IDT71V2576SA133BQ

128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect x x IDT71V2576S IDT71V2578S IDT71V2576SA IDT71V2578SA Features 128K x 36, 256K x 18 memory configurations Supports high system speed: Commercial and Industrial: – 150MHz 3.8ns clock access time – 133MHz 4.2ns clock access time LBO input selects interleaved or linear burst mode Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx) 3.3V core power supply Power down controlled by ZZ input 2.5V I/O Optional - Boundary Scan JTAG Interface (IEEE 1149.1 compliant) Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA) Description The IDT71V2576/78 are high-speed SRAMs organized as 128K x 36/256K x 18. The IDT71V2576/78 SRAMs contain write, data, address and control registers. Internal logic allows the SRAM to generate a selftimed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as the IDT71V2576/78 can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will be pipelined for one cycle before it is available on the next rising clock edge. If burst mode operation is selected (ADV=LOW), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin. The IDT71V2576/78 SRAMs utilize IDT’s latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA). Input Input Input Input Input Input Input Input Input Input Input Input Input Input Input Output Input Input I/O Supply Supply Synchronous Synchronous Synchronous Asynchronous Synchronous Synchronous Synchronous N/A Synchronous Synchronous Synchronous DC Synchronous Synchronous N/A Synchronous Asynchronous Asynchronous Synchronous N/A N/A 4876 tbl 01 x x x x x x x Pin Description Summary A0-A17 CE CS0, C S1 OE GW BWE BW1, BW2, BW3, BW4 CLK ADV ADSC ADSP LBO TMS TDI TCK TDO TRST ZZ I/O0-I/O31, I/OP1-I/OP4 VDD, VDDQ VSS (1) Address Inputs Chip Enable Chip Selects Output Enable Global Write Enable Byte Write Enable Individual Byte Write Selects Clock Burst Address Advance Address Status (Cache Controller) Address Status (Processor) Linear / Interleaved Burst Order Test Mode Select Test Data Input Test Clock Test Data Output JTAG Reset (Optional) Sleep Mode Data Input / Output Core Power, I/O Power Ground NOTE: 1. BW3 and BW4 are not applicable for the IDT71V2578. JUNE 2003 1 DSC-4876/09 ©2003 Integrated Device Technology, Inc. IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Pin Definitions(1) Symbol A0-A17 ADSC ADSP Pin Function Address Inputs Address Status (Cache Controller) Address Status (Processor) Burst Address Advance I/O I I I Active N/A LOW LOW Description Synchronous Address inputs. The address register is triggered by a co mbination of the rising edge of CLK and ADSC Low or ADSP Low and CE Low. Synchronous Address Status from Cache Controller. ADSC is an active LOW input that is used to load the address registers with new addresses. Synchronous Address Status from Processor. ADSP is an active LOW input that is used to load the address registers with new addresses. ADSP is gated by CE. Synchronous Address Advance. ADV is an active LOW input that is used to advance the internal burst counter, controlling burst access after the initial address is loaded. When the input is HIGH the burst counter is not incremented; that is, there is no address advance. Synchronous byte write enable gates the byte write inputs BW1-BW4. If BWE is LOW at the rising edge of CLK then BWx inputs are passed to the next stage in the circuit. If BWE is HIGH then the byte write inputs are blocked and only GW c an initiate a write cycle. Synchronous byte write enables. BW1 c ontrols I/O0-7, I/OP1, BW2 c ontrols I/O8-15, I/OP2, etc. Any active byte write causes all outputs to be disabled. Synchronous chip enable. CE is used with CS 0 and CS1 to enable the IDT71V2576/78. CE also gates ADSP. This is the clock input. All timing references for the device are made with respect to this input. Synchronous active HIGH chip select. CS0 is used with CE and CS1 to enable the chip. Synchronous active LOW chip select. CS1 is used with CE and CS0 to enable the chip. Synchronous global write enable. This input will write all four 9-bit data bytes when LOW on the rising edge of CLK. GW s upersedes individual byte write enables. Synchronous data input/output (I/O) pins. Both the data input path and data output path are registered and triggered by the rising edge of CLK. Asynchronous burst order selection input. When LBO is HIGH, the interleaved burst sequence is selected. When LBO is LOW the Linear burst sequence is selected. LBO is a static input and must not change state while the device is operating. Asynchronous output enable. When OE is LOW the data output drivers are enabled on the I/O pins if the chip is also selected. When OE is HIGH the I/O pins are in a high-impedance state. Gives input command for TAP controller. Sampled on rising edge of TDK. This pin has an internal pullup. Serial input of registers placed between TDI and TDO. Sampled on rising edge of TCK. This pin has an internal pullup. Clock input of TAP controller. Each TAP event is clocked. Test inputs are captured on rising edge of TCK, while test outputs are driven from the falling edge of TCK. This pin has an internal pullup. Serial output of registers placed between TDI and TDO. This output is active depending on the state of the TAP controller. Optional Asynchronous JTAG reset. Can be used to reset the TAP controller, but not required. JTAG reset occurs automatically at power up and also resets using TMS and TCK per IEEE 1149.1. If not used TRST can be left floating. This pin has an internal pullup. Only available in BGA package. Asynchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down the IDT71V2576/78 to its lowest power consumption level. Data retention is guaranteed in Sleep Mode.This pin has an internal pull down. 3.3V core power supply. 2.5V I/O Supply. Ground. NC pins are not electrically connected to the device. 4876 tbl 02 ADV I LOW BWE Byte Write Enable Individual Byte Write Enables Chip Enable Clock Chip Select 0 Chip Select 1 Global Write Enable Data Input/Output I LOW BW1-BW4 CE CLK CS 0 CS1 GW I/O0-I/O31 I/OP1-I/OP4 LBO I I I I I I I/O LOW LOW N/A HIGH LOW LOW N/A Linear Burst Order I LOW OE TMS TDI TCK TDO Output Enable Test ModeSelect Test Data Input Test Clock Test DataOutput JTAG Reset (Optional) I I I I O LOW N/A N/A N/A N/A TRST I LOW ZZ VDD VDDQ VSS NC Sleep Mode Power Supply Power Supply Ground No Connect I N/A N/A N/A N/A HIGH N/A N/A N/A N/A NOTE: 1. All synchronous inputs must meet specified setup and hold times with respect to CLK. 6.42 2 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Functional Block Diagram LBO ADV CEN Burst Sequence INTERNAL ADDRESS CLK ADSC ADSP CLK EN Binary Counter CLR 2 Burst Logic 17/18 A0* A1* Q0 Q1 128K x 36/ 256K x 18BIT MEMORY ARRAY 2 17/18 A0,A1 A0 - A16/17 GW BWE BW1 ADDRESS REGISTER Byte 1 Write Register A2 - A17 36/18 36/18 Byte 1 Write Driver 9 Byte 2 Write Register Byte 2 Write Driver BW2 Byte 3 Write Register 9 Byte 3 Write Driver BW3 Byte 4 Write Register 9 Byte 4 Write Driver BW4 9 OUTPUT REGISTER CE CS0 CS1 D Q Enable Register CLK EN DATA INPUT REGISTER ZZ Powerdown D Q Enable Delay Register OE OUTPUT BUFFER OE I/O0 — I/O31 I/OP1 — I/OP4 TMS TDI TCK TRST (Optional) 36/18 , 4876 drw 01 JTAG (SA Version) TDO 6.42 3 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Absolute Maximum Ratings(1) Symbol VTERM(2) VTERM(3,6) VTERM(4,6) VTERM(5,6) Rating Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Commercial Operating Temperature Industrial Operating Temperature TBIAS TSTG PT IOUT Temperature Under Bias Storage Temperature Power Dissipation DC Output Current Commercial & Industrial -0.5 to +4.6 -0.5 to VDD -0.5 to VDD +0.5 -0.5 to VDDQ +0.5 -0 to +70 -40 to +85 -55 to +125 -55 to +125 2.0 50 Unit V V V V o Recommended Operating Temperature and Supply Voltage Grade Commercial Industrial Temperature(1) 0°C to +70°C -40°C to +85°C VSS 0V 0V VDD 3.3V±5% 3.3V±5% VDDQ 2.5V±5% 2.5V±5% 4876 tbl 04 NOTES: 1. TA is the "instant on" case temperature Recommended DC Operating Conditions Symbol VDD Parameter Core Supply Voltage I/O Supply Voltage Supply Voltage Input High Voltage Inputs Input High Voltage - I/O Input Low Voltage Min. 3.135 2.375 0 1.7 1.7 -0.3(2) Typ. 3.3 2.5 0 ____ C C Max. 3.465 2.625 0 VDD +0.3 VDDQ +0.3(1) 0.7 Unit V V V V V V 4876 tbl 05 TA (7) o VDDQ o C C VSS VIH o VIH W mA 4876 tbl 03 ____ VIL ____ NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VDD terminals only. 3. VDDQ terminals only. 4. Input terminals only. 5. I/O terminals only. 6. This is a steady-state DC parameter that applies after the power supplies have ramped up. Power supply sequencing is not necessary; however, the voltage on any input or I/O pin cannot exceed VDDQ during power supply ramp up. 7. TA is the "instant on" case temperature NOTES: 1. VIH (max) = VDDQ + 1.0V for pulse width less than tCYC/2, once per cycle. 2. VIL (min) = -1.0V for pulse width less than tCYC/2, once per cycle. 100 TQFP Capacitance (TA = +25°C, f = 1.0MHz) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 5 7 Unit pF pF 4876 tbl 07 119 BGA Capacitance (TA = +25°C, f = 1.0MHz) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions V IN = 3dV VOUT = 3dV Max. 7 7 Unit pF pF 4876 tbl 07a 165 fBGA Capacitance (TA = +25°C, f = 1.0MHz) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 7 7 Unit pF pF 4876 tbl 07b NOTE: 1. This parameter is guaranteed by device characterization, but not production tested. 6.42 4 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Pin Configuration – 128K x 36 A6 A7 CE CS0 BW4 BW3 BW2 BW1 CS1 VDD VSS CLK GW BWE OE ADSC ADSP ADV A8 A9 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 I/OP3 I/O16 I/O17 VDDQ VSS I/O18 I/O19 I/O20 I/O21 VSS VDDQ I/O22 I/O23 VDD/NC(1) VDD NC VSS I/O24 I/O25 VDDQ VSS I/O26 I/O27 I/O28 I/O29 VSS VDDQ I/O30 I/O31 I/OP4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 I/OP2 I/O15 I/O14 VDDQ VSS I/O13 I/O12 I/O11 I/O10 VSS VDDQ I/O9 I/O8 VSS NC VDD ZZ(2) I/O7 I/O6 VDDQ VSS I/O5 I/O4 I/O3 I/O2 VSS VDDQ I/O1 I/O0 I/OP1 4876 drw 02 , LBO A5 A4 A3 A2 A1 A0 100 TQFP Top View NOTES: 1. Pin 14 can either be directly connected to VDD, or connected to an input voltage ≥ VIH, or left unconnected. 2. Pin 64 can be left unconnected and the device will always remain in active mode. NC NC VSS VDD NC NC A10 A11 A12 A13 A14 A15 A16 6.42 5 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Pin Configuration – 256K x 18 A6 A7 CE CS0 NC NC BW2 BW1 CS1 VDD VSS CLK GW BWE OE ADSC ADSP ADV A8 A9 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 NC NC NC VDDQ VSS NC NC I/O8 I/O9 VSS VDDQ I/O10 I/O11 VDD/NC(1) VDD NC VSS I/O12 I/O13 VDDQ VSS I/O14 I/O15 I/OP2 NC VSS VDDQ NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A10 NC NC VDDQ VSS NC I/OP1 I/O7 I/O6 VSS VDDQ I/O5 I/O4 VSS NC VDD ZZ(2) I/O3 I/O2 VDDQ VSS I/O1 I/O0 NC NC VSS VDDQ NC NC NC 4876 drw 03 , NOTES: 1. Pin 14 can either be directly connected to VDD, or connected to an input voltage ≥ VIH, or left unconnected. 2. Pin 64 can be left unconnected and the device will always remain in active mode. LBO A5 A4 A3 A2 A1 A0 NC NC VSS VDD NC NC A11 A12 A13 A14 A15 A16 A17 100 TQFP Top View 6.42 6 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Pin Configuration – 128K x 36, 119 BGA 1 A B C D E F G H J K L M N P R T U VDDQ NC NC I/O16 I/O17 VDDQ I/O20 I/O22 VDDQ I/O24 I/O25 VDDQ I/O29 I/O31 NC NC VDDQ 2 A6 CS0 A7 I/OP3 I/O18 I/O19 I/O21 I/O23 VDD I/O26 I/O27 I/O28 I/O30 I/OP4 A5 NC 3 A4 A3 A2 VSS VSS VSS BW3 VSS NC VSS BW4 VSS VSS VSS LBO A10 4 ADSP ADSC VDD NC CE OE ADV GW VDD CLK NC BWE A1 A0 VDD A11 5 A8 A9 A12 VSS VSS VSS BW 2 VSS NC VSS BW1 VSS VSS VSS VDD / NC(1) A14 6 A16 CS1 A15 I/OP2 I/O13 I/O12 I/O11 I/O9 VDD I/O6 I/O4 I/O3 I/O2 I/O0 A13 NC 7 VDDQ NC NC I/O15 I/O14 VDDQ I/O10 I/O8 VDDQ I/O7 I/O5 VDDQ I/O1 I/OP1 NC ZZ(3) NC/TMS(2) NC/TDI(2) NC/TCK(2) NC/TDO(2) NC/TRST(2,4) VDDQ 4876 drw 04 , Top View Pin Configuration – 256K x 18, 119 BGA 1 A B C D E F G H J K L M N P R T U VDDQ NC NC I/O8 NC VDDQ NC I/O11 VDDQ NC I/O13 VDDQ I/O15 NC NC NC VDDQ 2 A6 CS0 A7 NC I/O9 NC I/O10 NC VDD I/O12 NC I/O14 NC I/OP2 A5 A10 3 A4 A3 A2 VSS VSS VSS BW2 VSS NC VSS VSS VSS VSS VSS LBO A15 4 ADSP ADSC VDD NC CE OE ADV GW VDD CLK NC BWE A1 A0 VDD NC 5 A8 A9 A13 VSS VSS VSS VSS VSS NC VSS BW1 VSS VSS VSS VDD / NC(1) A14 6 A16 CS1 A17 I/O7 NC I/O5 NC I/O3 VDD NC I/O1 NC I/O0 NC A12 A11 7 VDDQ NC NC NC I/O6 VDDQ I/O4 NC VDDQ I/O2 NC VDDQ NC I/OP1 NC ZZ(3) VDDQ 4876 drw 05 NC/TMS(2) NC/TDI(2) NC/TCK(2) NC/TDO(2) NC/TRST(2,4) NOTES: 1. R5 can either be directly connected to VDD, or connected to an input voltage ≥ VIH, or left unconnected. 2. These pins are NC for the "S" version or the JTAG signal listed for the "SA" version. Note: If NC, these pins can either be tied to VSS, VDD or left floating. 3. T7 can be left unconnected and the device will always remain in active mode. 4. TRST is offered as an optional JTAG Reset if required in the application. If not needed, can be left floating and will internally be pulled to VDD. Top View , 6.42 7 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Pin Configuration – 128K x 36, 165 fBGA 1 A B C D E F G H J K L M N P R NC(4) NC I/OP3 I/O17 I/O19 I/O21 I/O23 VDD (1) 2 A7 A6 NC I/O16 I/O18 I/O20 I/O22 NC I/O24 I/O26 I/O28 I/O30 NC NC(4) NC(4) 3 CE1 CS0 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A5 A4 4 BW3 BW4 VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A2 A3 5 BW2 BW1 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC/TRST(2,5) 6 CS1 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC(4) A1 A0 7 BWE GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC NC/TDO(2) NC/TCK(2) 8 ADSC OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A10 A11 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A13 A12 10 A8 A9 NC I/O15 I/O13 I/O11 I/O9 NC I/O7 I/O5 I/O3 I/O1 NC A14 A15 11 NC NC(4) I/OP2 I/O14 I/O12 I/O10 I/O8 ZZ(3) I/O6 I/O4 I/O2 I/O0 I/OP1 NC(4) A16 4876 tbl 17 I/O25 I/O27 I/O29 I/O31 I/OP4 NC LBO NC/TDI(2) NC/TMS (2) Pin Configuration – 256K x 18, 165 fBGA 1 A B C D E F G H J K L M N P R NC(4) NC NC NC NC NC NC VDD(1) I/O12 I/O13 I/O14 I/O15 I/OP2 NC LBO 2 A7 A6 NC I/O8 I/O9 I/O10 I/O11 NC NC NC NC NC NC NC (4) 3 CE1 CS0 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A5 A4 4 BW2 NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A2 A3 5 NC BW1 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC/ TRST (2,5) 6 CS1 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC (4) 7 BWE GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC NC/TDO (2) 8 ADSC OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A 11 A12 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A14 A13 10 A8 A9 NC NC NC NC NC NC I/O3 I/O2 I/O1 I/O0 NC A15 A16 11 A10 NC(4) I/OP1 I/O7 I/O6 I/O5 I/O4 ZZ(3) NC NC NC NC NC NC(4) A17 NC/TDI (2) A1 A0 NC(4) NC/TMS (2) NC/TCK (2) 4876 tbl 17a NOTES: 1. H1 can either be directly connected to VDD, or connected to an input voltage ≥ VIH, or left unconnected. 2. These pins are NC for the "S" version or the JTAG signal listed for the "SA" version. Note: If NC, these pins can either be tied to VSS, VDD or left floating. 3. H11 can be left unconnected and the device will always remain in active mode. 4. Pins P11, N6, B11, A1, R2 and P2 are reserved for 9M, 18M, 36M, 72M, 144M and 288M respectively. 5. TRST is offered as an optional JTAG Reset if required in the application. If not needed, can be left floating and will internally be pulled to VDD. 6.42 8 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V ± 5%) Symbol |ILI| |ILZZ| |ILO| VOL VOH Input Leakage Current ZZ LBO and JTAG Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage (1) Parameter Test Conditions VDD = Max., VIN = 0V to V DD VDD = Max., VIN = 0V to V DD VOUT = 0V to V DDQ, Device Deselected IOL = +6mA, VDD = Min. IOH = -6mA, VDD = Min. Min. ___ Max. 5 30 5 0.4 ___ Unit µA µA µA V V 4876 tbl 08 ___ ___ ___ 2.0 NOTE: 1. The LBO, TMS, TDI, TCK and TRST pins will be internally pulled to VDD and the ZZ pin will be internally pulled to VSS if they are not actively driven in the application. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1) 150MHz Symbol IDD ISB1 ISB2 IZZ Parameter Operating Power Supply Current CMOS Standby Power Supply Current Clock Running Power Supply Current Full Sleep Mode Supply Current Test Conditions Device Selected, Outputs Open, VDD = Max., VDDQ = Max., VIN > VIH o r < VIL, f = fMAX(2) Device Deselected, Outputs Open, VDD = Max., VDDQ = Max., VIN > VHD o r < VLD, f = 0(2,3) Device Deselected, Outputs Open, VDD = Max., VDDQ = Max., VIN > VHD o r < VLD, f = fMAX(2,3) ZZ > VHD, VDD = Max. Com'l 295 30 105 30 Ind 305 35 115 35 133MHz Com'l 250 30 100 30 Ind 260 35 110 35 Unit mA mA mA mA 4876 tbl 09 NOTES: 1. All values are maximum guaranteed values. 2. At f = fMAX, inputs are cycling at the maximum frequency of read cycles of 1/tCYC while ADSC = LOW; f=0 means no input lines are changing. 3. For I/Os VHD = VDDQ - 0.2V, VLD = 0.2V. For other inputs VHD = VDD - 0.2V, VLD = 0.2V. AC Test Conditions (VDDQ = 2.5V) Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Timing Reference Levels AC Test Load 0 to 2.5V 2ns (VDDQ/2) (VDDQ/2) See Figure 1 4876 tbl 10 AC Test Load I/O Z0 = 50Ω VDDQ/2 50Ω 4876 drw 06 , Figure 1. AC Test Load 6 5 4 ∆tCD 3 (Typical, ns) 2 1 20 30 50 80 100 Capacitance (pF) 200 4876 drw 07 , Figure 2. Lumped Capacitive Load, Typical Derating 6.42 9 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Synchronous Truth Table(1,3) Operation Deselected Cycle, Power Down Deselected Cycle, Power Down Deselected Cycle, Power Down Deselected Cycle, Power Down Deselected Cycle, Power Down Read Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. OE is an asynchronous input. 3. ZZ = low for this table. Address Used None None None None None External External External External External External External Next Next Next Next Next Next Next Next Next Next Next Next Current Current Current Current Current Current Current Current Current Current Current Current CE H L L L L L L L L L L L X X X X H H H H X X H H X X X X H H H H X X H H CS0 X X L X L H H H H H H H X X X X X X X X X X X X X X X X X X X X X X X X CS1 X H X H X L L L L L L L X X X X X X X X X X X X X X X X X X X X X X X X ADSP X L L X X L L H H H H H H H H H X X X X H H X X H H H H X X X X H H X X ADSC L X X L L X X L L L L L H H H H H H H H H H H H H H H H H H H H H H H H ADV X X X X X X X X X X X X L L L L L L L L L L L L H H H H H H H H H H H H GW X X X X X X X H H H H L H H H H H H H H H L H L H H H H H H H H H L H L BWE X X X X X X X H L L L X H H X X H H X X L X L X H H X X H H X X L X L X BWx X X X X X X X X H H L X X X H H X X H H L X L X X X H H X X H H L X L X OE (2) X X X X X L H L L H X X L H L H L H L H X X X X L H L H L H L H X X X X CLK - I/O HI-Z HI-Z HI-Z HI-Z HI-Z DOUT HI-Z DOUT DOUT HI-Z DIN DIN DOUT HI-Z DOUT HI-Z DOUT HI-Z DOUT HI-Z DIN DIN DIN DIN DOUT HI-Z DOUT HI-Z DOUT HI-Z DOUT HI-Z DIN DIN DIN DIN 4876 tbl 11 6.42 10 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Synchronous Write Function Truth Table(1, 2) Operation Read Read Write all Bytes Write all Bytes Write Byte 1 (3) (3) GW H H L H H H H H BWE H L X L L L L L BW1 X H X L L H H H BW2 X H X L H L H H BW3 X H X L H H L H BW4 X H X L H H H L 4876 tbl 12 Write Byte 2 Write Byte 3(3) Write Byte 4 (3) NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. BW3 and BW4 are not applicable for the IDT71V2578. 3. Multiple bytes may be selected during the same cycle. Asynchronous Truth Table(1) Operation(2) Read Read Write Deselected Sleep Mode OE L H X X X ZZ L L L L H I/O Status Data Out High-Z High-Z – Data In High-Z High-Z Power Active Active Active Standby Sleep 4876 tbl 13 NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. Synchronous function pins must be biased appropriately to satisfy operation requirements. Interleaved Burst Sequence Table (LBO=VDD) Sequence 1 A1 First A d d re ss S e co nd A d d re s s Third A d d re ss Fo urth A d d re ss (1) Sequence 2 A1 0 0 1 1 A0 1 0 1 0 Sequence 3 A1 1 1 0 0 A0 0 1 0 1 Sequence 4 A1 1 1 0 0 A0 1 0 1 0 4876 tbl 14 A0 0 1 0 1 0 0 1 1 NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state. Linear Burst Sequence Table (LBO=VSS) Sequence 1 A1 First Address Second Address Third Address Fourth Address (1) 0 0 1 1 A0 0 1 0 1 Sequence 2 A1 0 1 1 0 A0 1 0 1 0 Sequence 3 A1 1 1 0 0 A0 0 1 0 1 Sequence 4 A1 1 0 0 1 A0 1 0 1 0 4876 tbl 15 NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state. 6.42 11 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges AC Electrical Characteristics (VDD = 3.3V ±5%, Commercial and Industrial Temperature Ranges) 150MHz Symbol Parameter Min. Max. Min. 133MHz Max. Unit tCYC tCH(1) tCL(1) Clock Cycle Time Clock High Pulse Width Clock Low Pulse Width 6.7 2.6 2.6 ____ 7.5 3 3 ____ ns ns ns ____ ____ ____ ____ Output Parameters tCD tCDC tCLZ(2) tCHZ(2) tOE tOLZ(2) tOHZ(2) Clock High to Valid Data Clock High to Data Change Clock High to Output Active Clock High to Data High-Z Output Enable Access Time Output Enable Low to Output Active Output Enable High to Output High-Z ____ 3.8 ____ ____ 4.2 ____ ns ns ns ns ns ns ns 1.5 0 1.5 ____ 1.5 0 1.5 ____ ____ ____ 3.8 3.8 ____ 4.2 4.2 ____ 0 ____ 0 ____ 3.8 4.2 Set Up Times tSA tSS tSD tSW tSAV tSC Address Setup Time Address Status Setup Time Data In Setup Time Write Setup Time Address Advance Setup Time Chip Enable/Select Setup Time 1.5 1.5 1.5 1.5 1.5 1.5 ____ 1.5 1.5 1.5 1.5 1.5 1.5 ____ ns ns ns ns ns ns ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ Hold Times tHA tHS tHD tHW tHAV tHC Address Hold Time Address Status Hold Time Data In Hold Time Write Hold Time Address Advance Hold Time Chip Enable/Select Hold Time 0.5 0.5 0.5 0.5 0.5 0.5 ____ 0.5 0.5 0.5 0.5 0.5 0.5 ____ ns ns ns ns ns ns ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ Sleep Mode and Configuration Parameters tZZPW tZZR(3) tCFG (4) ZZ Pulse Width ZZ Recovery Time Configuration Set-up Time 100 100 27 ____ 100 100 30 ____ ns ns ns 4876 tbl 16 ____ ____ ____ ____ NOTES: 1. Measured as HIGH above VIH and LOW below VIL. 2. Transition is measured ±200mV from steady-state. 3. Device must be deselected when powered-up from sleep mode. 4. tCFG is the minimum time required to configure the device based on the LBO input. LBO is a static input and must not change during normal operation. 6.42 12 tCYC CLK tCH tCL tSS tHS ADSP (1) ADSC tHA Ax tSW tHW Ay tSA ADDRESS GW,BWE, BWx tHC tSAV tHAV tSC CE, CS1 (Note 3) ADV tOE tCD tOHZ tCDC O1(Ay) O2(Ay) O3(Ay) ADV HIGH suspends burst Timing Waveform of Pipeline Read Cycle(1,2) IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges 6.42 13 tOLZ tCLZ O1(Ax) OE (Burst wraps around to its initial state) tCHZ O4(Ay) O1(Ay) O2(Ay) DATAOUT Output Disabled Pipelined Read Burst Pipelined Read 4876 drw 08 NOTES: 1. O1 (Ax) represents the first output from the external address Ax. O1 (Ay) represents the first output from the external address Ay; O2 (Ay) represents the next output data in the burst sequence of the base address Ay, etc. where A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. ZZ input is LOW and LBO is Don't Care for this cycle. 3. CS0 timing transitions are identical but inverted to the CE and CS1 signals. For example, when CE and CS1 are LOW on this waveform, CS0 is HIGH. , tCYC CLK tCH tCL (2) tSS tHS ADSP tSA tHA Ax Ay tSW tHW Az ADDRESS GW ADV Timing Waveform of Combined Pipelined Read and Write Cycles(1,2,3) IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges 6.42 14 OE tSD tHD tOE tCD tCLZ O1(Ax) tOHZ I1(Ay) tOLZ tCDC O1(Az) tCD O2(Az) O3(Az) DATAIN DATAOUT Single Read Pipelined Write Pipelined Burst Read 4876 drw 09 , NOTES: 1. Device is selected through entire cycle; CE and CS1 are LOW, CS0 is HIGH. 2. ZZ input is LOW and LBO is Don't Care for this cycle. 3. O1 (Ax) represents the first output from the external address Ax. I1 (Ay) represents the first input from the external address Ay; O1 (Az) represents the first output from the external address Az; O2 (Az) represents the next output data in the burst sequence of the base address Az, etc. where A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. tCYC CLK tCH tCL tSS tHS ADSP ADSC tSA tHA Ax GW is ignored when ADSP initiates a cycle and is sampled on the next clock rising edge ADDRESS Ay Az tHW tSW GW tSC tHC CE, CS1 tSAV tHAV (Note 3) ADV (ADV HIGH suspends burst) Timing Waveform of Write Cycle No. 1 — GW Controlled(1,2,3) IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges 6.42 15 I1(Ax) I2(Ay) tOHZ I1(Ay) I2(Ay) Burst Write Single Write OE tSD I3(Ay) I4(Ay) I1(Az) tHD DATAIN I2(Az) I3(Az) DATAOUT O3(Aw) O4(Aw) Burst Read Burst Write 4876 drw 10 , NOTES: 1. ZZ input is LOW, BWE is HIGH and LBO is Don't Care for this cycle. 2. O4 (Aw) represents the final output data in the burst sequence of the base address Aw. I1 (Ax) represents the first input from the external address Ax. I1 (Ay) represents the first input from the external address Ay; I2 (Ay) represents the next input data in the burst sequence of the base address Ay, etc. where A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. In the case of input I2 (Ay) this data is valid for two cycles because ADV is high and has suspended the burst. 3. CS0 timing transitions are identical but inverted to the CE and CS1 signals. For example, when CE and CS1 are LOW on this waveform, CS0 is HIGH. . tCYC CLK tCH tCL tSS tHS ADSP ADSC tSA tHA Ax BWE is ignored when ADSP initiates a cycle and is sampled on next clock rising edge ADDRESS Ay Az tHW tSW BWE BWx is ignored when ADSP initiates a cycle and is sampled on next clock rising edge tHW tSW BWx tSC tHC CE, CS1 tSAV (Note 3) Timing Waveform of Write Cycle No. 2 — Byte Controlled(1,2,3) IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges 6.42 16 (ADV suspends burst) ADV OE tSD I1(Ax) tOHZ O4(Aw) Single Write Burst Write Extended Burst Write 4876 drw 11 tHD DATAIN I1(Ay) I2(Ay) I2(Ay) I3(Ay) I4(Ay) I1(Az) I2(Az) I3(Az) DATAOUT O3(Aw) Burst Read , NOTES: 1. ZZ input is LOW, GW is HIGH and LBO is Don't Care for this cycle. 2. O4 (Aw) represents the final output data in the burst sequence of the base address Aw. I1 (Ax) represents the first input from the external address Ax. I1 (Ay) represents the first input from the external address Ay; I2 (Ay) represent the next input data in the burst sequence of the base address Ay, etc. where A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. In the case of input I2 (Ay) this data is valid for two cycles because ADV is high and has suspended the burst. 3. CS0 timing transitions are identical but inverted to the CE and CS1 signals. For example, when CE and CS1 are LOW on this waveform, CS0 is HIGH. tCYC CLK tCH tCL tSS tHS ADSP ADSC tHA Az tSA ADDRESS Ax GW tHC tSC CE, CS1 (Note 4) Timing Waveform of Sleep (ZZ) and Power-Down Modes(1,2,3) IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges 6.42 17 tOE tOLZ O1(Ax) tZZPW ADV OE DATAOUT tZZR ZZ Single Read Snooze Mode 4876 drw 12 , NOTES: 1. Device must power up in deselected Mode. 2. LBO is Don't Care for this cycle. 3. It is not necessary to retain the state of the input registers throughout the Power-down cycle. 4. CS0 timing transitions are identical but inverted to the CE and CS1 signals. For example, when CE and CS1 are LOW on this waveform, CS0 is HIGH. IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Non-Burst Read Cycle Timing Waveform CLK ADSP ADSC ADDRESS Av Aw Ax Ay Az GW, BWE, BWx CE, CS1 CS0 OE DATAOUT (Av) (Aw) (Ax) (Ay) 4876 drw 14 , NOTES: 1. ZZ input is LOW, ADV is HIGH and LBO is Don't Care for this cycle. 2. (Ax) represents the data for address Ax, etc. 3. For read cycles, ADSP and ADSC function identically and are therefore interchangable. Non-Burst Write Cycle Timing Waveform CLK ADSP ADSC ADDRESS Av Aw Ax Ay Az GW CE, CS1 CS0 DATAIN (Av) (Aw) (Ax) (Ay) (Az) , 4876 drw 15 NOTES: 1. ZZ input is LOW, ADV and OE are HIGH, and LBO is Don't Care for this cycle. 2. (Ax) represents the data for address Ax, etc. 3. Although only GW writes are shown, the functionality of BWE and BWx together is the same as GW. 4. For write cycles, ADSP and ADSC have different limitations. 6.42 18 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges JTAG Interface Specification (SA Version only) tJCYC tJF TCK tJCL tJR tJCH Device Inputs(1)/ TDI/TMS tJS Device Outputs(2)/ TDO tJH tJDC tJRSR tJCD x M4876 drw 01 TRST(3 ) tJRST NOTES: 1. Device inputs = All device inputs except TDI, TMS and TRST. 2. Device outputs = All device outputs except TDO. 3. During power up, TRST could be driven low or not be used since the JTAG circuit resets automatically. TRST is an optional JTAG reset. JTAG AC Electrical Characteristics(1,2,3,4) Symbol tJCYC tJCH tJCL tJR tJF tJRST tJRSR tJCD tJDC tJS tJH Parameter JTAG Clock Input Period JTAG Clock HIGH JTAG Clock Low JTAG Clock Rise Time JTAG Clock Fall Time JTAG Reset JTAG Reset Recovery JTAG Data Output JTAG Data Output Hold JTAG Setup JTAG Hold Min. 100 40 40 ____ ____ Max. ____ ____ ____ Units ns ns ns ns ns ns ns ns ns ns ns I4876 tbl 01 Scan Register Sizes Register Name Instruction (IR) Bypass (BYR) JTAG Identification (JIDR) Boundary Scan (BSR) Bit Size 4 1 32 Note (1) I4876 tbl 03 5(1) 5(1) ____ ____ 50 50 ____ 20 ____ ____ ____ NOTE: 1. The Boundary Scan Descriptive Language (BSDL) file for this device is available by contacting your local IDT sales representative. 0 25 25 NOTES: 1. Guaranteed by design. 2. AC Test Load (Fig. 1) on external output signals. 3. Refer to AC Test Conditions stated earlier in this document. 4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet. 6.42 19 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges JTAG Identification Register Definitions (SA Version only) Instruction Field Revision Number (31:28) IDT Device ID (27:12) IDT JEDEC ID (11:1) ID Register Indicator Bit (Bit 0) Value 0x2 0x239, 0x23B 0x33 1 Reserved for version number. Defines IDT part number 71V2576SA and 71V2578SA, respectively. Allows unique identification of device vendor as IDT. Indicates the presence of an ID register. I4876 tbl 02 Description Available JTAG Instructions Instruction EXTEST Description Forces contents of the bound ary scan cells onto the device outputs (1). Places the boundary scan registe r (BSR) between TDI and TDO. Places the boundary scan registe r (BSR) between TDI and TDO. SAMPLE allows data from device inputs (2) and outputs(1) to be captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the bo undary scan cells via the TDI. Loads the JTAG ID register (JIDR) with the vendor ID code and places the register between TDI and TDO. Places the bypass register (BYR) be tween TDI and TDO. Forces all device o utput drivers to a High-Z state. OPCODE 0000 SAMPLE/PRELOAD 0001 DEVICE_ID HIGHZ RESERVED RESERVED RESERVED RESERVED CLAMP RESERVED RESERVED 0010 0011 0100 Several combinations are reserved. Do not use codes other than those identified for EXTEST, SAMPLE/PRELOAD, DEVICE_ID, HIGHZ, CLAMP, VALIDATE and BYPASS instructions. 0101 0110 0111 Uses BYR. Forces contents of the bound ary scan cells onto the device outputs. Places the byp ass registe r (BYR) between TDI and TDO. 1000 1001 1010 Same as above. RESERVED RESERVED VALIDATE RESERVED BYPASS Automatically loaded into the instruction register whenever the TAP controller passes through the CAPTURE-IR state. The lower two bits '01' are mand ated by the IEEE std. 1149.1 specification. Same as above. The BYPASS instruction is used to truncate the boundary scan register as a single bit in length. 1011 1100 1101 1110 1111 I4876 tbl 04 NOTES: 1. Device outputs = All device outputs except TDO. 2. Device inputs = All device inputs except TDI, TMS, and TRST. 6.42 20 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Ordering Information IDT XXX Device Type X S Power X Speed XX Package X Process/ Temperature Range Blank I PF* BG BQ 150 133 S SA Blank Y 71V2576 71V2578 Commercial (0°C to +70°C) Industrial (-40°C to +85°C) 100-pin Plastic Thin Quad Flatpack (TQFP) 119 Ball Grid Array (BGA) 165 Fine Pitch Ball Grid Array (fBGA) Frequency in Megahertz Standard Power Standard Power with JTAG Interface First generation or current stepping Second generation die step 128K x 36 Pipelined Burst Synchronous SRAM with 2.5V I/O 256K x 18 Pipelined Burst Synchronous SRAM with 2.5V I/O 4876 drw 13 , * JTAG (SA Version) is not available with 100-pin TQFP package Package Infor mation 100-Pin Thin Quad Plastic Flatpack (TQFP) 119 Ball Grid Array (BGA) 165 Fine Pitch Ball Grid Array (fBGA) Information available on the IDT website 6.42 21 IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges Datasheet Document History 7/23/99 9/17/99 Pg. 8 Pg. 11 Pg. 18 Pg. 20 Pg. 1, 8, 11, 19 Pg. 1, 4, 8, 11, 19 Pg. 18 Pg. 4 Updated to new format Revised ISB1 and IZZ for speeds 100–200MHz Revised tCDC at 166MHz Added 119-Lead BGA package diagram Added Datasheet Document History Removed 166, 183, and 200MHz speed grade offerings (See IDT71V25761 and IDT71V25781) Added Industrial Temperature range offerings Added 100pinTQFP Package Diagram Outline Add capacitance table for the BGA package; Add industrial temperature to table;Insert note to Absolute Max Rating and Recommended Operating Temperature tables Add new package offering 13 x 15mm 165fBGA Correct 119 BGA PackageDiagram Outline Add note reference to BG119 pinout Add DNU reference note to BQ165 pinout Update BG119 Package Diagram Outline Dimensions Remove Preliminary status Add reference note to pin N5 on BQ165 pinout, reserved for JTAG TRST Updated 165 BGA table from information from TBA to 7 Updated datasheet with JTAG information Removed note for NC pins (38,39(PF package); L4, U4 (BG package) H2, N7 (BQ package)) requiring NC or connection to Vss. Added two pages of JTAG Specification, AC Electrical, Definitions and Instructions Removed old package information from the datasheet Updated ordering information with JTAG and Y stepping information. Added information regarding packages available IDT website. 12/31/99 04/04/00 06/01/00 07/15/00 Pg. 20 Pg. 7 Pg. 8 Pg. 20 Pg. 8 Pg. 4 Pg. 1,2,3,5-9 Pg. 5-8 Pg. 19,20 Pg. 21-23 Pg. 24 10/25/00 04/22/03 06/30/03 CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com for Tech Support: sramhelp@idt.com 800-544-7726, x4033 The IDT logo is a registered trademark of Integrated Device Technology, Inc. 6.42 22