1) Clock Low Time (Pipelined)(1) Address Setup Time Address Hold Time Chip Enable Setup Time Chip Enable Hold Time Byte Enable Setup Time Byte Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time REPEAT Setup Time REPEAT Hold Time Output Enable to Data Valid Output Enable to Output Low-Z Output Enable to Output High-Z Clock to Data Valid (Flow-Through) Clock to Data Valid (Pipelined) (1) (1) 4.0 ____ 4.2 ____ 1 1 ____ ____ 1 1 ____ ____ 3.6 12 3.6 ____ 4.2 15 4.2 ____ Data Output Hold After Clock High Clock High to Output High-Z Clock High to Output Low-Z 1 1 1 1 1 1 3 ____ 3 ____ Port-to-Port Delay tCO Clock-to-Clock Offset 5 ____ 6 ____ ns 5623 tbl 11 NOTES: 1. The Pipelined output parameters (t CYC2, tCD2) apply to either or both left and right ports when FT/PIPEX = VIH. Flow-through parameters (tCYC1, tCD1) apply when FT /PIPE = VIL for that port. 2. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE) and FT/PIPE. FT/PIPE should be treated as a DC signal, i.e. steady state during operation. 3. These values are valid for either level of V DDQ (3.3V/2.5V). See page 5 for details on selecting the desired operating voltage levels for each port. 6.42 11 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Read Cycle for Pipelined Operation (FT/PIPE'X' = VIH)(2) tCYC2 tCH2 CLK CE0 tCL2 tSC CE1 tSB UB, LB tHC tSC (3) tHC tHB tSB (5) tHB R/W tSW tSA tHW tHA An + 1 (1 Latency) tCD2 Qn tCKLZ (1) ADDRESS (4) An An + 2 tDC Qn + 1 An + 3 DATAOUT Qn + 2 tOLZ (5) tOHZ OE (1) tOE 5623 drw 06 Timing Waveform of Read Cycle for Flow-through Output (FT/PIPE"X" = VIL)(2,6) tCYC1 tCH1 CLK CE0 tCL1 tSC CE1 tSB UB, LB tHC tSC (3) tHC tHB tSB tHB R/W tSW tHW tSA tHA An + 1 tCD1 tDC Qn tCKLZ (1) ADDRESS (4) An An + 2 An + 3 tCKHZ DATAOUT Qn + 1 tOHZ tOLZ Qn + 2 (5) tDC OE NOTES: 1. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge. 2. ADS = VIL, CNTEN and REPEAT = VIH. 3. The output is disabled (High-Impedance state) by CE0 = VIH, CE1 = VIL, UB, LB = VIH following the next rising edge of the clock. Refer to Truth Table 1. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. If UB, LB was HIGH, then the appropriate Byte of DATAOUT for Qn + 2 would be disabled (High-Impedance state). 6. "x" denotes Left or Right port. The diagram is with respect to that port. tOE 5623 drw 07 6.42 12 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of a Multi-Device Pipelined Read(1,2) tCH2 CLK tSA ADDRESS(B1) tSC CE0(B1) tCYC2 tCL2 tHA A0 tHC tSC tCD2 tHC tCD2 Q0 tDC Q1 tDC A3 A4 tCKLZ A5 tCKHZ tCD2 Q3 tCKHZ A6 A1 A2 A3 A4 A5 A6 DATAOUT(B1) tSA ADDRESS(B2) tHA A0 A1 A2 tSC CE0(B2) tHC tSC tHC tCD2 tCKHZ Q2 tCKLZ tCKLZ 5623 drw 08 tCD2 Q4 DATAOUT(B2) Timing Waveform of a Multi-Device Flow-Through Read(1,2) tCH1 CLK tSA ADDRESS(B1) tSC tHA A0 tHC tSC tHC tCD1 DATAOUT(B1) tSA ADDRESS(B2) tHA A0 A1 A2 A3 A4 A5 A6 D0 tDC tCD1 D1 tDC tCKLZ (1) tCYC1 tCL1 A1 A2 A3 A4 A5 A6 CE0(B1) tCKHZ (1) tCD1 D3 tCKHZ (1) tCD1 D5 tCKLZ (1) tSC tHC CE0(B2) tSC tHC tCD1 DATAOUT(B2) tCKLZ (1) tCKHZ D2 (1) tCD1 tCKLZ (1) tCKHZ D4 (1) 5623 drw 09 NOTES: 1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70V3319/99 for this waveform, and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation. 2. UB, LB, OE, and ADS = VIL; CE1(B1), CE 1(B2), R/W, CNTEN, and REPEAT = VIH. 6.42 13 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Left Port Write to Pipelined Right Port Read(1,2,4) CLK"A" tSW R/W"A" tSA ADDRESS"A" tHA NO MATCH tHW MATCH tSD DATAIN"A" tHD VALID tCO(3) CLK"B" tCD2 R/W"B" tSW tSA ADDRESS"B" tHW tHA NO MATCH MATCH DATAOUT"B" VALID NOTES: 1. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = V IH. 2. OE = VIL for Port "B", which is being read from. OE = VIH for Port "A", which is being written to. 3. If tCO < minimum specified, then data from Port "B" read is not valid until following Port "B" clock cycle (ie, time from write to valid read on opposite port will be tCO + 2 tCYC2 + tCD2 ). If tCO > minimum, then data from Port "B" read is available on first Port "B" clock cycle (ie, time from write to valid read on opposite port will be tCO + t CYC2 + t CD2). 4. All timing is the same for Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite of Port "A" tDC 5623 drw 10 Timing Waveform with Port-to-Port Flow-Through Read(1,2,4) CLK "A" tSW R/W "A" tSA ADDRESS "A" tHA NO MATCH tHW MATCH tSD DATAIN "A" tHD VALID tCO CLK "B" (3) tCD1 R/W "B" tSW tSA ADDRESS "B" tHW tHA NO MATCH MATCH tCD1 DATAOUT "B" tDC VALID VALID tDC 5623 drw 11 NOTES: 1. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = V IH. 2. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to. 3. If tCO < minimum specified, then data from Port "B" read is not valid until following Port "B" clock cycle (i.e., time from write to valid read on opposite port will be tCO + t CYC + tCD1 ). If tCO > minimum, then data from Port "B" read is available on first Port "B" clock cycle (i.e., time from write to valid read on opposite port will be tCO + t CD1). 4. All timing is the same for both left and right ports. Port "A" may be either left or right port. Port "B" is the opposite of Port "A". 6.42 14 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read-to-Write-to-Read tCYC2 (OE = VIL)(2) tCH2 tCL2 CLK CE0 tSC CE1 tSB UB, LB tHC tHB tSW tHW R/W tSW tHW ADDRESS (3) An tSA tHA An +1 An + 2 An + 2 tSD tHD Dn + 2 An + 3 An + 4 DATAIN (1) tCD2 Qn tCKHZ tCKLZ tCD2 Qn + 3 DATAOUT READ NOP (4) WRITE READ 5623 drw 12 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE0, UB, LB, and ADS = V IL; CE1, CNTEN, and REPEAT = V IH. "NOP" is "No Operation". 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity. Timing Waveform of Pipelined Read-to-Write-to-Read ( OE Controlled)(2) tCH2 CLK CE0 tCYC2 tCL2 tSC CE1 tSB UB, LB tHC tHB tSW tHW R/W tSW tHW (3) ADDRESS An tSA tHA An +1 An + 2 tSD tHD An + 3 An + 4 An + 5 DATAIN (1) tCD2 Qn tOHZ (4) Dn + 2 Dn + 3 tCKLZ tCD2 Qn + 4 DATAOUT OE 5623 drw 13 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE 0, UB , LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH . 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. This timing does not meet requirements for fastest speed grade. This waveform indicates how logically it could be done if timing so allows. READ WRITE READ 6.42 15 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(2) tCH1 CLK tCYC1 tCL1 CE0 tSC tHC CE1 tSB UB, LB tHB tSW tHW R/W tSW tHW ADDRESS (3) tSA DATAIN (1) An tHA An +1 An + 2 An + 2 tSD tHD Dn + 2 An + 3 An + 4 tCD1 Qn tDC READ tCD1 Qn + 1 tCKHZ (5) NOP tCD1 tCD1 Qn + 3 tDC READ DATAOUT tCKLZ WRITE 6523 drw 14 Timing Waveform of Flow-Through Read-to-Write-to-Read (OE Controlled)(2) tCYC1 tCH1 tCL1 CLK CE0 tSC tHC CE1 tSB UB, LB tHB tSW tHW R/W ADDRESS (3) tSW tHW An tSA tHA An +1 An + 2 tSD tHD Dn + 2 (1) An + 3 An + 4 An + 5 DATAIN tCD1 Qn tOHZ OE Dn + 3 tDC tOE tCD1 tCKLZ tCD1 Qn + 4 tDC DATAOUT READ WRITE READ 5623 drw 15 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = V IH. 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity. 6.42 16 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read with Address Counter Advance(1) tCH2 CLK tSA ADDRESS tHA tCYC2 tCL2 An tSAD tHAD ADS tSAD tHAD CNTEN tSCN tHCN tCD2 DATAOUT Qx - 1(2) Qx tDC Qn Qn + 1 Qn + 2(2) Qn + 3 READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 5623 drw 16 Timing Waveform of Flow-Through Read with Address Counter Advance(1) tCH1 CLK tSA ADDRESS tHA tCYC1 tCL1 An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tCD1 DATAOUT Qx(2) tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 5623 drw 17 Qn Qn + 1 Qn + 2 Qn + 3(2) Qn + 4 NOTES: 1. CE 0, OE, UB, LB = VIL; CE1, R/ W, and REPEAT = VIH. 2. If there is no address change via ADS = V IL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains constant for subsequent clocks. 6.42 17 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write with Address Counter Advance (Flow-through or Pipelined Inputs)(1) tCH2 CLK tSA ADDRESS tHA tCYC2 tCL2 An INTERNAL(3) ADDRESS tSAD tHAD ADS An(7) An + 1 An + 2 An + 3 An + 4 tSCN tHCN CNTEN tSD tHD DATAIN Dn WRITE EXTERNAL ADDRESS Dn + 1 Dn + 1 Dn + 2 Dn + 3 Dn + 4 WRITE WRITE WITH COUNTER COUNTER HOLD WRITE WITH COUNTER 5623 drw 18 Timing Waveform of Counter Repeat(2) tCH2 CLK tSA tHA (4) tCYC2 tCL2 ADDRESS INTERNAL(3) ADDRESS Ax LAST ADS LOAD tSW tHW R/W ADS CNTEN An LAST ADS +1 An + 1 An + 2 An An + 1 t SAD tHAD tSCN tHCN tSRPT tHRPT REPEAT tSD tHD D0 DATAIN (5) DATAOUT (6) QLAST EXECUTE REPEAT WRITE LAST ADS ADDRESS READ LAST ADS ADDRESS READ LAST ADS ADDRESS + 1 QLAST+1 READ ADDRESS n+1 Qn READ ADDRESS n NOTES: 1. CE0, UB, LB, and R/W = VIL; CE1 and REPEAT = VIH. 2. CE0, UB, LB = V IL; CE1 = VIH. 3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 6. No dead cycle exists during REPEAT operation. A READ or WRITE cycle may be coincidental with the counter REPEAT cycle: Address loaded by last valid ADS load will be accessed. Extra cycles are shown here simply for clarification. For more information on REPEAT function refer to Truth Table II. 7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’Address is written to during this cycle. 5623 drw 19 6.42 18 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Functional Description The IDT70V3319/99 provides a true synchronous Dual-Port Static RAM interface. Registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. All internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse is independent of the LOW to HIGH transition of the clock signal. An asynchronous output enable is provided to ease asynchronous bus interfacing. Counter enable inputs are also provided to stall the operation of the address counters for fast interleaved memory applications. A HIGH on CE0 or a LOW on CE1 for one clock cycle will power down the internal circuitry to reduce static power consumption. Multiple chip enables allow easier banking of multiple IDT70V3319/99s for depth expansion configurations. Two cycles are required with CE0 LOW and CE1 HIGH to re-activate the outputs. Depth and Width Expansion The IDT70V3319/99 features dual chip enables (refer to Truth Table I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various chip enables in order to expand two devices in depth. The IDT70V3319/99 can also be used in applications requiring expanded width, as indicated in Figure 4. Through combining the control signals, the devices can be grouped as necessary to accommodate applications needing 36-bits or wider. A18/A17(1) IDT70V3319/99 CE0 CE1 VDD IDT70V3319/99 CE0 CE1 VDD Control Inputs Control Inputs IDT70V3319/99 CE1 CE0 IDT70V3319/99 CE1 CE0 UB, LB, R/W, OE, CLK, ADS, REPEAT, CNTEN Control Inputs Control Inputs 5623 drw 20 Figure 4. Depth and Width Expansion with IDT70V3319/99 NOTE: 1. A17 is for IDT70V3319, A16 is for IDT70V3399. 6.42 19 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges JTAG Timing Specifications tJF TCK tJCL tJCYC tJR tJCH Device Inputs(1)/ TDI/TMS tJS Device Outputs(2)/ TDO TRST 5623 drw 21 tJH tJDC tJRSR tJCD , tJRST Figure 5. Standard JTAG Timing NOTES: 1. Device inputs = All device inputs except TDI, TMS, and TRST. 2. Device outputs = All device outputs except TDO. JTAG AC Electrical Characteristics(1,2,3,4) 70V3319/99 Symbol tJCYC tJCH tJCL tJR tJF tJRST tJRSR tJCD tJDC tJS tJH Parameter JTAG Clock Input Period JTAG Clock HIGH JTAG Clock Low JTAG Clock Rise Time JTAG Clock Fall Time JTAG Reset JTAG Reset Recovery JTAG Data Output JTAG Data Output Hold JTAG Setup JTAG Hold Min. 100 40 40 ____ ____ Max. ____ ____ ____ Units ns ns ns ns ns ns ns ns ns ns ns 5623 tbl 12 3 (1) 3(1) ____ ____ 50 50 ____ 25 ____ ____ ____ 0 15 15 NOTES: 1. Guaranteed by design. 2. 30pF loading on external output signals. 3. Refer to AC Electrical Test Conditions stated earlier in this document. 4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet. 6.42 20 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Identification Register Definitions Instruction Field Revision Number (31:28) IDT Device ID (27:12) IDT JEDEC ID (11:1) ID Register Indicator Bit (Bit 0) NOTE: 1. Device ID for IDT70V3399 is 0x0315. Value 0x0 0x0314 0x33 1 (1) Description Reserved for version number Defines IDT part number Allows unique identification of device vendor as IDT Indicates the presenc e of an ID register 5623 tbl 13 Scan Register Sizes Register Name Instruction (IR) Bypass (BYR) Identification (IDR) Boundary Scan (BSR) Bit Size 4 1 32 Note (3) 5623 tbl 14 System Interface Parameters Instruction EXTEST BYPASS IDCODE Code 0000 1111 0010 0011 0001 Description Forces contents of the boundary scan cells onto the device outputs(1). Places the boundary scan registe r (BSR) between TDI and TDO. Places the by pass register (BYR) between TDI and TDO. Loads the ID register (IDR) with the vendor ID code and places the register between TDI and TDO. Places the bypass register (BYR) be tween TDI and TDO. Forces all device output drivers to a High-Z state. Places the boundary scan registe r (BSR) between TDI and TDO. SAMPLE allows data from device inputs (2) to be captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the b oundary scan cells via the TDI. Several combinations are reserved. Do not use codes other than those identified above. 5623 tbl 15 HIGHZ SAMPLE/PRELOAD RESERVED All other codes NOTES: 1. Device outputs = All device outputs except TDO. 2. Device inputs = All device inputs except TDI, TMS, and TRST. 3. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local IDT sales representative. 6.42 21 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Ordering Information IDT XXXXX Device Type A Power 999 Speed A Package A Process/ Temperature Range Blank I BF PRF BC Commercial (0°C to +70°C) Industrial (-40°C to +85°C) 208-pin fpBGA (BF-208) 128-pin TQFP (PK-128) 256-pin BGA (BC-256) 166 133 S Commercial Only Commercial & Industrial Standard Power Speed in Megahertz 70V3319 4Mbit (256K x 18-Bit) Synchronous Dual-Port RAM 70V3399 2Mbit (128K x 18-Bit) Synchronous Dual-Port RAM 5623 drw 22 IDT Clock Solution for IDT70V3319/99 Dual-Port Dual-Port I/O Specitications IDT Dual-Port Part Number Voltage 3.3/2.5 I/O LVTTL Input Capacitance 8pF Clock Specifications Input Duty Cycle Requirement 40% Maximum Frequency 166 Jitter Tolerance 75ps IDT PLL Clock Device IDT5V2528 5623 tbl 16a 70V3319/99 6.42 22 IDT70V3319/99S High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Datasheet Document History: 06/02/00: 07/12/00: 06/20/01: 07/30/01: 11/20/01: Initial Public Offering Page 1 Added mux to functional block diagram Page 1 Added JTAG information for TQFP package Page 4 Corrected TQFP package size Page 1 Added PL/FToption Page 20 Changed maximum value for JTAG AC Electrical Characteristics for tJCD from 20ns to 25ns Page 9 Added Industrial Temperature DC Parameters Page 2, 3 & 4 Added date revision for pin configurations Page 11 Changed tOE value in AC Electrical Characteristics, please refer to Errata #SMEN-01-05 Page 1 & 22 Replaced TM logo with ® logo Page 10 Changed AC Test Conditions Input Rise/Fall Times Consolidated multiple devices into one datasheet Page 1 & 5 Added DCD capability for Pipelined Outputs Page 7 Clarified TBIAS and added TJN Page 9 Changed DC Electrical Parameters Page 11 Removed Clock Rise & Fall Time from AC Electrical Characteristics Table Removed Preliminary status Page 11 Added Byte Enable SetupTime & Byte Enable Hold Time to AC Elecctrical Characteristics Table Page 22 Added IDT Clock Solution Table 08/06/02: 05/19/03: CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-5166 fax: 408-492-8674 www.idt.com 6.42 23 for Tech Support: 831-754-4613 DualPortHelp@idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc.